SPEC NO: DSAB0730
REV NO: V.4
DATE: APR/04/2003
PAGE: 1 OF 4
APPROVED : J. Lu
CHECKED : Allen Liu
DRAWN: D.H.FANG
APED3820EC HIGH EFFICIENCY RED
3.8x2.0mm DOME LENS SMD CHIP LED LAMP
Description
The High Efficiency Red source color devices are made
with Gallium Arsenide Phosphide on Gallium Phosphide
Orange Light Emitting Diode.
Package Dimensions
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is
0.2(0.008") unless otherwise noted.
3. Specifications are subject to change without notice.
Features
l
3.8mmx2.0mm SMT LED,3.2mm THICKNESS.
l
LOW POWER CONSUMPTION.
l
IDEAL FOR BACKLIGHT AND INDICATOR.
l
VARIOUS COLORS AND LENS TYPES AVAILABLE.
l
PACKAGE : 500PCS / REEL.
SPEC NO: DSAB0730
REV NO: V.4
DATE: APR/04/2003
PAGE: 2 OF 4
APPROVED : J. Lu
CHECKED : Allen Liu
DRAWN: D.H.FANG
Selection Guide
Note:
1.
1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
.o
N
tra
P
.o
N
tra
P
.o
N
tra
P
.o
N
tra
P
.o
N
tra
P
ec
iD ec
iD ec
iD ec
iD ec
iD
ep
yT
sn
eL
ep
yT
sn
eL
ep
yT
sn
eL
ep
yT
sn
eL
ep
yT
sn
eL
)d
c
m(
vI
)d
c
m(
vI
)d
c
m(
vI
)d
c
m(
vI
)d
c
m(
vI
A
m
02
@
gn
iw
ei
V
gn
iw
ei
V
gn
iw
ei
V
gn
iw
ei
V
gn
iw
ei
V elg
n
A
.ni
M .ni
M .ni
M .ni
M .ni
M
.p
yT .p
yT .p
yT .p
yT .p
yT
2
/
1
2 2
/
1
2 2
/
1
2 2
/
1
2 2
/
1
2
C
E0
28
3
D
E
P
A
)P
a
G/
Ps
Aa
G(
D
E
R
Y
C
N
EI
CI
F
F
E
H
GI
H
R
A
EL
C
R
ET
A
W
81
04
06
)H
(
53
)V
(
Electrical / Optical Characteristics at T
A
=25
C
Absolute Maximum Ratings at T
A
=25
C
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
de
R
yc
ne
ici
ff
E
hg
iH
de
R
yc
ne
ici
ff
E
hg
iH
de
R
yc
ne
ici
ff
E
hg
iH
de
R
yc
ne
ici
ff
E
hg
iH
de
R
yc
ne
ici
ff
E
hg
iH
sti
n
U sti
n
U sti
n
U sti
n
U sti
n
U
no
ita
pi
ss
id
re
w
o
P
50
1
W
m
tn
err
u
C
dr
a
wr
oF
C
D
03
A
m
]1[
tn
err
u
C
dr
a
wr
oF
ka
e
P
06
1
A
m
eg
atl
oV
es
re
ve
R
5
V
er
ut
ar
ep
m
eT
eg
ar
ot
S/
gn
ita
re
p
O
04
-
58
+
oT
C
C
lo
b
m
yS lo
b
m
yS lo
b
m
yS lo
b
m
yS lo
b
m
yS
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ret
e
m
ar
a
P
ec
iv
e
D ec
iv
e
D ec
iv
e
D ec
iv
e
D ec
iv
e
D
.p
yT .p
yT .p
yT .p
yT .p
yT
.x
a
M .x
a
M .x
a
M .x
a
M .x
a
M
sti
n
U sti
n
U sti
n
U sti
n
U sti
n
U
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
sn
oit
id
no
C
ts
eT
ka
ep
ht
gn
el
ev
a
W
ka
e
P
de
R
yc
ne
icif
fE
hg
iH
72
6
m
n
I
F
A
m
02
=
D
ht
gn
el
ev
a
W
et
an
im
o
D
de
R
yc
ne
icif
fE
hg
iH
52
6
m
n
I
F
A
m
02
=
2/
1
ht
di
w-
fla
H
en
iL
lar
tc
ep
S
de
R
yc
ne
icif
fE
hg
iH
54
m
n
I
F
A
m
02
=
C
ec
na
tic
ap
a
C
de
R
yc
ne
icif
fE
hg
iH
51
Fp
V
F
zH
M
1=
f;V
0=
V
F
eg
atl
oV
dr
a
wr
oF
de
R
yc
ne
icif
fE
hg
iH
0.
2
5.
2
V
I
F
A
m
02
=
I
R
tn
err
u
C
es
re
ve
R
de
R
yc
ne
icif
fE
hg
iH
01
Au
V
R
V5
=
SPEC NO: DSAB0730
REV NO: V.4
DATE: APR/04/2003
PAGE: 4 OF 4
APPROVED : J. Lu
CHECKED : Allen Liu
DRAWN: D.H.FANG
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
APED3820EC
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
PDF 
ZIP