1
LTC2401/LTC2402
1-/2-Channel 24-Bit
Power
No Latency
TM
ADCs in MSOP-10
s
Weight Scales
s
Direct Temperature Measurement
s
Gas Analyzers
s
Strain Gauge Transducers
s
Instrumentation
s
Data Acquisition
s
Industrial Process Control
No Latency
is a trademark of Linear Technology Corporation.
MICROWIRE is a trademark of National Semiconductor Corporation.
Pseudo Differential Bridge Digitizer
, LTC and LT are registered trademarks of Linear Technology Corporation.
The LTC
2401/LTC2402 are 1- and 2-channel 2.7V to 5.5V
micropower 24-bit analog-to-digital converters with an
integrated oscillator, 4ppm INL and 0.6ppm RMS noise.
These ultrasmall devices use delta-sigma technology and
a new digital filter architecture that settles in a single cycle.
This eliminates the latency found in conventional
converters and simplifies multiplexed applications.
Through a single pin, the LTC2401/LTC2402 can be
configured for better than 110dB rejection at 50Hz or
60Hz
2%, or can be driven by an external oscillator for
a user defined rejection frequency in the range 1Hz to
120Hz. The internal oscillator requires no external fre-
quency setting components.
These converters accept an external reference voltage
from 0.1V to V
CC
. With an extended input conversion
range of 12.5% V
REF
to 112.5% V
REF
(V
REF
= FS
SET
ZS
SET
), the LTC2401/LTC2402 smoothly resolve the off-
set and overrange problems of preceding sensors or
signal conditioning circuits.
The LTC2401/LTC2402 communicate through a 2- or
3-wire digital interface that is compatible with SPI and
MICROWIRE
TM
protocols.
s
24-Bit ADCs in Tiny MSOP-10 Packages
s
4ppm INL, No Missing Codes
s
4ppm Full-Scale Error
s
0.5ppm Offset
s
0.6ppm Noise
s
Single Conversion Settling Time for
Multiplexed Applications
s
1- or 2-Channel Inputs
s
Automatic Channel Selection (Ping-Pong) (LTC2402)
s
Zero Scale and Full Scale Set for Reference
and Ground Sensing
s
Internal Oscillator--No External Components Required
s
110dB Min, 50Hz/60Hz Notch Filter
s
Reference Input Voltage: 0.1V to V
CC
s
Live Zero--Extended Input Range Accommodates
12.5% Overrange and Underrange
s
Single Supply 2.7V to 5.5V Operation
s
Low Supply Current (200
A) and Auto Shutdown
ANALOG INPUT RANGE
ZS
SET
0.12V
REF
TO
FS
SET
+ 0.12V
REF
(V
REF
= FS
SET
ZS
SET
)
V
CC
F
O
FS
SET
ZS
SET
SCK
CH1
SDO
GND
CS
REFERENCE VOLTAGE
ZS
SET
+ 0.1V TO V
CC
0V TO FS
SET
100mV
CH0
= INTERNAL OSC/50Hz REJECTION
= EXTERNAL CLOCK SOURCE
= INTERNAL OSC/60Hz REJECTION
3-WIRE
SPI INTERFACE
1
F
1
10
9
8
7
6
2
3
4
5
2.7V TO 5.5V
LTC2402
24012 TA01
V
CC
V
CC
FS
SET
ZS
SET
SCK
CH0
SDO
F
O
CS
CH1
GND
LTC2402
3-WIRE
SPI INTERFACE
INTERNAL OSCILLATOR
60Hz REJECTION
1
9
2.7V TO 5.5V
8
7
10
6
24012TA02
2
4
3
5
FEATURES
DESCRIPTIO
U
APPLICATIO S
U
TYPICAL APPLICATIO
U
2
LTC2401/LTC2402
ORDER PART NUMBER
Consult factory for Military grade parts.
(Notes 1, 2)
Supply Voltage (V
CC
) to GND ....................... 0.3V to 7V
Analog Input Voltage to GND ....... 0.3V to (V
CC
+ 0.3V)
Reference Input Voltage to GND .. 0.3V to (V
CC
+ 0.3V)
Digital Input Voltage to GND ........ 0.3V to (V
CC
+ 0.3V)
Digital Output Voltage to GND ..... 0.3V to (V
CC
+ 0.3V)
T
JMAX
= 125
C,
JA
= 130
C/W
LTC2401CMS
LTC2401IMS
ABSOLUTE
M
AXI
M
U
M
RATINGS
W
W
W
U
PACKAGE/ORDER I
N
FOR
M
ATIO
N
U
U
W
1
2
3
4
5
V
CC
FS
SET
CH1
CH0
ZS
SET
10
9
8
7
6
F
O
SCK
SDO
CS
GND
TOP VIEW
MS10 PACKAGE
10-LEAD PLASTIC MSOP
Operating Temperature Range
LTC2401/LTC2402C ................................ 0
C to 70
C
LTC2401/LTC2402I ............................ 40
C to 85
C
Storage Temperature Range ................. 65
C to 150
C
Lead Temperature (Soldering, 10 sec).................. 300
C
ORDER PART NUMBER
MS10 PART MARKING
LTC2402CMS
LTC2402IMS
LTMD
LTME
MS10 PART MARKING
LTMB
LTMC
T
JMAX
= 125
C,
JA
= 130
C/W
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
Resolution
q
24
Bits
No Missing Codes Resolution
0.1V
FS
SET
V
CC
, ZS
SET
= 0V (Note 5)
q
24
Bits
Integral Nonlinearity
FS
SET
= 2.5V, ZS
SET
= 0V (Note 6)
q
2
10
ppm of V
REF
FS
SET
= 5V, ZS
SET
= 0V (Note 6)
q
4
15
ppm of V
REF
Offset Error
2.5V
FS
SET
V
CC
, ZS
SET
= 0V
q
0.5
2
ppm of V
REF
Offset Error Drift
2.5V
FS
SET
V
CC
, ZS
SET
= 0V
0.01
ppm of V
REF
/
C
Full-Scale Error
2.5V
FS
SET
V
CC
, ZS
SET
= 0V
q
4
10
ppm of V
REF
Full-Scale Error Drift
2.5V
FS
SET
V
CC
, ZS
SET
= 0V
0.04
ppm of V
REF
/
C
Total Unadjusted Error
FS
SET
= 2.5V, ZS
SET
= 0V
5
ppm of V
REF
FS
SET
= 5V, ZS
SET
= 0V
10
ppm of V
REF
Output Noise
V
IN
= 0V (Note 13)
3
V
RMS
Normal Mode Rejection 60Hz
2%
(Note 7)
q
110
130
dB
Normal Mode Rejection 50Hz
2%
(Note 8)
q
110
130
dB
Power Supply Rejection, DC
FS
SET
= 2.5V, ZS
SET
= 0V, V
IN
= 0V
100
dB
Power Supply Rejection, 60Hz
2%
FS
SET
= 2.5V, ZS
SET
= 0V, V
IN
= 0V, (Notes 7, 15)
110
dB
Power Supply Rejection, 50Hz
2%
FS
SET
= 2.5V, ZS
SET
= 0V, V
IN
= 0V, (Notes 8, 15)
110
dB
The
q
denotes specifications which apply over the full operating
temperature range, otherwise specifications are at T
A
= 25
C. V
REF
= FS
SET
ZS
SET
. (Notes 3, 4)
CO
N
VERTER CHARACTERISTICS
U
1
2
3
4
5
V
CC
FS
SET
V
IN
NC
ZS
SET
10
9
8
7
6
TOP VIEW
MS10 PACKAGE
10-LEAD PLASTIC MSOP
F
O
SCK
SDO
CS
GND
3
LTC2401/LTC2402
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
V
IH
High Level Input Voltage
2.7V
V
CC
5.5V
q
2.5
V
CS, F
O
2.7V
V
CC
3.3V
2.0
V
V
IL
Low Level Input Voltage
4.5V
V
CC
5.5V
q
0.8
V
CS, F
O
2.7V
V
CC
5.5V
0.6
V
V
IH
High Level Input Voltage
2.7V
V
CC
5.5V (Note 9)
q
2.5
V
SCK
2.7V
V
CC
3.3V (Note 9)
2.0
V
V
IL
Low Level Input Voltage
4.5V
V
CC
5.5V (Note 9)
q
0.8
V
SCK
2.7V
V
CC
5.5V (Note 9)
0.6
V
I
IN
Digital Input Current
0V
V
IN
V
CC
q
10
10
A
CS, F
O
I
IN
Digital Input Current
0V
V
IN
V
CC
(Note 9)
q
10
10
A
SCK
C
IN
Digital Input Capacitance
10
pF
CS, F
O
C
IN
Digital Input Capacitance
(Note 9)
10
pF
SCK
V
OH
High Level Output Voltage
I
O
= 800
A
q
V
CC
0.5
V
SDO
V
OL
Low Level Output Voltage
I
O
= 1.6mA
q
0.4
V
SDO
V
OH
High Level Output Voltage
I
O
= 800
A (Note 10)
q
V
CC
0.5
V
SCK
V
OL
Low Level Output Voltage
I
O
= 1.6mA (Note 10)
q
0.4
V
SCK
I
OZ
High-Z Output Leakage
q
10
10
A
SDO
DIGITAL I PUTS A D DIGITAL OUTPUTS
U
U
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
V
CC
Supply Voltage
q
2.7
5.5
V
I
CC
Supply Current
Conversion Mode
CS = 0V (Note 12)
q
200
300
A
Sleep Mode
CS = V
CC
(Note 12)
q
20
30
A
POWER REQUIRE E TS
W
U
The
q
denotes specifications which apply over the full
operating temperature range, otherwise specifications are at T
A
= 25
C. (Note 3)
The
q
denotes specifications which apply over the full operating temperature range,
otherwise specifications are at T
A
= 25
C. (Note 3)
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
V
IN
Input Voltage Range
(Note 14)
q
ZS
SET
0.12V
REF
FS
SET
+ 0.12V
REF
V
FS
SET
Full-Scale Set Range
q
0.1 + ZS
SET
V
CC
V
ZS
SET
Zero-Scale Set Range
q
0
FS
SET
0.1
V
C
S(IN)
Input Sampling Capacitance
10
pF
C
S(REF)
Reference Sampling Capacitance
15
pF
I
IN(LEAK)
Input Leakage Current
CS = V
CC
q
10
1
10
nA
I
REF(LEAK)
Reference Leakage Current
V
REF
= 2.5V, CS = V
CC
q
12
1
12
nA
The
q
denotes specifications which apply over the full operating
temperature range, otherwise specifications are at T
A
= 25
C. V
REF
= FS
SET
ZS
SET
. (Note 3)
A ALOG I PUT A D REFERE CE
U
U
U
U
4
LTC2401/LTC2402
The
q
denotes specifications which apply over the full operating temperature
range, otherwise specifications are at T
A
= 25
C. (Note 3)
f
EOSC
External Oscillator Frequency Range
q
2.56
307.2
kHz
t
HEO
External Oscillator High Period
q
0.5
390
s
t
LEO
External Oscillator Low Period
q
0.5
390
s
t
CONV
Conversion Time
F
O
= 0V
q
130.86
133.53
136.20
ms
F
O
= V
CC
q
157.03
160.23
163.44
ms
External Oscillator (Note 11)
q
20510/f
EOSC
(in kHz)
ms
f
ISCK
Internal SCK Frequency
Internal Oscillator (Note 10)
19.2
kHz
External Oscillator (Notes 10, 11)
f
EOSC
/8
kHz
D
ISCK
Internal SCK Duty Cycle
(Note 10)
45
55
%
f
ESCK
External SCK Frequency Range
(Note 9)
q
2000
kHz
t
LESCK
External SCK Low Period
(Note 9)
q
250
ns
t
HESCK
External SCK High Period
(Note 9)
q
250
ns
t
DOUT_ISCK
Internal SCK 32-Bit Data Output Time
Internal Oscillator (Notes 10, 12)
q
1.64
1.67
1.70
ms
External Oscillator (Notes 10, 11)
q
256/f
EOSC
(in kHz)
ms
t
DOUT_ESCK
External SCK 32-Bit Data Output Time
(Note 9)
q
32/f
ESCK
(in kHz)
ms
t
1
CS
to SDO Low Z
q
0
150
ns
t
2
CS
to SDO High Z
q
0
150
ns
t
3
CS
to SCK
(Note 10)
q
0
150
ns
t
4
CS
to SCK
(Note 9)
q
50
ns
t
KQMAX
SCK
to SDO Valid
q
200
ns
t
KQMIN
SDO Hold After SCK
(Note 5)
q
15
ns
t
5
SCK Set-Up Before CS
q
50
ns
t
6
SCK Hold After CS
q
50
ns
SYMBOL
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
Note 1: Absolute Maximum Ratings are those values beyond which the
life of the device may be impaired.
