SPEC NO: DSAC0596
REV NO: V.4 DATE: JUL/12/2003 PAGE: 1 OF 4
APPROVED: J. Lu
CHECKED: Allen Liu DRAWN: S.J.HOU
1.6x0.8mm SM D CHIP LED LAM P
Features
1.6mmx0.8mm SMT LED, 0.7mm THICKNESS.
LOW POWER CONSUMPTION.
WIDE VIEWING ANGLE.
IDEAL FOR BACK LIGHT AND INDICATOR.
VARIOUS COLORS AND LENS TYPES AVAILABLE.
PACKAGE : 2000PCS / REEL.
Package Dimensions
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is
0
.1(0.004") unless otherwise noted.
3. Specifications are subject to change without notice.
ATTENTION
OBSERVE PRECAUTIONS
FOR HANDLING
ELECTROSTATIC
DISCHARGE
SENSITIVE
DEVICES
Description
The s ourc e c olor devic es are m ade wit h I nGaN
on S iC Light Emit ting Diode.
S t at ic elect ric it y and s urge dam age t he LE DS .
I t is rec ommended t o us e a wris t band or
ant i-elect rost atic glove when handling t he LE Ds .
A ll devic es, equipment and mac hinery mus t be
elect ric ally grounded.
APHK1608PWC
WHITE
SPEC NO: DSAC0596
REV NO: V.4 DATE: JUL/12/2003 PAGE: 2 OF 4
APPROVED: J. Lu
CHECKED: Allen Liu DRAWN: S.J.HOU
Selection Guide
Note:
1.
1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
Part No.
Dice
Lens Type
Iv (mcd)
@ 20mA
Viewing
Angle
Min.
Typ.
2
1/2
APHK1608PWC
WHITE (InGaN)
WATER CLEAR
70
150
90
Electrical / Optical Characteristics at T
A
=25C
Absolute Maximum Ratings at T
A
=25C
Parameter
White
Units
Power dissipation
102
mW
DC Forward Current
30
mA
Peak Forward Current [1]
160
mA
Reverse Voltage
5
V
Operating/Storage Temperature
-40C To +85C
Symbol
Parameter
Device
Typ.
Max.
Units
Test Conditions
V
F
Forward Voltage
White
3.65
4.2
V
I
F
=20mA
I
R
Reverse Current
White
10
uA
V
R
= 5V
X
Chromaticity Coordinates
White
0.33
Y
0.34
C
Capacitance
White
65
pF
V
F
=0V;f=1MHz
SPEC NO: DSAC0596
REV NO: V.4 DATE: JUL/12/2003 PAGE: 4 OF 4
APPROVED: J. Lu
CHECKED: Allen Liu DRAWN: S.J.HOU
Recommended Soldering Pattern
(Units : mm)
Tape Specifications
(Units : mm)
APHK1608PWC
SMT Reflow Soldering Instruction
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
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