LITE-ON TECHNOLOGY CORPORATION

P r o p e r t y o f L i t e - O n O n l y

Features

* Low power consumption.
* High efficiency.
* Versatile mounting on p.c. board or panel.
* I.C. compatible/low current requirement.
* Popular T-1 diameter package.

Package Dimensions

Part No.

Lens

Source Color

LTL42CB6N

Water Clear

InGaN Blue

Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25mm(.010") unless otherwise noted.
3. Protruded resin under flange is 1.0mm(.04") max.
4. Lead spacing is measured where the leads emerge from the package.
5. Specifications are subject to change without notice.

Part No. : LTL42CB6N

Page : 1 of 10

BNS-OD-C131/A4

LITE-ON TECHNOLOGY CORPORATION

P r o p e r t y o f L i t e - O n O n l y

Absolute Maximum Ratings at T

=25

Parameter

Maximum

Rating

Unit

Power

Dissipation

120

Peak Forward Current
(1/10 Duty Cycle, 0.1ms Pulse Width)

100 mA

DC Forward Current

Derating Linear From 30 0.5

mA/

Reverse

Voltage

Operating Temperature Range

-20 to + 80

Storage Temperature Range

-30 to + 100

Lead Soldering Temperature
[1.6mm(.063") From Body]

260 for 5 Seconds

Part No. : LTL42CB6N

Page : 2 of 10

BNS-OD-C131/A4

LITE-ON TECHNOLOGY CORPORATION

P r o p e r t y o f L i t e - O n O n l y

Electrical / Optical Characteristics at T

=25

Parameter Symbol

Min.

Typ.

Max.

Unit

Test

Condition

Luminous Intensity

600 1900 mcd

= 20mA

Note 1,5

Viewing Angle

1/2

deg

Note 2 (Fig.6)

Peak Emission Wavelength

468 nm

Measurement
@Peak (Fig.1)

Dominant Wavelength

470 nm

Note 3

Spectral Line Half-Width

Forward Voltage

3.5

4.0

= 20mA

Reverse Current

100

µA

= 5V

NOTE: 1. Luminous intensity is measured with a light sensor and filter combination that approximates the CIE
eye-response curve.
2.

1/2

is the off-axis angle at which the luminous intensity is half the axial luminous intensity.

3. The dominant wavelength, d is derived from the CIE chromaticity diagram and represents the single
wavelength which defines the color of the device.

4. Iv classification code is marked on each packing bag.
5. The Iv guarantee should be added ±15tolerance.

6. Precautions in handling:

When soldering, leave 2mm of minimum clearance from the resin to the soldering point.

Dipping the resin to solder must be avoided.

Correcting the soldered position after soldering must be avoided.

In soldering, do not apply any stress to the lead frame particularly when heated.

When forming a lead, make sure not to apply any stress inside the resin.

Lead forming must be done before soldering.

It is necessary to cut the lead frame at normal temperature.

7. Caution in ESD:
Static Electricity and surge damages the LED. It is recommend to use a wrist band or anti-electrostatic

glove when handling the LED. All devices, equipment and machinery must be properly grounded.

Part No. : LTL42CB6N

Page : 3 of 10

BNS-OD-C131/A4

LITE-ON TECHNOLOGY CORPORATION

P r o p e r t y o f L i t e - O n O n l y

CAUTIONS

1. Application

The LEDs described here are intended to be used for ordinary electronic equipment (such as office equipment,
communication equipment and household applications).Consult Liteon's Sales in advance for information on
applications in which exceptional reliability is required, particularly when the failure or malfunction of the
LEDs may directly jeopardize life or health (such as in aviation, transportation, traffic control equipment,
medical and life support systems and safety devices).

2. Storage

The storage ambient for the LEDs should not exceed 30°C temperature or 70% relative humidity.
It is recommended that LEDs out of their original packaging are used within three months.
For extended storage out of their original packaging, it is recommended that the LEDs be stored in
a sealed container with appropriate desiccant or in desiccators with nitrogen ambient.

3. Cleaning

Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LEDs if necessary.

4. Lead Forming & Assembly

During lead forming, the leads should be bent at a point at least 3mm from the base of LED lens.
Do not use the base of the lead frame as a fulcrum during forming.
Lead forming must be done before soldering, at normal temperature.
During assembly on PCB, use minimum clinch force possible to avoid excessive mechanical stress.

5. Soldering

When soldering, leave a minimum of 2mm clearance from the base of the lens to the soldering point.

Dipping the lens into the solder must be avoided.
Do not apply any external stress to the lead frame during soldering while the LED is at high temperature.

Recommended soldering conditions :

Soldering iron

Wave soldering

Temperature
Soldering time

300°C Max.
3 sec. Max.
(one time only)

Pre-heat
Pre-heat time
Solder wave
Soldering time

100°C Max.
60 sec. Max.
260°C Max.
10 sec. Max.

