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General Description
The MAX9390/MAX9391 dual 2 x 2 crosspoint switches
perform high-speed, low-power, and low-noise signal
distribution. The MAX9390/MAX9391 multiplex one of two
differential input pairs to either or both low-voltage differ-
ential signaling (LVDS) outputs for each channel.
Independent enable inputs turn on or turn off each differ-
ential output pair.
Four LVCMOS/LVTTL logic inputs (two per channel) con-
trol the internal connections between inputs and outputs.
This flexibility allows for the following configurations: 2 x 2
crosspoint switch, 2:1 mux, 1:2 splitter, or dual repeater.
This makes the MAX9390/MAX9391 ideal for protection
switching in fault-tolerant systems, loopback switching for
diagnostics, fanout buffering for clock/data distribution,
and signal regeneration.
Fail-safe circuitry forces the outputs to a differential low
condition for undriven inputs or when the common-
mode voltage exceeds the specified range. The
MAX9390 provides high-level input fail-safe detection
for LVDS, HSTL, and other GND-referenced differential
inputs. The MAX9391 provides low-level input fail-safe
detection for LVPECL, CML, and other V
CC
-referenced
differential inputs.
Ultra-low 82ps
(
P-P)
(max) pseudorandom bit sequence
(PRBS) jitter ensures reliable communications in high-
speed links that are highly sensitive to timing error,
especially those incorporating clock-and-data recovery,
or serializers and deserializers. The high-speed switch-
ing performance guarantees 1.5GHz operation and less
than 65ps (max) skew between channels.
LVDS inputs and outputs are compatible with the
TIA/EIA-644 LVDS standard. The LVDS outputs drive
100
loads. The MAX9390/MAX9391 are offered in a
32-pin TQFP and 5mm x 5mm thin QFN package with
exposed paddle and operate over the extended tem-
perature range (-40C to +85C).
Also refer to the MAX9392/MAX9393 with flow-through
pinout.
Applications
High-Speed Telecom/Datacom Equipment
Central-Office Backplane Clock Distribution
DSLAM
Protection Switching
Fault-Tolerant Systems
Features
o 1.5GHz Operation with 250mV Differential Output
Swing
o 2ps
(RMS)
(max) Random Jitter
o AC Specifications Guaranteed for 150mV
Differential Input
o Signal Inputs Accept Any Differential Signaling
Standard
o LVDS Outputs for Clock or High-Speed Data
o High-Level Input Fail-Safe Detection (MAX9390)
o Low-Level Input Fail-Safe Detection (MAX9391)
o +3.0V to +3.6V Supply Voltage Range
o LVCMOS/LVTTL Logic Inputs Control Signal
Routing
MAX9390/MAX9391
Anything-to-LVDS Dual 2 x 2
Crosspoint Switches
________________________________________________________________ Maxim Integrated Products
1
TOP VIEW
MAX9390
MAX9391
TQFP
32
28
29
30
31
25
26
27
INA1
INA1
V
CC
ASEL0
ASEL1
INA0
INA0
GND
10
13
15
14
16
11
12
9
GND
INB0
INB0
BSEL0
V
CC
INB1
INB1
BSEL1
17
18
19
20
21
22
23 OUTA0
24 V
CC
OUTA0
ENA0
GND
OUTA1
OUTA1
ENA1
2
3
4
5
6
7
8
V
CC
OUTB0
OUTB0
GND
OUTB1
OUTB1
1
ENB1
ENB0
PART
TEMP RANGE
PIN-PACKAGE
MAX9390EHJ
-40C to +85C
32 TQFP
MAX9390ETJ*
-40C to +85C
32 Thin QFN
MAX9391EHJ
-40C to +85C
32 TQFP
MAX9391ETJ*
-40C to +85C
32 Thin QFN
Pin Configurations
Ordering Information
19-2829; Rev 1; 7/03
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim's website at www.maxim-ic.com.
*Future product--contact factory for availability.
Pin Configurations continued at end of data sheet.
Functional Diagram and Typical Operating Circuit appear at
end of data sheet.
MAX9390/MAX9391
Anything-to-LVDS Dual 2 x 2
Crosspoint Switches
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
DC ELECTRICAL CHARACTERISTICS
(V
CC
= +3.0V to +3.6V, R
L
= 100
1%, EN_ _ = V
CC
, V
CM
= 0.05V to (V
CC
- 0.6V) (MAX9390), V
CM
= 0.6V to (V
CC
- 0.05V)
(MAX9391) T
A
= -40C to +85C, unless otherwise noted. Typical values are at V
CC
= +3.3V, |V
ID
| = 0.2V, V
CM
= +1.2V, T
A
= +25C.)
