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TVS Avalanche Diode in a Chip Scale Package
SP0501BACT
The product is a silicon P/N structure tailored for ESD protection and is
offered in the standard EIA 0402 size. The single channel Chip Scale
device is used to help protect sensitive digital or analog input circuits on
data, signal, or control lines with voltage levels up to 5VDC. The bipolar
device is ideal for protection where AC signals are present.
The state-of-the-art device is designed to suppress ESD and other
transient over-voltage events to meet the International Electrotechnical
Compatability (EMC transient immunity stantards IEC 61000-4-2 for
Electrosatic Discharge Requirements). The monolithic silicon device is
comprised of specially designed structures for transient voltage suppres-
sion (TVS). The size and shape of these structures has been tailored
for transient protection. The low capacitance and clamp voltage are ideal
for high speed signal line protection.
Ordering Information
Schematic
Features
Single channel suppressor in an EIA 0402 device size
ESD Capability
- IEC 61000-4-2, Direct Discharge .................................30kV (Level 4)
- IEC 61000-4-2, Air Discharge ......................................30kV (Level 4)
- MIL STD 883D (Method 3015.7).................................................30kV
Signal line protection for applications up to 5VDC
Fast response time .........................................................................< 1ns
Low input capacitance .........................................................30pF Typical
Low clamp voltage (8kV test) ................................................13V Typical
Low input leakage ....................................................1nA @ 3.3V Typical
Operating temperature range ............................................-40C to 85C
Applications
Cell phone handsets
Personal Digital Assistants (PDA)
Portable handheld equipment (Laptop, Palmtop computers)
Computer port, keyboard (USB1.1)
Set-Top Box (Audio and Video ports)
PCMCIA cards
SP0501BAC
TVS Diode Arrays
Bumps
2
Part Number
SP0501BACT
Quantity Per
Reel
3500
Package Size
mils (mm)
40x20 (1x 0.5)
Diode
Channels
1
5
TVS DIODE ARRA
YS
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SP0501BACT
TVS Diode Arrays
TVS Avalanche Diode in a Chip Scale Package
Electrical Specifications
T
A
= 25C Unless Otherwise Specified
PARAMETER
Reverse Standoff Voltage
Reverse Standoff Leakage Current
Signal Clamp Voltage
Positive
Negative
Clamp Voltage during ESD
MIL-STD 833D (Method 3015.7)
ESD Test Level
IEC-61000-4-2, Contact discharge
MIL-STD-883D Method 3015 (HBM)
Capacitance
Turn on/off Time
Temperature Range
Operating
Storage
TEST CONDITIONS
I = 10A
V = 5.5V
I = 10mA
I = 10mA
8kV
5V @ 1Mhz
MIN
5.9
6.0
-9.2
30
30
-40
-65
MAX
-
100
9.2
- 6.0
85
150
UNITS
V
A
V
V
V
V
kV
kV
pF
ns
C
C
TYPICAL
-
1
7.5
- 7.5
13
30
<1
50
40
30
20
10
0
0
1
5
4
3
2
Voltage Across Device (V)
0.076
(.003")
0.15 (.006")
0.36
(.014")
0.076 (.003")
1.0 (.04")
0.5 (.02")
0.36 (.014")
0.076 (.003")
NOTE** Metal Bump: 63/37 (Sn/Pb) alloy
Outline Drawing
Typical Device Capacitance vs. Voltage
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TVS Avalanche Diode in a Chip Scale Package
SP0501BACT
Printed Circuit Board Recommendations
Pad Size in PCB
14 x 6 mils (0.356 x 0.152mm)
Pad Shape
Rectangle
Pad Definition
Non Solder Mask Defined Pads (NSMD)
Solder Mask Opening
18 x 10 mils (0.457 x 0.254mm)
Solder Stencil Thickness
6 mils (0.152mm)
Solder Stencil Aperture Opening
14 x 6 mils (0356 x 0.152mm)
Solder Flux Ratio
50/50
Solder Paste Type
No Clean
Board Trace Finish
Organic Solderable Preservative (OSP)
(Enteck: Cu Plus 106A)
28 mils
14 mils 18 mils
10 mils
2 mils
Solder stencil
opening/PCB land
Solder Mask
Opening
6 mils
2 mils
TVS Diode Arrays
5
TVS DIODE ARRA
YS
Typical Solder Reflow Thermal Profile (No-Clean Flux)
0
48
97
Time (s)
145
194
242
290
339
387
435
EXH
CD
RF
Z
Z4
Z3
Z2
PH
EXH
250
225
200
175
150
125
100
75
50
25
T
emper
ature (
o
C)
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