DIM300WHS12-E000
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
1/8
www.dynexsemi.com
PDS5685-1.2 January 2004
FEATURES
I
Trench Gate Field Stop Technology
I
Low Conduction Losses
I
Low Switching Losses
I
10
s Short Circuit Withstand
APPLICATIONS
I
Motor Drives
I
Wind Turbines
I
UPS Systems
The Powerline range of high power modules includes half
bridge, chopper, dual, single and bi-directional switch
configurations covering voltages from 600V to 3300V and
currents up to 3600A.
The DIM300WHS12-E000 is a half bridge 1700V, n channel
enhancement mode, insulated gate bipolar transistor (IGBT)
module. The IGBT has a wide reverse bias safe operating area
(RBSOA) plus full 10
s short circuit withstand.
The module incorporates an electrically isolated base plate
and low inductance construction enabling circuit designers to
optimise circuit layouts and utilise grounded heat sinks for safety.
ORDERING INFORMATION
Order As:
DIM300WHS12-E000
Note: When ordering, please use the complete part number.
KEY PARAMETERS
V
CES
1200V
V
CE(sat)
(typ)
1.7V
I
C
(max)
300A
I
C(PK)
(max)
600A
DIM300WHS12-E000
Half Bridge IGBT Module
Fig. 1 Half bridge circuit diagram
Fig. 2 Module Outline
Outline type code: W
(See package details for further information)
3(C1)
1(E1C2)
2(E2)
6(G
2
)
7(E
2
)
5(E
1
)
4(G
1
)
DIM300WHS12-E000
2/8
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
www.dynexsemi.com
Test Conditions
Continuous dissipation -
junction to case
Continuous dissipation -
junction to case
Mounting torque 5Nm
(with mounting grease)
Transistor
Diode
-
Mounting - M6
Electrical connections - M6
Parameter
Thermal resistance - transistor (per arm)
Thermal resistance - diode (per arm)
Thermal resistance - case to heatsink
(per module)
Junction temperature
Storage temperature range
Screw torque
THERMAL AND MECHANICAL RATINGS
Internal insulation: Al
2
O
3
Clearance: 13mm
Baseplate material: Cu
CTI (Critical Tracking Index): 175
Creepage distance: 24mm
Symbol
R
th(j-c)
R
th(j-c)
R
th(c-h)
T
j
T
stg
-
Units
C/kW
C/kW
C/kW
C
C
C
Nm
Nm
Max.
90
160
15
150
125
125
5
5
Typ.
-
-
-
-
-
-
-
-
Min.
-
-
-
-
-
40
3
2.5
ABSOLUTE MAXIMUM RATINGS - PER ARM
Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. In extreme
conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety precautions
should always be followed. Exposure to Absolute Maximum Ratings may affect device reliability.
T
case
= 25C unless stated otherwise
Test Conditions
V
GE
= 0V
-
T
case
= 70C
1ms, T
case
= 115C
T
case
= 25C, T
j
= 150C
V
R
= 0, t
p
= 10ms, T
vj
= 125C
Commoned terminals to base plate. AC RMS, 1 min, 50Hz
IEC1287. V
1
= 1300V, V
2
= 1000V, 50Hz RMS
Symbol
V
CES
V
GES
I
C
I
C(PK)
P
max
I
2
t
V
isol
Q
pd
Units
V
V
A
A
kW
kA
2
s
V
pC
Max.
1200
20
300
600
1.5
11.3
2500
10
Parameter
Collector-emitter voltage
Gate-emitter voltage
Continuous collector current
Peak collector current
Max. transistor power dissipation
Diode I
2
t value
Isolation voltage - per module
Partial discharge - per module
DIM300WHS12-E000
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
3/8
www.dynexsemi.com
Test Conditions
V
GE
= 0V, V
CE
= V
CES
V
GE
= 0V, V
CE
= V
CES
, T
case
= 125C
V
GE
=
20V, V
CE
= 0V
I
C
= 12mA, V
GE
= V
CE
V
GE
= 15V, I
C
= 300A
V
GE
= 15V, I
C
= 300A, , T
case
= 125C
DC
t
p
= 1ms
I
F
= 300A
I
F
= 300A, T
case
= 125C
V
CE
= 25V, V
GE
= 0V, f = 1MHz
-
-
T
j
= 125C, V
CC
= 900V,
I
1
t
p
10
s, V
CE(max)
= V
CES
L*. di/dt
I
2
IEC 60747-9
Parameter
Collector cut-off current
Gate leakage current
Gate threshold voltage
Collector-emitter saturation voltage
Diode forward current
Diode maximum forward current
Diode forward voltage
Input capacitance
Module inductance
Internal transistor resistance - per arm
Short circuit. I
SC
ELECTRICAL CHARACTERISTICS
T
case
= 25C unless stated otherwise.
