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Электронный компонент: SY58011U

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DESCRIPTION
Precision 1:2, 400mV CML fanout buffer
Guaranteed AC performance over temperature/
voltage:
> 7GHz f
MAX
clock
< 60ps t
r
/ t
f
times
< 250ps t
pd
< 15ps max. skew
Low jitter performance:
< 10ps
(pk-pk)
total jitter (clock)
< 1ps
(rms)
random jitter (data)
< 10ps
(pk-pk)
deterministic jitter (data)
Accepts an input signal as low as 100mV
Unique input termination and V
T
pin accepts DC-
coupled and AC-coupled differential
inputs: LVPECL, LVDS, and CML
50
source terminated CML outputs
Power supply 2.5V
5% and 3.3V
10%
Industrial temperature range: 40
C to +85
C
Available in 16-pin (3mm


3mm) MLFTM package
FEATURES
7GHz, 1:2 CML FANOUT
BUFFER/TRANSLATOR WITH
INTERNAL I/O TERMINATION
Precision EdgeTM
SY58011U
APPLICATIONS
s All SONET and GigE clock distribution
s
Fibre Channel clock and data distribution
s
Backplanes
s
Data distribution: OC-48, OC-48+FEC, XAUI
s
High-end, low skew, multiprocessor synchronous
clock distribution
1
Rev.: A
Amendment: /0
Issue Date:
June 26, 2003
The SY58011U is a 2.5V/3.3V precision, high-speed, fully
differential 1:2 CML fanout buffer. Optimized to provide two
identical output copies with less than 15ps of skew and less
than 10ps
(pk-pk)
total jitter, the SY58011U can process clock
signals as fast as 7GHz or data patterns up to 10.7Gbps.
The differential input includes Micrel's unique, 3-pin input
termination architecture that interfaces to LVPECL, LVDS,
or CML differential signals, (AC-coupled or DC-coupled) as
small as 100mV without any level-shifting or termination
resistor networks in the signal path. For AC-coupled input
interface applications, an on-board output reference voltage
(V
REF
-AC) is provided to bias the V
T
pin. The outputs are
compatible with 400mV typical swing into 50
loads, with
extremely fast rise/fall times guaranteed to be less than
60ps.
The SY58011U operates from a 2.5V
5% supply or
3.3V
10% supply and is guaranteed over the full industrial
temperature range (40
C to +85
C). For applications that
require LVPECL outputs, consider the SY58012U or
SY58013U 1:2 fanout buffer with 800mV and 400mV output
swing, respectively. The SY58011U is part of Micrel's high-
speed, Precision EdgeTM product line. Data sheets and
support documentation can be found on Micrel's web site at
www.micrel.com.
FUNCTIONAL BLOCK DIAGRAM
TYPICAL PERFORMANCE
Precision Edge is a trademark of Micrel, Inc.
Micro
LeadFrame and MLF are trademarks of Amkor Technology, Inc.
IN
/IN
Q1
/Q1
Q0
/Q0
V
T
50
50
V
REF
-AC
2GHz Output
TIME (70ps/div.)
Output Swing
(100mV/div
.)
V
CC
= 2.5V
2GHz with 100mV Input
Precision EdgeTM
2
Precision EdgeTM
SY58011U
Micrel
PACKAGE/ORDERING INFORMATION
Ordering Information
(Note 1)
Package
Operating
Package
Part Number
Type
Range
Marking
SY58011UMI
MLF-16
Industrial
011U
SY58011UMITR
(Note 2)
MLF-16
Industrial
011U
Note 1.
Contact factory for die availability. Die are guaranteed at T
A
=
25
C, DC electricals only.
Note 2.
Tape and Reel.
Pin Number
Pin Name
Pin Function
1, 4
IN, /IN
Differential Input: This input pair is the signal to be buffered. Each pin of this pair internally
terminates with 50
to the V
T
pin. Note that this input will default to an indeterminate state
if left open. See
"Input Interface Applications"
section.
2
VT
Input Termination Center-Tap: Each input terminates to this pin. The V
T
pin provides a
center-tap for each input (IN, /IN) to a termination network for maximum interface flexibility.
