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Электронный компонент: MX27C1000MI-15

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FEATURES
128K x 8 organization
Single +5V power supply
+12.5V programming voltage
Fast access time: 45/55/70/90/100/120/150 ns
Totally static operation
Completely TTL compatible
1
Operating current: 30mA
Standby current: 100uA
Package type:
- 32 pin plastic DIP
- 32 pin SOP
- 32 pin PLCC
- 32 pin TSOP
REV. 5.9, NOV. 19, 2002
P/N: PM0234
GENERAL DESCRIPTION
The MX27C1000 is a 5V only, 1M-bit, One Time
Programmable Read Only Memory. It is organized as
128K words by 8 bits per word, operates from a single +
5 volt supply, has a static standby mode, and features
fast single address location programming. All program-
ming signals are TTL levels, requiring a single pulse. For
programming outside from the system, existing EPROM
programmers may be used. The MX27C1000 supports
an intelligent fast programming algorithm which can
result in programming time of less than thirty seconds.
This EPROM is packaged in industry standard 32 pin
dual-in-line packages, 32 lead PLCC , 32 lead SOP , and
32 lead TSOP packages.
PIN CONFIGURATIONS
PDIP/SOP
PLCC
TSOP
MX27C1000
1M-BIT [128K x 8] CMOS EPROM
1
4
5
9
13
14
17
20
21
25
29
32
30
A14
A13
A8
A9
A11
OE
A10
CE
Q7
A7
A6
A5
A4
A3
A2
A1
A0
Q0
Q1
Q2
GND
Q3
Q4
Q5
Q6
A12
A15
A16
VPP
VCC
PGM
NC
MX27C1000
A11
A9
A8
A13
A14
NC
PGM
VCC
VPP
A16
A15
A12
A7
A6
A5
A4
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
OE
A10
CE
Q7
Q6
Q5
Q4
Q3
GND
Q2
Q1
Q0
A0
A1
A2
A3
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
MX27C1000
MX27C1000
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
VPP
A16
A15
A12
A7
A6
A5
A4
A3
A2
A1
A0
Q0
Q1
Q2
GND
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
VCC
PGM
NC
A14
A13
A8
A9
A11
OE
A10
CE
Q7
Q6
Q5
Q4
Q3
2
MX27C1000
REV. 5.9, NOV. 19, 2002
P/N: PM0234
PROGRAM INHIBIT MODE
Programming of multiple MX27C1000s in parallel with
different data is also easily accomplished by using the
Program Inhibit Mode. Except for CE and OE, all like
inputs of the parallel MX27C1000 may be common. A
TTL low-level program pulse applied to an MX27C1000
CE input with VPP = 12.5
0.5 V and PGM LOW will
program that MX27C1000. A high-level CE input inhibits
the other MX27C1000s from being programmed.
PROGRAM VERIFY MODE
Verification should be performed on the programmed bits
to determine that they were correctly programmed. The
verification should be performed with OE and CE at VIL,
PGM at VIH, and VPP at its programming voltage.
AUTO IDENTIFY MODE
The auto identify mode allows the reading out of a binary
code from an EPROM that will identify its manufacturer
and device type. This mode is intended for use by
programming equipment for the purpose of automatically
matching the device to be programmed with its
corresponding programming algorithm. This mode is
functional in the 25
C
5
C ambient temperature range
that is required when programming the MX27C1000.
BLOCK DIAGRAM
PIN DESCRIPTION
FUNCTIONAL DESCRIPTION
THE PROGRAMMING OF THE MX27C1000
When the MX27C1000 is delivered, or it is erased,
the chip has all 1M bits in the "ONE" or HIGH state.
"ZEROs" are loaded into the MX27C1000 through the
procedure of programming.
For programming, the data to be programmed is applied
with 8 bits in parallel to the data pins.
Vcc must be applied simultaneously or before Vpp, and
removed simultaneously or after Vpp. When
programming an MXIC EPROM, a 01.uF capacitor is
required across Vpp and ground to suppress spurious
voltage transients which may damage the device.
