2003 Microchip Technology Inc.
DS21516C-page 1
M
TC1240/TC1240A
Features
Charge Pumps in 6-Pin SOT-23A Package
>99% Typical Voltage Conversion Efficiency
Voltage Doubling
Input Voltage Range, TC1240: +2.5V to +4.0V,
TC1240A: +2.5V to +5.5V
Low Output Resistance, TC1240: 17
(Typical)
TC1240A: 12
(Typical)
Only Two External Capacitors Required
Low Supply Current, TC1240: 180 A (Typical)
TC1240A: 550 A (Typical)
Power-Saving Shutdown Mode (1 A Maximum)
Shutdown Input Fully Compatible with 1.8V Logic
Systems
Applications
Cellular Phones
Pagers
PDAs, Portable Data Loggers
Battery Powered Devices
Handheld Instruments
Package Type
General Description
The TC1240/TC1240A is a doubling CMOS charge
pump voltage converter in a small 6-Pin SOT-23A
package. The TC1240 doubles an input voltage that
can range from +2.5V to +4.0V, while the TC1240A
doubles an input voltage that can range from +2.5V to
+5.5V. Conversion efficiency is typically >99%. Internal
oscillator frequency is 160 kHz for both devices. The
TC1240 and TC1240A have an active-high shutdown
that limits the current consumption of the devices to
less than 1 A.
External component requirement is only two capacitors
for standard voltage doubler applications. All other
circuitry (including control, oscillator and power
MOSFETs) are integrated on-chip. Typical supply cur-
rent is 180 A for the TC1240 and 550 A for the
TC1240A. Both devices are available in a 6-Pin SOT-
23A surface mount package.
Typical Application Circuit
NOTE: 6-Pin SOT-23A is equivalent to the
C-
6
6-Pin SOT-23A
TC1240ECH
TC1240AECH
1
3
4
2
V
IN
C+
GND
5
SHDN
V
OUT
EIAJ (SC-74A)
Positive Voltage Doubler
V
IN
2 x INPUT
C+
C-
C
1
INPUT
GND
V
OUT
SHDN
OFF
ON
TC1240
TC1240A
+
+
C
2
Positive Doubling Charge Pumps with Shutdown
in a SOT-23 Package
TC1240/TC1240A
DS21516C-page 2
2003 Microchip Technology Inc.
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings
Input Voltage (V
IN
to GND)
TC1240 ............................................. +4.5V, -0.3V
TC1240A ........................................... +5.8V, -0.3V
Output Voltage (V
OUT
to GND)
TC1240 ....................................... +9.0V, V
IN
-0.3V
TC1240A ................................... +11.6V, V
IN
-0.3V
Current at V
OUT
Pin............................................50 mA
Short-Circuit Duration: V
OUT
to GND .............Indefinite
Thermal Resistance .......................................210C/W
Power Dissipation (
T
A
= +25
C)........................600 mW
Operating Temperature Range.............-40C to +85C
Storage Temperature (Unbiased) .......-65C to +150C
Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
TC1240 ELECTRICAL SPECIFICATIONS
Electrical Specifications: Unless otherwise noted, typical values apply at T
A
= +25C. Minimum and maximum val-
ues apply for T
A
= -40 to +85C, and V
IN
= +2.8V, C
1
= C
2
= 3.3 F, SHDN = GND.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Supply Current
I
DD
--
180
300
A
R
LOAD
=
Shutdown Supply Current
I
SHDN
--
0.1
1.0
A
SHDN = V
IN
Minimum Supply Voltage
V
MIN
2.5
--
--
V
R
LOAD
= 1.0 k
Maximum Supply Voltage
V
MAX
--
--
4.0
V
R
LOAD
= 1.0 k
Oscillator Frequency
F
OSC
--
160
--
kHz
T
A
= -40C to +85C
Switching Frequency (Note 1)
F
SW
40
80
125
kHz
T
A
= -40C to +85C
Shutdown Input Logic High
V
IH
1.4
--
--
V
V
IN
= V
MIN
to V
MAX
Shutdown Input Logic Low
V
IL
--
--
0.4
V
V
IN
= V
MIN
to V
MAX
Power Efficiency
P
EFF
86
93
--
%
R
LOAD
= 1.0 k
Voltage Conversion Efficiency
V
EFF
97.5
99.96
--
%
R
LOAD
=
Output Resistance (Note 2)
R
OUT
--
--
17
--
--
30
R
LOAD
= 1.0 k
T
A
= -40C to +85C
Note 1:
Switching frequency is one-half internal oscillator frequency.
