FEATURES

· 262,144 bytes by 8-bit organization
· Fast access time: 70/90/120 ns
· Low power consumption

50mA maximum active current
100uA maximum standby current

· Programming and erasing voltage 12V

· Command register architecture

Byte Programming (15us typical)
Auto chip erase 5 seconds typical

(including preprogramming time)

Block Erase

· Optimized high density blocked architecture

Four 4-KB blocks (Top)
Fourteen 16-KB blocks
Four 4-KB blocks (Bottom)

P/N: PM0380

· Auto Erase (chip & block) and Auto Program

DATA polling
Toggle bit

· 10,000 minimum erase/program cycles
· Latch-up protected to 100mA from -1 to VCC+1V
· Advanced CMOS Flash memory technology
· Compatible with JEDEC-standard byte-wide 32-pin

EPROM pinouts

· Package type:

32-pin plastic DIP
32-pin PLCC
32-pin TSOP (Type 1)

REV. 1.5, OCT 29, 1998

GENERAL DESCRIPTION

The MX28F2000P is a 2-mega bit Flash memory or-
ganized as 256K bytes of 8 bits each. MXIC's Flash
memories offer the most cost-effective and reliable
read/write non-volatile random access memory. The
MX28F2000P is packaged in 32-pin PDIP, PLCC
and TSOP. It is designed to be reprogrammed and
erased in-system or in-standard EPROM program-
mers.

The standard MX28F2000P offers access times as
fast as 70 ns, allowing operation of high-speed
microprocessors without wait states. To eliminate
bus contention, the MX28F2000P has separate chip
enable (CE) and output enable (OE ) controls.

MXIC's Flash memories augment EPROM function-
a l i t y w i t h i n - c i r c u i t e l e c t r i c a l e r a s u r e a n d
programming. The MX28F2000P uses a command
r e g i s t e r t o m a n a g e t h i s f u n c t i o n a l i t y , w h i l e
m a i n t a i n i n g a s t a n d a r d 3 2 - p i n p i n o u t . T h e
command register allows for 100% TTL level control
inputs and fixed power supply levels during erase
and programming, while maintaining maximum
EPROM compatibility.

MXIC Flash technology reliably stores memory con-
tents even after 10,000 erase and program cycles.
The MXIC cell is designed to optimize the erase and
programming mechanisms. In addition, the combi-
nation of advanced tunnel oxide processing and low
internal electric fields for erase and programming
o p e r a t i o n s p r o d u c e s r e l i a b l e c y c l i n g . T h e
MX28F2000P uses a 12.0V

5% VPP supply to

perform the Auto Program/Erase algorithms.

The highest degree of latch-up protection is
achieved with MXIC's proprietary non-epi process.
Latch-up protection is proved for stresses up to 100
milliamps on address and data pin from -1V to VCC
+ 1V.

MX28F2000P

2M-BIT [256K x 8] CMOS FLASH MEMORY

P/N: PM0380

REV. 1.5, OCT 29, 1998

MX28F2000P

MX28F2000P Block Address and Block Structure

3 F F F F H

A 1 7 ~ A 0

3 D 0 0 0 H

3 F 0 0 0 H

3 E 0 0 0 H

3 C 0 0 0 H

3 8 0 0 0 H

3 0 0 0 0 H

4 - K b y t e

1 6 - K b y t e

0 0 0 0 0 H

1 6 - K b y t e

4 - K b y t e

3 4 0 0 0 H

2 C 0 0 0 H

3 E F F F H

3 D F F F H

3 C F F F H

3 B F F F H

3 7 F F F H

3 3 F F F H

2 F F F F H

2 B F F F H

2 8 0 0 0 H

2 7 F F F H

2 4 0 0 0 H

2 3 F F F H

2 0 0 0 0 H

1 F F F F H

1 C 0 0 0 H

1 B F F F H

1 8 0 0 0 H

1 7 F F F H

1 4 0 0 0 H

1 3 F F F H

1 0 0 0 0 H

0 F F F F H

0 C 0 0 0 H

0 B F F F H

0 8 0 0 0 H

0 7 F F F H

0 4 0 0 0 H

0 3 F F F H

0 3 0 0 0 H

0 2 F F F H

0 2 0 0 0 H

0 1 F F F H

0 1 0 0 0 H

0 0 F F F H

P/N: PM0380

REV. 1.5, OCT 29, 1998

MX28F2000P

PIN CONFIGURATIONS

32 PDIP

TSOP (TYPE 1)

