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Электронный компонент: 53252-102

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Micropac Industries cannot assume any responsibility for any circuits shown or represent that they are free from patent infringement.
Micropac reserves the right to make changes at any time in order to improve design and to supply the best product possible.
MICROPAC INDUSTRIES, INC. MICROCIRCUITS DIVISION
905 E. Walnut St., Garland, TX 75040 (972) 272-3571 Fax (972) 494-2281
www.micropac.com
E-MAIL:
hybridsales@micropac.com
6/9/03
Pg. 1 of 6
53252
90V - 0.8A DUAL POWER
MOSFET OPTOCOUPLERS
DSCC DWG #5962-03247
Mii
MICROCIRCUITS DIVISION

Features:
8-Pin Dual-In-Line Hermetic Package
Performance over 55C to +125C
Compact Isolation Solid State Switches
Continuous Output Current: 0.8 A
(1)
Optically Coupled between Input and Output
Isolation Tested to 1000 VDC
High Level of Transient Immunity
3 A Output Surge Current
Shock and Vibration Resistant
MIL-PRF-38534 screening optional

Applications:
Military/High Reliability Systems
Standard 28 VDC and 48 VDC Load Driver
Aircraft Controls
Electromechanical and Solid State Relay
Replacement
I/O Modules
Switching Heaters

DESCRIPTION

The 53252 is two power MOSFET optocouplers in a single 8-pin dual-in-line package suitable for applications
where two independent switches are required. The popular hermetic eight-pin dual-in-line ceramic package
combined with 1000 VDC isolation between input and output and between two isolated relays, makes this device
ideal for solid-state relay applications. Performance is specified over the full military temperature range. This device
is available in a variety of quality levels from COTS to class H including any custom screening requirements. Gold
plated leads are standard, but other lead finishes per MIL-PRF-38534 are also available.

Functionally, the device operates as two SPST, normally open (2 Form "A") solid-state relays. Each relay is
actuated by an input current, which can be driven from a standard TTL device. The input current biases a light
emitting diode that is optically coupled to an integrated photovoltaic diode array. The photovoltaic diode array
energizes control circuitry that operates the output MOSFET.













53252
90VDC 0.8A Dual Power MOSFET Optocouplers
DSCC DWG# 5962-03247
Micropac Industries cannot assume any responsibility for any circuits shown or represent that they are free from patent infringement.
Micropac reserves the right to make changes at any time in order to improve design and to supply the best product possible.
MICROPAC INDUSTRIES, INC. MICROCIRCUITS DIVISION
905 E. Walnut St., Garland, TX 75040 (972) 272-3571 Fax (972) 494-2281
www.micropac.com
E-MAIL:
hybridsales@micropac.com
6/9/03
Pg. 2 of 6
ABSOLUTE MAXIMUM RATINGS:
(Per relay unless otherwise noted)

Storage Temperature Range .............................................................................................. -65C to +150C
Operating Ambient Temperature - T
A
................................................................................... -55C to +125C
Junction Temperature - T
J
................................................................................................................ +150C
Lead Solder Temperature for 10 seconds ............................................................................................ +260C
(1.6 mm below seating plane)
Average Input Current - I
F
................................................................................................................. 20 mA
Peak Repetitive Input Current - I
Fpk
.................................................................................................... 40 mA
(pulse width < 100 ms; duty cycle < 50%)
Peak Surge Input Current - I
Fpk
surge .............................................................................................. 100 mA
(pulse width < 0.2 ms; duty cycle < 0.1%)
Continuous Output Current per relay - I
O
............................................................................................ 0.8 A
(1)
Single Shot Output Current per relay- I
Opk
surge (pulse width < 10 ms) ....................................................... 3 A
Output Voltage - V
O
........................................................................................................................ 90 VDC




RECOMMENDED OPERATING CONDITIONS:

Parameter Symbol
Min.
Max.
Units
Input Current (ON)
I
F (ON)
10 20 mA
Input Voltage (OFF)
V
F (OFF)
0 0.6 VDC
Operating Temperature
T
A
-55
+125 C