2:
Capacitor contribution is approximately 26% of the output impedance [ESR = 1 / switching frequency x
capacitance].
2003 Microchip Technology Inc.
DS21516C-page 3
TC1240/TC1240A
TC1240A ELECTRICAL SPECIFICATIONS
Electrical Specifications: Unless otherwise noted, typical values apply at T
A
= +25C. Minimum and maximum
values apply for T
A
= -40 to +85C, and V
IN
= +5.0V, C
1
= C
2
= 3.3 F, SHDN = GND.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Supply Current
I
DD
--
550
900
A
R
LOAD
=
Shutdown Supply Current
I
SHDN
--
0.01
1.0
A
SHDN = V
IN
Minimum Supply Voltage
V
MIN
2.5
--
--
V
Maximum Supply Voltage
V
MAX
--
--
5.5
V
Output Current
I
LOAD
20
--
--
mA
Sum of the R
DS(ON)
of the
internal MOSFET Switches
R
SW
--
4
8
I
LOAD
= 20 mA
Oscillator Frequency
F
OSC
--
160
--
kHz
T
A
= -40C to +85C
Switching Frequency (Note 1)
F
SW
40
80
125
kHz
T
A
= -40C to +85C
Shutdown Input Logic High
V
IH
1.4
--
--
V
V
IN
= V
MIN
to V
MAX
Shutdown Input Logic Low
V
IL
--
--
0.4
V
V
IN
= V
MIN
to V
MAX
Power Efficiency
P
EFF
86
94
--
%
I
LOAD
= 5 mA
Voltage Conversion Efficiency
V
EFF
99
99.96
--
%
R
LOAD
=
Output Resistance (Note 2)
R
OUT
--
--
12
--
--
25
I
LOAD
= 20 A
T
A
= -40C to +85C
Note 1:
Switching frequency is one-half internal oscillator frequency.
2:
Capacitor contribution is approximately 26% of the output impedance [ESR = 1 / switching frequency x
capacitance].
TC1240/TC1240A
DS21516C-page 4
2003 Microchip Technology Inc.
2.0
TYPICAL PERFORMANCE CURVES
Note: Unless otherwise indicated, typical values apply at T
A
= +25C.
FIGURE 2-1:
Supply Current vs. Supply
Voltage (No Load).
FIGURE 2-2:
Output Source Resistance
vs. Supply Voltage (with R
LOAD
= 1 k
)
FIGURE 2-3:
Output Voltage Drop vs.
Load Current.
FIGURE 2-4:
Supply Current vs.
Temperature (No Load).
FIGURE 2-5:
Output Source Resistance
vs. Temperature (with R
LOAD
= 1 k
).
FIGURE 2-6:
Power Efficiency vs. Load
Current.
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
700
600
500
400
300
200
100
0
2.00 3.00 4.00 5.00 6.00
SUPPL
Y CURRENT (
A)
SUPPLY VOLTAGE (V)
2.00 3.00 4.00 5.00 6.00
SUPPLY VOLTAGE (V)
20
15
10
5
0
OUTPUT SOURCE RESIST
ANCE (
)
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
V
O
L
T
DR
OP (V)
0 5 10 15 20 25 30 35 40 45 50
LOAD CURRENT (mA)
V
IN
= 4.0V
V
IN
= 2.8V
450
400
350
300
250
200
100
0
150
50
-50 -25 0 25 50 75 100 125
TEMPERATURE (
C)
SUPPL
Y CURRENT (
A)
V
IN
= 4.0V
V
IN
= 2.8V
25
20
15
10
5
0
-50 -25 0 25 50 75 100 125
TEMPERATURE (
C)
V
IN
= 2.8V
OUTPUT SOURCE RESIST
ANCE (
)
V
IN
= 4.0V
100%
90%
80%
70%
60%
50%
40%
0 5 10 15 20 25 30 35 40 45 50
PO
WER EFFICIENCY (%)
LOAD CURRENT (mA)
30%
20%
10%
0%
V
IN
= 2.5V
V
IN
= 3.5V
V
IN
= 4.5V
2003 Microchip Technology Inc.
DS21516C-page 5
TC1240/TC1240A
Note: Unless otherwise indicated, typical values apply at T
A
= +25C.