(REVERSE TYPE)

(NORMAL TYPE)

32 PLCC

SYMBOL

PIN NAME

A0~A17

Address Input

Q0~Q7

Data Input/Output

Chip Enable Input

Output Enable Input

Write enable Pin

VPP

Program Supply Voltage

VCC

Power Supply Pin (+5V)

GND

Ground Pin

PIN DESCRIPTION:

MX28F2000P

VPP

A16

A15

A12

GND

VCC

A17

A14

A13

A11

A10

A14

A13

A11

A10

VSS

A12

A15

A16

VPP

VCC

A17

MX28F2000P

A11

A9
A8

A13
A14
A17

VCC

VPP

A16
A15
A12

A7
A6
A5
A4

1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16

OE
A10
CE
Q7
Q6
Q5
Q4
Q3
GND
Q2
Q1
Q0
A0
A1
A2
A3

32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17

MX28F2000P

A10

Q7
Q6
Q5
Q4
Q3

GND

Q2
Q1
Q0

A0
A1
A2
A3

32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17

A11
A9
A8
A13
A14
A17
WE
VCC
VPP
A16
A15
A12
A7
A6
A5
A4

1
2
3
4
5
6
7
8
9

10
11
12
13
14
15
16

MX28F2000P

P/N: PM0380

REV. 1.5, OCT 29, 1998

MX28F2000P

AUTOMATIC PROGRAMMING

The MX28F2000P is byte programmable using the
Automatic Programming algorithm. The Automatic
Programming algorithm does not require the system to
time out or verify the data programmed. The typical
room temperature chip programming time of the
MX28F2000P is less than 5 seconds.

AUTOMATIC CHIP ERASE

The device may be erased using the Automatic Erase
algorithm. The Automatic Erase algorithm automati-
cally programs the entire array prior to electrical erase.
The timing and verification of electrical erase are
controlled internal to the device.

AUTOMATIC BLOCK ERASE

The MX28F2000P is block(s) erasable using MXIC's
Auto Block Erase algorithm. Block erase modes allow
blocks of the array to be erased in one erase cycle.
The Automatic Block Erase algorithm automatically
programs the specified block(s) prior to electrical
erase. The timing and verification of electrical erase
are controlled internal to the device.

AUTOMATIC PROGRAMMING ALGORITHM

MXIC's Automatic Programming algorithm requires
the user to only write a program set-up command and
a program command (program data and address). The
device automatically times the programming pulse
width, provides the program verify, and counts the
number of sequences. A status bit similar to DATA
polling and a status bit toggling between consecutive
read cycles, provide feedback to the user as to the
status of the programming operation.

MXIC's Automatic Erase algorithm requires the user to
only write an erase set-up command and erase com-
mand. The device will automatically pre-program and
verify the entire array. Then the device automatically
times the erase pulse width, provides the erase verify,
and counts the number of sequences. A status bit
similar to DATA polling and a status bit toggling
between consecutive read cycles, provide feedback to
the user as to the status of the erase operation.

Commands are written to the command register using
standard microprocessor write timings. Register con-
tents serve as inputs to an internal state-machine
which controls the erase and programming circuitry.
During write cycles, the command register internally
latches address and data needed for the programming
and erase operations. For system design simplifica-
tion, the MX28F2000P is designed to support either
WE or CE controlled writes. During a system write
cycle, addresses are latched on the falling edge of WE
or CE whichever occurs last. Data is latched on the
rising edge of WE or CE whichever occur first. To
simplify the following discussion, the WE pin is used as
the write cycle control pin throughout the rest of this
text. All setup and hold times are with respect to the
WE signal.

MXIC's Flash technology combines years of EPROM
experience to produce the highest levels of quality, relia-
bility, and cost effectiveness. The MX28F2000P electri-
cally erases all bits simultaneously using Fowler-Nord-
heim tunneling. The bytes are programmed one byte at
a time using the EPROM programming mechanism of hot
electron injection.

