SPEC NO:DSAB3136
REV NO: V.2
DATE:JAN/22/2003
PAGE: 1 OF 5
APPROVED : J. Lu
CHECKED : Joe Lee
DRAWN:L.ZHANG
APPDC04-41MBWA BLUE
Package Dimensions & Internal Circuit Diagram
SURFACE MOUNT DISPLAY
Description
The Blue source color devices are made with GaN on
SiC Light Emitting Diode.
Static electricity and surge damage the LEDS. It is
recommended to use a wrist band or anti-electrostatic
glove when handling the LEDs.
All devices, equipment and machinery must be
electrically grounded.
Features
!
0.4 INCH CHARACTER HEIGHT.
!
LOW CURRENT OPERATION.
!
HIGH CONTRAST AND LIGHT OUTPUT.
!
EASY MOUNTING ON P.C. BOARDS OR SOCKETS.
!
CATEGORIZED FOR LUMINOUS INTENSITY.
!
MECHANICALLY RUGGED.
!
GRAY FACE, WHITE SEGMENT.
!
PACKAGE :500PCS / REEL.
Notes:
1. All dimensions are in millimeters (inches), Tolerance is
0.25(0.01")unless otherwise noted.
2. Specifications are subject to change without notice.
SPEC NO:DSAB3136
REV NO: V.2
DATE:JAN/22/2003
PAGE: 2 OF 5
APPROVED : J. Lu
CHECKED : Joe Lee
DRAWN:L.ZHANG
Electrical / Optical Characteristics at T
)
=25
C
Absolute Maximum Ratings at T
)
=25
C
Note:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
Selection Guide
l
o
b
m
y
S
l
o
b
m
y
S
l
o
b
m
y
S
l
o
b
m
y
S
l
o
b
m
y
S
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
r
e
t
e
m
a
r
a
P
e
c
i
v
e
D
e
c
i
v
e
D
e
c
i
v
e
D
e
c
i
v
e
D
e
c
i
v
e
D
.
p
y
T .
p
y
T .
p
y
T .
p
y
T .
p
y
T
.
x
a
M .
x
a
M .
x
a
M .
x
a
M .
x
a
M
s
ti
n
U s
ti
n
U s
ti
n
U s
ti
n
U s
ti
n
U
s
n
o
it
i
d
n
o
C
t
s
e
T
s
n
o
it
i
d
n
o
C
t
s
e
T
s
n
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it
i
d
n
o
C
t
s
e
T
s
n
o
it
i
d
n
o
C
t
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T
s
n
o
it
i
d
n
o
C
t
s
e
T
k
a
e
p
h
t
g
n
e
l
e
v
a
W
k
a
e
P
e
u
l
B
0
3
4
m
n
I
F
A
m
0
2
=
D
h
t
g
n
e
l
e
v
a
W
e
t
a
n
i
m
o
D
e
u
l
B
6
6
4
m
n
I
F
A
m
0
2
=
2
/
1
h
t
d
i
w
-f
l
a
H
e
n
i
L
l
a
rt
c
e
p
S
e
u
l
B
0
6
m
n
I
F
A
m
0
2
=
C
e
c
n
a
ti
c
a
p
a
C
e
u
l
B
0
0
1
F
p
V
F
z
H
M
1
=
f;
V
0
=
V
F
e
g
a
tl
o
V
d
r
a
w
r
o
F
e
u
l
B
8
.
3
5
.
4
V
I
F
A
m
0
2
=
I
R
t
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e
r
r
u
C
e
s
r
e
v
e
R
e
u
l
B
0
1
A
u
V
R
V
5
=
r
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t
e
m
a
r
a
P
r
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t
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m
a
r
a
P
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P
r
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t
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m
a
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a
P
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u
l
B e
u
l
B e
u
l
B e
u
l
B e
u
l
B
s
ti
n
U s
ti
n
U s
ti
n
U s
ti
n
U s
ti
n
U
n
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it
a
p
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d
r
e
w
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5
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1
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m
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]
1
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t
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C
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r
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w
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0
5
1
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m
e
g
a
tl
o
V
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s
r
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v
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R
5
V
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r
u
t
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p
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T
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g
a
r
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t
S
/
g
n
it
a
r
e
p
O
0
4
-
5
8
+
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T
C
C
.
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N
t
r
a
P
.
o
N
t
r
a
P
.
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N
t
r
a
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N
t
r
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.
o
N
t
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c
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c
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D e
c
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p
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T
s
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L
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p
y
T
s
n
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L
e
p
y
T
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p
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L
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p
y
T
s
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L
)
d
c
u
(
v
I
)
d
c
u
(
v
I
)
d
c
u
(
v
I
)
d
c
u
(
v
I
)
d
c
u
(
v
I
A
m
0
1
@
n
o
it
p
ir
c
s
e
D
n
o
it
p
ir
c
s
e
D
n
o
it
p
ir
c
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D
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it
p
ir
c
s
e
D
n
o
it
p
ir
c
s
e
D
.
n
i
M .
n
i
M .
n
i
M .
n
i
M .
n
i
M
.
p
y
T .
p
y
T .
p
y
T .
p
y
T .
p
y
T
A
W
B
M
1
4
-
4
0
C
D
P
P
A
)
N
a
G
(
E
U
L
B
D
E
S
U
F
F
I
D
E
T
I
H
W
0
0
8
0
0
8
3
,
e
d
o
h
t
a
C
n
o
m
m
o
C
l
a
m
i
c
e
D
d
n
a
H
.t
R
SPEC NO:DSAB3136
REV NO: V.2
DATE:JAN/22/2003
PAGE: 4 OF 5
APPROVED : J. Lu
CHECKED : Joe Lee
DRAWN:L.ZHANG
Recommended Soldering Pattern
(Units : mm)
APPDC04-41MBWA
SMT Reflow Soldering Instructions
Number of reflow process shall be less than 2 times and cooling
process to normal temperature is required between first and
second soldering process.
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