Note: Excessive soldering temperature and/or time might result in deformation of the LED lens or

catastrophic failure of the LED

Part No. : LTL42CB6N

Page : 7 of 10

BNS-OD-C131/A4

LITE-ON TECHNOLOGY CORPORATION

P r o p e r t y o f L i t e - O n O n l y

6. Drive Method

An LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs

connected in parallel in an application, it is recommended that a current limiting resistor be
incorporated in the drive circuit, in series with each LED as shown in Circuit A below.

Circuit model A Circuit model B

LED

(A) Recommended circuit

(B) The brightness of each LED might appear different due to the differences in the I-V characteristics

of those LEDs

7. ESD (Electrostatic Discharge)

Static Electricity or power surge will damage the LED.

Suggestions to prevent ESD damage:

Use a conductive wrist band or anti- electrostatic glove when handling these LEDs
All devices, equipment, and machinery must be properly grounded
Work tables, storage racks, etc. should be properly grounded
Use ion blower to neutralize the static charge which might have built up on surface of the LEDs

plastic lens as a result of friction between LEDs during storage and handing

Part No. : LTL42CB6N

Page : 8 of 10

BNS-OD-C131/A4

LITE-ON TECHNOLOGY CORPORATION

P r o p e r t y o f L i t e - O n O n l y

Suggested checking list :

Training and Certification
1. Everyone working in a static-safe area is ESD-certified?
2. Training records kept and re-certification dates monitored?
Static-Safe Workstation & Work Areas
1. Static-safe workstation or work-areas have ESD signs?
2. All surfaces and objects at all static-safe workstation and within 1 ft measure less than 100V?
3. All ionizer activated, positioned towards the units?
4. Each work surface mats grounding is good?
Personnel Grounding
1. Every person (including visitors) handling ESD sensitive (ESDS) items wear wrist strap, heel strap or

conductive shoes with conductive flooring?

2. If conductive footwear used, conductive flooring also present where operator stand or walk?
3. Garments, hairs or anything closer than 1 ft to ESD items measure less than 100V*?
4. Every wrist strap or heel strap/conductive shoes checked daily and result recorded for all DSL?
5. All wrist strap or heel strap checkers calibration up to date?
Note: *50V for Blue LED.
Device Handling
1. Every ESDS items identified by EIA-471 labels on item or packaging?

2. All ESDS items completely inside properly closed static-shielding containers when not at static-safe

workstation?

3. No static charge generators (e.g. plastics) inside shielding containers with ESDS items?
4. All flexible conductive and dissipative package materials inspected before reuse or recycle?
Others
1. Audit result reported to entity ESD control coordinator?
2. Corrective action from previous audits completed?

3. Are audit records complete and on file?

Part No. : LTL42CB6N

Page : 9 of 10

BNS-OD-C131/A4

LITE-ON TECHNOLOGY CORPORATION

P r o p e r t y o f L i t e - O n O n l y

8. Reliability Test

Classification

Test Item

Test Condition

Reference Standard

Operation Life

Ta= Under Room Temperature As
Per Data Sheet Maximum Rating
*Test Time= 1000HRS (-24HRS,+72HRS)

MIL-STD-750D:1026 (1995)
MIL-STD-883D:1005 (1991)
JIS C 7021:B-1 (1982)

High Temperature
High Humidity
Storage

Ta= 65±5
RH= 90 95%
Test Time= 240HRS±2HRS

MIL-STD-202F: 103B(1980)
JIS C 7021 : B-11(1982)

High Temperature
High Humidity
Reverse BIAS

Ta= 65±5
RH= 90 95%
VR=5V
Test Time = 500HRS (-24HRS, +48HRS)

JIS C 7021 : B-11(1982)

High Temperature
Storage

Ta= 105±5
*Test Time= 1000HRS (-24HRS,+72HRS)

MIL-STD-883D:1008 (1991)
JIS C 7021:B-10 (1982)

Endurance
Test

Low Temperature
Storage

Ta= -55±5
*Test Time=1000HRS (-24HRS,+72HRS)

JIS C 7021:B-12 (1982)

Temperature
Cycling

105

-55

30mins 5mins 30mins 5mins
10 Cycles

MIL-STD-202F:107D (1980)
MIL-STD-750D:1051(1995)
MIL-STD-883D:1010 (1991)
JIS C 7021: A-4(1982)

Thermal
Shock

105 ± 5

-55 ± 5

10mins 10mins
10 Cycles

MIL-STD-202F:107D(1980)
MIL-STD-750D:1051(1995)
MIL-STD-883D:1011 (1991)

Solder
Resistance

T.sol = 260 ± 5
Dwell Time= 10 ± 1secs

MIL-STD-202F:210A(1980)
MIL-STD-750D:2031(1995)
JIS C 7021: A-1(1982)

Environmental
Test

Solderability

T. sol = 230 ± 5
Dwell Time= 5 ± 1secs

MIL-STD-202F:208D(1980)
MIL-STD-750D:2026(1995)
MIL-STD-883D:2003(1991)
JIS C 7021: A-2(1982)

9. Others

The appearance and specifications of the product may be modified for improvement, without prior notice.

Part No. : LTL42CB6N

Page : 10 of 10

BNS-OD-C131/A4

Ð­Ð»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: LTL42CB6N

ÐÐ»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: LTL42CB6N