SCOPE: CMOS, BUFFERED, MULTIPLYING 8-BIT D/A CONVERTER

Device Type Generic Number Circuit Function
01

MX7528S(x)/883B DAC with

4 LSB

02 MX7528T(x)/883B DAC with

2 LSB

03 MX7528U(x)/883B DAC with

1 LSB

Case Outline(s). The case outlines shall be designated in Mil-Std-1835 and as follows:

Outline Letter Mil-Std-1835 Case Outline Package Code
MAXIM SMD
Q

R GDIP1-T20 or CDIP2-T20 20 LEAD CERDIP J20

Absolute Maximum Ratings:
V

to AGND ...................................................................................................... 0V, + 17V

to DGND ...................................................................................................... 0V, + 17V

RFBA

, V

RFBB

to DGND .................................................................................................

25V

REFA

, V

REFB

to AGND .................................................................................................

25V

Digital Input Voltage to DGND .............................................................. -0.3V to V

+0.3V

V pin 1 to DGND .............................................................................................. -0.3V to V

V pin 2, V pin 20 to AGND ..................................................................... -0.3V to V

+0.3V

AGND to DGND ......................................................................................... -0.3V, V

+0.3V

DGND to AGND .......................................................................................................... +0.3V
Lead Temperature (soldering, 10 seconds) ........................................................................ +300

Storage Temperature ........................................................................................... -65

C to +150

Continuous Power Dissipation ................................................................................... T

20 pin CERDIP(derate 11.1mW/

C above +70

C) ......................................................... 889mW

Junction Temperature T

............................................................................................... +150

Thermal Resistance, Junction to Case,

20 pin CERDIP.......................................................................................................... 40

C/W

Thermal Resistance, Junction to Ambient,

JA:

20 pin CERDIP.......................................................................................................... 90

C/W

Recommended Operating Conditions
Ambient Operating Range (T

) ..................................................................... -55

C to

125

Supply Voltage Range (V

) ............................... +4.75V to +5.25V and +14.25V to +15.75V

REF

DAC A = V

REF

DAC B ............................................................................................. +10V

OUT DAC A = OUT DAC B ............................................................................................... 0V

Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device.
These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.

----------------------------

Electrical Characteristics of MX7528/883B

19-0387

Rev. B

for SMD 5962-87701

Page 2 of

TABLE 1. ELECTRICAL TESTS:

TEST

Symbol

CONDITIONS
-55

C <=T

<= +125

C 1/

Unless otherwise specified

Group A

Subgroup

Device
type

Limits

Min

Limits

Max

Units

ACCURACY
Resolution NOTE 4

RES

=+5V and V

=+15V

1,2,3

All

8.0

Bits

Relative Accuracy

=+5V and V

=+15V

1,2,3

1.0 LSB

Relative Accuracy

=+5V and V

=+15V

2,3

02,03

1.0

0.5

LSB

Relative Accuracy

=+5V & V

=+15V, NOTE 2

02,03

0.5 LSB

Differential Nonlinearity

DNL

=+5V and V

=+15V

Monotonic to 8-Bits

1,2,3

All

1.0 LSB

Gain Error NOTE 3

=+5V and V

=+15V

All

4.0 LSB

Gain Error NOTE 3

=+5V

=+15V

2,3

6.0

5.0

LSB

Gain Error NOTE 2,3

=+5V

=+15V

=+5V

=+15V

2,3

4.0

3.0

2.0

1.0

LSB

Gain Error NOTE 2,3

=+5V

=+15V

=+5V, V

=+15V

2,3

3.0

1.0

LSB

Power Supply Rejection

PSRR

=+5V,

2,3

All

0.02

0.04

%/%

Power Supply Rejection

PSRR

=+15V,

2,3

All

0.01

0.02

%/%

Output Leakage Current
PIN 2 and 20

=+5V, DAC latches loaded

with 0000 0000

2,3

All

400

Output Leakage Current
PIN 2 and 20

=+15V, DAC latches loaded

with 0000 0000

2,3

All

200

Reference Input
Resistance V

REF

A, V

REF

=+5V and +15V

1,2,3

All

15 k

Digital Input High
Voltage

=+5V

=+15V

1,2,3

All

2.4

13.5

Digital Input Low
Voltage

=+5V

=+15V

1,2,3

All

0.8
1.5

Digital Input Leakage
Current

=+5V

=0V or V

2,3

All

1.0

Digital Input Leakage
Current

=+15V

=0V or V

2,3

All

1.0

Supply Current

=+5V All digital inputs

=+15V V

or V

1,2,3

All

2.0
2.0

Supply Current

=+5V & +15V. All digital

inputs 0V or V

2,3

All

100
500

Gain Temperature
Coefficient NOTE 4

=+5V

=+15V

1,2,3

All

ppm/

----------------------------

Electrical Characteristics of MX7528/883B

19-0387

Rev. B

for SMD 5962-87701

Page 3 of

TEST

Symbol

CONDITIONS
-55

C <=T

<= +125

C 1/

Unless otherwise specified

Group A
Subgroup

Device
type

Limits

Min

Limits

Max

Units

Feedthrough Error
V

REF

A to OUTA and

REF

B to OUTB

REF

=+5V or V

=+15V,

REF

=+10V, 100kHz sinewave,

DAC latches loaded with 0000
0000 NOTE 4, NOTE 5

4,5,6

All

-70 dB

Digital Input
Capacitance
NOTE 6

=+5V

DB0-DB7
V

=+15V

All

Digital Input
Capacitance
NOTE 6

=+5V ___ __ _____

WR, CS, DACA/DACB
V

=+15V

All

ANALOG INPUTS
Digital Output pin 2
Capacitance 6/
pin 20

OUTA

OUTB

=+5V and 15V,

DAC latches loaded with 0000
0000

All

Digital Output pin 2
Capacitance 6/
pin 20

OUTA

OUTB

=+5V and 15V,

DAC latches loaded with 1111
1111

All

120

TIMING
Chip select to write
setup time
NOTE 7

=+5V

=+15V

10,11

All

200
230

60
80

Chip select to write
hold time
NOTE 7

=+5V

=+15V

10,11

All

20
30

10
15

Write pulse width
NOTE 7

=+5V, t

, t

=+15V, t

, t

10,11

All

180
200

60
80

Data valid to write
setup time
NOTE 7

=+5V

=+15V

10,11

All

110
130

50
70

Data valid to write
hold time
NOTE 7

=+5V

=+15V

9,10,11

All

Data select to write
setup time
NOTE 7

=+5V

=+15V

10,11

All

200
230

60
80

----------------------------

Electrical Characteristics of MX7528/883B

19-0387

Rev. B

for SMD 5962-87701

Page 4 of

TEST

Symbol

CONDITIONS
-55

C <=T

<= +125

C, 1/

Unless otherwise specified

Group A
Subgroup

Device
type

Limits

Min

Limits

Max

Units

Data select to write
hold time
NOTE 7

=+5V

=+15V

10,11

All

20
30

10
15

Reference input
resistance match

RMIN

REF

=+5V

=+15V

4,5,6

All

Channel to Channel
isolation NOTE 4
V

REF

A to OUTB

CHISO

=+5V or +15V. V

REF

10V,

100kHz sinewave, V

REF

B=0V

4,5,6

All

-60 dB

Channel to Channel
isolation NOTE 4
V

REF

B to OUTA

CHISO

=+5V or +15V. V

REF

10V,

100kHz sinewave, DAC,
V

REF

A=0V

4,5,6

All

-60 dB

Output Current
Settling Time
NOTE 4

=+5V

=+15V

9,10,11

All

350

180

NOTE 1: V

OUT

1=0V; VREF=+10V, AGND=DGND unless otherwise specified.

NOTE 2: Optional Subgroup 12 is used for grading and part selection at +25

NOTE 3: Measured using internal RFBA and RFBB. Gain error is adjustable. DAC register loaded with
1111, 1111, 1111.
NOTE 4: Guaranteed, if not tested.
NOTE 5: Feedthrough error can be reduced by connecting the metal lid to ground.
NOTE 6: Subgroup 4 (C

and C

OUT

measurements) shall be measured only for the inital test and after

process or design changes which may affect capacitance.
NOTE 7: Timing in accordance with Write Cycle Timing Diagram in Commercial Data Sheet.

MODE SELECTION TABLE:

___

_____

DAC A/DAC B

DAC A

DAC B

Write

Hold

Write

Hold

L = Low state, H = High state, X = Don't care

TERMINAL CONNECTIONS:

AGND

DB3

OUTA

DB2

RFBA

DB1

VREFA

DB0(LSB)

DGND

___
CS

____
DAC A/DAC B

___
WR

(MSB)DB7

VDD

DB6

VREFB

DB5

RFBB

DB4

OUTB

----------------------------

Electrical Characteristics of MX7528/883B

19-0387

Rev. B

for SMD 5962-87701

Page 5 of

ORDERING INFORMATION:

Package

Pkg. Code

Device ID

SMD Number

20 pin CERDIP

J20

MX7528SQ/883B

5962-8770101RA

20 pin CERDIP

J20

MX7528TQ/883B

5962-8770102RA

20 pin CERDIP

J20

MX7528UQ/883B

5962-8770103RA

QUALITY ASSURANCE

Sampling and inspection procedures shall be in accordance with MIL-Prf-38535, Appendix A as specified in Mil-
Std-883.

Screening shall be in accordance with Method 5004 of Mil-Std-883. Burn-in test Method 1015:
1. Test Condition, A, B, C, or D.
2. TA = +125

C minimum.

3. Interim and final electrical test requirements shall be specified in Table 2.

Quality conformance inspection shall be in accordance with Method 5005 of Mil-Std-883, including Groups A, B,
C, and D inspection.

Group A inspection:
1. Tests as specified in Table 2.
2. Selected subgroups in Table 1, Method 5005 of Mil-Std-883 shall be omitted.

Group C and D inspections:
a. End-point electrical parameters shall be specified in Table 1.
b. Steady-state life test, Method 1005 of Mil-Std-883:
1. Test condition A, B, C, D.
2. TA = +125

C, minimum.

3. Test duration, 1000 hours, except as permitted by Method 1005 of Mil-Std-883.

TABLE 2. ELECTRICAL TEST REQUIREMENTS

Mil-Std-883 Test Requirements

Subgroups

per Method 5005, Table 1

Interim Electric Parameters

Method 5004

Final Electrical Parameters

Method 5005

1*, 2, 3, 12

Group A Test Requirements

Method 5005

1, 2, 3, 4, 5, 6, 9, 10**, 11**, 12

Group C and D End-Point Electrical Parameters

Method 5005

* PDA applies to Subgroup 1 only.
** Subgroups 10 and 11, if not tested shall be guaranteed to the limits specified in Table 1.

----------------------------

Electrical Characteristics of MX7528/883B

19-0387

Rev. B

for SMD 5962-87701

Page 6 of

Ð­Ð»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: MX7528UQ/883B

ÐÐ»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: MX7528UQ/883B