SCHOTTKY DIE SPECIFICATION
TYPE: MBR360
60 V 3A ( Low Ir)
Single Anode
SYM
Die Sort UNIT
DC Blocking Voltage: Ir=1mA(for wafer form)
VRRM
63
Volt
Ir=0.5mA (for dice form)
IFAV
Amp
VF MAX
0.635
Volt
IR MAX
0.09
mA
Cj MAX
pF
IFSM
Amp
Tj
C
TSTG
C
Specification apply to die only. Actual performance may degrade when assembled.
MEMT does not guarantee device performance after assembly.
Data sheet information is subjected to change without notice.
DIM
um
2
Mil
2
A
1524
60.00
B
1424
56.1
C
1444
56.9
D
254
10
305
12
Micro-Electro-Magnetical Tech Co.
Spec. Limit
60
3
Thickness (Max)
0.1
Top Metal Pad Size
Passivation Seal
Thickness (Min)
PS:
(1)Cutting street width is around 80um(3.14mil).
(2)Both of top-side and back-side metals are Ti/Ni/Ag.
General Description:
100
-65 to +125
-65 to +125
0.645
@ 3 Amperes, Ta=25C
Maximum Instantaneous Reverse Voltage
VR= 60 Volt, Ta=25C
ELECTRICAL CHARACTERISTICS
Average Rectified Forward Current
Maximum Instantaneous Forward Voltage
Maximum Junction Capacitance @ 0V, 1MHZ
MAXIMUM RATINGS
Nonrepetitive Peak Surge Current
Operating Junction Temperature
Storage Temperatures
ITEM
Die Size
DICE OUTLINE DRAWING
B
C
A
Top-side Metal
D
SiO2 Passivation
P
+
Guard Ring
Back-side Metal
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