FAST PROGRAMMING
The device is set up in the fast programming mode when
the programming voltage VPP = 12.75V is applied, with
VCC = 6.25 V and PGM = VIL(or OE = VIH) (Algorithm
is shown in Figure 1). The programming is achieved
by applying a single TTL low level 100us pulse to the
PGM input after addresses and data line are stable. If
the data is not verified, an additional pulse is applied
for a maximum of 25 pulses. This process is repeated
while sequencing through each address of the device.
When the programming mode is completed, the data in
all address is verified at VCC = VPP = 5V
10%.
SYMBOL
PIN NAME
A0~A16
Address Input
Q0~Q7
Data Input/Output
CE
Chip Enable Input
OE
Output Enable Input
PGM
Programmable Enable Input
VPP
Program Supply Voltage
NC
No Internal Connection
VCC
Power Supply Pin (+5V)
GND
Ground Pin
CONTROL
LOGIC
OUTPUT
BUFFERS
Q0~Q17
CE
PGM
OE
A0~A16
ADDRESS
INPUTS
Y-DECODER
X-DECODER
Y-SELECT
1M BIT
CELL
MAXTRIX
VCC
GND
VPP
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
3
MX27C1000
REV. 5.9, NOV. 19, 2002
P/N: PM0234
the primary device-selecting function, while OE be made
a common connection to all devices in the array and
connected to the READ line from the system control
bus. This assures that all deselected memory devices
are in their low-power standby mode and that the output
pins are only active when data is desired from a particular
memory device.
SYSTEM CONSIDERATIONS
During the switch between active and standby
conditions, transient current peaks are produced on the
rising and falling edges of Chip Enable. The magnitude
of these transient current peaks is dependent on the
output capacitance loading of the device. At a minimum,
a 0.1 uF ceramic capacitor (high frequency, low inherent
inductance) should be used on each device between
VCC and GND to minimize transient effects. In addition,
to overcome the voltage drop caused by the inductive
effects of the printed circuit board traces on EPROM
arrays, a 4.7 uF bulk electrolytic capacitor should be
used between VCC and GND for each eight devices.
The location of the capacitor should be close to where
the power supply is connected to the array.
To activate this mode, the programming equipment must
force 12.0
0.5 V on address line A9 of the device.
Two identifier bytes may then be sequenced from the
device outputs by toggling address line A0 from VIL to
VIH. All other address lines must be held at VIL during
auto identify mode.
Byte 0 ( A0 = VIL) represents the manufacturer code,
and byte 1 (A0 = VIH), the device identifier code. For
the MX27C1000, these two identifier bytes are given in
the Mode Select Table. All identifiers for manufacturer
and device codes will possess odd parity, with the MSB
(DQ7) defined as the parity bit.
READ MODE
The MX27C1000 has two control functions, both of which
must be logically satisfied in order to obtain data at the
outputs. Chip Enable (CE) is the power control and
should be used for device selection. Output Enable (OE)
is the output control and should be used to gate data
to the output pins, independent of device selection.
Assuming that addresses are stable, address access
time (tACC) is equal to the delay from CE to output (tCE).
Data is available at the outputs tQE after the falling edge
of OE, assuming that CE has been LOW and addresses
have been stable for at least tACC - tQE.
STANDBY MODE
The MX27C1000 has a CMOS standby mode which
reduces the maximum VCC current to 100 uA. It is
placed in CMOS standby when CE is at VCC
0.3 V.
The MX27C1000 also has a TTL-standby mode which
reduces the maximum VCC current to 1.5 mA. It is
placed in TTL-standby when CE is at VIH. When in
standby mode, the outputs are in a high-impedance
state, independent of the OE input.
TWO-LINE OUTPUT CONTROL FUNCTION
To accommodate multiple memory connections, a two-
line control function is provided to allow for:
1. Low memory power dissipation,
2. Assurance that output bus contention will not
occur.