See
"Input Interface Applications"
section.
3
VREF-AC
Reference Output Voltage: This output biases to V
CC
1.4V. It is used when AC-coupling
the inputs (IN, /IN). Connect V
REF
-AC directly to the V
T
pin. Bypass with 0.01
F low ESR
capacitor to V
CC
. Maximum current source or sink is 0.5mA. See
"Input Interface Applica
tions"
section.
5, 8, 13, 16
VCC
Positive Power Supply: Bypass with 0.1
F//0.01
F low ESR capacitors as close to the
V
CC
pins as possible.
6, 7, 14, 15
GND,
Ground. Exposed pad must be connected to a ground plane that is the same potential
(Exposed Pad)
as the ground pin.
12, 11
Q0, /Q0,
CML Differential Output Pairs: Differential buffered output copy of the input signal. The
9, 10
Q1, /Q1
output swing is typically 400mV. Unused output pairs may be left floating with no impact on
jitter. See "
CML Output Termination"
section.
PIN DESCRIPTION
1
2
3
4
12
11
10
9
16 15 14 13
5
6
7
8
IN
VT
VREF-AC
/IN
Q0
/Q0
/Q1
Q1
VCC
GND
GND
VCC
VCC
GND
GND
VCC
16-Pin MLFTM (MLF-16)
3
Precision EdgeTM
SY58011U
Micrel
Absolute Maximum Ratings
(Note 1)
Power Supply Voltage (V
CC
) ....................... 0.5V to +4.0V
Input Voltage (V
IN
) ......................................... 0.5V to V
CC
CML Output Voltage (V
OUT
) ........... V
CC
1.0V to V
CC
+0.5V
Current (V
T
)
Source or sink current on V
T
pin ........................
100mA
Input Current
Source or sink current on IN, /IN ..........................
50mA
Current (V
REF
)
Source or sink current on V
REF
-AC, Note 4 ........
1.5mA
Lead Temperature Soldering, (10 seconds) .............. 270
C
Storage Temperature Range (T
STORE
) .... 65
C to +150
C
Operating Ratings
(Note 2)
Supply Voltage (V
CC
) ............................ +2.375V to +3.60V
Operating Temperature Range (T
A
) ........... 40
C to +85
C
Package Thermal Resistance, Note 3
MLFTM
(
JA
)
Still-Air ............................................................. 60
C/W
500lfpm ............................................................ 54
C/W
MLFTM
(
JB
) ........................................................ 33
C/W
T
A
= 40
C to +85
C
Symbol
Parameter
Condition
Min
Typ
Max
Units
V
CC
Power Supply Voltage
2.375
3.60
V
I
CC
Power Supply Current
Max. V
CC
, no load
75
95
mA
V
IH
Input HIGH Voltage
IN, /IN, Note 6
V
CC
1.6
V
CC
V
V
IL
Input LOW Voltage
IN, /IN
0
V
IH
0.1
V
V
IN
Input Voltage Swing
see Figure 1a.
0.1
1.7
V
V
DIFF_IN
Differential Input Voltage Swing
see Figure 1b.
0.2
3.4
V
R
IN
Into V
T
Resistance
40
50
60
V
REF
-AC
Output Reference Voltage
V
CC
1.525
V
CC
1.4
V
CC
1.325
V
IN to V
T
1.28
V
DC ELECTRICAL CHARACTERISTICS
(Note 5)
V
CC
= 3.3V
10% or 2.5V
5%; T
A
= 40
C to +85
C; R
L
= 100
across each output pair, or equivalent, unless otherwise stated.
Symbol
Parameter
Condition
Min
Typ
Max
Units
V
OH
Output HIGH Voltage
Q0, /Q0, Q1, /Q1
V
CC
0.020 V
CC
0.010
V
CC
V
V
OUT
Output Voltage Swing
Q0, /Q0, Q1, /Q1; see Figure 1a
325
400
mV
V
DIFF_OUT
Differential Output Voltage Swing
Q0, /Q0, Q1, /Q1; see Figure 1b
650
800
mV
R
OUT
Output Source Impedance
Q0, /Q0, Q1, /Q1
40
50
60
Note 1.
Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. This is a stress rating only and functional operation
is not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to ABSOLUTE MAXIMUM
RATINGS conditions for extended periods may affect device reliability.
Note 2.
The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
Note 3.
Thermal performance assumes exposed pad is soldered (or equivalent) to the device's most negative potential (GND) on the PCB.
Note 4.
Due to the limited drive capability, use for input of the same package only.
Note 5.
The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
Note 6.
V
IH
(min.) not lower than 1.2V.
CML DC ELECTRICAL CHARACTERISTICS
(Note 5)
4
Precision EdgeTM
SY58011U
Micrel
V
CC
= 2.5V
5% or 3.3V
10%; T
A
= 40
C to +85
C; R
L
= 100
across each output pair, or equivalent, unless otherwise stated.
Symbol
Parameter
Condition
Min
Typ
Max
Units
f
MAX
Maximum Operating Frequency
NRZ Data
10.7
Gbps
V
OUT
200mV
Clock
7
8
GHz
t
pd
Propagation Delay
V
IN
100mV
100
170
250
ps
t
CHAN
Channel-to-Channel Skew
Note 8
3
15
ps
t
SKEW
Part-to-Part Skew
Note 9
100
ps
t
JITTER
Data
Random Jitter (RJ)
Note 10
1
ps(rms)
Deterministic Jitter (DJ)
Note 11
10
ps(pk-pk)
Clock
Cycle-to-Cycle Jitter
Note 12
1
ps(rms)
Total Jitter (TJ)
Note 13
10
ps(pk-pk)
t
r
, t
f
Output Rise/Fall Time
20% to 80% at full output swing
20
40
60
ps
Note 7.
High frequency AC electricals are guaranteed by design and characterization.
Note 8.
Skew is measured between outputs of the same bank under identical transitions.
Note 9.
Skew is defined for two parts with identical power supply voltages at the same temperature and with no skew of the edges at the respective
inputs.
Note 10. RJ is measured with a K28.7 comma detect character pattern, measured at 10.7Gbps and 2.5Gbps/3.2Gbps.
Note 11. DJ is measured at 10.7Gbps and 2.5Gbps/3.2Gbps with both K28.5 and 2
23
1 PRBS pattern
Note 12. Cycle-to-cycle jitter definition: The variation of periods between adjacent cycles, T
n
T
n1
where T is the time between rising edges of the
output signal.
Note 13. Total jitter definition: With an ideal clock input of frequency
f
MAX
, no more than one output edge in 10
12
output edges will deviate by more
than the specified peak-to-peak jitter value.
AC ELECTRICAL CHARACTERISTICS
(Note 7)
TIMING DIAGRAM
SINGLE-ENDED AND DIFFERENTIAL SWINGS
V
IN
,
V
OUT
(Typ. 400mV)
Figure 1a. Single-Ended Voltage Swing
V
DIFF_IN
,
V
DIFF_OUT
(Typ. 800mV)
Figure 1b. Differential Voltage Swing
/IN
IN
/Q
Q
t
pd
5
Precision EdgeTM
SY58011U
Micrel
0
50
100
150
200
250
300
350
400
450
500
0
2000
4000
6000
8000
10000
12000
AMPLITUDE (mV)
FREQUENCY (MHz)
Frequency vs. Amplitude
TYPICAL OPERATING CHARACTERISTICS
V
CC
= 3.3V, GND = 0, V
IN
= 100mV, T
A
= 25
C, unless otherwise stated.
0
1
2
3
4
5
6
7
8
9
10
-40 -20
0
20
40
60
80 100
WITHIN-DEVICE SKEW (ps)
TEMPERATURE (
C)
Within-Device Skew vs.
Temperature
150
152
154
156
158
160
162
0
200
400
600
800
1000
PROPAGATION DELAY (ps)
INPUT VOLTAGE SWING (V)
Propagation Delay vs.
Input Voltage Swing
125
130
135
140
145
150
155
160
165
170
175
180
185
-40 -20
0
20
40
60
80 100
PROPAGATION DELAY (ps)
TEMPERATURE (
C)
Propagation Delay vs.
Temperature
V
IN
200mV