FIGURE 2-7:
Switching Frequency vs.
Temperature.
100
80
60
40
20
0
-50 -25 0 25 50 75 100 125
TEMPERATURE (
C)
V
IN
= 4.0V
SWITCHING FREQ
UENCY (kHz)
V
IN
= 2.8V
TC1240/TC1240A
DS21516C-page 6
2003 Microchip Technology Inc.
3.0
PIN DESCRIPTION
The description of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Pin No.
Symbol
Description
1
V
IN
Power supply input
2
GND
Ground
3
C-
Commutation capacitor negative terminal
4
SHDN
Shutdown input (active high)
5
V
OUT
Doubled output voltage
6
C+
Commutation capacitor positive terminal
2003 Microchip Technology Inc.
DS21516C-page 7
TC1240/TC1240A
4.0
DETAILED DESCRIPTION
The TC1240/TC1240A charge pump converter dou-
bles the voltage applied to the V
IN
pin. Conversion con-
sists of a two-phase operation (Figure 4-1). During the
first phase, switches S
2
and S
4
are open and S
1
and S
3
are closed. During this time, C
1
charges to the voltage
on V
IN
and load current is supplied from C
2
. During the
second phase, S
2
and S
4
are closed, while S
1
and S
3
are open.
During this second phase, C
1
is level-shifted upward by
V
IN
volts. This connects C
1
to the reservoir capacitor
C
2
, allowing energy to be delivered to the output as
needed. The actual voltage is slightly lower than 2 x V
IN
since the four switches (S
1
-S
4
) have an on-resistance
and the load drains charge from reservoir capacitor C
2
.
FIGURE 4-1:
Ideal Switched Capacitor
Charge Pump Doubler.
5.0
TYPICAL APPLICATIONS
5.1
Output Voltage Considerations
The TC1240/TC1240A performs voltage doubling but
does not provide regulation. The output voltage will
droop in a linear manner with respect to load current.
The value of this equivalent output resistance is approx-
imately 12
nominal at +25C and V
IN
= +5.0V for the
TC1240A and 17
nominal at +25C and V
IN
= +2.8V
for the TC1240. V
OUT
is approximately +10.0V at light
loads for the TC1240A and +5.6V for the TC1240, and
droops according to the equation below:
EQUATION
5.2
Charge Pump Efficiency
The overall power efficiency of the charge pump is
affected by four factors:
1.
Losses from power consumed by the internal
oscillator, switch drive, etc. (which vary with
input voltage, temperature and oscillator
frequency).
2.
I
2
R losses due to the on-resistance of the
MOSFET switches on-board the charge pump.
3.
Charge pump capacitor losses due to effective
series resistance (ESR).
4.
Losses that occur during charge transfer (from
commutation capacitor to the output capacitor)
when a voltage difference between the two
capacitors exist.
Most of the conversion losses are due to factors (2) and
(3) above. These losses are given by Equation 5-1.
EQUATION 5-1:
V
OUT
= 2 x V
IN
C1
C
2
TC1240/TC1240A
V
IN
S
1
S
3
S
4
S
2
OSC
V
IN
VOUT 2 VIN VDROOP
=
VDROOP
IOUT ROUT
=
a)
b)
P
LOSS(2,3)
I
OUT
2
R
OUT
=
R
OUT
1
F
SW
C
1
( )
----------------------
8R
SWITCH
4ESR
C1
ESR
C2
+
+
+
=
TC1240/TC1240A
DS21516C-page 8
2003 Microchip Technology Inc.
The switching frequency in Equation 5-1b is defined as
one-half the oscillator frequency (i.e., F
SW
= F
OSC
/2).
