Silicon Bipolar XXXXXXX (Headline)
Part Number
M/A-COM Division Of AMP Incorporated
n
North America: Tel. (800) 366-2266, Fax (800) 618-8883
n
Asia/Pacific: Tel. +85 2 2111 8088, Fax +85 2 2111 8087
n
Europe: Tel. +44 (1344) 869 595, Fax +44 (1344) 300 020
www.macom.com
AMP and Connecting at a Higher Level are trademarks.
Specifications subject to change without notice.
V3.00
GaAs Constant Gamma Flip-
Chip Varactor Diode
Features
Constant Gamma for Linear Tuning
Low Parasitic Capacitance
High Q
Silicon Nitride Passivation
Polyimide Scratch Protection
Surface Mount Configuration
Description
M/A-COM's MA46H120 is a gallium arsenide flip chip
hyperabrupt varactor diode. These devices are fabricated on
OMCVD epitaxial wafers using a process designed for high
device uniformity and extremely low parasitics. The
MA46H120 diodes are fully passivated with silicon nitride
and have an additional layer of polyimide for scratch
protection. The protective coatings prevent damage to the
junction during automated or manual handling. The flip chip
configuration is suitable for pick and place insertion.
Applications
The MA46H120 hyperabrupt GaAs tuning varactor is
designed for wide bandwidth VCOs and voltage tuned filters
where large capacitance change versus tuning voltage and
high Q are required. With a constant gamma of 1.0, these
diodes are particularly useful where highly predictable
frequency tuning is required.
Chip Layout
TOP VIEW
BOTTOM VIEW
Electrical Specifications @ TA = +25
C
Breakdown Voltage @ I
R
= 10
A, V
B
= 15V Minimum
C
T
C
T
C
T
Q Factor
Gamma
(pF)
(pF)
(pF)
f=1MHz, V
R
=0V
f=1MHz, V
R
=4V
f=1MHz, V
R
=10V
f=50MHz, V
R
=4V
V
R
=2-12V
Min
Typ Max
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
MA46H120
1.1
0.30
0.40
0.14
0.20
3000
0.9
1.1
MA46H120
GaAs Constant Gamma Flip-Chip Varactor Diode
MA46H120
M/A-COM Division Of AMP Incorporated
n
North America: Tel. (800) 366-2266, Fax (800) 618-8883
n
Asia/Pacific: Tel. +85 2 2111 8088, Fax +85 2 2111 8087
n
Europe: Tel. +44 (1344) 869 595, Fax +44 (1344) 300 020
www.macom.com
AMP and Connecting at a Higher Level are trademarks.
Specifications subject to change without notice.
V3.00
Chip Outline Drawing
(ODS-1203)
INCHES
MM
DIM
MIN
MAX
MIN
MAX
A
.025
.027
.64
.69
B
.012
.015
.32
.37
C
.006
.008
.15
.20
D
.007
.009
.17
.22
E
.004
.006
.10
.15
F
.018
.020
.45
.50
Typical Performance Curve
CAPACITANCE vs VOLTAGE
Gamma = 1.0
10% from 2 - 12 Volts
0.1
1
1
10
100
REVERSE VOLTAGE (V)
TOTAL CAPACITANCE (pF)
Absolute Maximum Ratings
1
Parameter
Maximum Ratings
Operating Temperature
-40
C to +125
C
Storage Temperature
-65
C to +150
C
Power Dissipation
100 mW
Mounting Temperature
+235
C for 10 seconds
1. Exceeding these limits may cause permanent damage.
Mounting Techniques
These chips were designed to be inserted onto hard or soft
substrates with the junction side down. They can be
mounted with conductive epoxy or with a low temperature
solder preform. The die can also be assembled with the
junction side up, and wire or ribbon bonds made to the pads.
Solder Die Attachment
Solder which does not scavenge gold, such as Indalloy #2, is
recommended. Sn-Pb based solders are not recommended
due to solder embrittlement. Do not expose die to a
temperature greater than 235
C, or greater than 200
C for
longer than 10 seconds. No more than three seconds of
scrub should be required for attachment.
Epoxy Die Attachment
Assembly can be preheated to 125 - 150
C. Use a minimum
amount of epoxy. Cure epoxy per manufacturer's schedule.
For extended cure times, temperatures must be kept below
200
C.
Handling Procedures
The following precautions should be observed to avoid
damaging GaAs Flip-Chips:
Cleanliness
These chips should be handled in a clean environment. Do
not attempt to clean die after installation.
Static Sensitivity
Varactor diodes are ESD sensitive and can be damaged by
static electricity. Proper ESD techniques should be followed
to when handling these devices.
General Handling
The protective polymer coating on the active areas of these
dice provides scratch protection, particularly for the metal
airbridge which contacts the anode. Dice can be handled
with tweezers or vacuum pickups and are suitable for use
with automatic pick-and-place equipment.
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