AUTOMATIC ERASE ALGORITHM

P/N: PM0380

REV. 1.5, OCT 29, 1998

MX28F2000P

TABLE 1. COMMAND DEFINITIONS

COMMAND

BUS

FIRST BUS CYCLE

SECOND BUS CYCLE

CYCLES

OPERATION

ADDRESS

DATA

OPERATION

ADDRESS

DATA

Read Memory

Write

00H

Read Identified codes

Write

90H

Read

Setup auto erase/

Write

30H

Write

30H

auto erase (chip)

Setup auto erase/

Write

20H

Write

D0H

auto erase (block)

Setup auto program/

Write

40H

Write

program

Setup Erase/

Write

20H

Write

20H

Erase (chip)

Setup Erase/

Write

60H

Write

60H

Erase (block)

Erase verify

Write

EVA

A0H

Read

EVD

Reset

Write

FFH

Write

FFH

Note:
IA

= Identifier address

= Block of memory location to be erased

= Address of memory location to be pro-

grammed

= Data read from location IA during device iden-

tification

= Data to be programmed at location PA

EVA = Address of memory location to be read during

erase verify.

EVD = Data read from location EVA during erase

verify.

Auto modes have the build-in enchanced features.
Please use the auto erase mode whenever it is.

P/N: PM0380

REV. 1.5, OCT 29, 1998

MX28F2000P

COMMAND DEFINITIONS

When low voltage is applied to the VPP pin, the con-
tents of the command register default to 00H, enabling
read-only operation.

Placing high voltage on the VPP pin enables read/write
operations. Device operations are selected by writing
specific data patterns into the command register. Ta-
ble 1 defines these MX28F2000P register commands.
Table 2 defines the bus operations of MX28F2000P.

TABLE 2. MX28F2000P BUS OPERATIONS

OPERATION

VPP(1)

DQ0-DQ7

READ-ONLY

Read

VPPL

VIL

VIH

Data Out

Output Disable

VPPL

VIL

VIH

Tri-State

Standby

VPPL

VIH

Tri-State

Read Silicon ID (Mfr)(2)

VPPL

VIL

VID(3)

VIL

VIH

Data = C2H

Read Silicon ID (Device)(2)

VPPL

VIH

VID(3)

VIL

VIH

Data = 2AH

READ/WRITE

Read

VPPH

VIL

VIH

Data Out(4)

Standby(5)

VPPH

VIH

Tri-State

Write

VPPH

VIL

VIH

VIL

Data In(6)

NOTES:
1. VPPL may be grounded, a no-connect with a resistor tied

to ground, or < VCC + 2.0V. VPPH is the programming
voltage specified for the device. When VPP = VPPL,
memory contents can be read but not written or erased.

2. Manufacturer and device codes may also be accessed

via a command register write sequence. Refer to Table
1. All other addresses don't care.

3. VID is the Silicon-ID-Read high voltage.(11.5V to 13v)
4. Read operations with VPP = VPPH may access array

data or Silicon ID codes.

5. With VPP at high voltage, the standby current equals ICC

+ IPP (standby).

6. Refer to Table 1 for valid Data-In during a write operation.
7. X can be VIL or VIH.

P/N: PM0380

REV. 1.5, OCT 29, 1998

MX28F2000P

contain an all-zero pattern, a self-timed chip erase and
verify begin. The erase and verify operations are
complete when the data on DQ7 is "1" at which time the
device returns to the Read mode. The system is not
required to provide any control or timing during these
operations.

When using the Automatic Chip Erase algorithm, note
that the erase automatically terminates when
adequate erase margin has been achieved for the
memory array(no erase verify command is required).
The margin voltages are internally generated in the
same manner as when the standard erase verify
command is used.

The Automatic set-up erase command is a command-
only operation that stages the device for automatic
electrical erasure of all bytes in the array. Automatic
set-up erase is performed by writing 30H to the
command register.

To command automatic chip erase, the command 30H
must be written again to the command register. The
automatic chip erase begins on the rising edge of the
WE and terminates when the data on DQ7 is "1" and
the data on DQ6 stops toggling for two consecutive
read cycles, at which time the device returns to the
Read mode.