(Notes 1, 2, and 3)
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
V
CC
to GND ...........................................................-0.3V to +4.1V
IN_ _, IN_ _, OUT_ _, OUT_ _, EN_ _,
_SEL_ to GND.........................................-0.3V to (V
CC
+ 0.3V)
IN_ _ to IN_ _ ..........................................................................
3V
Short-Circuit Duration (OUT_ _, OUT_ _) ...................Continuous
Continuous Power Dissipation (T
A
= +70C)
32-Pin QFP (derate 13.1mW/C
above +70C).............................................................1047mW
32-Pin 5mm x 5mm Thin QFN (derate 21.3mW/C
above +70C).............................................................1702mW
Junction-to-Ambient Thermal Resistance in Still Air
32-Pin QFP..............................................................+76.4C/W
32-Pin 5mm x 5mm Thin QFN....................................+47C/W
Junction-to-Case Thermal Resistance
32-Pin 5mm x 5mm Thin QFN......................................+2C/W
Operating Temperature Range ...........................-40C to +85C
Junction Temperature ......................................................+150C
Storage Temperature Range .............................-65C to +150C
ESD Protection (Human Body Model)
(IN_ _, IN_ _, OUT_ _, OUT_ _, EN_ _, SEL_ _) ................
2kV
Soldering Temperature (10s) ...........................................+300C
PARAMETER
SYM B O L CONDITIONS
MIN
TYP
MAX
UNITS
LVCMOS/LVTTL INPUTS (EN_ _, _SEL_)
Input High Voltage
V
IH
2.0
V
CC
V
Input Low Voltage
V
IL
0
0.8
V
Input High Current
I
IH
V
IN
= +2.0V to V
CC
0
20
A
Input Low Current
I
IL
V
IN
= 0 to +0.8V
0
10
A
DIFFERENTIAL INPUTS (IN_ _,
I
I
I
IN
N
N
N__
_
_ __
_
_)
Differential Input Voltage
V
ID
V
ILD
>
0 and V
IHD
<
V
CC
, Figure 1
0.1
3.0
V
MAX9390
0.05
V
CC
- 0.6
Input Common-Mode Range
V
CM
MAX9391
0.6
V
CC
- 0.05
V
MAX9390
|V
ID
|
< 3.0V
-75
+10
Input Current
I
IN_ _
,
I
IN_ _
MAX9391
|V
ID
|
< 3.0V
-10
+100
A
LVDS OUTPUTS (OUT_ _,
O
O
O
OU
U
U
UT
T
T
T__
_
_ __
_
_)
Differential Output Voltage
V
OD
R
L
= 100
, Figure 2
250
350
450
mV
Change in Magnitude of V
OD
Between Complementary Output
States
V
OD
Figure 2
1.0
50
mV
Offset Common-Mode Voltage
V
OS
Figure 2
1.125
1.25
1.375
V
Change in Magnitude of V
OS
Between Complementary Output
States
V
OS
Figure 2
1.0
50
mV
MAX9390/MAX9391
Anything-to-LVDS Dual 2 x 2
Crosspoint Switches
_______________________________________________________________________________________
3
AC ELECTRICAL CHARACTERISTICS
(V
CC
= +3.0V to +3.6V, f
IN
< 1.34GHz, t
R_IN
= t
F_IN
= 125ps, R
L
= 100
1%, |V
ID
| > 150mV, V
CM
= +0.075V to (V
CC
- 0.6V)
(MAX9390 only), V
CM
= +0.6V to (V
CC
- 0.075V) (MAX9391 only), EN_ _ = V
CC
, T
A
= -40C to +85C, unless otherwise noted. Typical
values are at V
CC
= +3.3V, |V
ID
| = 0.2V, V
CM
= +1.2V, f
IN
= 1.34GHz, T
A
= +25C.) (Note 5)
Note 1: Measurements obtained with the device in thermal equilibrium. All voltages referenced to GND except V
ID
, V
OD
, and
V
OD
.
Note 2: Current into the device defined as positive. Current out of the device defined as negative.
Note 3: DC parameters tested at T
A
= +25C and guaranteed by design and characterization for T
A
= -40C to +85C.
Note 4: Current through either output.
Note 5: Guaranteed by design and characterization. Limits set at
6 sigma.
Note 6: t
SKEW
is the magnitude difference of differential propagation delays for the same output over same conditions. t
SKEW
=
|t
PHL
- t
PLH
|.
Note 7: Measured between outputs of the same device at the signal crossing points for a same-edge transition, under the same
conditions.
Note 8: Device jitter added to the differential input signal.