The 1/(F
SW
)(C
1
) term in Equation 5-1b is the effective
output resistance of an ideal switched capacitor circuit
(Figure 5-1 and Figure 5-2).
The output voltage ripple is given by Equation 5-2.
EQUATION 5-2:
FIGURE 5-1:
Ideal Switched Capacitor
Model.
FIGURE 5-2:
Equivalent Output
Resistance.
5.3
Capacitor Selection
In order to maintain the lowest output resistance and
output ripple voltage, it is recommended that low ESR
capacitors be used. Additionally, larger values of C
1
will
lower the output resistance and larger values of C
2
will
reduce output ripple (see Equation 5-1b).
Table 5-1 shows various values of C
1
and the
corresponding output resistance values @ +25C. It
assumes a 0.1
ESR
C1
and 0.9
R
SW
. Table 5-2
shows the output voltage ripple for various values of
C
2
. The V
RIPPLE
values assume 5mA output load
current and 0.1
ESR
C2
.
TABLE 5-1:
OUTPUT RESISTANCE
VS. C
1
(ESR = 0.1
)
TABLE 5-2:
OUTPUT VOLTAGE RIPPLE
VS. C
2
(ESR = 0.1
)
I
OUT
5 mA
VRIPPLE
IOUT
2 FSW
(
) C2
(
)
-------------------------------- 2 IOUT
(
) ESRC2
(
)
+
=
V+
V
OUT
R
L
C
2
C
1
f
F
SW
x C
1
1
V+
V
OUT
R
EQUIV
R
EQUIV
=
R
L
C
2
C
1
(F)
TC1240
R
OUT
(
)
TC1240A
R
OUT
(
)
0.47
47
35
1
28.5
20.5
2.2
19.5
14
3.3
17
12
4.7
15.5
10.5
10
13.6
9.3
47
12.5
8.3
100
12.2
8.1
C
1
(F)
TC1240/TC1240A
V
RIPPLE
(mV)
0.47
142
1
67
2.2
30
3.3
20
4.7
14
10
6.7
47
2.5
100
1.6
2003 Microchip Technology Inc.
DS21516C-page 9
TC1240/TC1240A
5.4
Input Supply Bypassing
The V
IN
input should be capacitively bypassed to
reduce AC impedance and minimize noise effects due
to the switching internal to the device. The
recommended capacitor should be a large value (at
least equal to C
1
) connected from the input to GND.
5.5
Shutdown Input
The TC1240 and TC1240A are disabled when SHDN is
high, and enabled when SHDN is low. This input cannot
be allowed to float.
FIGURE 5-3:
Test Circuit.
5.6
Voltage Doubler
The most common application for charge pump
devices is the doubler (Figure 5-3). This application
uses two external capacitors C
1
and C
2
(plus a power
supply bypass capacitor, if necessary). The output is
equal to 2 x V
IN
minus any voltage drops due to
loading. Refer to Table 5-1 and Table 5-2 for capacitor
selection.
3
1
2
4
5
C
3
C
1
C
2
V
IN
V
OUT
R
L
TC1240
TC1240A
C-
V
IN
OUT
C+
GND
SHDN
6
+
+
+
Device
C
1
C
2
C
3
TC1240
TC1240A
3.3 F
3.3 F
3.3 F
TC1240/TC1240A
DS21516C-page 10
2003 Microchip Technology Inc.
5.7
Cascading Devices
Two or more TC1240/TC1240As can be cascaded to
increase output voltage (Figure 5-4). If the output is
lightly loaded, it will be close to ((n + 1) x V
IN
), but will
droop at least by R
OUT
of the first device multiplied by
the I
Q
of the second. It can be seen that the output
resistance rises rapidly for multiple cascaded devices.
For the case of the two-stage `tripler', output resistance
can be approximated as R
OUT
= 2 x R
OUT1
+ R
OUT2
,
where R
OUT1
is the output resistance of the first stage
and R
OUT2
is the output resistance of the second stage.