SET-UP AUTOMATIC BLOCK ERASE/ERASE
COMMANDS

The automatic block erase does not require the device
to be entirely pre-programmed prior to executing the
Automatic set-up block erase command and
Automatic block erase command. Upon executing the
Automatic block erase command, the device automati-
cally will program and verify the block(s) memory for an
all-zero data pattern. The system is not required to
provide any controls or timing during these operations.

When the block(s) is automatically verified to contain
an all-zero pattern, a self-timed block erase and verify
begin. The erase and verify operations are complete
when the data on DQ7 is "1" and the data on DQ6 stops
toggling for two consecutive read cycles, at which time
the device returns to the Read mode. The system is
not required to provide any control or timing during
these operations.

READ COMMAND

While VPP is high, for erasure and programming,
memory contents can also be accessed via the read
command. The read operation is initiated by writing
00H into the command register. Microprocessor read
cycles retrieve array data. The device remains en-
abled for reads until the command register contents
are altered.

The default contents of the register upon VPP power-
up is 00H. This default value ensures that no spurious
alteration of memory contents occurs during the VPP
power transition. Where the VPP supply is hard-wired
to the MX28F2000P, the device powers up and
remains enabled for reads until the command register
contents are changed.

SILICON-ID-READ COMMAND

Flash-memories are intended for use in applications
where the local CPU alters memory contents. As such,
manufacturer- and device-codes must be accessible
while the device resides in the target system. PROM
programmers typically access signature codes by rais-
ing A9 to a high voltage. However, multiplexing high
voltage onto address lines is not a desired system-
design practice.

The MX28F2000P contains a Silicon-ID-Read opera-
tion to supplement traditional PROM-programming
methodology. The operation is initiated by writing 90H
into the command register. Following the command
write, a read cycle from address 0000H retrieves the
manufacturer code of C2H. A read cycle from address
0001H returns the device code of 2AH.

SET-UP AUTOMATIC CHIP ERASE/ERASE
COMMANDS

The automatic chip erase does not require the device
to be entirely pre-programmed prior to excuting the
Automatic set-up erase command and Automatic chip
erase command. Upon executing the Automatic chip
erase command, the device automatically will program
and verify the entire memory for an all-zero data
pattern. When the device is automatically verified to

P/N: PM0380

REV. 1.5, OCT 29, 1998

MX28F2000P

When using the Automatic Block Erase algorithm, note
that the erase automatically terminates when adequate
erase margin has been achieved for the memory array
(no erase verify command is required). The margin
voltages are internally generated in the same manner
as when the standard erase verify command is used.

The Automatic set-up block erase command is a com-
mand only operation that stages the device for auto-
matic electrical erasure of selected blocks in the array.
Automatic set-up block erase is performed by writing
20H to the command register.

To enter automatic block erase, the user must write
the command D0H to the command register. Block
addresses are loaded into internal register on the 2nd
falling edge of WE. Each successive block load cycles,
started by the falling edge of WE, must begin within
30us from the rising edge of the preceding WE.
Otherwise, the loading period ends and internal auto
block erase cycle starts. When the data on DQ7 is "1"
and the data on DQ6 stops toggling for two
consecutive read cycles, at which time auto erase
ends and the device returns to the Read mode.

Refer to page 2 for detailed block address.

SET-UP AUTOMATIC PROGRAM/PROGRAM
COMMANDS

The Automatic Set-up Program is a command-only
operation that stages the device for automatic pro-
gramming. Automatic Set-up Program is performed by
writing 40H to the command register.

Once the Automatic Set-up Program operation is per-
formed, the next WE pulse causes a transition to an
active programming operation. Addresses are
internally latched on the falling edge of the WE pulse.
Data is internally latched on the rising edge of the WE
pulse. The rising edge of WE also begins the
programming operation. The system is not required to
provide further controls or timings. The device will
automatically provide an adequate internally
generated program pulse and verify margin. The
automatic programming operation is completed when
the data read on DQ6 stops toggling for two
consecutive read cycles and the data on DQ7 and
DQ6 are equivalent to data written to these two bits, at
which time the device returns to the Read mode (no
program verify command is required).

RESET COMMAND

A reset command is provided as a means to safely
abort the erase- or program-command sequences.
Following either set-up command (erase or program)
with two consecutive writes of FFH will safely abort the
operation. Memory contents will not be altered. Should
program-fail or erase-fail happen, two consecutive
writes of FFH will reset the device to abort the
operation. A valid command must then be written to
place the device in the desired state.

