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Электронный компонент: KAF-1301LE

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KAF-1301LE
Eastman Kodak Company - Image Sensor Solutions
For the most current information regarding this product:
Phone: (585) 722-4385 Fax: (585) 477-4947 Web: www.kodak.com/go/imagers E-mail: imagers@kodak.com


KAF - 1301LE
1280 (H) x 1024 (V) Pixel
Full-Frame CCD Image Sensor
Performance Specification



Eastman Kodak Company
Image Sensor Solutions
Rochester, New York 14650-2010





Revision 1.1
April 29, 2003
KAF-1301LE
Eastman Kodak Company - Image Sensor Solutions
For the most current information regarding this product:
Phone: (585) 722-4385 Fax: (585) 477-4947 Web: www.kodak.com/go/imagers E-mail: imagers@kodak.com
2
Revision
1.1
TABLE OF CONTENTS

1. Device Description............................................................................................................ 3
1.1.Features......................................................................................................................... 3
1.2. Description.................................................................................................................. 3
1.3. Image Acquisition....................................................................................................... 4
1.4. Charge Transport ........................................................................................................ 4
1.5. Output Structure .......................................................................................................... 4
1.6. Dark Reference Pixels ................................................................................................. 4
1.7. Dummy Pixels ............................................................................................................ 4
2. Package Configuration ...................................................................................................... 5
2.1. Pin Description ............................................................................................................ 6
3. Operating Conditions ......................................................................................................... 7
3.1. Absolute Maximum Ratings....................................................................................... 7
3.2. DC Operating Conditions ........................................................................................... 8
3.3. AC Operating Conditions ........................................................................................... 9
3.4. AC Timing Conditions ............................................................................................... 9
4. Performance Specifications.............................................................................................. 11
4.1. Electro Optical Performance...................................................................................... 11
4.2. Spectral Response...................................................................................................... 12
4.3. Cosmetic Specification ............................................................................................. 13
5. Quality Assurance and Reliability.................................................................................... 14
6. Ordering Information ....................................................................................................... 15
6.1. Available Part Configurations .................................................................................. 15
7. Revision Changes............................................................................................................. 15
FIGURES


Figure 1 Functional Block Diagram................................................................................................ 3
Figure 2 Package Drawing .............................................................................................................. 5
Figure 3 Package Pin Designations................................................................................................ 6
Figure 4 Typical Output Structure Load Diagram ......................................................................... 8
Figure 5 Timing Diagrams ........................................................................................................... 10
Figure 6 Spectral Response .......................................................................................................... 12

KAF-1301LE
Eastman Kodak Company - Image Sensor Solutions
For the most current information regarding this product:
Phone: (585) 722-4385 Fax: (585) 477-4947 Web: www.kodak.com/go/imagers E-mail: imagers@kodak.com
3
Revision
1.1
1. D
EVICE
D
ESCRIPTION
1.1 Features
1.3M Pixel Area CCD
1280H x 1024V (16
m) Pixels
Transparent Gate True Two Phase
Technology (Enhanced Spectral Response)
20.48
mm H x 16.38 mm V Photosensitive
Area
2-Phase Register Clocking
Anti-blooming Protection
70% Fill Factor
Low Dark Current (<15pA/cm2 @ 25oC)
1.2 Description
The KAF-1301LE is a high performance
monochrome area CCD (charge-coupled device)
image sensor with 1280H x 1024V photoactive pixels
designed for a wide range of image sensing
applications in the 400nm to 1000nm wavelength
band. Typical applications include military,
scientific, and industrial imaging. A 72dB dynamic
range is possible when operating at room
temperature.
The sensor is built with a true two-phase CCD
technology. This technology simplifies the support
circuits that drive the sensor and reduces the dark
current without compromising charge capacity. The
transparent gate results in spectral response increased
ten times at 400nm, compared to a front side
illuminated standard poly silicon gate technology.
The sensitivity is increased 50% over the rest of the
visible wavelengths.

Total chip size is 22mm x 17.1mm and is housed in a
36-pin package with an integral copper-tungsten back
plate providing excellent thermal conductivity.