Symbol
I
CES
I
GES
V
GE(TH)
V
CE(sat)
I
F
I
FM
V
F
C
ies
L
M
R
INT
SC
Data
Units
mA
mA
A
V
V
V
A
A
V
V
nF
nH
m
A
A
Max.
0.5
2.5
2
6.5
2.15
2.5
300
600
2.15
2.15
-
-
-
-
-
Typ.
-
-
-
5.8
1.7
2.0
-
-
1.65
1.65
21
20
0.23
1200
TBD
Min.
-
-
-
5.0
-
-
-
-
-
-
-
-
-
-
-
Note:
L* is the circuit inductance + L
M
DIM300WHS12-E000
4/8
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
www.dynexsemi.com
Units
ns
ns
mJ
ns
ns
mJ
C
C
A
mJ
Max.
-
-
-
-
-
-
-
-
-
-
Typ.
550
100
30
200
75
30
3
22
250
9
Min.
-
-
-
-
-
-
-
-
-
-
Test Conditions
I
C
= 300A
V
GE
=
15V
V
CE
= 600V
R
G(ON)
= 6.8
R
G(OFF)
= 2.4
L ~ 100nH
I
F
= 300A, V
R
= 600V,
dI
F
/dt = 4800A/
s
Parameter
Turn-off delay time
Fall time
Turn-off energy loss
Turn-on delay time
Rise time
Turn-on energy loss
Gate charge
Diode reverse recovery charge
Diode reverse current
Diode reverse recovery energy
ELECTRICAL CHARACTERISTICS
T
case
= 25C unless stated otherwise
Symbol
t
d(off)
t
f
E
OFF
t
d(on)
t
r
E
ON
Q
g
Q
rr
I
rr
E
REC
T
case
= 125C unless stated otherwise
Units
ns
ns
mJ
ns
ns
mJ
C
A
mJ
Max.
-
-
-
-
-
-
-
-
-
Typ.
700
150
48
250
75
40
45
310
18
Min.
-
-
-
-
-
-
-
-
-
Test Conditions
I
C
= 300A
V
GE
=
15V
V
CE
= 600V
R
G(ON)
= 6.8
R
G(OFF)
= 2.4
L ~ 100nH
I
F
= 300A, V
R
= 600V,
dI
F
/dt = 4400A/
s
Parameter
Turn-off delay time
Fall time
Turn-off energy loss
Turn-on delay time
Rise time
Turn-on energy loss
Diode reverse recovery charge
Diode reverse current
Diode reverse recovery energy
Symbol
t
d(off)
t
f
E
OFF
t
d(on)
t
r
E
ON
Q
rr
I
rr
E
REC
Note:
Switching Characteristic measurements taken using standard driver circuit conditions.
DIM300WHS12-E000
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
5/8
www.dynexsemi.com
TYPICAL CHARACTERISTICS
Fig. 3 Typical output characteristics
Fig. 4 Typical output characteristics
Fig. 5 Typical switching energy vs collector current
Fig. 6 Typical switching energy vs gate resistance
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
Collector voltage, V
ce
- (V)
0
100
200
300
400
500
600
Collector current, I
C
- (A)
V
GE
= 10V
V
GE
= 12V
V
GE
= 15V
V
GE
= 20V
Common emitter
T
case
= 125C
0
15
30
45
60
75
90
105
0
200
100
400
300
500
600
Collector current, I
C
- (A)
Switching energy, E
sw
- (mJ)
E
on
E
off
E
rec
Conditions:
T
case
= 125C
R
g(on)
= 6.8 ohms
R
g(off)
= 2.4 ohms
V
cc
= 600V
0
15
30
45
60
75
90
105
120
135
150
0
4
8 10
2
6
20
18
12 14 16
22 24 26 28 30
Gate resistance, R
g
- (ohms)
Switching energy, E
sw
- (mJ)
E
on
E
off
E
rec
Conditions:
T
case
= 125C
I
C
= 300A
V
cc
= 600V
0
50
100
150
200
250
300
350
400
450
500
550
600
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
Collector voltage, V
ce
- (V)
Collector current, I
C
- (A)
V
GE
= 10V
V
GE
= 12V
V
GE
= 15V
V
GE
= 20V
Common emitter
T
case
= 25C
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