WRITE OPERATON STATUS

TOGGLE BIT-DQ6

The MX28F2000P features a "Toggle Bit" as a method
to indicate to the host sytem that the Auto Program/
Erase algorithms are either in progress or completed.

While the Automatic Program or Erase algorithm is in
progress, successive attempts to read data from the
device will result in DQ6 toggling between one and
zero. Once the Automatic Program or Erase algorithm
is completed, DQ6 will stop toggling and valid data will
be read. The toggle bit is valid after the rising edge of
the second WE pulse of the two write pulse sequences.

DATA POLLING-DQ7

The MX28F2000P also features Data Polling as a
method to indicate to the host system that the
Automatic Program or Erase algorithms are either in
progress or completed.

While the Automatic Programming algorithm is in op-
eration, an attempt to read the device will produce the
complement data of the data last written to DQ7. Upon
completion of the Automatic Program algorithm an
attempt to read the device will produce the true data
last written to DQ7. The Data Polling feature is valid
after the rising edge of the second WE pulse of the two
write pulse sequences.

P/N: PM0380

REV. 1.5, OCT 29, 1998

MX28F2000P

While the Automatic Erase algorithm is in operation,
DQ7 will read "0" until the erase operation is com-
pleted. Upon completion of the erase operation, the
data on DQ7 will read "1". The Data Polling feature is
valid after the rising edge of the second WE pulse of
two write pulse sequences.

The Data Polling feature is active during Automatic
Program/Erase algorithms.

POWER-UP SEQUENCE

The MX28F2000P powers up in the Read only mode.
In addition, the memory contents may only be altered
after successful completion of a two-step command
sequence. Power up sequence is not required.

SYSTEM CONSIDERATIONS

During the switch between active and standby condi-
tions, transient current peaks are produced on the
rising and falling edges of Chip Enable. The
magnitude of these transient current peaks is
dependent on the output capacitance loading of the
device. At a minimum, a 0.1uF ceramic capacitor (high
frequency, low inherent inductance) should be used
on each device between VCC and GND, and between
VPP and GND to minimize transient effects. In
addition, to overcome the voltage drop caused by the
inductive effects of the printed circuit board traces on
FLASH memory arrays, a 4.7uF bulk electrolytic
capacitor should be used between VCC and GND for
each eight devices. The location of the capacitor
should be close to where the power supply is con-
nected to the array.

P/N: PM0380

REV. 1.5, OCT 29, 1998

MX28F2000P

ABSOLUTE MAXIMUM RATINGS

RATING

VALUE

Ambient Operating Temperature

C to 70

Storage Temperature

-65

C to 125

Applied Input Voltage

-0.5V to 7.0V

Applied Output Voltage

-0.5V to 7.0V

VCC to Ground Potential

-0.5V to 7.0V

A9 & VPP

-0.5V to 13.5V

NOTICE:
Stresses greater than those listed under ABSOLUTE MAXI-
MUM RATINGS may cause permanent damage to the de-
vice. This is stress rating only and functional operational
sections of this specification is not implied. Exposure to ab-
solute maximum rating conditions for extended period may
affect reliability.
NOTICE:
Specifications contained within the following tables are sub-
ject to change.

CAPACITANCE TA = 25

C, f = 1.0 MHz

SYMBOL

PARAMETER

MIN.

TYP

MAX.

UNIT

CONDITIONS

CIN

Input Capacitance

VIN = 0V

COUT

Output Capacitance

VOUT = 0V

READ OPERATION
DC CHARACTERISTICS

TA = 0

C TO 70

C, VCC = 5V

10%, VPP = GND to VCC

SYMBOL

PARAMETER

MIN.

TYP

MAX.

UNIT

CONDITIONS

ILI

Input Leakage Current

VIN = GND to VCC

ILO

Output Leakage Current

VOUT = GND to VCC

IPP1

VPP Current

100

VPP = 5.5V

ISB1

Standby VCC current

CE = VIH

ISB2

100

CE = VCC + 0.3V

ICC1

Operating VCC current

IOUT = 0mA, f=1MHz

ICC2

IOUT = 0mA, f=11MHz

VIL

Input Low Voltage

-0.3

(NOTE 1)

0.8

VIH

Input High Voltage

2.4

VCC + 0.3

VOL

Output Low Voltage

0.45

IOL = 2.1mA

VOH

Output High Voltage

2.4

IOH = -400uA

NOTES:

1. VIL min. = -1.0V for pulse width

50 ns.