It is recommended that CE be decoded and used as
4
MX27C1000
REV. 5.9, NOV. 19, 2002
P/N: PM0234
NOTES:
1. VH = 12.0 V
0.5 V
2. X = Either VIH or VIL
3. A1 - A8 = A10 - A16 = VIL(For auto select)
4. See DC Programming Characteristics for VPP voltage during programming.
MODE SELECT TABLE
PINS
MODE
CE
OE
PGM
A0
A9
VPP
OUTPUTS
Read
VIL
VIL
X
X
X
VCC
DOUT
Output Disable
VIL
VIH
X
X
X
VCC
High Z
Standby (TTL)
VIH
X
X
X
X
VCC
High Z
Standby (CMOS)
VCC
0.3V
X
X
X
X
VCC
High Z
Program
VIL
VIH
VIL
X
X
VPP
DIN
Program Verify
VIL
VIL
VIH
X
X
VPP
DOUT
Program Inhibit
VIH
X
X
X
X
VPP
High Z
Manufacturer Code(3)
VIL
VIL
X
VIL
VH
VCC
C2H
Device Code(27C1000)(3)
VIL
VIL
X
VIH
VH
VCC
0EH
5
MX27C1000
REV. 5.9, NOV. 19, 2002
P/N: PM0234
START
ADDRESS = FIRST LOCATION
VCC = 6.25V
VPP = 12.75V
X = 0
PROGRAM ONE 100us PULSE
INCREMENT X
X = 25?
VERIFY BYTE
LAST ADDRESS
VCC = VPP = 5.25V
DEVICE PASSED
VERIFY ALL BYTES
?
DEVICE FAILED
INCREMENT ADDRESS
INTERACTIVE
SECTION
VERIFY SECTION
FAIL
PASS
YES
PASS
NO
YES
NO
FAIL
FIGURE 1. FAST PROGRAMMING FLOW CHART
FAIL
?
6
MX27C1000
REV. 5.9, NOV. 19, 2002
P/N: PM0234
SWITCHING TEST CIRCUITS
SWITCHING TEST WAVEFORMS
2.0V
0.8V
TEST POINTS
INPUT
2.0V
0.8V
OUTPUT
AC TESTING: AC driving levels are 2.4V/0.4V for commercial grade, 3.0V/0V for industrial grade.
Input pulse rise and fall times are < 10ns.
AC driving levels
DEVICE
UNDER
TEST
DIODES = IN3064
OR EQUIVALENT
CL = 100 pF including jig capacitance(30pF for 45/55/70 ns parts)
6.2K ohm
1.8K ohm
+5V
CL
1.5V
TEST POINTS
INPUT
1.5V
OUTPUT
AC TESTING: (1) AC driving levels are 3.0V/0V for both commercial grade and industrial grade.
Input pulse rise and fall times are < 10ns.
(2) For MX27C1000-45, MX27C1000-55, MX27C1000-70.
AC driving levels
7
MX27C1000
REV. 5.9, NOV. 19, 2002
P/N: PM0234
SYMBOL
PARAMETER
MIN.
MAX.
UNIT
CONDITIONS
VOH
Output High Voltage
2.4
V
IOH = -0.4mA
VOL
Output Low Voltage
0.4
V
IOL = 2.1mA
VIH
Input High Voltage
2.0
VCC + 0.5
V
VIL
Input Low Voltage
-0.2
0.8
V
ILI
Input Leakage Current
-10
10
uA
VIN = 0 to 5.5V
ILO
Output Leakage Current
-10
10
uA
VOUT = 0 to 5.5V
ICC3
VCC Power-Down Current
100
uA
CE = VCC
0.3V
ICC2
VCC Standby Current
1.5
mA
CE = VIH
ICC1
VCC Active Current
30
mA
CE = VIL, f=5MHz, Iout = 0mA
IPP
VPP Supply Current Read
10
uA
CE = VIL, VPP = 5.5V
NOTICE:
Stresses greater than those listed under ABSOLUTE
MAXIMUM RATINGS may cause permanent damage to the
device. This is a stress rating only and functional operation
of the device at these or any other conditions above those
indicated in the operational sections of this specification is not
implied. Exposure to absolute maximum rating conditions for
extended period may affect reliability.
NOTICE:
Specifications contained within the following tables are sub-
ject to change.
