MAX1287EKA
Rev. A
RELIABILITY REPORT
FOR
MAX1287EKA
PLASTIC ENCAPSULATED DEVICES
February 1, 2004
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Written by
Reviewed by
Jim Pedicord
Bryan J. Preeshl
Quality Assurance
Quality Assurance
Reliability Lab Manager
Executive Director
Conclusion
The MAX1287 successfully meets the quality and reliability standards required of all Maxim products. In addition,
Maxim's continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim's quality
and reliability standards.
Table of Contents
I. ........Device Description
V. ........Quality Assurance Information
II. ........Manufacturing Information
VI. .......Reliability Evaluation
III. .......Packaging Information
IV. .......Die Information
.....Attachments
I. Device Description
A. General
The MAX1287 is a low-cost, micropower, serial output 12-bit analog-to-digital converter (ADC) available in a tiny 8-pin
SOT23. The MAX1287 operates with a single +3V supply. The devices feature a successive-approximation ADC,
automatic shutdown, fast wakeup (1.4s), and a high-speed 3-wire interface. Power consumption is only 0.5mW
(V
DD
= +2.7V) at the maximum sampling rate of 150ksps. AutoShutdownTM (0.2A) between conversions results in
reduced power consumption at slower throughput rates. The MAX1287 provides 2-channel, single-ended operations
and accept input signals from 0 to V
REF
. Data is accessed using an external clock through the 3-wire
SPITM/QSPITM/MICROWIRETM-compatible serial interface. Excellent dynamic performance, low power, ease of use,
and small package size make these converters ideal for portable battery-powered data-acquisition applications, and
for other applications that demand low power consumption and minimal space.
B. Absolute Maximum Ratings
Item
Rating
VDD to GND
-0.3V to +6V
CNVST, SCLK, DOUT to GND
-0.3V to (VDD + 0.3V)
REF, AIN1 (AIN+), AIN2 (AIN-) to GND
-0.3V to (VDD + 0.3V)
Maximum Current into Any Pin
50mA
Operating Temperature Range
-40C to +85C
Storage Temperature Range
-60C to +150C
Lead Temperature (soldering, 10s)
+300C
Continuous Power Dissipation (TA = +70C)
8-Pin SOT
696mW
Derates above +70C
8-Pin SOT
9.7mW/C
II. Manufacturing Information
A. Description/Function: 150ksps, 12-Bit, 2-Channel Single-Ended ADCs in SOT23
B. Process:
S6 (Standard 0.6 micron silicon gate CMOS)
C. Number of Device Transistors:
6922
D. Fabrication Location: California, USA
E. Assembly Location:
Malaysia
F. Date of Initial Production:
October, 2001
III. Packaging Information
A. Package Type:
8-Pin SOT
B. Lead Frame:
Copper
C. Lead Finish:
Solder Plate
D. Die Attach:
N/A
E. Bondwire:
6 mil dia. ball
F. Mold Material:
Epoxy with silica filler
G. Assembly Diagram:
#05-2101-0032
H. Flammability Rating:
Class UL94-V0
I. Classification of Moisture Sensitivity
per JEDEC standard JESD22-112: Level 1
IV. Die Information
A. Dimensions:
90 x 45 mils
B. Passivation:
Si
3
N
4
/SiO
2
(Silicon nitride/ Silicon dioxide)
C. Interconnect:
Aluminum/Si (Si = 1%)
D. Backside Metallization:
None
E. Minimum Metal Width:
0.6 microns (as drawn)
F. Minimum Metal Spacing:
0.6 microns (as drawn)
G. Bondpad Dimensions:
5 mil. Sq.
H. Isolation Dielectric:
SiO
2
I. Die Separation Method:
Wafer Saw
V. Quality Assurance Information
A. Quality Assurance Contacts:
Jim Pedicord (Manager, Reliability Operations)
Bryan Preeshl (Executive Director)
Kenneth Huening (Vice President)
B. Outgoing Inspection Level: 0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate: < 50 ppm
D. Sampling Plan: Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135
C biased (static) life test are shown in Table 1. Using these results, the Failure
Rate (
) is calculated as follows:
= 1 = 1.83 (Chi square value for MTTF upper limit)
MTTF
192 x 4389 x 320 x 2
Temperature Acceleration factor assuming an activation energy of 0.8eV
= 3.39 x 10
-9
= 3.39 F.I.T. (60% confidence level @ 25
C)
This low failure rate represents data collected from Maxim's reliability monitor program. In addition to
routine production Burn-In, Maxim pulls a sample from every fabrication process three times per week and subjects
it to an extended Burn-In prior to shipment to ensure its reliability. The reliability control level for each lot to be
shipped as standard product is 59 F.I.T. at a 60% confidence level, which equates to 3 failures in an 80 piece
sample. Maxim performs failure analysis on any lot that exceeds this reliability control level. Attached Burn-In
Schematic (Spec. # 06-5676) shows the static Burn-In circuit. Maxim also performs quarterly 1000 hour life test
monitors. This data is published in the Product Reliability Report (RR-1M).
B. Moisture Resistance Tests
Maxim pulls pressure pot samples from every assembly process three times per week. Each lot sample
must meet an LTPD = 20 or less before shipment as standard product. Additionally, the industry standard
85
C/85%RH testing is done per generic device/package family once a quarter.
C. E.S.D. and Latch-Up Testing
The AC13
die type has been found to have all pins able to withstand a transient pulse of
1000V per Mil-
Std-883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that this device
withstands a current of
200mA.
Table 1
Reliability Evaluation Test Results
MAX1287EKA
TEST ITEM
TEST CONDITION
FAILURE
SAMPLE
NUMBER OF
IDENTIFICATION
PACKAGE
SIZE
FAILURES
Static Life Test (Note 1)
Ta = 135
C
DC Parameters
320
0
Biased
& functionality
Time = 192 hrs.
Moisture Testing (Note 2)
Pressure Pot
Ta = 121
C
DC Parameters
SOT
77
0
P = 15 psi.
& functionality
RH= 100%
Time = 168hrs.
85/85
Ta = 85
C
DC Parameters
77
0
RH = 85%
& functionality
Biased
Time = 1000hrs.
Mechanical Stress (Note 2)
Temperature
-65
C/150
C
DC Parameters
77
0
Cycle
1000 Cycles
Method 1010
Note 1: Life Test Data may represent plastic DIP qualification lots.
Note 2: Generic Package/Process data
PDF 
ZIP