VIL min. = -2.0V for pulse width < 20 ns.

2. VIH max. = VCC + 1.5V for pulse width < 20 ns

If VIH is over the specified maximum value, read operation

cannot be guaranteed.

P/N: PM0380

REV. 1.5, OCT 29, 1998

MX28F2000P

AC CHARACTERISTICS

TA = 0

C to 70

C, VCC = 5V

10%, VPP = GND to VCC

28F2000P-70

28F2000P-90 28F2000P-12

SYMBOL

PARAMETER

MIN.

MAX.

MIN.

MAX.

MIN.

MAX.

UNIT CONDITIONS

tACC

Address to Output Delay

120

CE=OE=VIL

tCE

CE to Output Delay

120

OE=VIL

tOE

OE to Output Delay

CE=VIL

tDF

OE High to Output Float

(

Note1)

CE=VIL

tOH

Address to Output hold

CE=OE=VIL

NOTE:

1. tDF is defined as the time at which the output achieves the

open circuit condition and data is no longer driven.

TEST CONDITIONS:

· Input pulse levels: 0.45V/2.4V

· Input rise and fall times:

10ns

· Output load: 1 TTL gate + 100pF (Including scope and jig)

· Reference levels for measuring timing: 0.8V, 2.0V

READ TIMING WAVEFORMS

ADDRESS

tOH

tDF

tACC

tOE

tCE

ACTIVE MODE

STANDBY MODE

DATA OUT

DATA OUT VALID

P/N: PM0380

REV. 1.5, OCT 29, 1998

MX28F2000P

COMMAND PROGRAMMING/DATA PROGRAMMING/ERASE OPERATION

DC CHARACTERISTICS

TA = 0

C to 70

C, VCC = 5V

10%, VPP = 12.0V

SYMBOL

PARAMETER

MIN.

TYP

MAX.

UNIT

CONDITIONS

ILI

Input Leakage Current

VIN=GND to VCC

ILO

Output Leakage Current

VOUT=GND to VCC

ISB1

Standby VCC current

CE=VIH

ISB2

100

CE=VCC

0.3V

ICC1 (Read)

Operating VCC Current

IOUT=0mA, f=1MHz

ICC2

IOUT=0mA, F=11MHz

ICC3 (Program)

In Programming

ICC4 (Erase)

In Erase

ICC5 (Program Verify)

In Program Verify

ICC6 (Erase Verify)

In Erase Verify

IPP1 (Read)

VPP Current

100

VPP=12.6V

IPP2 (Program)

In Programming

IPP3 (Erase)

In Erase

IPP4 (Program Verify)

In Program Verify

IPP5 (Erase Verify)

In Erase Verify

VIL

Input Voltage

-0.3 (Note 5)

0.8

VIH

2.4

VCC+0.3V V

(Note 6)

VOL

Output Voltage

0.45

IOL=2.1mA

VOH

2.4

IOH=-400uA

NOTES:

1. VCC must be applied before VPP and removed after VPP.

2. VPP must not exceed 14V including overshoot.

3. An influence may be had upon device reliability if the device

is installed or removed while VPP=12V.

4. Do not alter VPP either VIL to 12V or 12V to VIL when

CE=VIL.

5. VIL min. = -0.6V for pulse width

20ns.

6. If VIH is over the specified maximum value, programming

operation cannot be guranteed.

7. All currents are in RMS unless otherwise noted.(Sampled, not

100% tested.)

P/N: PM0380

REV. 1.5, OCT 29, 1998

MX28F2000P

AC CHARACTERISTICS

TA = 0

C to 70

C, VCC = 5V

10%, VPP =12V

28F2000P-70

28F2000P-90

28F2000P-12

SYMBOL PARAMETER

MIN.

MAX.

MIN.

MAX.

MIN.

MAX.

