SCOPE: CMOS, PARALLEL-LOADING, DUAL, MULTIPLYING 12-BIT D/A CONVERTER
Device Type Generic Number
01
MX7537U(x)/883B
02 MX7537T(x)/883B
03 MX7537S(x)/883B
04
MX7547U(x)/883B
05 MX7547T(x)/883B
06 MX7547S(x)/883B
Case Outline(s). The case outlines shall be designated in Mil-Std-1835 and as follows:
Outline Letter Mil-Std-1835 Case Outline Package Code
MAXIM SMD
Q
L GDIP1-T24 or CDIP2-T24 24 LEAD CERDIP J24
E 3 CQCC1-N28 28 LEADLESS CHIP L28
Absolute Maximum Ratings:
V
DD
to DGND .................................................................................................. -0.3V, + 17V
V
RFBA
, V
RFBB
to AGND .................................................................................................
25V
V
REFA
, V
REFB
to AGND .................................................................................................
25V
Digital Input Voltage to DGND .............................................................. -0.3V, (V
DD
+0.3V)
IOUTA, IOUTB Voltage to DGND ......................................................... -0.3V, (V
DD
+0.3V)
AGND to DGND ...................................................................................... -0.3V, (V
DD
+0.3V)
Lead Temperature (soldering, 10 seconds) ........................................................................ +300
C
Storage Temperature ........................................................................................... -65
C to +150
C
Continuous Power Dissipation ................................................................................... T
A
=
+
70
C
24 pin CERDIP(derate 12.5mW/
C above +70
C) ....................................................... 1000mW
28 pin LCC(derate 10.2mW/
C above +70
C) ............................................................... 816mW
Junction Temperature T
J
............................................................................................... +150
C
Thermal Resistance, Junction to Case,
JC
24 pin CERDIP.......................................................................................................... 40
C/W
28 pin LCC ................................................................................................................ 15
C/W
Thermal Resistance, Junction to Ambient,
JA:
24 pin CERDIP.......................................................................................................... 80
C/W
28 pin LCC ............................................................................................................... 98
C/W
Recommended Operating Conditions
Ambient Operating Range (T
A
) ..................................................................... -55
C to
+
125
C
Logic Supply Voltage (V
LOGIC
) ......................................................................... +4.5V to +5.5V
Positive Supply Voltage (V
DD
)....................................................................... +11.4V to +16.5V
Negative Supply Voltage (V
EE
)........................................................................ -11.4V to -16.5V
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device.
These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
-----------------------
Electrical Characteristics of MX7537/47/883B for /883B
19-0057
Rev. C
and SMD 5962-87763 and SMD 5962-89657
Page 2 of
7
TABLE 1. ELECTRICAL TESTS:
TEST
Symbol
CONDITIONS
-55
C <=T
A
<= +125
C 1/
Unless otherwise specified
Group A
Subgroup
Device
type
Limits
Min
Limits
Max
Units
ACCURACY
Resolution
RES
1,2,3
All
12.0
Bits
Relative Accuracy
RA
V
DD
=+10.8V and V
DD
=+16.5V
V
DD
=10.8V (MX7547 only)
1,2,3
1,2,4,5
3,6
0.5
1.0
LSB
Differential Nonlinearity
DNL
Guaranteed monotonic
1,2,3
All
1.0 LSB
Gain Error
AE
Measured using R
FBA
, R
FBB
; DAC
registers loaded with all 1's,