DC CHARACTERISTICS
ABSOLUTE MAXIMUM RATINGS
RATING
VALUE
Ambient Operating Temperature -40
o
C to 125
o
C
Storage Temperature
-65
o
C to 125
o
C
Applied Input Voltage
-0.5V to 7.0V
Applied Output Voltage
-0.5V to VCC + 0.5V
VCC to Ground Potential
-0.5V to 7.0V
A9 & Vpp
-0.5V to 13.5V
DC/AC Operating Conditions for Read Operation
MX27C1000
-45
-55
-70
-90
-10
-12
-15
Operating
Commercial
0
C to 70
C
0
C to 70
C
0
C to 70
C
0
C to 70
C
0
C to 70
C
0
C to 70
C
0
C to 70
C
Temperature Industrial
-40
C to 85
C -40
C to 85
C -40
C to 85
C -40
C to 85
C -40
C to 85
C -40
C to 85
C
Automotive
-40
C to 125
C -40
C to 125
C -40
C to 125
C -40
C to 125
C
Vcc Power Supply
5V
5%
5V
5%
5V
10%
5V
10%
5V
10%
5V
10%
5V
10%
CAPACITANCE
TA = 25
o
C, f = 1.0 MHz (Sampled only)
SYMBOL
PARAMETER
MIN.
MAX.
UNIT
CONDITIONS
CIN
Input Capacitance
8
12
pF
VIN = 0V
COUT
Output Capacitance
8
12
pF
VOUT = 0V
Vpp
VPP Capacitance
18
25
pF
VPP = 0V
8
MX27C1000
REV. 5.9, NOV. 19, 2002
P/N: PM0234
DC PROGRAMMING CHARACTERISTICS
TA = 25
o
C
5
o
C
SYMBOL
PARAMETER
MIN.
MAX.
UNIT
CONDITIONS
VOH
Output High Voltage
2.4
V
IOH = -0.40mA
VOL
Output Low Voltage
0.4
V
IOL = 2.1mA
VIH
Input High Voltage
2.0
VCC + 0.5
V
VIL
Input Low Voltage
-0.3
0.8
V
ILI
Input Leakage Current
-10
10
uA
VIN = 0 to 5.5V
VH
A9 Auto Select Voltage
11.5
12.5
V
ICC3
VCC Supply Current (Program & Verify)
50
mA
IPP2
VPP Supply Current(Program)
30
mA
CE = PGM = VIL,
OE = VIH
VCC1
Fast Programming Supply Voltage
6.00
6.50
V
VPP1
Fast Programming Voltage
12.5
13.0
V
27C1000-90 27C1000-10 27C1000-12 27C1000-15
SYMBOL PARAMETER
MIN.
MAX.
MIN.
MAX.
MIN.
MAX. MIN.
MAX. UNIT CONDITIONS
tACC
Address to Output Delay
90
100
120
150
ns
CE=OE=VIL
tCE
Chip Enable to Output Delay
90
100
120
150
ns
OE=VIL
tOE
Output Enable to Output Delay
40
45
50
65
ns
CE=VIL
tDF
OE High to Output Float,
0
25
0
30
0
35
0
50
ns
or CE High to Output Float
tOH
Output Hold from Address,
0
0
0
0
ns
CE or OE which ever occurred first
AC CHARACTERISTICS
27C1000-45 27C1000-55 27C1000-70
SYMBOL PARAMETER
MIN.
MAX. MIN.
MAX. MIN.
MAX.
UNIT
CONDITIONS
tACC
Address to Output Delay
45
55
70
ns
CE = OE = VIL
tCE
Chip Enable to Output Delay
45
55
70
ns
OE = VIL
tOE
Output Enable to Output Delay
25
30
35
ns
CE = VIL
tDF
OE High to Output Float,
0
17
0
20
0
20
ns
or CE High to Output Float
tOH
Output Hold from Address,
0
0
0
ns
CE or OE which ever occurred first
9
MX27C1000
REV. 5.9, NOV. 19, 2002
P/N: PM0234
AC PROGRAMMING CHARACTERISTICS
TA = 25
o
C
5
o
C
SYMBOL
PARAMETER
MIN.
MAX.