UNIT CONTIONS

tVPS

VPP setup time

100

tOES

OE setup time

100

tCWC

Command programming cycle

120

tCEP

WE programming pulse width

tCEPH1

WE programming pluse width High

tCEPH2

WE programming pluse width High

100

tAS

Address setup time

tAH

Address hold time

tAH1

Address hold time for DATA POLLING

tDS

Data setup time

tDH

Data hold time

tCESP

CE setup time before DATA polling/toggle bit

100

tCES

CE setup time

tCESC

CE setup time before command write

100

tCESV

CE setup time before verify

tVPH

VPP hold time

100

tDF

Output disable time (Note 3)

tDPA

DATA polling/toggle bit access time

120

tAETC

Total erase time in auto chip erase

5(TYP.)

tAETB

Total erase time in auto block erase

5(TYP.)

tAVT

Total programming time in auto verify

300

tBALC

Block address load cycle

0.3

tBAL

Block address load time

100

tCH

CE Hold Time

tCS

CE setup to WE going low

NOTES:

1. CE and OE must be fixed high during VPP transition from 5V

to 12V or from 12V to 5V.

2. Refer to read operation when VPP=VCC about read opera-

tion while VPP 12V.

3. tDF defined as the time at which the output achieves the open

circuit condition and data is no longer driven.

P/N: PM0380

REV. 1.5, OCT 29, 1998

MX28F2000P

AUTOMATIC PROGRAMMING TIMING WAVEFORM

One byte data is programmed. Verify in fast algorithm
and additional programming by external control are not
required because these operations are excuted auto-
matically by internal control circuit. Programming
completion can be verified by DATA polling and toggle bit

checking after automatic verify starts. Device outputs
DATA during programming and DATA after programming
on Q7. Q0 to Q5 (Q6 is for toggle bit; see toggle bit, DATA
polling, timing waveform) are in high impedance.

tCWC

Address

valid

tAS

tCEP

tOES

tCEP

tCESP tCES

tCESC

tDS

tDH

tDS

tDF

Data in

Command in

Data in

Command in

Vcc 5V

tAVT

12V
Vpp
0V

Command #40H

tVPH

tVPS

Q0~Q5

DATA polling

Auto program & DATA polling

Setup auto program/

program command

DATA

A0 ~ A17

tCEPH1

tAH1

DATA

tDPA

P/N: PM0380

REV. 1.5, OCT 29, 1998

MX28F2000P

erase starts. Device outputs 0 during erasure and 1 after
erasure on Q7. Q0 to Q5 (Q6 is for toggle bit; see toggle
bit, DATA polling, timing waveform) are in high imped-
ance.

AUTOMATIC CHIP ERASE TIMING WAVEFORM

All data in chip are erased. External erase verify is not
required because data is erased automatically by internal
control circuit. Erasure completion can be verified by
DATA polling and toggle bit checking after automatic

tCWC

tCEP

tOES

tCEP

tCESP tCES

tCESC

tDS

tDH

tDS

tDF

Command in

Vcc 5V

tAETC

Command in

12V
Vpp
0V

Command #30H Command #30H

tVPH

tVPS

Q0~Q5

Auto chip erase & DATA polling

DATA polling

A0 ~ A17

tCEPH1

Setup auto chip erase/

erase command

tDPA

P/N: PM0380

REV. 1.5, OCT 29, 1998

MX28F2000P

checking after automatic erase starts. Device outputs 0
during erasure and 1 after erasure on Q7. Q0 to Q5 (Q6
is for toggle bit; see toggle bit, DATA polling, timing
waveform) are in high impedance.

AUTOMATIC BLOCK ERASE TIMING WAVEFORM

Block data indicated by A12 to A17 are erased. External
erase verify is not required because data are erased
automatically by internal control circuit. Erasure comple-
tion can be verified by DATA polling and toggle bit

*Refer to page 2 for detailed block address.

Vcc 5V

tCEP

tOES

tDF

Command in

tCESC

tDS

tDH

tDS

tDH

Block

address 0

Block

address 1

tCWC

tAS

tAH

tBALC

tCEP

12V
Vpp
0V

Block

address #

Command #20H Command #D0H

tVPH

tVPS

tBAL

tAETB

Q0~Q5

Auto block erase & DATA polling

DATA polling

A12 ~ A17

tCEPH2

tCEPH1

tCH

tCS

tAH1

Setup auto block erase/erase command

tDPA

A0 ~ A11

P/N: PM0380

REV. 1.5, OCT 29, 1998

MX28F2000P

COMPATIBLE BLOCK ERASE

This device can be applied to the compatible block erase
algorithm shown in the following flowchart. This algorithm
allows to obtain faster erase time by the block (refer to

page2) without any voltage stress to the device nor
deterioration in reliability of data.