V
DD
=10.8V
1,2,3
1,4
2,5
3,6
2.0
3.0
6.0
LSB
Gain Tempco
Gain/
Temperature
NOTE 2
TCFS
4
All
5.0 ppm/
C
Output Leakage Current
IOUTA, IOUTB
ILKG
V
DD
=+16.5V, DAC registers
loaded with all 0s
1,3
2
All
10
250
nA
VREFA, VREFB Input
Leakage
RREF
V
DD
=+10.8V
1,2,3
All
9
20 k
VREFA, VREFB Input
Resistance Match
RREF
V
DD
=+10.8V
1,2,3
1,4
2,3,5,6
1.0
3.0
%
Digital Input High
Voltage
V
IH
V
DD
=+10.8V and V
DD
=+16.5V
1,2,3
All
2.4
V
Digital Input Low
Voltage
V
IL
V
DD
=+10.8V and V
DD
=+16.5V
1,2,3
All
0.8 V
Digital Input Leakage
Current
I
IN
V
IN
=+0V or 16.5V
1,3
2
All
1.0
10
A
Digital Input Capacitance
C
IN
4
All
10 pF
Supply Voltage
V
DD
Operating range, V
DD
=16.5V
1,2,3
All
10.8
16.5 V
Supply Current
I
DD
1,2,3
All
2.0 mA
Current Settling Time
t
SL
To 0.5 LSB, IOUT load =100
,
CEXT=13pF, DAC output ___
measured from falling edge of WR
9,10,11
4,5,6
1.5
s
Current Settling Time
t
SL
To 0.5 LSB, IOUT load =100
,
CEXT=13pF, DAC output ___
measured from rising edge of WR
4
1,2,3
1.5
s
VREFA
to IOUTA
Feedthrough
Error
VREFB
to IOUTB
NOTE 2
FTE
DAC VREFA=20Vp-p
registers 10kHz sine wave,
loaded VREFB=0V
with all 0s
VREFB=20Vp-p
10kHz sine wave,
VREFA=0V
4,5,6
(SMD)
4,5,6
-70
-65
(SMD)
dB
VREFA
to IOUTA
Feedthrough
Error
VREFB
to IOUTB
NOTE 2
FTE
DAC VREFA=20Vp-p
registers 10kHz sine wave,
loaded VREFB=0V
with all 0s
VREFB=20Vp-p
10kHz sine wave,
VREFA=0V
4
(SMD)
1,2,3
-70
-65
(SMD)
dB
-----------------------
Electrical Characteristics of MX7537/47/883B for /883B
19-0057
Rev. C
and SMD 5962-87763 and SMD 5962-89657
Page 3 of
7
TEST
Symbol
CONDITIONS
-55
C <=T
A
<= +125
C 1/
Unless otherwise specified
Group A
Subgroup
Device
type
Limits
Min
Limits
Max
Units
Power-Supply
Rejection Ratio
PSRR
V
DD
=10.8V,
V
DD
=12V
5%
V
DD
=10.8V,
V
DD
=V
DD
MAX -
V
DD
MIN
1
2,3
1
2,3
01,02,03
All
0.01
0.02
0.01
0.02
%/%
Output Capacitance
(IOUTA, IOUTB)
C
OUT
DAC A, DAC B loaded with 0s
DAC A, DAC B loaded with 1s
4
All
-70
140
dB
Channel-to-Channel
Isolation
VREFA
to IOUTA
VREFB to
IOUTB
VREFA=20Vp-p, 10kHz sine
wave, VREFB=0V
VREFB=20Vp-p, 10kHz sine
wave, VREFA=0V
4
All
-84
dB
TIMING
Address Valid to
Write-setup Time
t
1
9
10,11
01,02,03
20
30
ns
Address Valid to
Write-hold Time
t
2
9
10,11
01,02,03
15
25
ns
Data-setup Time
t
3
9
10,11
All
60
80
ns
Data-hold Time
t
4
9,10,11
All
25
ns
Chip Select or Update
to Write-setup Time
t
5
9,10,11
9
10,11
01,02,03
04,05,06
0
80
100
ns
Chip Select orUpdate
to Write Hold Time
t
6
9,10,11
All
0
ns
Write Pulse Width
t
7
9
10,11
All
80
100
ns
Clear Pulse Width
t
8
9
10,11
All
80
100
ns
NOTE 1: Conditions unless otherwise specified, 4.5V
V
DD
5.5V. VDD=10.8V to 16.5V, AGND=DGND=0V,
use maximum possible reference voltage.
NOTE 2: Typical number, for design aid only.
MODE SELECTION TABLE:
MX7537
___
CLR
___
UPD
___
CS
___
WR
A1
A0
Function
1
1
1
X
X
X
No data transfer
1
1
X
1
X
X
No data transfer
0
X
X
X
X
X
All registers cleared
1
1
0
0
0
0
DAC A LS input register loaded with D7-D0
1
1
0
0
0
1
DAC A MS input register loaded with D3-D0
1
1
0
0
1
0
DAC B LS input register loaded with D7-D0
1
1
0
0
1
1
DAC B MS input register loaded with D3-D0
1
0
1
0
X
X
DAC A, DAC B registers updated simultaneously from input
registers. Input registers not changed.
1
0
0
0
X
X
DAC A, DAC B registers are transparent. Input registers loaded.
X = Don't care
-----------------------
Electrical Characteristics of MX7537/47/883B for /883B
19-0057
Rev. C
and SMD 5962-87763 and SMD 5962-89657
Page 4 of
7
MODE SELECTION TABLE:
MX7547
___
CSA
___
CSB
___
WR
Function
X
X
1
No data transfer
1
1
X
No data transfer
0
___ ___
A rising edge on CSA or CSB transfer data to the respective DAC.
0
1
DAC A register loaded from data bus.
1
0
DAC B register loaded from data bus.