UNIT
tAS
Address Setup Time
2.0
us
tOES
OE Setup Time
2.0
us
tDS
Data Setup Time
2.0
us
tAH
Address Hold Time
0
us
tDH
Data Hold Time
2.0
us
tDFP
Output Enable to Output Float Delay
0
130
ns
tVPS
VPP Setup Time
2.0
us
tPW
PGM Program Pulse Width
95
105
us
tVCS
VCC Setup Time
2.0
us
tCES
CE Setup Time
2.0
us
tOE
Data valid from OE
150
ns
WAVEFORMS
READ CYCLE
ADDRESS
INPUTS
DATA
OUT
OE
CE
DATA ADDRESS
VALID DATA
tDF
tACC
tCE
tOE
tOH
10
MX27C1000
REV. 5.9, NOV. 19, 2002
P/N: PM0234
FAST PROGRAMMING ALGORITHM WAVEFORMS
Addresses
CE
OE
PGM
DATA
VPP
VCC
VIH
VIL
VPP1
VCC
VCC1
VCC
VIH
VIL
VIH
VIL
VIH
VIL
DATA OUT VALID
Hi-z
DATA IN STABLE
tAS
tVPS
tVCS
tCES
tOE
Max
tPW
tDS
tDH
tOES
tDFP
tAH
PROGRAM VERIFY
PROGRAM
11
MX27C1000
REV. 5.9, NOV. 19, 2002
P/N: PM0234
PLASTIC PACKAGE
PART NO.
ACCESS TIME
OPERATING
STANDBY
OPERATING
PACKAGE
(ns)
Current MAX.(mA) Current MAX.(uA) TEMPERATURE
MX27C1000PC-45
45
30
100
0
C to 70
C
32 PIN DIP
MX27C1000MC-45
45
30
100
0
C to 70
C
32 Pin SOP
MX27C1000QC-45
45
30
100
0
C to 70
C
32 Pin PLCC
MX27C1000TC-45
45
30
100
0
C to 70
C
32 Pin TSOP
MX27C1000PC-55
55
30
100
0
C to 70
C
32 Pin DIP
MX27C1000MC-55
55
30
100
0
C to 70
C
32 Pin SOP
MX27C1000QC-55
55
30
100
0
C to 70
C
32 Pin PLCC
MX27C1000TC-55
55
30
100
0
C to 70
C
32 Pin TSOP
MX27C1000PC-70
70
30
100
0
C to 70
C
32 Pin DIP
MX27C1000MC-70
70
30
100
0
C to 70
C
32 Pin SOP
MX27C1000QC-70
70
30
100
0
C to 70
C
32 Pin PLCC
MX27C1000TC-70
70
30
100
0
C to 70
C
32 Pin TSOP
MX27C1000PC-90
90
30
100
0
C to 70
C
32 Pin DIP
MX27C1000MC-90
90
30
100
0
C to 70
C
32 Pin SOP
MX27C1000QC-90
90
30
100
0
C to 70
C
32 Pin PLCC
MX27C1000TC-90
90
30
100
0
C to 70
C
32 Pin TSOP
MX27C1000PC-10
100
30
100
0
C to 70
C
32 Pin DIP
MX27C1000MC-10
100
30
100
0
C to 70
C
32 Pin SOP
MX27C1000QC-10
100
30
100
0
C to 70
C
32 Pin PLCC
MX27C1000TC-10
100
30
100
0
C to 70
C
32 Pin TSOP
MX27C1000PC-12
120
30
100
0
C to 70
C
32 Pin DIP
MX27C1000MC-12
120
30
100
0
C to 70
C
32 Pin SOP
MX27C1000QC-12
120
30
100
0
C to 70
C
32 Pin PLCC
MX27C1000TC-12
120
30
100
0
C to 70
C
32 Pin TSOP
MX27C1000PC-15
150
30
100
0
C to 70
C
32 Pin DIP
MX27C1000MC-15
150
30
100
0
C to 70
C
32 Pin SOP
MX27C1000QC-15
150
30
100
0
C to 70
C
32 Pin PLCC
MX27C1000TC-15
150
30
100
0
C to 70
C
32 Pin TSOP
ORDER INFORMATION
12
MX27C1000
REV. 5.9, NOV. 19, 2002
P/N: PM0234
ORDER INFORMATION (CONTINUED)
PLASTIC PACKAGE
PART NO.
