1
SY89322V
Micrel
DESCRIPTION
s
3.3V and 5V power supply option
s
300ps typical propagation delay
s
Differential LVPECL outputs
s
PNP LVTTL inputs for minimal loading
s
Flow-through pinouts
s
Q outputs will default HIGH with inputs open
s
Max. frequency range 800MHz
s
Available in ultra-small 8-pin MLFTM
(2mm x 2mm)
package
FEATURES
Precision EdgeTM
SY89322V
Rev.: A
Amendment: /0
Issue Date:
August 2003
The SY89322V is a dual TTL/CMOS-to-differential PECL
translator capable of running from a 3.3V or 5V supply.
This part can be used in either LVTTL/LVCMOS/LVPECL
or TTL/CMOS/PECL systems.
It requires only a single positive supply of +3.3V or +5V,
no negative supply is required.
The SY89322V is functionally equivalent to the
SY100EPT22V, but in an ultra-small 8-lead MLFTM package
that features a 70% smaller footprint. The ultra-small
package and the low skew, dual gate design of the
SY89322V makes it ideal for those applications where space,
performance and low power are at a premium.
Precision EdgeTM
Precision Edge is a trademark of Micrel, Inc.
Micro
LeadFrame and MLF are trademarks of Amkor Technology, Inc.
3.3V/5V DUAL
LVTTL/LVCMOS-to-DIFFERENTIAL
LVPECL TRANSLATOR
BLOCK DIAGRAM
Q0
/Q0
INO
LVTTL
LVPECL
Q1
/Q1
INI
2
SY89322V
Micrel
PIN DESCRIPTION
Pin Number
Pin Name
Type
Pin Function
1, 2,
Q0, /Q0,
100k ECL Output
Differential LVPECL Outputs: Default to LOW if IN input left open. See
3, 4
Q1, /Q1
"Output Interface Applications"
section for recommendations on terminations.
5
GND,
Ground
GND and exposed pad must be tied to ground plane.
Exposed Pad
6, 7
IN0, IN1
TTL/LVTTL Input
Single-ended TTL Inputs.
8
VCC
Power
Positive Power Supply: Bypass with 0.1
F//0.01
F low ESR capacitors.
PACKAGE/ORDERING INFORMATION
Ordering Information
Package
Operating
Package
Part Number
Type
Range
Marking
SY89322VMITR
(Note 1)
MLF-8
Industrial
322V
Note 1.
Tape and Reel.
Q0
/Q0
Q1
LVTTL
/Q1
VCC
IN0
IN1
LVPECL
GND
1
2
3
4
8
7
6
5
8-Pin MLFTM
Ultra-Small Outline (2mm
2mm)
3
SY89322V
Micrel
Absolute Maximum Ratings
(Note 1)
Supply Voltage (V
CC
) .................................. 0.5V to +6.0V
Input Voltage (V
IN
) ......................................... 0.5V to V
CC
LVPECL Output Current (I
OUT
)
Continuous ............................................................. 50mA
Surge .................................................................... 100mA
Input Current
Source or sink current on IN, /IN ..........................
50mA
Lead Temperature (soldering, 10 sec.) ................... +220
C
Storage Temperature (T
S
) ....................... 65
C to +150
C
Operating Ratings
(Note 2)
Supply Voltage (V
CC
) .................................. +3.0V to +3.6V
............................................................ +4.5V to +5.5V
Ambient Temperature (T
A
) ......................... 40
C to +85
C
Package Thermal Resistance, Note 3
MLFTM (
JA
)
Still-Air ................................................................. 93
C/W
500lfpm ............................................................... 87
C/W
MLFTM (
JB
)
Junction-to-Board ................................................ 60
C/W
T
A
= 40
C to +85
C
Symbol
Parameter
Condition
Min
Typ
Max
Units
V
CC
Power Supply Voltage
3.0
3.6
V
4.5
5.5
V
I
CC
Power Supply Current
25
mA
DC ELECTRICAL CHARACTERISTICS
V
CC
= +3.3V
10% or +5.0V
10%; T
A
= 40
C to +85
C, unless otherwise noted.
Symbol
Parameter
Condition
Min
Typ
Max
Units
V
IH
Input HIGH Voltage
2.0
V
V
IL
Input LOW Voltage
0.8
V
I
IH
Input HIGH Current
V
IN
= 2.7V
20
A
V
IN
= V
CC
100
A
I
IL
Input LOW Current
V
IN
= 0.5V
0.2
mA
V
IK
Input Clamp Voltage
I
IN
= 18mA
1.2
V
TTL DC ELECTRICAL CHARACTERISTICS
Note 1.
Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. This is a stress rating only and functional operation
is not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to ABSOLUTE MAXIMUM
RATlNG conditions for extended periods may affect device reliability.
Note 2.
The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
Note 3.
Package thermal resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB.
V
CC
= +3.3V
10% or +5V
10%; R
L
= 50
to V
CC
2V; T
A
= 40
C to +85
C, unless otherwise noted.
Symbol
Parameter
Condition
Min
Typ
Max
Units
V
OH
Output HIGH
V
CC
1.080
V
CC
0.880
V
V
OL
Output LOW Voltage
V
CC
1.83
V
CC
1.550
V
PECL DC ELECTRICAL CHARACTERISTICS
4
SY89322V
Micrel
V
CC
= +3.3V
10% or +5.0V
10%; R
L
= 50
to V
CC
2V, T
A
= 40
C to +85
C, unless otherwise noted.
Symbol
Parameter
Condition
Min
Typ
Max
Units
f
MAX
Maximum Toggle Frequency
800
MHz
t
PD
Propagation Delay
IN-to-Q
100
600
ps
t
SKEW
Within-Device Skew
Note 4
100
ps
Part-to-Part Jitter
Note 4
500
ps
t
Jitter
Cycle-to-Cycle Jitter
Note 5
2
ps(rms)
Total Jitter
Note 6
25
ps(pk-pk)
t
r
, t
f
Output Rise/Fall Time (20% to 80%)
200
500
ps
Note 4.
Same transition at common V
CC
levels.
Note 5.
Cycle-to-cycle jitter definition: The variation of periods between adjacent cycles, T
n
T
n1
,where T is the time between rising edges of the
output signal.
Note 6.
Total jitter definition: with an ideal clock input of frequency
f
MAX
, no more than one output edge in 10
12
output edge will deviate by more than
the specified peak-to-peak jitter value.
AC ELECTRICAL CHARACTERISTICS
LVPECL OUTPUT INTERFACE APPLICATIONS
Z
O
= 50
R2
R1
R1
R2
R3
R4
V
CC
--2V
V
CC
--1.3V
V
CC
V
CC
V
CC
V
CC
V
CC
= 3.3V; R1 = 130
, R2 = 82
, R3 = 1k
, R4 = 1.6k
,
V
CC
= 5V; R1 = 83
, R2 = 125
, R3 = 1k
, R4 = 2.8k
,
Figure 1c. Terminating Unused I/O
R2
R2
Z
O
= 50
Z
O
= 50
R1
R1
V
CC
--2V
V
CC
V
CC
V
CC
V
CC
= 3.3V; R1 = 130
, R2 = 82
V
CC
= 5V; R1 = 83
, R2 = 125
Figure 1a. Parallel Thevenin-
Equivalent Termination
Z
O
= 50
Z
O
= 50
R
pd
50
50
C (Optional)
0.01
F
V
CC
--2V
V
CC
V
CC
V
CC
= 3.3V; Rpd = 50
V
CC
= 5V; Rpd = 100
Figure 1b. Three Resistor
"Y Termination"
5
SY89322V
Micrel
MICREL, INC.
1849 FORTUNE DRIVE
SAN JOSE, CA 95131
USA
TEL
+ 1 (408) 944-0800
FAX
+ 1 (408) 944-0970
WEB
http://www.micrel.com
The information furnished by Micrel in this datasheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use.
Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.
Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can
reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into
the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser's
use or sale of Micrel Products for use in life support appliances, devices or systems is at Purchaser's own risk and Purchaser agrees to fully indemnify
Micrel for any damages resulting from such use or sale.
2003 Micrel, Incorporated.
8 LEAD ULTRA-SMALL EPAD-
MicroLeadFrameTM (MLF-8)
Package
EP- Exposed Pad
Die
CompSide Island
Heat Dissipation
Heavy Copper Plane
Heavy Copper Plane
V
EE
V
EE
Heat Dissipation
PCB Thermal Consideration for 8-Pin MLFTM Package
Package Notes:
Note 1.
Package meets Level 2 qualification.
Note 2.
All parts are dry-packaged before shipment.
Note 3.
Exposed pads must be soldered to a ground for proper thermal management.
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