Note 2: All voltage values are with respect to GND.
Note 3: V
CC
= 2.7 to 5.5V unless otherwise specified. Input source
resistance = 0
.
Note 4: Internal Conversion Clock source with the F
O
pin tied
to GND or to V
CC
or to external conversion clock source with
f
EOSC
= 153600Hz unless otherwise specified.
Note 5: Guaranteed by design, not subject to test.
Note 6: Integral nonlinearity is defined as the deviation of a code from
a straight line passing through the actual endpoints of the transfer
curve. The deviation is measured from the center of the quantization
band.
Note 7: F
O
= 0V (internal oscillator) or f
EOSC
= 153600Hz
2%
(external oscillator).
Note 8: F
O
= V
CC
(internal oscillator) or f
EOSC
= 128000Hz
2%
(external oscillator).
Note 9: The converter is in external SCK mode of operation such that
the SCK pin is used as digital input. The frequency of the clock signal
driving SCK during the data output is f
ESCK
and is expressed in kHz.
Note 10: The converter is in internal SCK mode of operation such that
the SCK pin is used as digital output. In this mode of operation, the
SCK pin has a total equivalent load capacitance C
LOAD
= 20pF.
Note 11: The external oscillator is connected to the F
O
pin. The external
oscillator frequency, f
EOSC
, is expressed in kHz.
Note 12: The converter uses the internal oscillator.
F
O
= 0V or F
O
= V
CC
.
Note 13: The output noise includes the contribution of the internal
calibration operations.
Note 14: V
REF
= FS
SET
ZS
SET
. The minimum input voltage is limited
to 0.3V and the maximum to V
CC
+ 0.3V.
Note 15: V
CC
(DC) = 4.1V, V
CC
(AC) = 2.8V
P-P
.
TI I G CHARACTERISTICS
U
W
5
LTC2401/LTC2402
TYPICAL PERFOR A CE CHARACTERISTICS
U
W
Total Unadjusted Error (3V Supply)
INPUT VOLTAGE (V)
0
ERROR (ppm)
0
5
2.0
24012 G01
5
10
0.5
1.0
1.5
2.5
10
V
CC
= 3V
V
REF
= 2.5V
T
A
= 55
C, 45
C, 25
C, 90
C
125
C
INPUT VOLTAGE (V)
0
ERROR (ppm)
0
5
2.0
24012 G02
5
10
0.5
1.0
1.5
3.0
2.5
10
V
CC
= 3V
V
REF
= 2.5V
T
A
= 55
C, 45
C, 25
C, 90
C
125
C
INPUT VOLTAGE (V)
0.3
10
ERROR (ppm)
5
0
5
10
0.25
0.2
0.15
0.1
24012 G03
0.05
0
T
A
= 25
C
T
A
= 45
C
T
A
= 55
C
T
A
= 90
C
T
A
= 125
C
V
CC
= 3V
V
REF
= 2.5V
INL (3V Supply)
Negative Extended Input Range
Total Unadjusted Error (3V Supply)
Positive Extended Input Range
Total Unadjusted Error (3V Supply)
Total Unadjusted Error (5V Supply)
INPUT VOLTAGE (V)
2.5
10
ERROR (ppm)
5
0
5
10
2.55
2.6
2.65
2.7
24012 G04
2.75
2.8
V
CC
= 3V
V
REF
= 2.5V
T
A
= 55
C, 45
C, 25
C, 90
C, 125
C
INPUT VOLTAGE (V)
0
ERROR (ppm)
0
5
4
24012 G05
5
10
1
2
3
5
10
V
CC
= 5V
V
REF
= 5V
T
A
= 55
C, 45
C, 25
C, 90
C, 125
C
INL (5V Supply)
INPUT VOLTAGE (V)
0
ERROR (ppm)
0
5
4
24012 G06
5
10
1
2
2.5
5
10
3
0.5
1.5
4.5
3.5
V
CC
= 5V
V
REF
= 5V
T
A
= 55
C, 45
C, 25
C, 90
C, 125
C
Negative Extended Input Range
Total Unadjusted Error (5V Supply)
Offset Error vs Reference Voltage
INPUT VOLTAGE (V)
0.3
10
ERROR (ppm)
5
0
5
10
0.25
0.2
0.15
0.1
24012 G07
0.05
0
T
A
= 25
C
T
A
= 45
C
T
A
= 55
C
V
CC
= 5V
V
REF
= 5V
T
A
= 90
C
T
A
= 125
C
Positive Extended Input Range
Total Unadjusted Error (5V Supply)
INPUT VOLTAGE (V)
5.0
10
ERROR (ppm)
5
0
5
10
5.05
5.1
5.15
5.2
24012 G08
5.25
5.3
T
A
= 25
C
T
A
= 45
C
T
A
= 55
C
T
A
= 90
C
T
A
= 125
C
V
CC
= 5V
V
REF
= 5V
REFERENCE VOLTAGE (V)
0
OFFSET ERROR (ppm)
30
40
50
4
24012 G09
20
10
0
1
2
3
5
V
CC
= 5V
T
A
= 25
C
6
LTC2401/LTC2402
TYPICAL PERFOR A CE CHARACTERISTICS
U
W
RMS Noise vs Reference Voltage
Offset Error vs V
CC
RMS Noise vs V
CC
REFERENCE VOLTAGE (V)
0
RMS NOISE (ppm OF V
REF
)
12
16
20
4
24012 G10
8
4
10
14
18
6
2
0
1
2
3
5
V
CC
= 5V
T
A
= 25
C
V
CC
2.7
5.0
OFFSET ERROR (ppm)
2.5
0
2.5
5.0
3.2
3.7
4.2
4.7
24012 G11
5.2
V
REF
= 2.5V
T
A
= 25
C
V
CC
2.7
0
RMS NOISE (ppm)
2.5
5.0
3.2
3.7
4.2
4.7
24012 G12
5.2
V
REF
= 2.5V
T
A
= 25
C
Noise Histogram
RMS Noise vs Code Out
Offset Error vs Temperature
OUTPUT CODE (ppm)
2
250
300
350
2
24012 G13
200
150
1
0
1
3
100
50
0
NUMBER OF READINGS
V
CC
= 5V
V
REF
= 5V
V
IN
= 0V
CODE OUT (HEX)
0.3
RMS NOISE (ppm)
0.50
0.75
5.3
24012 G14
0.25
0
2.5
1.00
V
CC
= 5V
V
REF
= 5V
V
IN
= 0.3V TO 5.3V
T
A
= 25
C
TEMPERATURE (
C)
55
5.0
OFFSET ERROR (ppm)
2.5
0
2.5
5.0
30
5
20
45
24012 G15
70
95
120
V
CC
= 5V
V
REF
= 5V
V
IN
= 0V
Full-Scale Error vs Temperature
Full-Scale Error
vs Reference Voltage
Full-Scale Error vs V
CC
TEMPERATURE (
C)
55
5.0
FULL-SCALE ERROR (ppm)
2.5
0
2.5
5.0
30
5
20
45
24012 G16
70
95
120
V
CC
= 5V
V
REF
= 5V
V
IN
= 5V
REFERENCE VOLTAGE (V)
0
0
FULL-SCALE ERROR (ppm)
10
20
30
40
50
60
1
2
3
4
24012 G17
5
V
CC
= 5V
V
IN
= V
REF
V
CC
2.7
0
FULL-SCALE ERROR (ppm)
3
2
1
6
5
4
3.2
3.7
4.2
4.7
24012 G18
5.2
V
REF
= 2.5V
V
IN
= 2.5V
T
A
= 25
C
7
LTC2401/LTC2402
TYPICAL PERFOR A CE CHARACTERISTICS
U
W
Conversion Current
vs Temperature
Sleep Current vs Temperature
Rejection vs Frequency at V
IN
Rejection vs Frequency at V
IN
Rejection vs Frequency at V
IN
Rejection vs Frequency at V
IN
TEMPERATURE (
C)
55
SUPPLY CURRENT (
A)
220
20
24012 G19
190
170
30
5
45
160
150
230
210
200
180
70
95
120
V
CC
= 5.5V
V
CC
= 4.1V
V
CC
= 2.7V
TEMPERATURE (
C)
55
0
SUPPLY CURRENT (
A)
10
20
30
30
5
20
45
24012 G20
70
95
120
V
CC
= 2.7V
V
CC
= 5V
FREQUENCY AT V
CC
(Hz)
1
120
REJECTION (dB)
105
90
75
60
100
10k
24012 G21
1M
V
CC
= 4.1V
V
IN
= 0V
T
A
= 25
C
F
O
= 0
Rejection vs Frequency at V
CC
Rejection vs Frequency at V
CC
FREQUENCY AT V
CC
(Hz)
0
REJECTION (dB)
80
60
200
24012 G22
100
120
50
100
150
250
40
V
CC
= 4.1V
V
IN
= 0V
T
A
= 25
C
F
O
= 0
Rejection vs Frequency at V
CC
FREQUENCY AT V
CC
(Hz)
15200
120
REJECTION (dB)
105
90
75
60
15250 15300 15350 15400
24012 G23
15450 15500
V
CC
= 4.1V
V
IN
= 0V
T
A
= 25
C
F
O
= 0
FREQUENCY AT V
IN
(Hz)
1
120
REJECTION (dB)
100
80
60
40
20
0
50
100
150
200
24012 G24
250
V
CC
= 5V
V
REF
= 5V
V
IN
= 2.5V
F
O
= 0
INPUT FREQUENCY DEVIATION FROM NOTCH FREQUENCY (%)
12
8
4
0
4
8
12
REJECTION (dB)
24012 G25
60
70
80
90
100
110
120
130
140
FREQUENCY AT V
IN
(Hz)
15100
120
REJECTION (dB)
100
80
60
40
20
0
15200
15300
15400
15500
24012 G26
V
CC
= 5V
V
REF
= 5V
V
IN
= 2.5V
F
O
= 0
SAMPLE RATE = 15.36kHz
2%
INPUT FREQUENCY
0
60
40
0
24012 G27
80
100
f
S
/2
f
S
120
140
20
REJECTION (dB)
8
LTC2401/LTC2402
TYPICAL PERFOR A CE CHARACTERISTICS
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V
CC
(Pin 1): Positive Supply Voltage. Bypass to GND
(Pin 6) with a 10
F tantalum capacitor in parallel with
0.1
F ceramic capacitor as close to the part as possible.
FS
SET
(Pin 2): Full-Scale Set Input. This pin defines the
full-scale input value. When V
IN
= FS
SET
, the ADC outputs
full scale (FFFFF
H
). The total reference voltage is
FS
SET
ZS
SET
.
CH0, CH1 (Pins 4, 3): Analog Input Channels. The input
voltage range is 0.125 V
REF
to 1.125 V
REF
. For
V
REF
> 2.5V, the input voltage range may be limited by the
absolute maximum rating of 0.3V to V
CC
+ 0.3V. Conver-
sions are performed alternately between CH0
and CH1 for the LTC2402. Pin 4 is a No Connect (NC) on
the LTC2401.
