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DA1175.005
26 March, 2002
MAS1175
IC FOR 10.00 20.00 MHz VCTCXO
Low Power
Wide Supply Voltage Range
True Sine Wave Output
Very High Level of Integration
Electrically Trimmable
Very Low Phase Noise
Low Cost
DESCRIPTION
The MAS1175 is an integrated circuit well suited to
build VCTCXO for mobile communication. Only two
external components are needed. Temperature
calibration is achieved with three calibration points
only. The trimming is done through a serial bus and
the calibration information is stored in an internal
PROM.
To build a VCTCXO only two additional
components, a varactor and a crystal are needed.
The compensation method is fully analog. IC
compensation work is continuous without
generating any steps or other interferences.
FEATURES
APPLICATIONS
Very small size
Minimum current draw
Wide operating temperature range
Phase noise <-130 dBc/Hz at 1 kHz offset
VCTCXO for mobile phones
VCTCXO for other telecommunications
systems
BLOCK DIAGRAM
MAS1175
T
Vref
TMux
DA
CLK
PV
VSS
VC
VDD
4
4
f(T)
f(T)
4
8
CUB
INF
SENS
LIN
8
CDAC1
CDAC2
TE1
TE2
X2
OUT
X1
2
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DA1175.005
26 March, 2002
PIN DESCRIPTION
Pin Description
Symbol
x-coordinate
y-coordinate
Power Supply Voltage
VDD
263
1330
Programming Input
PV
503
1326
Serial Bus Clock Input
CLK
745
1321
Serial Bus Data Input
DA
1001
1321
Temperature Output
TE1
1246
1325
Test Multiplexer Output
TE2
1454
1325
Voltage Control Input
VC
190
231
Crystal Oscillator Output
X1
398
231
Crystal/Varactor Oscillator Input
X2
1355
231
Power Supply Ground
VSS
1828
242
Buffer Output
OUT
2031
231
Note: Because the substrate of the die is internally connected to VDD, the die has to be connected to VDD or
left floating. Make sure that VDD is the first pad to be bonded. Pick-and-place and all component assembly are
recommended to be performed in ESD protected area.
Note: Pad coordinates are measured from the left bottom corner of the chip to the center of the pads. The
coordinates may vary depending on sawing width and location, however, distances between pads are accurate.
ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Min
Max
Unit
Note
Supply Voltage
V
DD
- V
SS
-0.3
6.0
V
Input Voltage
V
IN
V
SS
-0.3
V
DD
+ 0.3
V
1)
Power Dissipation
P
MAX
20
mW
Storage Temperature
T
ST
-40
120
o
C
Note: Not valid for programming pin PV
RECOMMENDED OPERATION CONDITIONS
Parameter
Symbol
Conditions
Min
Typ
Max
Unit
Supply Voltage
V
DD
2.7
2.8
5.5
V
Supply Current
I
CC
Vcc = 2.8 Volt
1.8
mA
Operable Temperature
T
C
-30
+85
o
C
Storage Temperature
T
S
Relative humidity =
15%...70%
-5
+40
o
C
Crystal Pulling Sensitivity
S
30
ppm/pF
Load Capacitance
C
L
10
pF
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DA1175.005
26 March, 2002
ELECTRICAL CHARACTERISTICS
Parameter
Symbol
Min
Typ
Max
Unit
Note
Frequency Range
f
o
10.00
20.00
MHz
Voltage Control Range
V
C
0
Vdd
Voltage Control Sensitivity
V
CSENS
10
ppm/V
Output Voltage (10k
// 10 pF)
V
out
1.0
Vpp
Compensation Range 2.5 ppm
T
C
-30
85
o
C
Compensation Range 2.0 ppm
T
C
-25
75
o
C
Compensation Range Linear Part
a1
-0.7
0.0
ppm/K
Compensation Inflection Point
INF
25
31
o
C
Compensation Range Cubic Part
a3
95
ppm
2
/K
3
Compensation CDAC1 (8 Bit)
C
X1
C10
C10 + 18
pF
2)
Compensation CDAC2 (2 Bit)
C
X2
C20
C20 + 4
pF
3)
Startup Time
T
START
2
ms
Note 2: typ C10 = 14pF
Note 3: typ C20 = 5pF (varactor capacitance has to be added)
IC OUTLINES
Note 1: MAS1175A pads are round with 95 m diameter at opening.
Note 2: Pins PV and TE1 shall not be connected and pins CLK and DA can either be connected to VSS or left
open in VCTCXO module end-user application.
Note 3: Die map reference is the actual left bottom corner of the sawn chip.
VDD
PV
CLK
DA
TE1
TE2
VC
X1
X2
VSS
OUT
MAS1175
2234 m
1
5
5
6
m
Die map reference
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DA1175.005
26 March, 2002
DEVICE OUTLINE CONFIGURATION
MSOP10
TE2
DA
CLK
PV
VDD
OUT
VSS
X2
X1
VC
Top View
1
1
7
5
A
Y
W
W
A = product version
Y = year
WW= week
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DA1175.005
26 March, 2002
PACKAGE (MSOP-10) OUTLINE
Symbol
Min
Nom
Max
Unit
A
--
--
1.10
mm
A1
0.00
--
0.15
mm
A2
0.75
0.85
0.95
mm
b
0.15
--
0.30
mm
b1
0.15
---
0.25
mm
c
0.08
0.23
mm
c1
0.08
0.18
mm
D
3.00 BSC
mm
E
4.90 BSC
mm
E1
3.00 BSC
mm
e
0.50 BSC
mm
F
4.8
mm
G
0.50
mm
L
(Terminal length for
soldering)
0.40
0.60
0.80
mm
L1
0.95 REF
L2
0.25 BSC
mm
M
0.41
mm
N
1.02
mm
S
0.50
Mm
Dimensions do not include mold or interlead flash, protrusions or gate burrs.
Reference Standard : JEDEC MO-187 BA.
b1
B
(b)
c
c1
F
G
M
N
Land
Pattern
Recommendation
See Detail A
Detail A
5-15 Degrees
Gauge Plane
Seating Plane
0 - 8 Degrees
B
E
L1
L
L2
D
A
A1
E1
e
S
E1
A2
E
A
A
Section B - B
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