The sensor consists of 1296 parallel (vertical) CCD
shift registers each 1028 elements long. These
registers act as both the photosensitive elements and
as the transport circuits that allow the image to be
sequentially read out of the sensor. The elements of
these registers are arranged into a 1280 x 1024
photosensitive array surrounded by a light shielded
dark reference of 16 columns and 4 rows. Parallel
(vertical) CCD registers transfer the image one line at
a time into a single 1304 element (horizontal) CCD
shift register. The horizontal register transfers the
charge to a single output amplifier. The output
amplifier is a two-stage source follower that converts
the photo-generated charge to a voltage for each
pixel.
KAF-1301LE
Usable Active Image Area
1280(H) x 1024(V)
16
m x 16
m pixels
1280 Active Pixels/Line
4 Inactive
H1
H2
4 Inactive
16 Dark
Guard
1.5 Dark
Lines
V1
V2
2.5 Dark
Lines
R
Vog
Vrd
Vss
Vout
Vdd
Sub
Vlg
= scavenging
shift registers
Figure 1 Functional Block Diagram
KAF-1301LE
Eastman Kodak Company - Image Sensor Solutions
For the most current information regarding this product:
Phone: (585) 722-4385 Fax: (585) 477-4947 Web: www.kodak.com/go/imagers E-mail: imagers@kodak.com
4
Revision
1.1

1.3 Image Acquisition
An electronic representation of an image is formed
when incident photons falling on the sensor plane
create electron-hole pairs within the sensor. These
photon-induced electrons are collected locally by the
formation of potential wells at each photogate or
pixel site. The number of electrons collected is
linearly dependent on light level and exposure time
and non-linearly dependent on wavelength. When the
pixel's capacity is reached, excess electrons are
removed by the presence of a lateral overflow drain
(LOD) anti-blooming protection structure. During the
integration period, the
V1and
V2 register clocks
are held at a constant (low) level.
See Figure 5 Timing Diagrams - Timing Diagrams.
1.4 Charge Transport

Referring again to Figure 5 Timing Diagrams, the
integrated charge from each photogate is transported
to the output using a two step process. Each line
(row) of charge is first transported from the vertical
CCDs to the horizontal CCD register using the
V1and
V2 register clocks. The horizontal CCD is
presented a new line on the falling edge of
V2 while
H1 is held high. The horizontal CCDs then transport
each line, pixel by pixel, to the output structure by
alternately clocking the
H1 and
H2 pins in a
complementary fashion. On each falling edge of
H1
a new charge packet is transferred onto a floating
diffusion and sensed by the output amplifier.
1.5 Output Structure

Charge presented to the floating diffusion (FD) is
converted into a voltage and current amplified in
order to drive off-chip loads. The resulting voltage
change seen at the output is linearly related to the
amount of charge placed on FD. Once the signal has
been sampled by the system electronics, the reset gate
(
R
) is clocked to remove the signal and FD is reset to
the potential applied by VRD. More signal at the
floating diffusion reduces the voltage seen at the
output pin.

In order to activate the output structure, an off-chip load
must be added to the Vout pin of the device see
Figure 4 Typical Output
Structure Load Diagram. The
amplifier has a 45MHz bandwidth.
1.6 Dark Reference Pixels
Surrounding the peripheral of the device is a border
of light shielded pixels. These can be used to track
the dark level if the temperature of the array is
allowed to vary. Each line has 16 trailing pixels that
are connected to vertical CCD registers covered with
aluminum. There are also 2.5 dark lines at the start of
every frame and 1.5 dark lines at the end of each
frame. That is, the light shield covering the dark
reference rows extend into the adjacent photo-active
row. This provides better rejection of unwanted
optical signal at the expense of lower response in the
adjacent photo active rows. Under normal
circumstances, these pixels do not respond to light.
However, dark reference pixels in close proximity to
an active pixel, or the outer bounds of the chip
(including the first two lines out), can scavenge
signal depending on light intensity and wavelength
and therefore will not represent the true dark signal.
1.7 Dummy Pixels

Within the horizontal shift register are 4 leading and
4 trailing additional shift phases which are not
associated with a column of pixels within the vertical
register. These pixels contain only horizontal shift
register dark current signal and do not respond to
light. A few leading dummy pixels may scavenge
false signal depending on operating conditions.
There are several columns of dummy vertical CCD
adjacent to the photo active and light shielded
vertical CCD that act to scavenge unwanted stray
signal away from the imaging area. These columns
are not connected to the horizontal register so their
presence does not have to be taken into account when
clocking out each line. They transfer their charge in a
direction opposite of the photo-active columns and
the charge is removed through a connection to Vdd.
KAF-1301LE
Eastman Kodak Company - Image Sensor Solutions
For the most current information regarding this product:
Phone: (585) 722-4385 Fax: (585) 477-4947 Web: www.kodak.com/go/imagers E-mail: imagers@kodak.com
5
Revision
1.1
2. P
ACKAGE
C
ONFIGURATION
Figure 2 Package Drawing
(Detailed drawings available upon request.)