ZS
SET
(Pin 5): Zero-Scale Set Input. This pin defines the
zero-scale input value. When V
IN
= ZS
SET
, the ADC
outputs zero scale (00000
H
).
GND (Pin 6): Ground. Shared pin for analog ground,
digital ground, reference ground and signal ground. Should
be connected directly to a ground plane through a mini-
mum length trace or it should be the single-point-ground
in a single-point grounding system.
CS (Pin 7): Active LOW Digital Input. A LOW on this pin
enables the SDO digital output and wakes up the ADC.
Following each conversion, the ADC automatically enters
the Sleep mode and remains in this low power state as
long as CS is HIGH. A LOW on CS wakes up the ADC. A
LOW-to-HIGH transition on this pin disables the SDO
digital output. A LOW-to-HIGH transition on CS during the
Data Output transfer aborts the data transfer and starts a
new conversion.
SDO (Pin 8): Three-State Digital Output. During the data
output period, this pin is used for serial data output. When
the chip select CS is HIGH (CS = V
CC
), the SDO pin is in a
high impedance state. During the Conversion and Sleep
periods, this pin can be used as a conversion status out-
put. The conversion status can be observed by pulling CS
LOW.
INL vs Output Rate
OUTPUT RATE (Hz)
0
INL (BITS)
16
20
80
24012 G28
12
8
20
40
60
100
24
V
CC
= 5V
V
REF
= 5V
F
O
= EXTERNAL
T
A
= 55
C
T
A
= 25
C
T
A
= 90
C
Resolution vs Output Rate
OUTPUT RATE (Hz)
0
RESOLUTION (BITS)
16
20
80
24012 G29
12
8
20
40
60
100
24
V
CC
= 5V
V
REF
= 5V
F
O
= EXTERNAL
T
A
= 55
C
T
A
= 25
C
T
A
= 90
C
9
LTC2401/LTC2402
PI
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SCK (Pin 9): Bidirectional Digital Clock Pin. In the Internal
Serial Clock Operation mode, SCK is used as digital output
for the internal serial interface clock during the data output
period. In the External Serial Clock Operation mode, SCK
is used as digital input for the external serial interface. An
internal pull-up current source is automatically activated
in Internal Serial Clock Operation mode. The Serial Clock
mode is determined by the level applied to SCK at power
up and the falling edge of CS.
F
O
(Pin 10): Frequency Control Pin. Digital input that
controls the ADC's notch frequencies and conversion
time. When the F
O
pin is connected to V
CC
(F
O
= V
CC
), the
converter uses its internal oscillator and the digital filter's
first null is located at 50Hz. When the F
O
pin is connected
to GND (F
O
= 0V), the converter uses its internal oscillator
and the digital filter's first null is located at 60Hz. When F
O
is driven by an external clock signal with a frequency f
EOSC
,
the converter uses this signal as its clock and the digital
filter first null is located at a frequency f
EOSC
/2560.
FU
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AL BLOCK DIAGRA
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TEST CIRCUITS
3.4k
SDO
24012 TC01
Hi-Z TO V
OH
V
OL
TO V
OH
V
OH
TO Hi-Z
C
LOAD
= 20pF
3.4k
SDO
24012 TC02
Hi-Z TO V
OL
V
OH
TO V
OL
V
OL
TO Hi-Z
C
LOAD
= 20pF
V
CC
AUTOCALIBRATION
AND CONTROL
DAC
DECIMATING FIR
INTERNAL
OSCILLATOR
SERIAL
INTERFACE
ADC
GND
V
CC
V
IN
SDO
SCK
V
REF
CS
F
O
(INT/EXT)
24012 FD
10
LTC2401/LTC2402
APPLICATIO S I FOR ATIO
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Converter Operation Cycle
The LTC2401/LTC2402 are low power, delta-sigma ana-
log-to-digital converters with an easy to use 3-wire serial
interface. Their operation is simple and made up of three
states. The converter operating cycle begins with the
conversion, followed by a low power sleep state and
concluded with the data output (see Figure 1). The 3-wire
interface consists of serial data output (SDO), a serial
clock (SCK) and a chip select (CS).
Initially, the LTC2401/LTC2402 perform a conversion.
Once the conversion is complete, the device enters the
sleep state. While in this sleep state, power consumption
is reduced by an order of magnitude. The part remains in
the sleep state as long as CS is logic HIGH. The conversion
result is held indefinitely in a static shift register while the
converter is in the sleep state.
Once CS is pulled low, the device begins outputting the
conversion result. There is no latency in the conversion
result. The data output corresponds to the conversion just
performed. This result is shifted out on the serial data out
pin (SDO) under the control of the serial clock (SCK). Data
is updated on the falling edge of SCK allowing the user to
reliably latch data on the rising edge of SCK, see Figure 3.
The data output state is concluded once 32 bits are read
out of the ADC or when CS is brought HIGH. The device
automatically initiates a new conversion cycle and the
cycle repeats.
Through timing control of the CS and SCK pins, the
LTC2401/LTC2402 offer several flexible modes of opera-
tion (internal or external SCK and free-running conversion
modes). These various modes do not require program-
ming configuration registers; moreover, they do not dis-
turb the cyclic operation described above. These modes of
operation are described in detail in the Serial Interface
Timing Modes section.
Conversion Clock
A major advantage delta-sigma converters offer over
conventional type converters is an on-chip digital filter
(commonly known as Sinc or Comb filter). For high
resolution, low frequency applications, this filter is typi-
cally designed to reject line frequencies of 50Hz or 60Hz
plus their harmonics. In order to reject these frequencies
in excess of 110dB, a highly accurate conversion clock is
required. The LTC2401/LTC2402 incorporate an on-chip
highly accurate oscillator. This eliminates the need for
external frequency setting components such as crystals or
oscillators. Clocked by the on-chip oscillator, the LTC2401/
LTC2402 reject line frequencies (50Hz or 60Hz
2%) a
minimum of 110dB.
Ease of Use
The LTC2401/LTC2402 data output has no latency, filter
settling or redundant data associated with the conversion
cycle. There is a one-to-one correspondence between the
conversion and the output data. Therefore, multiplexing
an analog input voltage is easy.
The LTC2401/LTC2402 perform offset and full-scale cali-
brations every conversion cycle. This calibration is trans-
parent to the user and has no effect on the cyclic operation
described above. The advantage of continuous calibration
is extreme stability of offset and full-scale readings with
respect to time, supply voltage change and temperature
drift.
Power-Up Sequence
The LTC2401/LTC2402 automatically enter an internal
reset state when the power supply voltage V
CC
drops
below approximately 2.2V. This feature guarantees the
CONVERT
SLEEP
DATA OUTPUT
24012 F01
0
1 CS AND
SCK
Figure 1. LTC2401/LTC2402 State Transition Diagram
11
LTC2401/LTC2402
integrity of the conversion result and of the serial interface
mode selection which is performed at the initial power-up.
(See the 2-wire I/O sections in the Serial Interface Timing
Modes section.)
When the V
CC
voltage rises above this critical threshold,
the converter creates an internal power-on-reset (POR)
signal with duration of approximately 0.5ms. The POR
signal clears all internal registers. Following the POR
signal, the LTC2401/LTC2402 start a normal conversion
cycle and follows the normal succession of states de-
scribed above. The first conversion result following POR
is accurate within the specifications of the device.
Reference Voltage Range
The LTC2401/LTC2402 can accept a reference voltage
(V
REF
= FS
SET
ZS
SET
) from 0V to V
CC
. The converter
output noise is determined by the thermal noise of the
front-end circuits, and as such, its value in microvolts is
nearly constant with reference voltage. A decrease in
reference voltage will not significantly improve the
converter's effective resolution. On the other hand, a
reduced reference voltage will improve the overall con-
verter INL performance. The recommended range for the
LTC2401/LTC2402 voltage reference is 100mV to V
CC
.
Input Voltage Range
The converter is able to accommodate system level
offset and gain errors as well as system level overrange
situations due to its extended input range, see Figure 2.
The LTC2401/LTC2402 convert input signals within the
extended input range of 0.125 V
REF
to 1.125 V
REF
(V
REF
= FS
SET
ZS
SET
).
For large values of V
REF
(V
REF
= FS
SET
ZS
SET
), this range
is limited by the absolute maximum voltage range of
0.3V to (V
CC
+ 0.3V). Beyond this range, the input ESD
protection devices begin to turn on and the errors due to
the input leakage current increase rapidly.
Input signals applied to V
IN
may extend below ground by
300mV and above V
CC
by 300mV. In order to limit any
fault current, a resistor of up to 5k may be added in series
with the V
IN
pin without affecting the performance of the
device. In the physical layout, it is important to maintain
APPLICATIO S I FOR ATIO
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the parasitic capacitance of the connection between this
series resistance and the V
IN
pin as low as possible;
therefore, the resistor should be located as close as
practical to the V
IN
pin. The effect of the series resistance
on the converter accuracy can be evaluated from the
curves presented in the Analog Input/Reference Current
section. In addition, a series resistor will introduce a
temperature dependent offset error due to the input leak-
age current. A 1nA input leakage current will develop a
1ppm offset error on a 5k resistor if V
REF
= 5V. This error
has a very strong temperature dependency.
Output Data Format
The LTC2401/LTC2402 serial output data stream is 32 bits
long. The first 4 bits represent status information indicat-
ing the sign, selected channel, input range and conversion
state. The next 24 bits are the conversion result, MSB first.
The remaining 4 bits are sub LSBs beyond the 24-bit level
that may be included in averaging or discarded without
loss of resolution.
Bit 31 (first output bit) is the end of conversion (EOC)
indicator. This bit is available at the SDO pin during the
conversion and sleep states whenever the CS pin is LOW.
This bit is HIGH during the conversion and goes LOW when
the conversion is complete.
Bit 30 (second output bit) for the LTC2402, this bit is LOW
if the last conversion was performed on CH0 and HIGH for
CH1. This bit is always low for the LTC2401.
24012 F02
V
CC
+ 0.3V
FS
SET
+ 0.12V
REF
FS
SET
0.3V
(V
REF
= FS
SET
ZS
SET
)
ZS
SET
0.12V
REF
ZS
SET
NORMAL
INPUT
RANGE
EXTENDED
INPUT
RANGE
ABSOLUTE
MAXIMUM
INPUT
RANGE
Figure 2. LTC2401/LTC2402 Input Range
12
LTC2401/LTC2402
APPLICATIO S I FOR ATIO
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Figure 3. Output Data Timing
Bit 29 (third output bit) is the conversion result sign indi-
cator (SIG). If V
IN
is >0, this bit is HIGH. If V
IN
is <0, this
bit is LOW. The sign bit changes state during the zero code.
Bit 28 (forth output bit) is the extended input range (EXR)
indicator. If the input is within the normal input range
0
V
IN
V
REF
, this bit is LOW. If the input is outside the
normal input range, V
IN
> V
REF
or V
IN
< 0, this bit is HIGH.
The function of these bits is summarized in Table 1.
Table 1. LTC2401/LTC2402 Status Bits
Bit 31
Bit 30
Bit 29
Bit 28
Input Range
EOC
CH0/CH1
SIG
EXR
V
IN
> V
REF
0
0/1
1
1
0 < V
IN
V
REF
0
0/1
1
0
V
IN
= 0
+
/0
0
0/1
1/0
0
V
IN
< 0
0
0/1
0
1
Bit 27 (fifth output bit) is the most significant bit (MSB).
Bits 27-4 are the 24-bit conversion result MSB first.
Bit 4 is the least significant bit (LSB).
Bits 3-0 are sub LSBs below the 24-bit level. Bits 3-0 may
be included in averaging or discarded without loss of
resolution.
Data is shifted out of the SDO pin under control of the serial
clock (SCK), see Figure 3. Whenever CS is HIGH, SDO
remains high impedance and any SCK clock pulses are
ignored by the internal data out shift register.