5.8
Paralleling Devices
To reduce the value of R
OUT
, multiple TC1240/
TC1240As can be connected in parallel (Figure 5-5).
The output resistance will be reduced by a factor of N,
where N is the number of TC1240/TC1240As. Each
device will require its own pump capacitor (C1x), but all
devices may share one reservoir capacitor (C2).
However, to preserve ripple performance, the value of
C2 should be scaled according to the number of
paralled TC1240/TC1240As, respectively.
5.9
Layout Considerations
As with any switching power supply circuit good layout
practice is recommended. Mount components as close
together as possible to minimize stray inductance and
capacitance. Also use a large ground plane to minimize
noise leakage into other circuitry.
FIGURE 5-4:
Cascading Multiple Devices To Increase Output Voltage.
FIGURE 5-5:
Paralleling Multiple Devices To Reduce Output Resistance.
"n"
C+
GND
C-
OUT
3
2
5
1
6
TC1240
TC1240A
SHDN
4
V
IN
C+
GND
C-
OUT
C
1A
3
2
5
1
6
C
2B
V
IN
V
OUT
V
OUT
= (n + 1)V
IN
TC1240
TC1240A
SHDN
4
"1"
+
+
+
V
IN
C
1B
C
2A
+
C
1A
C
1B
6
4
2
3
2
5
1
1
5
3
C
2
V
OUT
V
OUT
= 2 x V
IN
R
OUT
=
R
OUT
OF SINGLE DEVICE
V
IN
NUMBER OF DEVICES
TC1240
TC1240A
TC1240
TC1240A
. . .
. . .
SHDN
SHDN
Shutdown
Control
4
6
V
IN
+
+
+
"1"
"n"
2003 Microchip Technology Inc.
DS21516C-page 11
TC1240/TC1240A
6.0
PACKAGING INFORMATION
6.1
Package Marking Information
Device
Code
TC1240
DN
TC1240A
EN
6
6-Pin SOT-23A
1
3
4
2
5
1
3
2
4
1
&
= part number code + temperature range
2
(two-digit code)
ex: 1240AECH =
E N
3
represents year and 2-month code
4
represents production lot ID code
TC1240/TC1240A
DS21516C-page 12
2003 Microchip Technology Inc.
6-Lead Plastic Small Outline Transistor (CH) (SOT-23)
10
5
0
10
5
0
Mold Draft Angle Bottom
10
5
0
10
5
0
Mold Draft Angle Top
0.50
0.43
0.35
.020
.017
.014
B
Lead Width
0.20
0.15
0.09
.008
.006
.004
c
Lead Thickness
10
5
0
10
5
0
Foot Angle
0.55
0.45
0.35
.022
.018
.014
L
Foot Length
3.10
2.95
2.80
.122
.116
.110
D
Overall Length
1.75
1.63
1.50
.069
.064
.059
E1
Molded Package Width
3.00
2.80
2.60
.118
.110
.102
E
Overall Width
0.15
0.08
0.00
.006
.003
.000
A1
Standoff
1.30
1.10
0.90
.051
.043
.035
A2
Molded Package Thickness
1.45
1.18
0.90
.057
.046
.035
A
Overall Height
1.90
.075
p1
Outside lead pitch (basic)
0.95
.038
p
Pitch
6
6
n
Number of Pins
MAX
NOM
MIN
MAX
NOM
MIN
Dimension Limits
MILLIMETERS
INCHES*
Units
1
D
B
n
E
E1
L
c
A2
A
A1
p1
exceed .005" (0.127mm) per side.
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
Notes:
JEITA (formerly EIAJ) equivalent: SC-74A
Drawing No. C04-120
*Controlling Parameter
2003 Microchip Technology Inc.
DS21516C-page 13
TC1240/TC1240A
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office
.
Sales and Support
PART NO.
X
/XX
Package
Temperature
Range
Device
Device
TC1240:
Positive Doubling Charge Pump with Shutdown
TC1240A
Positive Doubling Charge Pump with Shutdown
Temperature Range
I
= -40
C to +85C (Industrial)
Package
CHTR: =
6L SOT-23, Tape and Reel
Examples:
a)
TC1240ECHTR: Tape and Reel, 6L SOT-23
(EIAJ)
b)
TC1240AECHTR: Tape and Reel, 6L SOT-23
(EIAJ)
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and
recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1.