53252
90VDC 0.8A Dual Power MOSFET Optocouplers
DSCC DWG# 5962-03247
Micropac Industries cannot assume any responsibility for any circuits shown or represent that they are free from patent infringement.
Micropac reserves the right to make changes at any time in order to improve design and to supply the best product possible.
MICROPAC INDUSTRIES, INC. MICROCIRCUITS DIVISION
905 E. Walnut St., Garland, TX 75040 (972) 272-3571 Fax (972) 494-2281
www.micropac.com
E-MAIL:
hybridsales@micropac.com
6/9/03
Pg. 3 of 6
ELECTRICAL SPECIFICATIONS
Limits
Test
Symbol
Conditions
-55C
T
A
+125C
unless otherwise specified.
Group A
subgroups
Device
type
Min
Max
Unit
Output Withstand Voltage
V
O(OFF)
V
FOFF
= 0.6 V, I
O
= 10
A
1, 2, 3
All
90
V
Output On-Resistance 2/
R
(ON)
I
FON
= 10 mA, I
O
= 800 mA,
pulse duration
30 ms,
duty cycles < 10%
1, 2, 3
All
1.2
Output Leakage Current
I
O (OFF)
V
FOFF
= 0.6 V, V
O
= 90 V
1, 2, 3
All
10
A
Input Forward Voltage
V
FOFF
I
FON
= 10 mA
1, 2, 3
All
1.0
1.7
V
Input Reverse Breakdown Voltage
V
R
I
R
= 10
A
1, 2, 3
All
5.0
V
Input-Output Isolation Current 3/
I
I-O
V
I-O
= 1000 V dc, t = 5 s,
RH
45%, T
A
= +25C
1, 2, 3
All
1.0
A
Channel-Channel Isolation Current 3/
I
ISO
V
ISO
= 1000 V dc, t = 5 s,
RH
45%, T
A
= +25C
1, 2, 3
All
1.0
A
Turn-On Time 2/
t
ON
I
FON
= 10 mA, I
O
= 800 mA,
Pulse duration
30 ms,
duty cycles < 10%
1, 2, 3
All
6.0
ms
Turn-Off time 2/
t
OFF
I
FON
= 10 mA, I
O
= 800 mA,
pulse duration
30 ms,
duty cycles < 10%
1, 2, 3
All
2.0
ms

Notes:

1.
Maximum average current rating where the case temperature (T
C
) is maintained below 120C.
2.
During the pulsed R
ON
measurement (I
O
duration < 30 ms), ambient (T
A
) and case temperature (T
C
) are equal.
3.
This is a momentary withstand test, not a continuous operating condition.
4.
Typical junction to case thermal resistance (
JC
) for the device is 15C/W, where case temperature (T
C
) is measured at the center of the
package bottom.


CAUTION:
Care should be taken not to exceed the maximum output power dissipation, maximum case temperature, and maximum junction temperature
when repetitively switching loads.
53252
90VDC 0.8A Dual Power MOSFET Optocouplers
DSCC DWG# 5962-03247
Micropac Industries cannot assume any responsibility for any circuits shown or represent that they are free from patent infringement.
Micropac reserves the right to make changes at any time in order to improve design and to supply the best product possible.
MICROPAC INDUSTRIES, INC. MICROCIRCUITS DIVISION
905 E. Walnut St., Garland, TX 75040 (972) 272-3571 Fax (972) 494-2281
www.micropac.com
E-MAIL:
hybridsales@micropac.com
6/9/03
Pg. 4 of 6
Case outlines
X, Y
Terminal number
Terminal symbol
1
2
3
4
5
6
7
8
+ IN 1
- IN 1
- OUT 2
+ OUT 2
+ IN 2
- IN 2
- OUT 1
+ OUT 1


4
3
2
1
5
6
7
8
FIGURE 2. Terminal connections.



Input
Output
OFF OFF
ON ON
FIGURE 3. Truth table(s).
53252
90VDC 0.8A Dual Power MOSFET Optocouplers
DSCC DWG# 5962-03247
Micropac Industries cannot assume any responsibility for any circuits shown or represent that they are free from patent infringement.
Micropac reserves the right to make changes at any time in order to improve design and to supply the best product possible.
MICROPAC INDUSTRIES, INC. MICROCIRCUITS DIVISION
905 E. Walnut St., Garland, TX 75040 (972) 272-3571 Fax (972) 494-2281
www.micropac.com
E-MAIL:
hybridsales@micropac.com
6/9/03
Pg. 5 of 6
Case outline X
S
D
e
b
A
A1
L
E
E1
5
0
SEATING
PLANE
C
BASE
PLANE
Millimeters
Inches
Symbol
Min
Max
Min
Max
A 6.99 .275
A1 1.40 1.65 .055 .065
b 0.41 0.53 .016 .021
c 0.18 0.33 .007 .013
D 9.40 9.91 .370 .390
e 2.29 2.79 .090 .110
E 9.65 9.91 .380 .390
E1 8.13 .320
L 1.07 1.32 .042 .052
S 0.89 1.27 .035 .050

Case outline Y
S
e
D
A
b
eA
E
Q
BASE
PLANE
SETTING
PLANE
A1
C
L
Millimeters
Inches
Symbol
Min
Max
Min
Max
A 6.60 .260
A1 0.76 1.27 .030 .050
b 0.41 0.53 .016 .021
c 0.18 0.33 .007 .013
D 9.40 9.91 .370 .390
e 2.29 2.79 .090 .110
E 8.13 .320
eA 7.37 7.87 .290 .310
L
12.70
.500
Q 0.51 .020
S 0.89 1.27 .035 .050

NOTES:
1. The U.S. government preferred system of measurement is the metric SI. This item was designed using inch-pound units of measurement.
In case of problems involving conflicts between the metric and in-pound units, the inch-pound units shall rule.
2.
Pin 1 is indicated by the ESD triangle(s) marked on top of the package.