In order to shift the conversion result out of the device, CS
must first be driven LOW. EOC is seen at the SDO pin of the
device once CS is pulled LOW. EOC changes real time from
HIGH to LOW at the completion of a conversion. This
signal may be used as an interrupt for an external micro-
controller. Bit 31 (EOC) can be captured on the first rising
edge of SCK. Bit 30 is shifted out of the device on the first
falling edge of SCK. The final data bit (Bit 0) is shifted out
on the falling edge of the 31st SCK and may be latched on
the rising edge of the 32nd SCK pulse. On the falling edge
of the 32nd SCK pulse, SDO goes HIGH indicating a new
conversion cycle has been initiated. This bit serves as EOC
(Bit 31) for the next conversion cycle. Table 2 summarizes
the output data format.
As long as the voltage on the V
IN
pin is maintained within
the 0.3V to (V
CC
+ 0.3V) absolute maximum operating
range, a conversion result is generated for any input value
from 0.125 V
REF
to 1.125 V
REF
.
For input voltages
greater than 1.125 V
REF
, the conversion result is clamped
to the value corresponding to 1.125 V
REF
. For input
voltages below 0.125 V
REF
, the conversion result is
clamped to the value corresponding to 0.125 V
REF
.
Frequency Rejection Selection (F
O
Pin Connection)
The LTC2401/LTC2402 internal oscillator provides better
than 110dB normal mode rejection at the line frequency
and all its harmonics for 50Hz
2% or 60Hz
2%. For
60Hz rejection, F
O
(Pin 10) should be connected to GND
(Pin 6) while for 50Hz rejection the F
O
pin should be
connected to V
CC
(Pin 1).
The selection of 50Hz or 60Hz rejection can also be made
by driving F
O
to an appropriate logic level. A selection
change during the sleep or data output states will not
MSB
EXT
SIG
CH0/CH1
1
2
3
4
5
27
28
32
BIT 0
BIT 27
BIT 4
LSB
24
BIT 28
BIT 29
BIT 30
SDO
SCK
CS
EOC
BIT 31
SLEEP
DATA OUTPUT
CONVERSION
24012 F03
Hi-Z
13
LTC2401/LTC2402
APPLICATIO S I FOR ATIO
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Table 2. LTC2401/LTC2402 Output Data Format
Bit 31
Bit 30
Bit 29
Bit 28
Bit 27
Bit 26
Bit 25
Bit 24
Bit 23
...
Bit 4
Bit 3-0
Input Voltage
EOC
CH SELECT
SIG
EXR
MSB
LSB
SUB LSBs*
V
IN
> 9/8 V
REF
0
CH0/CH1
1
1
0
0
0
1
1
...
1
X
9/8 V
REF
0
CH0/CH1
1
1
0
0
0
1
1
...
1
X
V
REF
+ 1LSB
0
CH0/CH1
1
1
0
0
0
0
0
...
0
X
V
REF
0
CH0/CH1
1
0
1
1
1
1
1
...
1
X
3/4V
REF
+ 1LSB
0
CH0/CH1
1
0
1
1
0
0
0
...
0
X
3/4V
REF
0
CH0/CH1
1
0
1
0
1
1
1
...
1
X
1/2V
REF
+ 1LSB
0
CH0/CH1
1
0
1
0
0
0
0
...
0
X
1/2V
REF
0
CH0/CH1
1
0
0
1
1
1
1
...
1
X
1/4V
REF
+ 1LSB
0
CH0/CH1
1
0
0
1
0
0
0
...
0
X
1/4V
REF
0
CH0/CH1
1
0
0
0
1
1
1
...
1
X
0
+
/0
0
CH0/CH1
1/0**
0
0
0
0
0
0
...
0
X
1LSB
0
CH0/CH1
0
1
1
1
1
1
1
...
1
X
1/8 V
REF
0
CH0/CH1
0
1
1
1
1
0
0
...
0
X
V
IN
< 1/8 V
REF
0
CH0/CH1
0
1
1
1
1
0
0
...
0
X
*The sub LSBs are valid conversion results beyond the 24-bit level that may be included in averaging or discarded without loss of resolution.
**The sign bit changes state during the 0 code.
disturb the converter operation. If the selection is made
during the conversion state, the result of the conversion in
progress may be outside specifications but the following
conversions will not be affected.
When a fundamental rejection frequency different from
50Hz or 60Hz is required or when the converter must be
synchronized with an outside source, the LTC2401/
LTC2402 can operate with an external conversion clock.
The converter automatically detects the presence of an
external clock signal at the F
O
pin and turns off the internal
oscillator. The frequency f
EOSC
of the external signal must
be at least 2560Hz (1Hz notch frequency) to be detected.
The external clock signal duty cycle is not significant as
long as the minimum and maximum specifications for the
high and low periods t
HEO
and t
LEO
are observed.
While operating with an external conversion clock of a
frequency f
EOSC
, the LTC2401/LTC2402 provide better
than 110dB normal mode rejection in a frequency range
f
EOSC
/2560
4% and its harmonics. The normal mode
rejection as a function of the input frequency deviation
from f
EOSC
/2560 is shown in Figure 4.
Whenever an external clock is not present at the F
O
pin, the
converter automatically activates its internal oscillator and
enters the Internal Conversion Clock mode. The LTC2401/
LTC2402 operation will not be disturbed if the change of
conversion clock source occurs during the sleep state or
during the data output state while the converter uses an
INPUT FREQUENCY DEVIATION FROM NOTCH FREQUENCY (%)
12
8
4
0
4
8
12
REJECTION (dB)
24012 F04
60
70
80
90
100
110
120
130
140
Figure 4. LTC2401/LTC2402 Normal Mode Rejection When
Using an External Oscillator of Frequency f
EOSC
14
LTC2401/LTC2402
external serial clock. If the change occurs during the
conversion state, the result of the conversion in progress
may be outside specifications but the following conver-
sions will not be affected. If the change occurs during the
data output state and the converter is in the Internal SCK
mode, the serial clock duty cycle may be affected but the
serial data stream will remain valid.
Table 3 summarizes the duration of each state as a
function of F
O
.
SERIAL INTERFACE
The LTC2401/LTC2402 transmit the conversion results
and receives the start of conversion command through a
synchronous 3-wire interface. During the conversion and
sleep states, this interface can be used to assess the
converter status and during the data output state it is used
to read the conversion result.
Serial Clock Input/Output (SCK)
The serial clock signal present on SCK (Pin 9) is used to
synchronize the data transfer. Each bit of data is shifted out
the SDO pin on the falling edge of the serial clock.
In the Internal SCK mode of operation, the SCK pin is an
output and the LTC2401/LTC2402 create their own serial
clock by dividing the internal conversion clock by 8. In the
External SCK mode of operation, the SCK pin is used as
input. The internal or external SCK mode is selected on
power-up and then reselected every time a HIGH-to-LOW
transition is detected at the CS pin. If SCK is HIGH or float-
ing at power-up or during this transition, the converter
enters the internal SCK mode. If SCK is LOW at power-up
or during this transition, the converter enters the external
SCK mode.
Serial Data Output (SDO)
The serial data output pin, SDO (Pin 8), drives the serial
data during the data output state. In addition, the SDO pin
is used as an end of conversion indicator during the
conversion and sleep states.
When CS (Pin 7) is HIGH, the SDO driver is switched to a
high impedance state. This allows sharing the serial
interface with other devices. If CS is LOW during the
convert or sleep state, SDO will output EOC. If CS is LOW
during the conversion phase, the EOC bit appears HIGH on
the SDO pin. Once the conversion is complete, EOC goes
LOW. The device remains in the sleep state until the first
rising edge of SCK occurs while CS = 0.
Chip Select Input (CS)
The active LOW chip select, CS (Pin 7), is used to test the
conversion status and to enable the data output transfer as
described in the previous sections.
Table 3. LTC2401/LTC2402 State Duration
State
Operating Mode
Duration
CONVERT
Internal Oscillator
F
O
= LOW
133ms
(60Hz Rejection)
F
O
= HIGH
160ms
(50Hz Rejection)
External Oscillator
F
O
= External Oscillator
20510/f
EOSC
s
with Frequency f
EOSC
kHz
(f
EOSC
/2560 Rejection)
SLEEP
As Long As CS = HIGH Until CS = 0 and SCK
DATA OUTPUT
Internal Serial Clock
F
O
= LOW/HIGH
As Long As CS = LOW But Not Longer Than 1.67ms
(Internal Oscillator)
(32 SCK cycles)
F
O
= External Oscillator with
As Long As CS = LOW But Not Longer Than 256/f
EOSC
ms
Frequency f
EOSC
kHz
(32 SCK cycles)
External Serial Clock with
As Long As CS = LOW But Not Longer Than 32/f
SCK
ms
Frequency f
SCK
kHz
(32 SCK cycles)
APPLICATIO S I FOR ATIO
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15
LTC2401/LTC2402
In addition, the CS signal can be used to trigger a new
conversion cycle before the entire serial data transfer has
been completed. The LTC2401/LTC2402 will abort any
serial data transfer in progress and start a new conversion
cycle anytime a LOW-to-HIGH transition is detected at the
CS pin after the converter has entered the data output state
(i.e., after the first rising edge of SCK occurs with CS = 0).
Finally, CS can be used to control the free-running modes
of operation, see Serial Interface Timing Modes section.
Grounding CS will force the ADC to continuously convert
at the maximum output rate selected by F
O
. Tying a
capacitor to CS will reduce the output rate and power
dissipation by a factor proportional to the capacitor's
value, see Figures 12 to 14.
SERIAL INTERFACE TIMING MODES
The LTC2401/LTC2402's 3-wire interface is SPI and
MICROWIRE compatible. This interface offers several
flexible modes of operation. These include internal/exter-
nal serial clock, 2- or 3-wire I/O, single cycle conversion
and autostart. The following sections describe each of
these serial interface timing modes in detail. In all these
cases, the converter can use the internal oscillator (F
O
=
LOW or F
O
= HIGH) or an external oscillator connected to
the F
O
pin. Refer to Table 4 for a summary.
External Serial Clock, Single Cycle Operation
(SPI/MICROWIRE Compatible)
This timing mode uses an external serial clock to shift out
the conversion result and a CS signal to monitor and
control the state of the conversion cycle, see Figure 5.
The serial clock mode is selected on the falling edge of CS.
To select the external serial clock mode, the serial clock pin
(SCK) must be LOW during each CS falling edge.
The serial data output pin (SDO) is Hi-Z as long as CS is
HIGH. At any time during the conversion cycle, CS may be
pulled LOW in order to monitor the state of the converter.
While CS is pulled LOW, EOC is output to the SDO pin. EOC
= 1 while a conversion is in progress and EOC = 0 if the
device is in the sleep state. Independent of CS, the device
automatically enters the low power sleep state once the
conversion is complete.
When the device is in the sleep state (EOC = 0), its
conversion result is held in an internal static shift register.
The device remains in the sleep state until the first rising
edge of SCK is seen while CS is LOW. Data is shifted out
the SDO pin on each falling edge of SCK. This enables
external circuitry to latch the output on the rising edge of
SCK. EOC can be latched on the first rising edge of SCK
and the last bit of the conversion result can be latched on
the 32nd rising edge of SCK. On the 32nd falling edge of
SCK, the device begins a new conversion. SDO goes HIGH
(EOC = 1) indicating a conversion is in progress.
At the conclusion of the data cycle, CS may remain LOW
and EOC monitored as an end-of-conversion interrupt.
Alternatively, CS may be driven HIGH setting SDO to Hi-Z.
As described above, CS may be pulled LOW at any time in
order to monitor the conversion status.
Typically, CS remains LOW during the data output state.