DC ELECTRICAL CHARACTERISTICS (continued)
(V
CC
= +3.0V to +3.6V, R
L
= 100
1%, EN_ _ = V
CC
, V
CM
= 0.05V to (V
CC
- 0.6V) (MAX9390), V
CM
= 0.6V to (V
CC
- 0.05V)
(MAX9391) T
A
= -40C to +85C, unless otherwise noted. Typical values are at V
CC
= +3.3V, |V
ID
| = 0.2V, V
CM
= +1.2V, T
A
= +25C.)
(Notes 1, 2, and 3)
PARAMETER
SYM B O L CONDITIONS
MIN
TYP
MAX
UNITS
V
OUT_ _
or V
OUT_ _
= 0
30
40
Output Short-Circuit Current
(Either Output Shorted to GND)
|I
OS
|
V
ID
=
100m V
( N ote 4)
V
OUT_ _
= V
OUT_ _
= 0
18
24
mA
Output Short-Circuit Current
(Outputs Shorted Together)
|I
OSB
|
V
ID
=
100mV, V
OUT_ _
= V
OUT_ _
(Note 4)
5.0
12
mA
SUPPLY CURRENT
R
L
= 100
, EN_ _ = V
CC
68
98
Supply Current
I
CC
R
L
= 100
, EN_ _ = V
CC
, switching at
670MHz (1.34Gbps)
68
98
mA
PARAMETER
SYM B O L CONDITIONS
MIN
TYP
MAX
UNITS
_SEL_ to Switched Output
t
SWITCH
Figure 3
1.1
ns
Disable, Time to Differential
Output Low
t
PHD
Figure 4
1.7
ns
Enable, Time to Differential
Output High
t
PDH
Figure 4
1.7
ns
Switching Frequency
f
MAX
V
OD
>
250mV
1.50
2.20
GHz
Low-to-High Propagation Delay
t
PLH
Figures 1, 5
294
409
565
ps
High-to-Low Propagation Delay
t
PHL
Figures 1, 5
286
402
530
ps
Pulse Skew |t
PLH
- t
PHL
|
t
SKEW
Figures 1, 5 (Note 6)
7
97
ps
Output-to-Output Skew
t
CCS
Figures 5, 6 (Note 7)
10
65
ps
Output Low-to-High Transition
Time (20% to 80%)
t
R
Figures 1, 5; f
IN
= 100MHz
112
153
185
ps
Output High-to-Low Transition
Time (80% to 20%)
t
F
Figures 1, 5; f
IN
= 100MHz
112
153
185
ps
Added Random Jitter
t
RJ
f
IN_ _
= 1.34GHz, clock pattern (Note 8)
2
ps
(RMS)
Added Deterministic Jitter
t
DJ
1.34Gbps, 2
23
- 1 PRBS (Note 8)
55
82
ps
(P-P)
MAX9390/MAX9391
Anything-to-LVDS Dual 2 x 2
Crosspoint Switches
4
_______________________________________________________________________________________
Typical Operating Characteristics
(V
CC
= +3.3V, |V
ID
| = 0.2V, V
CM
= +1.2V, f
IN
= 1.34GHz, T
A
= +25C.)
SUPPLY CURRENT
vs. TEMPERATURE
MAX9390 toc01
TEMPERATURE (
C)
SUPPLY CURRENT (mA)
60
35
10
-15
58
62
66
70
74
78
82
54
-40
85
V
CC
= +3.6V
V
CC
= +3.3V
V
CC
= +3V
OUTPUT AMPLITUDE
vs. FREQUENCY
MAX9390 toc02
FREQUENCY (GHz)
OUTPUT AMPLITUDE (mV)
2.2
2.0
0.2 0.4 0.6
1.0 1.2 1.4 1.6
0.8
1.8
50
100
150
200
250
300
350
400
0
0
2.4
OUTPUT RISE AND FALL TIMES
vs. TEMPERATURE
MAX9390 toc03
TEMPERATURE (
C)
RISE/FALL TIME (ps)
60
35
10
-15
130
140
150
160
170
180
120
-40
85
t
F
f
IN
= 100MHz
t
R
PROPAGATION DELAY
vs. TEMPERATURE
MAX9390 toc04
TEMPERATURE (
C)
PROPAGATION DELAY (ps)
60
35
10
-15
360
370
380
390
400
410
420
430
440
450
350
-40
85
MAX9390
DIFFERENTIAL INPUT CURRENT
vs. TEMPERATURE
MAx9390 toc05
TEMPERATURE (
C)
INPUT CURRENT (
A)
60
35
10
-15
-45
-40
-35
-30
-25
-20
-15
-10
-5
0
5
10
-50
-40
85
V
IN
= -0.1V
V
IN
= 3V
MAX9391
DIFFERENTIAL INPUT CURRENT
vs. TEMPERATURE
MAX9390 toc06
TEMPERATURE (
C)
INPUT CURRENT (
A)
60
35
10
-15
0
10
20
30
40
50
60
70
80
-10
-40
85
V
IN
= 3.2V
V
IN
= 0.3V
MAX9390 INPUT CURRENT vs. V
IHD
MAX9390 toc07
V
IHD
(V)
INPUT CURRENT (
A)
3.3
3.0
2.4 2.7
0.6 0.9 1.2 1.5 1.8 2.1
0.3
-45
-40
-35
-30
-25
-20
-15
-10
-5
0
5
10
-50
0
3.6
IN_ _ OR
IN_ _ = GND
V