ACCESS TIME
OPERATING
STANDBY
OPERATING
PACKAGE
(ns)
Current MAX.(mA) Current MAX.(uA) TEMPERATURE
MX27C1000PI-55
55
30
100
-40
C to 85
C
32 Pin DIP
MX27C1000MI-55
55
30
100
-40
C to 85
C
32 Pin SOP
MX27C1000QI-55
55
30
100
-40
C to 85
C
32 Pin PLCC
MX27C1000TI-55
55
30
100
-40
C to 85
C
32 Pin TSOP
MX27C1000PI-70
70
30
100
-40
C to 85
C
32 Pin DIP
MX27C1000MI-70
70
30
100
-40
C to 85
C
32 Pin SOP
MX27C1000QI-70
70
30
100
-40
C to 85
C
32 Pin PLCC
MX27C1000TI-70
70
30
100
-40
C to 85
C
32 Pin TSOP
MX27C1000PI-90
90
30
100
-40
C to 85
C
32 Pin DIP
MX27C1000MI-90
90
30
100
-40
C to 85
C
32 Pin SOP
MX27C1000QI-90
90
30
100
-40
C to 85
C
32 Pin PLCC
MX27C1000TI-90
90
30
100
-40
C to 85
C
32 Pin TSOP
MX27C1000PI-12
120
30
100
-40
C to 85
C
32 Pin DIP
MX27C1000MI-12
120
30
100
-40
C to 85
C
32 Pin SOP
MX27C1000QI-12
120
30
100
-40
C to 85
C
32 Pin PLCC
MX27C1000TI-12
120
30
100
-40
C to 85
C
32 Pin TSOP
MX27C1000PI-15
150
30
100
-40
C to 85
C
32 Pin SOP
MX27C1000MI-12
120
30
100
-40
C to 85
C
32 Pin SOP
MX27C1000QI-15
150
30
100
-40
C to 85
C
32 Pin PLCC
MX27C1000TI-15
150
30
100
-40
C to 85
C
32 Pin TSOP
MX27C1000TA-90
90
30
100
-40
C to 125
C
32 Pin TSOP
MX27C1000TA-12
120
30
100
-40
C to 125
C
32 Pin TSOP
13
MX27C1000
REV. 5.9, NOV. 19, 2002
P/N: PM0234
PACKAGE INFORMATION
14
MX27C1000
REV. 5.9, NOV. 19, 2002
P/N: PM0234
15
MX27C1000
REV. 5.9, NOV. 19, 2002
P/N: PM0234
16
MX27C1000
REV. 5.9, NOV. 19, 2002
P/N: PM0234
17
MX27C1000
REV. 5.9, NOV. 19, 2002
P/N: PM0234
REVISION HISTORY
Revision No. Description
Page
Date
5.0
1) Reduce operating current change from 40mA to 30mA.
5/28/1997
2) Eliminate Interactive Programming Mode.
3) Add 27C1001 pin configuration.
5.1
IPP 100uA --> 10uA
8/08/1997
5.2
Change TSOP Orientation
4/09/1998
5.3
27C1000CDIP 70/90/100/120/150ns speed grades deleted from
5/07/1998
ordering information.
5.4
Add 55ns speed grade parts for industrial grade
P6,7,13
5/10/1999
5.5
Cancel 32pin ceramic DIP Package
P1,2,11,13,14
FEB/25/2000
5.6
Cancel the MX27C1001 Information
P1~4,6~8,11,12 JAN/18/2001
5.7
Cancel "Ultraviolet Erasable" wording in General Description
P1
AUG/20/2001
To modify Package Information
P13~16
5.8
Add automotive grade
P7,12
NOV/09/2001
5.9
To modify Package Information
P13~16
NOV/19/2002
MX27C1000
M
ACRONIX
I
NTERNATIONAL
C
O.,
L
TD.
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ACRONIX
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NC.
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MACRONIX INTERNATIONAL CO., LTD. reserves the right to change product and specifications without notice.