However, the data output state may be aborted by pulling
CS HIGH anytime between the first rising edge and the
32nd falling edge of SCK, see Figure 6. On the rising edge
Table 4. LTC2401/LTC2402 Interface Timing Modes
Conversion
Data
Connection
SCK
Cycle
Output
and
Configuration
Source
Control
Control
Waveforms
External SCK, Single Cycle Conversion
External
CS and SCK
CS and SCK
Figures 5, 6
External SCK, 2-Wire I/O
External
SCK
SCK
Figure 7
Internal SCK, Single Cycle Conversion
Internal
CS
CS
Figures 8, 9
Internal SCK, 2-Wire I/O, Continuous Conversion
Internal
Continuous
Internal
Figure 10
Internal SCK, Autostart Conversion
Internal
C
EXT
Internal
Figure 11
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Figure 5. External Serial Clock, Single Cycle Operation
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EOC
BIT 31
SDO
SCK
(EXTERNAL)
CS
TEST EOC
MSB
SUB LSB
EXR
CH0/CH1
BIT 0
LSB
BIT 4
BIT 27
BIT 26
BIT 28
BIT 29
BIT 30
SLEEP
DATA OUTPUT
CONVERSION
24012 F05
CONVERSION
Hi-Z
Hi-Z
Hi-Z
TEST EOC
TEST EOC
V
CC
F
O
FS
SET
ZS
SET
SCK
CH1
SDO
GND
CS
REFERENCE VOLTAGE
ZS
SET
+ 0.1V TO V
CC
0V TO FS
SET
100mV
CH0
= INTERNAL OSC/50Hz REJECTION
= EXTERNAL CLOCK SOURCE
= INTERNAL OSC/60Hz REJECTION
1
F
1
10
9
8
7
6
2
3
4
5
2.7V TO 5.5V
LTC2402
V
CC
3-WIRE
SERIAL I/O
ANALOG INPUT RANGE
ZS
SET
0.12V
REF
TO
FS
SET
+ 0.12V
REF
(V
REF
= FS
SET
ZS
SET
)
SDO
SCK
(EXTERNAL)
CS
DATA OUTPUT
CONVERSION
SLEEP
SLEEP
TEST EOC
TEST EOC
DATA OUTPUT
Hi-Z
Hi-Z
Hi-Z
CONVERSION
24012 F06
MSB
EXR
SIG
CH0/CH1
BIT 8
BIT 27
BIT 9
BIT 28
BIT 29
BIT 30
EOC
BIT 31
BIT 0
EOC
Hi-Z
TEST EOC
V
CC
F
O
FS
SET
ZS
SET
SCK
CH1
SDO
GND
CS
REFERENCE VOLTAGE
ZS
SET
+ 0.1V TO V
CC
0V TO FS
SET
100mV
CH0
= INTERNAL OSC/50Hz REJECTION
= EXTERNAL CLOCK SOURCE
= INTERNAL OSC/60Hz REJECTION
1
F
1
10
9
8
7
6
2
3
4
5
2.7V TO 5.5V
LTC2402
V
CC
3-WIRE
SERIAL I/O
ANALOG INPUT RANGE
ZS
SET
0.12V
REF
TO
FS
SET
+ 0.12V
REF
(V
REF
= FS
SET
ZS
SET
)
Figure 6. External Serial Clock, Reduced Data Output Length
17
LTC2401/LTC2402
of CS, the device aborts the data output state and imme-
diately initiates a new conversion. This is useful for
systems not requiring all 32 bits of output data, aborting
an invalid conversion cycle or synchronizing the start of a
conversion.
External Serial Clock, 2-Wire I/O
This timing mode utilizes a 2-wire serial I/O interface. The
conversion result is shifted out of the device by an exter-
nally generated serial clock (SCK) signal, see Figure 7. CS
may be permanently tied to ground (Pin 6), simplifying the
user interface or isolation barrier.
The external serial clock mode is selected at the end of the
power-on reset (POR) cycle. The POR cycle is concluded
approximately 0.5ms after V
CC
exceeds 2.2V. The level
applied to SCK at this time determines if SCK is internal or
external. SCK must be driven LOW prior to the end of POR
in order to enter the external serial clock timing mode.
Since CS is tied LOW, the end-of-conversion (EOC) can
be continuously monitored at the SDO pin during the
convert and sleep states. EOC may be used as an inter-
rupt to an external controller indicating the conversion
result is ready. EOC = 1 while the conversion is in
progress and EOC = 0 once the conversion enters the low
power sleep state. On the falling edge of EOC, the conver-
sion result is loaded into an internal static shift register.
The device remains in the sleep state until the first rising
edge of SCK. Data is shifted out the SDO pin on each
falling edge of SCK enabling external circuitry to latch
data on the rising edge of SCK. EOC can be latched on the
first rising edge of SCK. On the 32nd falling edge of SCK,
SDO goes HIGH (EOC = 1) indicating a new conversion
has begun.
Internal Serial Clock, Single Cycle Operation
This timing mode uses an internal serial clock to shift out
the conversion result and a CS signal to monitor and
control the state of the conversion cycle, see Figure 8.
In order to select the internal serial clock timing mode, the
serial clock pin (SCK) must be floating (Hi-Z) or pulled
HIGH prior to the falling edge of CS. The device will not
enter the internal serial clock mode if SCK is driven LOW
on the falling edge of CS. An internal weak pull-up resistor
is active on the SCK pin during the falling edge of CS;
therefore, the internal serial clock timing mode is auto-
matically selected if SCK is not externally driven.
Figure 7. External Serial Clock, CS = 0 Operation
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EOC
BIT 31
SDO
SCK
(EXTERNAL)
CS
MSB
EXR
SIG
CH0/CH1
BIT 0
LSB
24
BIT 4
BIT 27
BIT 26
BIT 28
BIT 29
BIT 30
SLEEP
DATA OUTPUT
CONVERSION
24012 F07
CONVERSION
V
CC
F
O
FS
SET
ZS
SET
SCK
CH1
SDO
GND
CS
REFERENCE VOLTAGE
ZS
SET
+ 0.1V TO V
CC
0V TO FS
SET
100mV
CH0
= INTERNAL OSC/50Hz REJECTION
= EXTERNAL CLOCK SOURCE
= INTERNAL OSC/60Hz REJECTION
1
F
1
10
9
2-WIRE SERIAL I/O
8
7
6
2
3
4
5
2.7V TO 5.5V
LTC2402
V
CC
ANALOG INPUT RANGE
ZS
SET
0.12V
REF
TO
FS
SET
+ 0.12V
REF
(V
REF
= FS
SET
ZS
SET
)
18
LTC2401/LTC2402
The serial data output pin (SDO) is Hi-Z as long as CS is
HIGH. At any time during the conversion cycle, CS may be
pulled LOW in order to monitor the state of the converter.
Once CS is pulled LOW, SCK goes LOW and EOC is output
to the SDO pin. EOC = 1 while a conversion is in progress
and EOC = 0 if the device is in the sleep state.
When testing EOC, if the conversion is complete (EOC = 0),
the device will exit the sleep state and enter the data output
state if CS remains LOW. In order to prevent the device
from exiting the low power sleep state, CS must be pulled
HIGH before the first rising edge of SCK. In the internal
SCK timing mode, SCK goes HIGH and the device begins
outputting data at time t
EOCtest
after the falling edge of CS
(if EOC = 0) or t
EOCtest
after EOC goes LOW (if CS is LOW
during the falling edge of EOC). The value of t
EOCtest
is 23
s
if the device is using its internal oscillator (F
0
= logic LOW
or HIGH). If F
O
is driven by an external oscillator of
frequency f
EOSC
, then t
EOCtest
is 3.6/f
EOSC
. If CS is pulled
HIGH before time t
EOCtest
, the device remains in the sleep
state. The conversion result is held in the internal static
shift register.
If CS remains LOW longer than t
EOCtest
, the first rising
edge of SCK will occur and the conversion result is serially
shifted out of the SDO pin. The data output cycle begins on
this first rising edge of SCK and concludes after the 32nd
rising edge. Data is shifted out the SDO pin on each falling
edge of SCK. The internally generated serial clock is output
to the SCK pin. This signal may be used to shift the
conversion result into external circuitry. EOC can be
latched on the first rising edge of SCK and the last bit of the
conversion result on the 32nd rising edge of SCK. After the
32nd rising edge, SDO goes HIGH (EOC = 1), SCK stays
HIGH, and a new conversion starts.
Typically, CS remains LOW during the data output state.
However, the data output state may be aborted by pulling
CS HIGH anytime between the first and 32nd rising edge
of SCK, see Figure 9. On the rising edge of CS, the device
aborts the data output state and immediately initiates a
new conversion. This is useful for systems not requiring
all 32 bits of output data, aborting an invalid conversion
cycle, or synchronizing the start of a conversion. If CS is
pulled HIGH while the converter is driving SCK LOW, the
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SCK
(INTERNAL)
CS
MSB
EXR
SIG
CH0/CH1
BIT 0
LSB
24
BIT 4
TEST EOC
BIT 27
BIT 26
BIT 28
BIT 29
BIT 30
EOC
BIT 31
SLEEP
DATA OUTPUT
CONVERSION
CONVERSION
2400 F08
<t
EOCtest
V
CC
10k
Hi-Z
Hi-Z
Hi-Z
Hi-Z
TEST EOC
V
CC
F
O
FS
SET
ZS
SET
SCK
CH1
SDO
GND
CS
REFERENCE VOLTAGE
ZS
SET
+ 0.1V TO V
CC
0V TO FS
SET
100mV
CH0
= INTERNAL OSC/50Hz REJECTION
= EXTERNAL CLOCK SOURCE
= INTERNAL OSC/60Hz REJECTION
1
F
1
10
9
8
7
6
2
3
4
5
2.7V TO 5.5V
LTC2402
V
CC
ANALOG INPUT RANGE
ZS
SET
0.12V
REF
TO
FS
SET
+ 0.12V
REF
(V
REF
= FS
SET
ZS
SET
)
Figure 8. Internal Serial Clock, Single Cycle Operation
19
LTC2401/LTC2402
internal pull-up is not available to restore SCK to a logic
HIGH state. This will cause the device to exit the internal
serial clock mode on the next falling edge of CS. This can
be avoided by adding an external 10k pull-up resistor to
the SCK pin or by never pulling CS HIGH when SCK is
LOW.
Whenever SCK is LOW, the LTC2401/LTC2402's internal
pull-up at pin SCK is disabled. Normally, SCK is not
externally driven if the device is in the internal SCK timing
mode. However, certain applications may require an ex-
ternal driver on SCK. If this driver goes Hi-Z after output-
ting a LOW signal, the LTC2401/LTC2402's internal pull-
up remains disabled. Hence, SCK remains LOW. On the
next falling edge of CS, the device is switched to the
external SCK timing mode. By adding an external 10k pull-
up resistor to SCK, this pin goes HIGH once the external
driver goes Hi-Z. On the next CS falling edge, the device
will remain in the internal SCK timing mode.
A similar situation may occur during the sleep state when
CS is pulsed HIGH-LOW-HIGH in order to test the conver-
sion status. If the device is in the sleep state (EOC = 0), SCK
will go LOW. Once CS goes HIGH (within the time period
defined above as t
EOCtest
), the internal pull-up is activated.
For a heavy capacitive load on the SCK pin, the internal
pull-up may not be adequate to return SCK to a HIGH level
before CS goes low again. This is not a concern under
normal conditions where CS remains LOW after detecting
EOC = 0. This situation is easily overcome by adding an
external 10k pull-up resistor to the SCK pin.
Internal Serial Clock, 2-Wire I/O,
Continuous Conversion
This timing mode uses a 2-wire, all output (SCK and SDO)
interface. The conversion result is shifted out of the device
by an internally generated serial clock (SCK) signal, see
Figure 10. CS may be permanently tied to ground (Pin 6),
simplifying the user interface or isolation barrier.