CC
= +3V
V
CC
= +3.6V
MAX9391
DIFFERENTIAL INPUT CURRENT vs. V
ILD
MAX9390 toc08
V
ILD
(V)
INPUT CURRENT (
A)
3.3
3.0
2.4 2.7
0.6 0.9 1.2 1.5 1.8 2.1
0.3
0
3.6
-10
10
0
40
30
20
50
60
70
80
V
CC
= +3.6V
V
CC
= +3V
IN_ _ OR
IN_ _ = V
CC
MAX9390/MAX9391
Anything-to-LVDS Dual 2 x 2
Crosspoint Switches
_______________________________________________________________________________________
5
PIN
NAME
FUNCTION
1
ENB1
B1 Output Enable. Drive ENB1 high to enable the B1 LVDS outputs. An internal 435k
resistor pulls ENB1
low when unconnected.
2
OUTB1
B1 LVDS Noninverting Output. Connect a 100
termination resistor between OUTB1 and OUTB1 at the
receiver inputs to ensure proper operation.
3
OUTB1
B1 LVDS Inverting Output. Connect a 100
termination resistor between OUTB1 and OUTB1 at the
receiver inputs to ensure proper operation.
4, 9,
20, 25
GND
Ground
5
ENB0
B0 Output Enable. Drive ENB0 high to enable the B0 LVDS outputs. An internal 435k
resistor pulls ENB0
low when unconnected.
6
OUTB0
B0 LVDS Noninverting Output. Connect a 100
termination resistor between OUTB0 and OUTB0 at the
receiver inputs to ensure proper operation.
7
OUTB0
B0 LVDS Inverting Output. Connect a 100
termination resistor between OUTB0 and OUTB0 at the
receiver inputs to ensure proper operation.
8, 13,
24, 29
V
CC
Power-Supply Input. Bypass each V
CC
to GND with 0. 1F and 0.01F ceramic capacitors. Install both
bypass capacitors as close to the device as possible, with the 0.01F capacitor closest to the device.
10
INB0
LVDS/HSTL (MAX9390) or LVPECL/CML (MAX9391) Inverting Input. An internal 128k
resistor to V
CC
pulls
the input high when unconnected (MAX9390). An internal 68k
resistor to GND pulls the input low when
unconnected (MAX9391).
11
INB0
LVDS/HSTL (MAX9390) or LVPECL/CML (MAX9391) Noninverting Input. An internal 128k
resistor to V
CC
pulls the input high when unconnected (MAX9390). An internal 68k
resistor to GND pulls the input low
when unconnected (MAX9391).
12
BSEL0
Input Select for B0 Output. Selects the differential input to reproduce at the B0 differential outputs. Connect
BSEL0 to GND or leave open to select the INB0 (INB0) set of inputs. Connect BSEL0 to V
CC
to select the
INB1 (INB1) set of inputs. An internal 435k
resistor pulls BSEL0 low when unconnected.
14
INB1
LVDS/HSTL (MAX9390) or LVPECL/CML (MAX9391) Inverting Input. An internal 128k
resistor to V
CC
pulls
the input high when unconnected (MAX9390). An internal 68k
resistor to GND pulls the input low when
unconnected (MAX9391).
15
INB1
LVDS/HSTL (MAX9390) or LVPECL/CML (MAX9391) Noninverting Input. An internal 128k
resistor to V
CC
pulls the input high when unconnected (MAX9390). An internal 68k
resistor to GND pulls the input low
when unconnected (MAX9391).
16
BSEL1
Input Select for B1 Output. Selects the differential input to reproduce at the B1 differential outputs. Connect
BSEL1 to GND or leave open to select the INB0 (INB0) set of inputs. Connect BSEL1 to V
CC
to select the
INB1 (INB1) set of inputs. An internal 435k
resistor pulls BSEL1 low when unconnected.
Pin Description
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