Your local Microchip sales office
2.
The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
3.
The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
TC1240/TC1240A
DS21516C-page 14
2003 Microchip Technology Inc.
NOTES:
2003 Microchip Technology Inc.
DS21516C-page 15
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip's products as critical
components in life support systems is not authorized except
with express written approval by Microchip. No licenses are
conveyed, implicitly or otherwise, under any intellectual
property rights.
Trademarks
The Microchip name and logo, the Microchip logo, K
EE
L
OQ
,
MPLAB, PIC, PICmicro, PICSTART, PRO MATE and
PowerSmart are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL
and The Embedded Control Solutions Company are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Accuron, Application Maestro, dsPIC, dsPICDEM,
dsPICDEM.net, ECONOMONITOR, FanSense, FlexROM,
fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC,
microPort, Migratable Memory, MPASM, MPLIB, MPLINK,
MPSIM, PICC, PICkit, PICDEM, PICDEM.net, PowerCal,
PowerInfo, PowerMate, PowerTool, rfLAB, rfPIC, Select
Mode, SmartSensor, SmartShunt, SmartTel and Total
Endurance are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
Serialized Quick Turn Programming (SQTP) is a service mark
of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
2003, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as "unbreakable."
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received QS-9000 quality system
certification for its worldwide headquarters,
design and wafer fabrication facilities in
Chandler and Tempe, Arizona in July 1999
and Mountain View, California in March 2002.
The Company's quality system processes and
procedures are QS-9000 compliant for its
PICmicro
8-bit MCUs, K
EE
L
OQ
code hopping
devices, Serial EEPROMs, microperipherals,
non-volatile memory and analog products. In
addition, Microchip's quality system for the
design and manufacture of development
systems is ISO 9001 certified.
DS21516C-page 16
2003 Microchip Technology Inc.
M
AMERICAS
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200 Fax: 480-792-7277
Technical Support: 480-792-7627
Web Address: http://www.microchip.com
Atlanta
3780 Mansell Road, Suite 130
Alpharetta, GA 30022
Tel: 770-640-0034 Fax: 770-640-0307
Boston
2 Lan Drive, Suite 120
Westford, MA 01886
Tel: 978-692-3848 Fax: 978-692-3821
Chicago
333 Pierce Road, Suite 180
Itasca, IL 60143
Tel: 630-285-0071 Fax: 630-285-0075
Dallas
4570 Westgrove Drive, Suite 160
Addison, TX 75001
Tel: 972-818-7423 Fax: 972-818-2924
Detroit
Tri-Atria Office Building
32255 Northwestern Highway, Suite 190
Farmington Hills, MI 48334
Tel: 248-538-2250 Fax: 248-538-2260
Kokomo
2767 S. Albright Road
Kokomo, IN 46902
Tel: 765-864-8360 Fax: 765-864-8387
Los Angeles
18201 Von Karman, Suite 1090
Irvine, CA 92612
Tel: 949-263-1888 Fax: 949-263-1338
Phoenix
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7966 Fax: 480-792-4338
San Jose
Microchip Technology Inc.
2107 North First Street, Suite 590
San Jose, CA 95131
Tel: 408-436-7950 Fax: 408-436-7955
Toronto
6285 Northam Drive, Suite 108
Mississauga, Ontario L4V 1X5, Canada
Tel: 905-673-0699 Fax: 905-673-6509
ASIA/PACIFIC
Australia
Microchip Technology Australia Pty Ltd
Marketing Support Division
Suite 22, 41 Rawson Street
Epping 2121, NSW
Australia
Tel: 61-2-9868-6733 Fax: 61-2-9868-6755
China - Beijing
Microchip Technology Consulting (Shanghai)
Co., Ltd., Beijing Liaison Office
Unit 915
Bei Hai Wan Tai Bldg.