SDO
SCK
(INTERNAL)
CS
> t
EOCtest
MSB
EXR
SIG
BIT 8
TEST EOC
TEST EOC
BIT 27
BIT 26
BIT 28
BIT 29
BIT 30
EOC
BIT 31
EOC
BIT 0
SLEEP
DATA OUTPUT
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
DATA OUTPUT
CONVERSION
CONVERSION
SLEEP
24012 F09
<t
EOCtest
V
CC
10k
TEST EOC
CH0/CH1
V
CC
F
O
FS
SET
ZS
SET
SCK
CH1
SDO
GND
CS
REFERENCE VOLTAGE
ZS
SET
+ 0.1V TO V
CC
0V TO FS
SET
100mV
CH0
= INTERNAL OSC/50Hz REJECTION
= EXTERNAL CLOCK SOURCE
= INTERNAL OSC/60Hz REJECTION
1
F
1
10
9
8
7
6
2
3
4
5
2.7V TO 5.5V
LTC2402
V
CC
ANALOG INPUT RANGE
ZS
SET
0.12V
REF
TO
FS
SET
+ 0.12V
REF
(V
REF
= FS
SET
ZS
SET
)
Figure 9. Internal Serial Clock, Reduced Data Output Length
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LTC2401/LTC2402
The internal serial clock mode is selected at the end of the
power-on reset (POR) cycle. The POR cycle is concluded
approximately 0.5ms after V
CC
exceeds 2.2V. An internal
weak pull-up is active during the POR cycle; therefore, the
internal serial clock timing mode is automatically selected
if SCK is not externally driven LOW (if SCK is loaded such
that the internal pull-up cannot pull the pin HIGH, the
external SCK mode will be selected).
During the conversion, the SCK and the serial data output
pin (SDO) are HIGH (EOC = 1). Once the conversion is
complete, SCK and SDO go LOW (EOC = 0) indicating the
conversion has finished and the device has entered the
low power sleep state. The part remains in the sleep state
a minimum amount of time (1/2 the internal SCK period)
then immediately begins outputting data. The data output
cycle begins on the first rising edge of SCK and ends after
the 32nd rising edge. Data is shifted out the SDO pin on
each falling edge of SCK. The internally generated serial
clock is output to the SCK pin. This signal may be used
to shift the conversion result into external circuitry. EOC
can be latched on the first rising edge of SCK and the last
bit of the conversion result can be latched on the 32nd
rising edge of SCK. After the 32nd rising edge, SDO goes
HIGH (EOC = 1) indicating a new conversion is in progress.
SCK remains HIGH during the conversion.
Internal Serial Clock, Autostart Conversion
This timing mode is identical to the internal serial clock,
2-wire I/O described above with one additional feature.
Instead of grounding CS, an external timing capacitor is
tied to CS.
While the conversion is in progress, the CS pin is held
HIGH by an internal weak pull-up. Once the conversion is
complete, the device enters the low power sleep state and
an internal 25nA current source begins discharging the
capacitor tied to CS, see Figure 11. The time the converter
spends in the sleep state is determined by the value of the
external timing capacitor, see Figures 12 and 13. Once the
voltage at CS falls below an internal threshold (
1.4V), the
device automatically begins outputting data. The data
output cycle begins on the first rising edge of SCK and
ends on the 32nd rising edge. Data is shifted out the SDO
pin on each falling edge of SCK. The internally generated
serial clock is output to the SCK pin. This signal may be
SDO
SCK
(INTERNAL)
CS
LSB
24
MSB
EXR
SIG
BIT 4
BIT 0
BIT 27
BIT 26
BIT 28
BIT 29
BIT 30
EOC
BIT 31
SLEEP
DATA OUTPUT
CONVERSION
CONVERSION
24012 F10
CH0/CH1
V
CC
F
O
FS
SET
ZS
SET
SCK
CH1
SDO
GND
CS
REFERENCE VOLTAGE
ZS
SET
+ 0.1V TO V
CC
0V TO FS
SET
100mV
CH0
= INTERNAL OSC/50Hz REJECTION
= EXTERNAL CLOCK SOURCE
= INTERNAL OSC/60Hz REJECTION
1
F
1
10
9
8
7
6
2
3
4
5
2.7V TO 5.5V
LTC2402
V
CC
V
CC
10k
ANALOG INPUT RANGE
ZS
SET
0.12V
REF
TO
FS
SET
+ 0.12V
REF
(V
REF
= FS
SET
ZS
SET
)
Figure 10. Internal Serial Clock, Continuous Operation
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LTC2401/LTC2402
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SDO
Hi-Z
Hi-Z
SCK
(INTERNAL)
CS
V
CC
GND
24012 F11
BIT 0
SIG
BIT 29
BIT 30
SLEEP
DATA OUTPUT
CONVERSION
CONVERSION
EOC
BIT 31
CH0/CH1
V
CC
F
O
FS
SET
ZS
SET
SCK
CH1
SDO
GND
CS
REFERENCE VOLTAGE
ZS
SET
+ 0.1V TO V
CC
0V TO FS
SET
100mV
CH0
= INTERNAL OSC/50Hz REJECTION
= EXTERNAL CLOCK SOURCE
= INTERNAL OSC/60Hz REJECTION
1
F
1
10
9
8
7
6
C
EXT
2
3
4
5
2.7V TO 5.5V
LTC2402
V
CC
V
CC
10k
ANALOG INPUT RANGE
ZS
SET
0.12V
REF
TO
FS
SET
+ 0.12V
REF
(V
REF
= FS
SET
ZS
SET
)
Figure 11. Internal Serial Clock, Autostart Operation
CAPACITANCE ON CS (pF)
1
5
6
7
1000
10000
24012 F12
4
3
10
100
100000
2
1
0
t
SAMPLE
(SEC)
V
CC
= 5V
V
CC
= 3V
CAPACITANCE ON CS (pF)
0
SAMPLE RATE (Hz)
3
4
5
1000
100000
24012 F13
2
1
0
10
100
10000
6
7
8
V
CC
= 5V
V
CC
= 3V
Figure 12. CS Capacitance vs t
SAMPLE
Figure 13. CS Capacitance vs Output Rate
22
LTC2401/LTC2402
used to shift the conversion result into external circuitry.
After the 32nd rising edge, CS is pulled HIGH and a new
conversion is immediately started. This is useful in appli-
cations requiring periodic monitoring and ultralow power.
Figure 14 shows the average supply current as a function
of capacitance on CS.
It should be noticed that the external capacitor discharge
current is kept very small in order to decrease the con-
verter power dissipation in the sleep state. In the autostart
mode the analog voltage on the CS pin cannot be observed
without disturbing the converter operation using a regular
oscilloscope probe. When using this configuration, it is
important to minimize the external leakage current at the
CS pin by using a low leakage external capacitor and
properly cleaning the PCB surface.
The internal serial clock mode is selected every time the
voltage on the CS pin crosses an internal threshold volt-
age. An internal weak pull-up at the SCK pin is active while
CS is discharging; therefore, the internal serial clock
timing mode is automatically selected if SCK is floating. It
is important to ensure there are no external drivers pulling
SCK LOW while CS is discharging.
as 100
s. However, some considerations are required to
take advantage of exceptional accuracy and low supply
current.
The digital output signals (SDO and SCK in Internal SCK
mode of operation) are less of a concern because they are
not generally active during the conversion state.
In order to preserve the LTC2401/LTC2402's accuracy, it
is very important to minimize the ground path impedance
which may appear in series with the input and/or reference
signal and to reduce the current which may flow through
this path. The GND pin should be connected to a low
resistance ground plane through a minimum length trace.
The use of multiple via holes is recommended to further
reduce the connection resistance.
In an alternative configuration, the GND pin of the converter
can be the single-point-ground in a single point grounding
system. The input signal ground, the reference signal
ground, the digital drivers ground (usually the digital
ground) and the power supply ground (the analog ground)
should be connected in a star configuration with the com-
mon point located as close to the GND pin as possible.
The power supply current during the conversion state
should be kept to a minimum. This is achieved by restrict-
ing the number of digital signal transitions occurring
during this period.
While a digital input signal is in the range 0.5V to
(V
CC
0.5V), the CMOS input receiver draws additional
current from the power supply. It should be noted that,
when any one of the digital input signals (F
O
, CS and SCK
in External SCK mode of operation) is within this range, the
LTC2401/LTC2402 power supply current may increase
even if the signal in question is at a valid logic level. For
micropower operation and in order to minimize the poten-
tial errors due to additional ground pin current, it is
recommended to drive all digital input signals to full CMOS
levels [V
IL
< 0.4V and V
OH
> (V
CC
0.4V)].
Severe ground pin current disturbances can also occur
due to the undershoot of fast digital input signals. Under-
shoot and overshoot can occur because of the impedance
mismatch at the converter pin when the transition time of
an external control signal is less than twice the propaga-
tion delay from the driver to LTC2401/LTC2402. For
APPLICATIO S I FOR ATIO
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CAPACITANCE ON CS (pF)
1
0
SUPPLY CURRENT (
A
RMS
)
50
100
150
200
250
300
10
100
1000
10000
24012 F14
100000
V
CC
= 5V
V
CC
= 3V
Figure 14. CS Capacitance vs Supply Current
DIGITAL SIGNAL LEVELS
The LTC2401/LTC2402's digital interface is easy to use.
Its digital inputs (F
O
, CS and SCK in External SCK mode of
operation) accept standard TTL/CMOS logic levels and the
internal hysteresis receivers can tolerate edge rates as slow
23
LTC2401/LTC2402
reference, on a regular FR-4 board, signal propagation
velocity is approximately 183ps/inch for internal traces
and 170ps/inch for surface traces. Thus, a driver gener-
ating a control signal with a minimum transition time of
1ns must be connected to the converter pin through a
trace shorter than 2.5 inches. This problem becomes
particularly difficult when shared control lines are used
and multiple reflections may occur. The solution is to
carefully terminate all transmission lines close to their
characteristic impedance.
Parallel termination near the LTC2401/LTC2402 pin will
eliminate this problem but will increase the driver power
dissipation. A series resistor between 27
and 56
placed near the driver or near the LTC2401/LTC2402 pin
will also eliminate this problem without additional power
dissipation. The actual resistor value depends upon the
trace impedance and connection topology.
Driving the Input and Reference
The analog input and reference of the typical delta-sigma
analog-to-digital converter are applied to a switched ca-
pacitor network. This network consists of capacitors
switching between the analog input (V
IN
), ZS
SET
(Pin 5)
and FS
SET
(Pin 2). The result is small current spikes seen
at both V
IN
and V
REF
. A simplified input equivalent circuit
is shown in Figure 15.
The key to understanding the effects of this dynamic
input current is based on a simple first order RC time
constant model. Using the internal oscillator, the
LTC2401/LTC2402's internal switched capacitor network
is clocked at 153,600Hz corresponding to a 6.5
s sam-
pling period. Fourteen time constants are required each
time a capacitor is switched in order to achieve 1ppm
settling accuracy.
Therefore, the equivalent time constant at V
IN
and V
REF
should be less than 6.5
s/14 = 460ns in order to achieve
1ppm accuracy.
Input Current (V
IN
)
If complete settling occurs on the input, conversion results
will be uneffected by the dynamic input current. If the
settling is incomplete, it does not degrade the linearity
performance of the device. It simply results in an offset/
full-scale shift, see Figure 16. To simplify the analysis of
input dynamic current, two separate cases are assumed:
large capacitance at V
IN
(C
IN
> 0.01
F) and small capaci-
tance at V
IN
(C
IN
< 0.01
F).
APPLICATIO S I FOR ATIO
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FS
SET
CH0/CH1
V
CC
R
SW
5k
AVERAGE INPUT CURRENT:
I
IN
= 0.25(V
IN
0.5 V
REF
)fC
EQ
I
REF(LEAK)
I
REF(LEAK)
V
CC
R
SW
5k
C
EQ
2.5pF (TYP)
R
SW
5k
I
IN(LEAK)
I
IN
24012 F15
I
IN(LEAK)
SWITCHING FREQUENCY
f = 153.6kHz FOR INTERNAL OSCILLATOR (f
O
= LOGIC LOW OR HIGH)
f = f
EOSC
FOR EXTERNAL OSCILLATORS
ZS
SET
Figure 15. LTC2401/LTC2402 Equivalent Analog Input Circuit
ZS
SET
TUE
V
IN
24012 F16
FS
SET
Figure 16. Offset/Full-Scale Shift
If the total capacitance at V
IN
(see Figure 17) is small
(< 0.01
F), relatively large external source resistances (up
to 20k for 20pF parasitic capacitance) can be tolerated
without any offset/full-scale error. Figures 18 and 19 show
a family of offset and full-scale error curves for various
small valued input capacitors (C
IN
< 0.01
F) as a function
of input source resistance.