BLOCK ERASE FLOW

COMPATIBLE BLOCK ERASE FLOWCHART

START

END

YES

FAIL

ALL BITS VERIFIED

N = 0

BLOCK ERASE FLOW

ERSVFY FLOW

N = 1024?

BLOCK ERASE FAIL

APPLY

VPP = VCC

BLOCK ERASE

COMPLETE

N = N+1

For selected block(s),

All bits PGM"0"

START

Apply

WRITE SETUP BLOCK ERASE COMMAND

END

VPP = VPPH

WRITE BLOCK ERASE COMMAND

( 60H )

WAIT

10 ms

( LOAD FIRST SECTOR ADDRESS , 60H )

LOAD OTHER SECTORS' ADDRESS

IF NECESSARY

( LOAD OTHER SECTOR ADDRESS )

P/N: PM0380

REV. 1.5, OCT 29, 1998

MX28F2000P

ORDERING INFORMATION

PLASTIC PACKAGE

PART NO.

ACCESS TIME

OPERATING

STANDBY

PACKAGE

ERASE/PROGRAM

CURRENT

CYCLE

(ns)

MAX.(mA)

MAX.(uA)

MIN.(time)

MX28F2000PPC-70C4

100

32 Pin DIP

10,000

MX28F2000PPC-90C4

100

32 Pin DIP

10,000

MX28F2000PPC-12C4

120

100

32 Pin DIP

10,000

MX28F2000PQC-70C4

100

32 Pin PLCC

10,000

MX28F2000PQC-90C4

100

32 Pin PLCC

10,000

MX28F2000PQC-12C4

120

100

32 Pin PLCC

10,000

MX28F2000PTC-70C4

100

32 Pin TSOP

10,000

(Normal Type)

MX28F2000PTC-90C4

100

32 Pin TSOP

10,000

(Normal Type)

MX28F2000PTC-12C4

120

100

32 Pin TSOP

10,000

(Normal Type)

MX28F2000PRC-70C4

100

32 Pin TSOP

10,000

(Reverse Type)

MX28F2000PRC-90C4

100

32 Pin TSOP

10,000

(Reverse Type)

MX28F2000PRC-12C4

120

100

32 Pin TSOP

10,000

(Reverse Type)

P/N: PM0380

REV. 1.5, OCT 29, 1998

MX28F2000P

PACKAGE INFORMATION

32-PIN PLASTIC DIP

ITEM

MILLIMETERS

INCHES

42.13 max.

1.660 max.

1.90 [REF]

.075 [REF]

2.54 [TP]

.100 [TP]

.46 [Typ.]

.050 [Typ.]

38.07

1.500

1.27 [Typ.]

.050 [Typ.]

3.30

.25

.130

.010

.51 [REF]

.020 [REF]

3.94

.25

1.55

.010

5.33 max.

.210 max.

15.22

.25

.600

.101

13.97

.25

.550

.010

.25 [Typ.]

.010 [Typ.]

NOTE: Each lead certerline is located within

.25mm[.01 inch] of its true position [TP] at a
maximum at maximum material condition.

32-PIN PLASTIC LEADED CHIP CARRIER (PLCC)

ITEM

MILLIMETERS

INCHES

12.44

.13

.490

.005

11.50

.13

.453

.005

14.04

.13

.553

.005

14.98

.13

.590

.005

1.93

.076

3.30

.25

.130

.010

2.03

.13

.080

.005

.51

.13

.020

.005

1.27 [Typ.]

.050 [Typ.]

.71 [REF]

.028 [REF]

.46 [REF]

.018 [REF]

10.40/12.94

.410/.510

(W) (L)

.89R

.035R

.25[Typ.]

.010[Typ.]

NOTE: Each lead certerline is located within

.25mm[.01 inch] of its true position [TP] at a
maximum at maximum material condition.

0~15¡

K
L

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