General Purpose Transistors
PNP Silicon
MAXIMUM RATINGS
Symbol
Value
Unit
Collector-Emitter Voltage
V
CEO
20
V
Collector-Base Voltage
V
CBO
40
V
Emitter-Base Voltage
V
EBO
5
V
Collector current-continuoun
IC
500
mAdc
THERMAL CHARATEERISTICS
Symbol
Max
Unit
Total Device Dissipation FR-5 Board, (1)
P
D
225
mW
1.8
mW/
o
C
Thermal Resistance, Junction to Ambient
R
JA
556
o
C
/
W
P
D
300
mW
2.4
mW/
o
C
Thermal Resistance, Junction to Ambient
R
JA
417
o
C
/
W
Junction and Storage Temperature
Tj ,Tstg
-55 to +150
o
C
DEVICE MARKING
L9012PLT1=12P
L9012QLT1=12Q
ELECTRICAL CHARACTERISTICS (T
A
=25
o
C unless otherwise noted)
Symbol
Min
Typ
Max
Unit
OFF CHARACTERISTICS
Collector-Emitter Breakdown Voltage
V
(BR)CEO
20
-
-
V
(I
C
=1.0mA)
Emitter-Base Breakdown Voltage
V
(BR)EBO
5
-
-
V
(I
E
=100
Collector-Base Breakdown Voltage
V
(BR)CBO
40
-
-
V
(I
C
=100
A)
Collector Cutoff Current (V
CB
=35V)
I
CBO
-
-
150
nA
Emitter Cutoff Current (V
BE
=4V)
I
EBO
150
nA
Characteristic
Total Device Dissipation
Derate above 25
o
C
Rating
T
A
=25
o
C
Derate above 25
o
C
Alumina Substrate, (2) T
A
=25
o
C
Characteristic
1
3
2
L9012*LT1
SOT-23 (TO-236AB)
2
EMITTER
3
COLLECTOR
1
BASE
LESHAN RADIO COMPANY, LTD.
L
9012*LT11/2
A)
FEATURE
Pb-Free Package is available.
ORDERING INFORMATION
Device
Package
Shipping
L9012*LT1
SOT-23
3000/Tape&Reel
L9012*LT1G
(Pb-Free)
SOT-23
3000/Tape&Reel
ON CHARACTERISTICS
DC Current Gain
(I
C
=50mA, V
CE
=1V)
H
fe
100
-
600
Collector-Emitter Saturation Voltage
(I
C
=500mA,I
B
=50mA)
V
CE(S)
-
-
0.6
V
NOTE:
*
P
Q
R
S
H
FE
100~200
150~300 200~400 300~600
L
9012*LT12/2
LESHAN RADIO COMPANY, LTD.
D
J
K
L
A
C
B S
H
G
V
3
1
2
DIM
A
MIN
MAX
MIN
MAX
MILLIMETERS
0.1102
0.1197
2.80
3.04
INCHES
B
0.0472
0.0551
1.20
1.40
C
0.0350
0.0440
0.89
1.11
D
0.0150
0.0200
0.37
0.50
G
0.0701
0.0807
1.78
2.04
H
0.0005
0.0040
0.013
0.100
J
0.0034
0.0070
0.085
0.177
K
0.0180
0.0236
0.45
0.60
L
0.0350
0.0401
0.89
1.02
S
0.0830
0.0984
2.10
2.50
V
0.0177
0.0236
0.45
0.60
PIN 1.
BASE
2.
EMITTER
3.
COLLECTOR
mm
inches
0.037
0.95
0.037
0.95
0.079
2.0
0.035
0.9
0.031
0.8
SOLDER PLATING.
2. LEAD THICKNESS SPECIFIED PER L / F DRAWING WITH
1. CONTROLLING DIMENSION: MILLIMETERS
NOTES:
SOT-23 (TO-236AB)
L9012*LT1
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