For large input capacitor values (C
IN
> 0.01
F), the input
spikes are averaged by the capacitor into a DC current. The
gain shift becomes a linear function of input source
24
LTC2401/LTC2402
resistance independent of input capacitance, see Figures
20 and 21. The equivalent input impedance is 6.25M
.
This results in
400
A of input dynamic current at the
extreme values of V
IN
(V
IN
= 0V and V
IN
= V
REF
, when
V
REF
= 5V). This corresponds to a 0.8ppm shift in offset
and full-scale readings for every 10
of input source
resistance.
C
IN
24012 F17
INTPUT
SIGNAL
SOURCE
R
SOURCE
V
IN
LTC2401/
LTC2402
C
PAR
20pF
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Figure 17. An RC Network at V
IN
Figure 18. Offset vs R
SOURCE
(Small C)
Figure 19. Offset vs R
SOURCE
(Large C)
In addition to the input current spikes, the input ESD
protection diodes have a temperature dependent leakage
current. This leakage current, nominally 1nA (
10nA
max), results in a fixed offset shift of 10
V for a 10k source
resistance.
The effect of input leakage current is evident for C
IN
= 0 in
Figures 18 and 21. A leakage current of 3nA results in a
150
V (30ppm) error for a 50k source resistance. As
R
SOURCE
gets larger, the switched capacitor input current
begins to dominate.
Reference Current (V
REF
)
Similar to the analog input, the reference input has a
dynamic input current. This current has negligible effect
Figure 20. Full-Scale Error vs R
SOURCE
(Large C)
Figure 21. Full-Scale Error vs R
SOURCE
(Small C)
R
SOURCE
(
)
1
10
OFFSET ERROR (ppm)
0
10
20
30
40
50
10
100
1k
10k
24012 F18
100k
V
CC
= 5V
V
REF
= 5V
V
IN
= 0V
T
A
= 25
C
C
IN
= 100pF
C
IN
= 0.01
F
C
IN
= 1000pF
C
IN
= NO CAP
R
SOURCE
(
)
0
OFFSET ERROR (ppm)
40
60
800
24012 F19
20
0
200
400
600
1000
80
C
IN
= 22
F
C
IN
= 10
F
C
IN
= 1
F
C
IN
= 0.1
F
C
IN
= 0.01
F
C
IN
= 0.001
F
V
CC
= 5V
V
REF
= 5V
V
IN
= 0V
T
A
= 25
C
R
SOURCE
(
)
0
80
FULL-SCALE ERROR (ppm)
70
50
40
30
400
800
1000
10
24012 F20
60
200
600
20
10
0
C
IN
= 22
F
C
IN
= 10
F
C
IN
= 1
F
C
IN
= 0.1
F
C
IN
= 0.01
F
C
IN
= 0.001
F
V
CC
= 5V
V
REF
= 5V
V
IN
= 5V
T
A
= 25
C
R
SOURCE
(
)
0
FULL-SCALE (ppm)
10
10
10k
24012 F21
30
50
10
100
1k
100k
30
V
CC
= 5V
V
REF
= 5V
V
IN
= 5V
T
A
= 25
C
C
IN
= NO CAP
C
IN
= 0.01
F
C
IN
= 1000pF
C
IN
= 100pF
25
LTC2401/LTC2402
on the offset. However, the reference current at V
IN
= V
REF
is similar to the input current at full-scale. For large values
of reference capacitance (C
VREF
> 0.01
F), the full-scale
error shift is 0.08ppm/
of external reference resistance
independent of the capacitance at V
REF
, see Figure 22. If
the capacitance tied to V
REF
is small (C
VREF
< 0.01
F), an
input resistance of up to 20k (20pF parasitic capacitance
at V
REF
) may be tolerated, see Figure 23.
Unlike the analog input, the integral nonlinearity of the
device can be degraded with excessive external RC time
constants tied to the reference input. If the capacitance
APPLICATIO S I FOR ATIO
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Figure 22. Full-Scale Error vs R
VREF
(Large C)
Figure 23. Full-Scale Error vs R
VFEF
(Small C)
Figure 24. INL Error vs R
VREF
(Small C)
Figure 25. INL Error vs R
VREF
(Large C)
at node V
REF
is small (C
VREF
< 0.01
F), the reference input
can tolerate large external resistances without reduction
in INL, see Figure 24. If the external capacitance is large
(C
VREF
> 0.01
F), the linearity will be degraded by
0.04ppm/
independent of capacitance at V
REF
, see
Figure 25.
In addition to the dynamic reference current, the V
REF
ESD
protection diodes have a temperature dependent leakage
current. This leakage current, nominally 1nA (
10nA max),
results in a fixed full-scale shift of 10
V for a 10k source
resistance.
RESISTANCE AT V
REF
(
)
0
FULL-SCALE ERROR (ppm)
80
120
800
24012 F22
40
0
200
400
600
1000
160
V
CC
= 5V
V
REF
= 5V
V
IN
= 5V
T
A
= 25
C
C
IN
= 10
F
C
IN
= 0.1
F
C
IN
= 0.01
F
C
IN
= 1
F
RESISTANCE AT V
REF
(
)
100
50
FULL-SCALE ERROR (ppm)
25
0
25
50
C
IN
= 10
F
1k
10k
24012 F23
100k
V
CC
= 5V
V
REF
= 5V
V
IN
= 5V
T
A
= 25
C
C
IN
= 20pF
C
IN
= 1000pF
C
IN
= 100pF
RESISTANCE AT V
REF
(
)
100
0
INL ERROR (ppm)
10
20
C
IN
= 0.01
F
C
IN
= 20pF
C
IN
= 1000pF
C
IN
= 100pF
30
40
50
V
CC
= 5V
V
REF
= 5V
T
A
= 25
C
1k
10k
24012 F24
100k
RESISTANCE AT V
REF
(
)
0
INL ERROR (ppm)
20
30
800
24012 F25
10
0
200
400
600
1000
40
V
CC
= 5V
V
REF
= 5V
T
A
= 25
C
C
VREF
= 10
F
C
VREF
= 0.1
F
C
VREF
= 1
F
C
VREF
= 0.01
F
26
LTC2401/LTC2402
APPLICATIO S I FOR ATIO
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ANTIALIASING
One of the advantages delta-sigma ADCs offer over con-
ventional ADCs is on-chip digital filtering. Combined with
a large oversampling ratio, the LTC2401/LTC2402 signifi-
cantly simplify antialiasing filter requirements.
The digital filter provides very high rejection except at
integer multiples of the modulator sampling frequency
(f
S
), see Figure 26. The modulator sampling frequency is
256 F
O
, where F
O
is the notch frequency (typically 50Hz
or 60Hz). The bandwidth of signals not rejected by the
digital filter is narrow (
0.2%) compared to the bandwidth
of the frequencies rejected.
As a result of the oversampling ratio (256) and the digital
filter, minimal (if any) antialias filtering is required in front
of the LTC2401/LTC2402. If passive RC components are
placed in front of the LTC2401/LTC2402, the input dy-
namic current should be considered (see Input Current
section). In cases where large effective RC time constants
are used, an external buffer amplifier may be required to
minimize the effects of input dynamic current.
The modulator contained within the LTC2401/LTC2402
can handle large-signal level perturbations without satu-
rating. Signal levels up to 40% of V
REF
do not saturate the
analog modulator. These signals are limited by the input
ESD protection to 300mV below ground and 300mV above
V
CC
.
Single Ended Half-Bridge Digitizer
with Reference and Ground Sensing
Sensors convert real world phenomena (temperature,
pressure, gas levels, etc.) into a voltage. Typically, this
voltage is generated by passing an excitation current
through the sensor. The wires connecting the sensor to
the ADC form parasitic resistors R
P1
and R
P2
. The excita-
tion current also flows through parasitic resistors R
P1
and
R
P2
, as shown in Figure 27. The voltage drop across these
parasitic resistors leads to systematic offset and full-scale
errors.
In order to eliminate the errors associated with these
parasitic resistors, the LTC2401/LTC2402 include a full-
scale set input (FS
SET
) and a zero-scale set input
(ZS
SET
). As shown in Figure 28, the FS
SET
pin acts as a zero
current full-scale sense input. Errors due to parasitic
resistance R
P1
in series with the half-bridge sensor are
removed by the FS
SET
input to the ADC. The absolute full-
scale output of the ADC (data out = FFFFFF
HEX
) will occur
INPUT FREQUENCY
0
60
40
0
24012 F26
80
100
f
S
/2
f
S
120
140
20
REJECTION (dB)
Figure 26. Sinc
4
Filter Rejection
V
FULL-SCALE ERROR
SENSOR
SENSOR OUTPUT
R
P1
I
EXCITATION
+
V
OFFSET ERROR
+
+
R
P2
24012 F27
V
CC
LTC2401
FS
SET
GND
SCK
V
IN
SDO
F
O
CS
ZS
SET
3-WIRE
SPI INTERFACE
1
9
8
7
10
24012 F03
2
3
5
R
P2
R
P5
I
DC
= 0
R
P1
V
B
V
A
6
R
P4
I
DC
= 0
I
EXCITATION
R
P3
I
DC
= 0
Figure 28. Half-Bridge Digitizer with
Zero-Scale and Full-Scale Sense
Figure 27. Errors Due to Excitation Currents
27
LTC2401/LTC2402
APPLICATIO S I FOR ATIO
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at V
IN
= V
B
= FS
SET
, see Figure 29. Similarly, the offset
errors due to R
P2
are removed by the ground sense input
ZS
SET
. The absolute zero output of the ADC (data out =
000000
HEX
) occurs at V
IN
= V
A
= ZS
SET
. Parasitic resistors
R
P3
to R
P5
have negligible errors due to the 1nA (typ)
leakage current at pins FS
SET
, ZS
SET
and V
IN
. The wide
dynamic input range ( 300mV to 5.3V) and low noise
(0.6ppm RMS) enable the LTC2401 or the LTC2402 to
directly digitize the output of the bridge sensor.
The LTC2402 is ideal for applications requiring continu-
ous monitoring of two input sensors. As shown in
Figure 30, the LTC2402 can monitor both a thermocouple
temperature probe and a cold junction temperature sen-
sor. Absolute temperature measurements can be
performed with a variety of thermocouples using digital
cold junction compensation.
The selection between CH0 and CH1 is automatic. Initially,
after power-up, a conversion is performed on CH0. For
each subsequent conversion, the input channel selection
is alternated. Embedded within the serial data output is a
status bit indicating which channel corresponds to the
conversion result. If the conversion was performed on
CH0, this bit (Bit 30) is LOW and is HIGH if the conversion
was performed on CH1 (see Figure 31).
Figure 29. Transfer Curve with Zero-Scale and Full-Scale Set
Figure 30. Isolated Temperature Measurement
00000
H
12.5%
UNDER
RANGE
ADC DATA OUT
FFFFF
H
ZS
SET
FS
SET
V
IN
24012 F29
12.5%
EXTENDED
RANGE
V
CC
F
O
FS
SET
ZS
SET
SCK
CH1
SDO
GND
CS
THERMOCOUPLE
COLD JUNCTION
ISOLATION
BARRIER
PROCESSOR
CH0
+
1
10
12k
THERMISTOR
100
9
8
7
6
2
3
4
5
2.7V TO 5.5V
LTC2402
24012 F30
28
LTC2401/LTC2402
There are no extra control or status pins required to
perform the alternating 2-channel measurements. The
LTC2402 only requires two digital signals (SCK and SDO).