No. 6 Chaoyangmen Beidajie
Beijing, 100027, No. China
Tel: 86-10-85282100 Fax: 86-10-85282104
China - Chengdu
Microchip Technology Consulting (Shanghai)
Co., Ltd., Chengdu Liaison Office
Rm. 2401-2402, 24th Floor,
Ming Xing Financial Tower
No. 88 TIDU Street
Chengdu 610016, China
Tel: 86-28-86766200 Fax: 86-28-86766599
China - Fuzhou
Microchip Technology Consulting (Shanghai)
Co., Ltd., Fuzhou Liaison Office
Unit 28F, World Trade Plaza
No. 71 Wusi Road
Fuzhou 350001, China
Tel: 86-591-7503506 Fax: 86-591-7503521
China - Hong Kong SAR
Microchip Technology Hongkong Ltd.
Unit 901-6, Tower 2, Metroplaza
223 Hing Fong Road
Kwai Fong, N.T., Hong Kong
Tel: 852-2401-1200 Fax: 852-2401-3431
China - Shanghai
Microchip Technology Consulting (Shanghai)
Co., Ltd.
Room 701, Bldg. B
Far East International Plaza
No. 317 Xian Xia Road
Shanghai, 200051
Tel: 86-21-6275-5700 Fax: 86-21-6275-5060
China - Shenzhen
Microchip Technology Consulting (Shanghai)
Co., Ltd., Shenzhen Liaison Office
Rm. 1812, 18/F, Building A, United Plaza
No. 5022 Binhe Road, Futian District
Shenzhen 518033, China
Tel: 86-755-82901380 Fax: 86-755-82966626
China - Qingdao
Rm. B505A, Fullhope Plaza,
No. 12 Hong Kong Central Rd.
Qingdao 266071, China
Tel: 86-532-5027355 Fax: 86-532-5027205
India
Microchip Technology Inc.
India Liaison Office
Marketing Support Division
Divyasree Chambers
1 Floor, Wing A (A3/A4)
No. 11, O'Shaugnessey Road
Bangalore, 560 025, India
Tel: 91-80-2290061 Fax: 91-80-2290062
Japan
Microchip Technology Japan K.K.
Benex S-1 6F
3-18-20, Shinyokohama
Kohoku-Ku, Yokohama-shi
Kanagawa, 222-0033, Japan
Tel: 81-45-471- 6166 Fax: 81-45-471-6122
Korea
Microchip Technology Korea
168-1, Youngbo Bldg. 3 Floor
Samsung-Dong, Kangnam-Ku
Seoul, Korea 135-882
Tel: 82-2-554-7200 Fax: 82-2-558-5934
Singapore
Microchip Technology Singapore Pte Ltd.
200 Middle Road
#07-02 Prime Centre
Singapore, 188980
Tel: 65-6334-8870 Fax: 65-6334-8850
Taiwan
Microchip Technology (Barbados) Inc.,
Taiwan Branch
11F-3, No. 207
Tung Hua North Road
Taipei, 105, Taiwan
Tel: 886-2-2717-7175 Fax: 886-2-2545-0139
EUROPE
Austria
Microchip Technology Austria GmbH
Durisolstrasse 2
A-4600 Wels
Austria
Tel: 43-7242-2244-399
Fax: 43-7242-2244-393
Denmark
Microchip Technology Nordic ApS
Regus Business Centre
Lautrup hoj 1-3
Ballerup DK-2750 Denmark
Tel: 45-4420-9895 Fax: 45-4420-9910
France
Microchip Technology SARL
Parc d'Activite du Moulin de Massy
43 Rue du Saule Trapu
Batiment A - ler Etage
91300 Massy, France
Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79
Germany
Microchip Technology GmbH
Steinheilstrasse 10
D-85737 Ismaning, Germany
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Italy
Microchip Technology SRL
Via Quasimodo, 12
20025 Legnano (MI)
Milan, Italy
Tel: 39-0331-742611 Fax: 39-0331-466781
United Kingdom
Microchip Ltd.
505 Eskdale Road
Winnersh Triangle
Wokingham
Berkshire, England RG41 5TU
Tel: 44-118-921-5869 Fax: 44-118-921-5820
03/25/03
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