Conclusion

The MAX8561 successfully meets the quality and reliability standards required of all Maxim products. In addition,

Maxim's continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim's quality
and reliability standards.

Table of Contents

I. ........Device Description

V. ........Quality Assurance Information

II. ........Manufacturing Information

VI. .......Reliability Evaluation

III. .......Packaging Information

IV. .......Die Information

.....Attachments

I. Device Description

A. General

The MAX8561 step-down dc-dc converter is optimized for applications that prioritize small size and high efficiency. It
utilizes a proprietary hysteretic-PWM control scheme that switches with fixed frequency and is adjustable up to
4MHz, allowing customers to trade efficiency for smaller external components. Output current is guaranteed up to
500mA, while quiescent current is only 40礎 (typ).

Internal synchronous rectification greatly improves efficiency and eliminates the external Schottky diode required in
conventional step-down converters. Built-in soft-start eliminates inrush current to reduce input capacitor
requirements. The MAX8561 features logic-controlled output voltage.

The MAX8561 is available in space-saving 8-pin 3mm x 3mm Thin DFN packages.

B. Absolute Maximum Ratings

Item

Rating

IN, FB, SHDN, ODI, ODO to GND

-0.3V to +6V

LX to GND (Note 1)

-0.3V to (VIN + 0.3V)

PGND to GND

-0.3V to +0.3V

LX Current

1.27A

Output Short Circuit to GND (typical operating circuit)

10s

Operating Temperature Range

-40癈 to +85癈

Junction Temperature

+150癈

Storage Temperature Range

-65癈 to +150癈

Lead Temperature (soldering, 10s)

+300癈

Continuous Power Dissipation (TA = +70癈)
8-Pin Thin DFN (3 x 3)

1951mW

Derates above +70癈
8-Pin Thin DFN (3 x 3)

24.4mW/癈

Note 1: LX has internal clamp diodes to PGND and IN. Applications that forward bias these diodes should take care
not to exceed the IC's package power-dissipation limits.

II. Manufacturing Information

A. Description/Function: 4MHz, 500mA Synchronous Step-Down DC-DC Converters in SOT and TDFN

B. Process:

B8 (Standard 0.8 micron silicon gate CMOS)

C. Number of Device Transistors:

1271

D. Fabrication Location: California, USA

E. Assembly Location:

Thailand

F. Date of Initial Production:

July, 200

III. Packaging Information

A. Package Type:

8-Pin Thin DFN

B. Lead Frame:

Copper

C. Lead Finish:

Solder Plate

D. Die Attach:

Silver-Filled Epxoy

E. Bondwire:

Gold (1.3 mil dia.)

F. Mold Material:

Epoxy with silica filler

G. Assembly Diagram:

# 05-9000-0685

H. Flammability Rating:

Class UL94-V0

I. Classification of Moisture Sensitivity
per JEDEC standard JESD22-112: Level 1

IV. Die Information

A. Dimensions:

40 x 59 mils

B. Passivation:

/SiO

(Silicon nitride/ Silicon dioxide)

C. Interconnect:

Aluminum/Si (Si = 1%)

D. Backside Metallization:

None

E. Minimum Metal Width:

0.8 microns (as drawn)

F. Minimum Metal Spacing:

0.8 microns (as drawn)

G. Bondpad Dimensions:

5 mil. Sq.

H. Isolation Dielectric:

SiO

I. Die Separation Method:

Wafer Saw

V. Quality Assurance Information

A. Quality Assurance Contacts:

Jim Pedicord (Manager, Reliability Operations)

Bryan Preeshl (Executive Director)

Kenneth Huening (Vice President)

B. Outgoing Inspection Level: 0.1% for all electrical parameters guaranteed by the Datasheet.

0.1% For all Visual Defects.

C. Observed Outgoing Defect Rate: < 50 ppm

D. Sampling Plan: Mil-Std-105D

VI. Reliability Evaluation

A. Accelerated Life Test
B.

The results of the 135

�

C biased (static) life test are shown in Table 1. Using these results, the Failure

Rate (

) is calculated as follows:

= 1 = 1.83 (Chi square value for MTTF upper limit)

MTTF

192 x 4389 x 48 x 2

Temperature Acceleration factor assuming an activation energy of 0.8eV

= 22.62 x 10

-9

= 22.62 F.I.T. (60% confidence level @ 25

�

This low failure rate represents data collected from Maxim's reliability monitor program. In addition to

routine production Burn-In, Maxim pulls a sample from every fabrication process three times per week and subjects
it to an extended Burn-In prior to shipment to ensure its reliability. The reliability control level for each lot to be
shipped as standard product is 59 F.I.T. at a 60% confidence level, which equates to 3 failures in an 80 piece
sample. Maxim performs failure analysis on any lot that exceeds this reliability control level. Attached Burn-In
Schematic (Spec. # 06-6205) shows the static Burn-In circuit. Maxim also performs quarterly 1000 hour life test
monitors. This data is published in the Product Reliability Report (RR-1M).

B. Moisture Resistance Tests

Maxim pulls pressure pot samples from every assembly process three times per week. Each lot sample

must meet an LTPD = 20 or less before shipment as standard product. Additionally, the industry standard
85

�

C/85%RH testing is done per generic device/package family once a quarter.

C. E.S.D. and Latch-Up Testing

The PN18-1

die type has been found to have all pins able to withstand a transient pulse of

�

1000V, per Mil-

Std-883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that this device
withstands a current of

�

250mA.

Table 1

Reliability Evaluation Test Results

MAX8561ETA

TEST ITEM

TEST CONDITION

FAILURE

SAMPLE

NUMBER OF

IDENTIFICATION

PACKAGE

SIZE

FAILURES

Static Life Test (Note 1)

Ta = 135

�

DC Parameters

Biased

& functionality

Time = 192 hrs.

Moisture Testing (Note 2)

Pressure Pot

Ta = 121

�

DC Parameters

QFN

P = 15 psi.

& functionality

RH= 100%

Time = 168hrs.

85/85

Ta = 85

�

DC Parameters

RH = 85%

& functionality

Biased

Time = 1000hrs.

Mechanical Stress (Note 2)

Temperature

-65

�

C/150

�

DC Parameters

Cycle

1000 Cycles

& functionality

Method 1010

Note 1: Life Test Data may represent plastic DIP qualification lots.
Note 2: Generic Package/Process data

协谢械泻褌褉芯薪薪褘泄 泻芯屑锌芯薪械薪褌: MAX8560

协谢械泻褌褉芯薪薪褘泄泻芯屑锌芯薪械薪褌: MAX8560