This simplification is ideal for isolated temperature mea-
surements or systems where minimal control signals are
available.
Pseudo Differential Applications
Generally, designers choose fully differential topologies
for several reasons. First, the interface to a 4- or 6-wire
bridge is simple (it is a differential output). Second, they
require good rejection of line frequency noise. Third, they
typically look at a small differential signal sitting on a
large common mode voltage; they need accurate
measurements of the differential signal independent of
Figure 31. Embedded Selected Channel Indicator
Figure 32. Pseudo Differential Strain Guage Application
APPLICATIO S I FOR ATIO
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the common mode input voltage. Many applications
currently using fully differential analog-to-digital con-
verters for any of the above reasons may migrate to a
pseudo differential conversion using the LTC2402.
Direct Connection to a Full Bridge
The LTC2402 interfaces directly to a 4- or 6-wire bridge, as
shown in Figure 32. The LTC2402 includes a FS
SET
and a
ZS
SET
for sensing the excitation voltage directly across the
bridge. This eliminates errors due to excitation currents
flowing through parasitic resistors. The LTC2402 also
includes two single ended input channels which can tie
directly to the differential output of the bridge. The two
conversion results may be digitally subtracted yielding the
differential result.
24012 F31
SCK
SDO
CH1
CH1 DATA OUT
CH0 DATA OUT
EOC
CH0
EOC
V
CC
LTC2402
FS
SET
ZS
SET
SCK
CH1
SDO
F
O
CS
CH0
GND
3-WIRE
SPI INTERFACE
1
5V
9
8
7
10
24012 F32
2
350
350
350
350
3
4
5
I
DC
= 0
I
EXCITATION
I
DC
= 0
29
LTC2401/LTC2402
The LTC2402's single ended rejection of line frequencies
(
2%) and harmonics is better than 110dB. Since the
device performs two independent single ended conver-
sions each with > 110dB rejection, the overall common
mode and differential rejection is much better than the
80dB rejection typically found in other differential input
delta-sigma converters.
In addition to excellent rejection of line frequency noise,
the LTC2402 also exhibits excellent single ended noise
rejection over a wide range of frequencies due to its 4
th
order sinc filter. Each single ended conversion indepen-
dently rejects high frequency noise (> 60Hz). Care must be
taken to insure noise at frequencies below 15Hz and at
multiples of the ADC sample rate (15,360Hz) are not
present. For this application, it is recommended the
LTC2402 is placed in close proximity to the bridge sensor
in order to reduce the noise injected into the ADC input. By
performing three successive conversions (CH0-CH1-CH0),
the drift and low frequency noise can be measured and
compensated for digitally.
The absolute accuracy (less than 10 ppm total error) of the
LTC2402 enables extremely accurate measurement of
small signals sitting on large voltages. Each of the two
pseudo differential measurements performed by the
LTC2402 is absolutely accurate independent of the com-
mon mode voltage output from the bridge. The pseudo
differential result obtained from digitally subtracting the
two single ended conversion results is accurate to within
the noise level of the device (3
V
RMS
) times the square
root of 2, independent of the common mode input voltage.
Typically, a bridge sensor outputs 2mV/V full scale. With
a 5V excitation, this translates to a full-scale output of
10mV. Divided by the RMS noise of 4.2
V(= 3
V 1.414),
this circuit yields 2,300 counts with no averaging or
amplification. If more counts are required, several conver-
sions may be averaged (the number of effective counts is
increased by a factor of square root of 2 for each doubling
of averages).
An RTD Temperature Digitizer
RTDs used in remote temperature measurements often
have long lead lengths between the ADC and RTD sensor.
These long lead lengths lead to voltage drops due to
excitation current in the interconnect to the RTD. This
voltage drop can be measured and digitally removed using
the LTC2402 (see Figure 33).
The excitation current (typically 200
A) flows from the
ADC through a long lead length to the remote temperature
sensor (RTD). This current is applied to the RTD, whose
resistance changes as a function of temperature (100
to
400
for 0
C to 800
C). The same excitation current flows
back to the ADC ground and generates another voltage
drop across the return leads. In order to get an accurate
measurement of the temperature, these voltage drops
must be measured and removed from the conversion
result. Assuming the resistance is approximately the same
Figure 33. RTD Remote Temperature Measurement
APPLICATIO S I FOR ATIO
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V
CC
LTC2402
FS
SET
ZS
SET
SCK
CH0
SDO
F
O
CS
CH1
GND
3-WIRE
SPI INTERFACE
1
5V
9
8
7
10
24012 F33
2
4
3
+
V
RTD
P
t
100
5
I
DC
= 0
I
EXCITATION
= 200
A
I
EXCITATION
= 200
A
R2
R1
5k
25
1000pF
5k
25
0.1
F
30
LTC2401/LTC2402
for the forward and return paths (R1 = R2), the auxiliary
channel on the LTC2402 can measure this drop. These
errors are then removed with simple digital correction.
The result of the first conversion on CH0 corresponds to
an input voltage of V
RTD
+ R1 I
EXCITATION.
The result of the
second conversion (CH1) is R1 I
EXCITATION.
Note, the
LTC2402's input range is not limited to the supply rails, it
has underrange capabilities. The device's input range is
300mV to V
REF
+ 300mV. Adding the two conversion
results together, the voltage drop across the RTD's leads
are cancelled and the final result is V
RTD
.
An Isolated, 24-Bit Data Acquisition System
The LTC1535 is useful for signal isolation. Figure 34
shows a fully isolated, 24-bit differential input A/D con-
verter implemented with the LTC1535 and LTC2402. Power
on the isolated side is regulated by an LT1761-5.0 low
noise, low dropout micropower regulator. Its output is
suitable for driving bridge circuits and for ratiometric
applications.
Figure 34. Complete, Isolated 24-Bit Data Acquisition System
APPLICATIO S I FOR ATIO
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During power-up, the LTC2402 becomes active at V
CC
=
2.3V, while the isolated side of the LTC1535 must wait for
V
CC2
to reach its undervoltage lockout threshold of 4.2V.
Below 4.2V, the LTC1535's driver outputs Y and Z are in a
high impedance state, allowing the 1k
pull-down to
define the logic state at SCK. When the LTC2402 first
becomes active, it samples SCK; a logic "0" provided by
the 1k
pull-down invokes the external serial clock mode.
In this mode, the LTC2402 is controlled by a single clock
line from the nonisolated side of the barrier, through the
LTC1535's driver output Y. The entire power-up sequence,
from the time power is applied to V
CC1
until the LT1761's
output has reached 5V, is approximately 1ms.
Data returns to the nonisolated side through the LTC1535's
receiver at RO. An internal divider on receiver input B sets
a logic threshold of approximately 3.4V at input A, facili-
tating communications with the LTC2402's SDO output
without the need for any external components.
+
+
F
O
SCK
SDO
CS
GND
V
CC
FS
SET
CH1
CH0
ZS
SET
LTC2402
24012 F09
LT1761-5
GND
10
F
10V
TANT
10
F
10V
TANT
+
10
F
16V
TANT
+
10
F
10V
TANT
10
F
1
F
T1
1/2 BAT54C
1/2 BAT54C
ISOLATION
BARRIER
= LOGIC COMMON
= FLOATING COMMON
T1 = COILTRONICS CTX02-14659
OR SIEMENS B78304-A1477-A3
1k
2
2
1
2
1
1
1
2
2
2
2
10
F
CERAMIC
A
B
Y
Z
RO
RE
DE
DI
V
CC2
ST2
G1
V
CC1
G2
ST1
"SDO"
"SCK"
LOGIC 5V
IN
OUT
SHDN
BYP
LTC1535
31
LTC2401/LTC2402
PACKAGE I FOR ATIO
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Dimensions in inches (millimeters) unless otherwise noted.
MS10 Package
10-Lead Plastic MSOP
(LTC DWG # 05-08-1661)
* DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH,
PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
** DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
0.021
0.006
(0.53
0.015)
0
6
TYP
SEATING
PLANE
0.007
(0.18)
0.040
0.006
(1.02
0.15)
0.009
(0.228)
REF
0.006
0.004
(0.15
0.102)
0.034
0.004
(0.86
0.102)
0.0197
(0.50)
BSC
MSOP (MS10) 1098
1 2 3 4 5
0.193
0.006
(4.90
0.15)
8
9
10
7 6
0.118
0.004*
(3.00
0.102)
0.118
0.004**
(3.00
0.102)
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
32
LTC2401/LTC2402
24012f LT/LCG 1000 4K PRINTED IN USA
LINEAR TECHNOLOGY CORPORATION 2000
RELATED PARTS
PART NUMBER
DESCRIPTION
COMMENTS
LT1019
Precision Bandgap Reference, 2.5V, 5V
3ppm/
C Drift, 0.05% Max
LTC1050
Precision Chopper Stabilized Op Amp
No External Components 5
V Offset, 1.6
V
P-P
Noise
LT1236A-5
Precision Bandgap Reference, 5V
0.05% Max, 5ppm/
C Drift
LTC1391
8-Channel Multiplexer
Low R
ON
: 45
, Low Charge Injection Serial Interface
LT1460
Micropower Series Reference
0.075% Max, 10ppm/
C Max Drift, 2.5V, 5V and 10V Versions
LT1461-2.5
Precision Micropower Voltage Reference
50
A Supply Current, 3ppm/
C Drift
LTC1535
Isolated RS485 Transceiver
2500V
RMS
Isolation
LTC2400
24-Bit, No Latency
ADC in SO-8
4ppm INL, 10ppm Total Unadjusted Error, 200
A
LTC2404/LTC2408
4-/8-Channel, 24-Bit, No Latency
ADC
4ppm INL, 10ppm Total Unadjusted Error, 200
A
LTC2410
24-Bit, Fully Differential, No Latency
ADC in SSOP-16
0.16ppm Noise, 2ppm INL, 10ppm Total Unadjusted Error, 200
A
LTC2411
24-Bit, Fully Differential, No Latency
ADC in MS10
0.29ppm Noise, 4ppm INL, 10ppm Total Unadjusted Error, 200
A
LTC2413
24-Bit, No Latency
ADC
Simultaneous 50Hz and 60Hz Rejection, 0.16ppm Noise
LTC2420
20-Bit, No Latency
ADC in SO-8
1.2ppm Noise, 8ppm INL, Pin Compatible with LTC2400
LTC2424/LTC2428
4-/8-Channel, 20-Bit, No Latency
ADC
1.2ppm Noise, 8ppm INL, Pin Compatible with LTC2404/LTC2408
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900
q
FAX: (408) 434-0507
q
www.linear-tech.com
TYPICAL APPLICATIO
U
Figure 35 shows the block diagram of a demo circuit
(contact LTC for a demonstration) of a multichannel
isolated temperature measurement system. This circuit
decodes an address to select which LTC2402 receives a
32-bit burst of SCK signal. All devices independently
convert either the thermal couple output or the thermistor
cold juntion output. After each conversion, the devices
enter their sleep state and wait for the SCK signal before
clocking out data and beginning the next conversion.
V
CC
FS
SET
CH1
SDO
SCK
CH0
ZS
SET
LTC2402
A
Y
D1
RE
R0
LTC1535
V
CC
FS
SET
CH1
SDO
SCK
CH0
2500V
ZS
SET
LTC2402
A
Y
D1
RE
R0
LTC1535
V
CC
FS
SET
CH1
SDO
SCK
24012 F35
CH0
ZS
SET
LTC2402
A
Y
D1
HC138
HC595
ADDRESS
LATCH
RE
R0
LTC1535
SEE FIGURE 34 FOR
THE COMPLETE CIRCUIT
HC138
SCK
SD0
D
IN
(ADDRESS
OR COUNTER)
+
Figure 35. Mulitchannel Isolated Temperature Measurement System