MP02 XX 260 Series
1/9
Code
Circuit
HB
G
GN
Halfwave, resistive load
Symbol
Parameter
Units
240
A
Conditions
A
T
case
= 75
o
C
T
heatsink
= 75
o
C
T
heatsink
= 85
o
C
T
case
= 85
o
C
T
case
= 75
o
C
I
F(RMS)
RMS value
A
420
Mean forward current
Repetitive
Peak
Voltages
V
RRM
Type
Number
Conditions
MP02/260-16
MP02/260-14
MP02/260-12
MP02/260-10
T
vj
= 150
o
C
I
RM
= 30mA
V
RSM
= V
RRM
+ 100V
1600
1400
1200
1000
Lower voltage grades available. For full description of part
numbers see "Ordering instructions" on page 3.
I
F(AV)
Module outline type code: MP02.
See Package Details for further information.
1
2
3
Max.
267
A
216
A
192
VOLTAGE RATINGS
CURRENT RATINGS - PER ARM
PACKAGE OUTLINE
CIRCUIT OPTIONS
KEY PARAMETERS
V
RRM
1600V
I
FSM
8100A
I
F(AV)
(per arm)
267A
V
isol
2500V
FEATURES
s
Dual Device Module
s
Electrically Isolated Package
s
Pressure Contact Construction
s
International Standard Footprint
s
Alumina (non-toxic) Isolation Medium
APPLICATIONS
s
Rectifier Bridges
s
DC Power Bridges
s
Plating Rectifiers
s
Traction Systems
MP02 XX 260 Series
Dual Diode Modules
Replaces December 1998 version, DS5102-3.0
DS5102-4.0 January 2000
MP02 XX 260 Series
2/9
Symbol
Parameter
Conditions
Max.
Units
A
Symbol
Parameter
Conditions
V
Units
Max.
mA
Forward voltage
30
V
FM
I
RM
Peak reverse current
At V
RRM
, T
j
= 150
o
C
At 600A, T
case
= 25
o
C
V
R
= 0
V
R
= 50% V
RRM
V
R
= 0
V
R
= 50% V
RRM
A
2
s
A
2
s
A
I
2
t for fusing
Surge (non-repetitive) forward current
I
FSM
Symbol
Parameter
Conditions
o
C/W
Units
o
C/W
o
C/W
Thermal resistance - case to heatsink
per Diode
R
th(c-hs)
R
th(j-c)
Virtual junction temperature
T
vj
o
C
o
C
T
sto
Storage temperature range
Mounting torque = 6Nm
with mounting compound
3 phase
halfwave
dc
Commoned terminals to base plate
AC RMS, 1min, 50Hz
Max.
0.22
0.23
150
m
0.667
At T
vj
= 150
o
C
r
T
On-state slope resistance
V
TO
Threshold voltage
V
0.84
At T
vj
= 150
o
C
Thermal resistance - junction to case
per Diode
Isolation voltage
V
isol
2.5
kV
0.07
10ms half sine;
T
j
= 150C
10ms half sine;
T
j
= 150C
I
2
t
-40 to 150
8100
6500
211000
328000
0.21
o
C/W
1.3
SURGE RATINGS - PER ARM
THERMAL & MECHANICAL RATINGS
CHARACTERISTICS
MP02 XX 260 Series
3/9
Part number is made up as follows:
MP02 HB 260 - 12
MP
= Pressure contact module
02
= Outline type
HB
= Circuit configuration code (see "circuit options" - front page)
260
= Nominal average current rating at T
case
= 75
o
C
12
= V
RRM
/100
Examples:
MP02 HB260-12
MP02 G260-16
MP02 GN260-10
Note: Prefered type is HB configuration. G & GN types are available for specific applications, only when requested.
Adequate heatsinking is required to maintain the base
temperature at 75
o
C if full rated current is to be achieved.
Power dissipation may be calculated by use of V
TO
and r
T
information in accordance with standard formulae. We can
provide assistance with calculations or choice of heatsink
if required.
The heatsink surface must be smooth and flat; a surface
finish of N6 (32
in) and a flatness within 0.05mm (0.002")
are recommended.
Immediately prior to mounting, the heatsink surface should
be lightly scrubbed with fine emery, Scotch Brite or a mild
chemical etchant and then cleaned with a solvent to
remove oxide build up and foreign material. Care should
be taken to ensure no foreign particles remain.
An even coating of thermal compound (eg. Unial) should be
applied to both the heatsink and module mounting surfaces.
This should ideally be 0.05mm (0.002") per surface to
ensure optimum thermal performance.
After application of thermal compound, place the module
squarely over the mounting holes, (or 'T' slots) in the
heatsink. Using a torque wrench, slowly tighten the
recommended fixing bolts at each end, rotating each in turn
no more than 1/4 of a revolution at a time. Continue until the
required torque of 6Nm (55lb.ins) is reached at both ends.
It is not acceptable to fully tighten one fixing bolt before
starting to tighten the others. Such action may DAMAGE the
module.
ORDERING INSTRUCTIONS
MOUNTING RECOMMENDATIONS
MP02 XX 260 Series
4/9
CURVES
0
500
1000
1500
2000
2500
Instantaneous forward current I
F
- (A)
Instantaneous forward voltage I
F
- (V)
T
j
= 150C
0.5
1.0
1.5
2.0
0.001
0.010
0.100
1.0
10
100
Time - (s)
0
0.1
0.2
0.3
Thermal Impedance - (C/W)
R
th(j-hs)
R
th(j-c)
Fig. 1 Maximum (limit) forward characteristics (Per diode)
Fig. 2 Transient thermal impedance (DC) - (Per diode)
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