0
0
DAC A and DAC B registers loaded from data bus.
X= don't care WR input is edge-triggered.
ORDERING INFORMATION:
Package
Pkg. Code
Device ID
SMD Number
01
24 pin CERDIP
J24
MX7537UQ/883B
5962-8776303LA
02
24 pin CERDIP
J24
MX7537TQ/883B
5962-8776302LA
03
24 pin CERDIP
J24
MX7537SQ/883B
5962-8776301LA
01
28 pin LCC
L28
MX7537UE/883B
5962-87763033C
02
28 pin LCC
L28
MX7537TE/883B
5962-87763023C
03
28 pin LCC
L28
MX7537SE/883B
5962-87763013C
04
24 pin CERDIP
J24
MX7547UQ/883B
5962-8965703LA
05
24 pin CERDIP
J24
MX7547TQ/883B
5962-8965702LA
06
24 pin CERDIP
J24
MX7547SQ/883B
5962-8965701LA
04
28 pin LCC
L28
MX7547UE/883B
5962-89657033C
05
28 pin LCC
L28
MX7547TE/883B
5962-89657023C
06
28 pin LCC
L28
MX7547SE/883B
5962-89657013C
TERMINAL CONNECTIONS:
MX7537
MX7537
MX7547
MX7547
MX7537
MX7537
MX7547
MX7547
J24
L28
J24
L28
J24
L28
J24
L28
1
AGNDA
NC
AGNDA
NC
15
A0
NC
D8
NC
2
I
OUTA
AGNDA
I
OUTA
AGNDA
16
A1
D6
D9
D6
3
RFBA
I
OUTA
RFBA
I
OUTA
17
____
CLR
D7
D10
D7
4
VREFA
RFBA
VREFA
RFBA
18
___
WR
A0
D11
(MSB)
D8
5
__
CS
VREFA
___
CSA
VREFA
19
___
UPD
A1
___
WR
D9
6
D0
__
CS
(LSB)D0
___
CSA
20
V
DD
____
CLR
____
CSB
D10
7
D1
D0
D1
(LSB)D0
21
VREFB
___
WR
V
DD
D11
8
D2
NC
D2
NC
22
RFBB
NC
VREFB
NC
9
D3
D1
D3
D1
23
I
OUTB
___
UPD
RFBB
___
WR
10
D4
D2
D4
D2
24
AGNDB
V
DD
I
OUTB
____
CSB
11
D5
D3
D5
D3
25
VREFB
V
DD
12
DGND
D4
DGND
D4
26
RFBB
VREFB
13
D6
D5
D6
D5
27
I
OUTB
RFBB
14
D7
DGND
D7
DGND
28
AGNDB
I
OUTB
-----------------------
Electrical Characteristics of MX7537/47/883B for /883B
19-0057
Rev. C
and SMD 5962-87763 and SMD 5962-89657
Page 5 of
7
QUALITY ASSURANCE
Sampling and inspection procedures shall be in accordance with MIL-Prf-38535, Appendix A as specified in Mil-Std-883.
Screening shall be in accordance with Method 5004 of Mil-Std-883. Burn-in test Method 1015:
1. Test Condition, A, B, C, or D.
2. TA = +125
C minimum.
3. Interim and final electrical test requirements shall be specified in Table 2.
Quality conformance inspection shall be in accordance with Method 5005 of Mil-Std-883, including Groups A, B, C, and D inspection.
Group A inspection:
1. Tests as specified in Table 2.
2. Selected subgroups in Table 1, Method 5005 of Mil-Std-883 shall be omitted.
Group C and D inspections:
a. End-point electrical parameters shall be specified in Table 1.
b. Steady-state life test, Method 1005 of Mil-Std-883:
1. Test condition A, B, C, D.
2. TA = +125
C, minimum.
3. Test duration, 1000 hours, except as permitted by Method 1005 of Mil-Std-883.
TABLE 2. ELECTRICAL TEST REQUIREMENTS
Mil-Std-883 Test Requirements
Subgroups
per Method 5005, Table 1
Interim Electric Parameters
Method 5004
1
Final Electrical Parameters
Method 5005
1*, 2, 3, 9, 10, 11
Group A Test Requirements
Method 5005
1, 2, 3, 4**, 5**, 6**, 9, 10**, 11**
Group C and D End-Point Electrical Parameters
Method 5005
1
* PDA applies to Subgroup 1 only.
** If not tested shall be guaranteed to the limits specified in Table 1.
-----------------------
Electrical Characteristics of MX7537/47/883B for /883B
19-0057
Rev. C
and SMD 5962-87763 and SMD 5962-89657
Page 6 of
7
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