Microsemi
Microwave Products Division
75 Technology Drive, Lowell, MA. 01851, 978-442-5600, Fax: 978-937-3748
Page 1
Copyright
2000
MSC
1618.PDF 2000-11-06
WWW.
M
i
cr
o
sem
i
.
COM
LSP1000 thru LSP1012
ENHANCED PERFORMANCE
SURFACE MOUNT "EPSM" PACKAGED
DEVICES
PRODUCT PREVIEW
M I C R O W A V E P R O D U C T S D I V I S I O N
DESCRIPTION
Our EPSM packaged devices are designed for the most demanding
commercial and Military requirements where the inconsistency of
performance inherent in plastic surface mount packages cannot be
tolerated. These package styles extend the surface mount construction
format to 6 GHz for high performance wireless applications including
VCO's, limiters, pin switches and pin attenuators. Select PIN diodes for
switching, attenuation or limiting through 6 GHz. They are available in
multiple chip configuration as well as outlines which directly replace SOT-
23 and SOD-323 devices. Other devices and values are always available -
contact our applications engineering department for more details.
IMPORTANT:
For the most current data, consult
MICROSEMI
's website: http://www.microsemi.com
PIN DIODE DEVICES FOR WIRELESS ATTENUATORS,
SWITCHES AND LIMITERS
ABSOLUTE MAXIMUM RATINGS AT 25
C
Forward Current (I
F
):
1 Amp (1
s Pulse)
Power Dissipation (P
D
): 500
mW
(Derate to 0 at max T
J
)
Peak Inverse Volts (PIV):
Same as V
B
Junction Temp. (Operating):
-65
C to + 125
C
Storage Temp. (Non-Operating): -65
C to + 125
C
Leakage:
<50 nA @ 80
%
%
%
%
V
B
@ 25
C
TEST
CONDITIONS:
V
B
@ 10
A R
S
@ 100 MHz
C
T
@ 1 MHz
T
L
@ I
F
= 10 mA
I
R
= 6 mA
K E Y F E A T U R E S
K E Y F E A T U R E S
K E Y F E A T U R E S
K E Y F E A T U R E S
!"
Frequencies from VHF to 6
GHz
!"
Lower Parasitics
!"
Mil Grade Ceramic/Epoxy
Amalgam Construction
!"
Dense SiO2 Junction
Passivation
!"
Superior
Consistency/Repeatability
!"
Footprints Available for
SOT-23/SOD-323/SOD-123
!"
Priced for Commercial
Products
!"
Tape & Reel for Volume
Pick & Place
APPLICATIONS/BENEFIT
APPLICATIONS/BENEFIT
APPLICATIONS/BENEFIT
APPLICATIONS/BENEFITS
S
S
S
!"
High performance wireless
surface
mounting
including:
!"
GSM
!"
TAGS
!"
WANS
!"
PCS
!"
AMPS
!"
DECT
!"
CELLULAR
L
L
S
S
P
P
1
1
0
0
0
0
0
0
t
t
h
h
r
r
u
u
L
L
S
S
P
P
1
1
0
0
1
1
2
2
TABLE 1
MODEL
VB
CT @ V
R
MAX.
RS @ IF
MAX.
TL
TYP.
APPLIC
-TION
LSP1000
> 35
.28 @ 5V
2.5
@
5 mA
80nS SWITCH
LSP1002
> 100
.32 @
50V
4
@
100 mA
1500nS
ATTENU-
ATOR
LSP1004
> 35
.75 @
20V
0.6
@
10 mA
150nS
SWITCH
LSP1011
> 200V
.35 @
50V
2
@
100 mA
2000nS
ATTENU-
ATOR
LSP1012
> 20V
.35pF @
10V
1.8
@
10 mA
5nS
LIMITER
Microsemi
Microwave Products Division
75 Technology Drive, Lowell, MA. 01851, 978-442-5600, Fax: 978-937-3748
Page 2
Copyright
2000
MSC
1618.PDF 2000-11-06
WWW.
M
i
cr
o
sem
i
.
COM
LSP1000 thru LSP1012
ENHANCED PERFORMANCE
SURFACE MOUNT "EPSM" PACKAGED
DEVICES
PRODUCT PREVIEW
M I C R O W A V E P R O D U C T S D I V I S I O N
P
P
A
A
C
C
K
K
A
A
G
G
E
E
D
D
A
A
T
T
A
A
EPSM AVAILABLE CONFIGURATIONS
Figure 1 Outline Style 150(X)
Figure 2 Outline Style 154
Figure 3 Outline Style 250(X)
Figure 4 Outline Style 254
Figure 5 Outline Style 350(X)
Figure 6 Outline Style 252A
Microsemi
Microwave Products Division
75 Technology Drive, Lowell, MA. 01851, 978-442-5600, Fax: 978-937-3748
Page 3
Copyright
2000
MSC
1618.PDF 2000-11-06
WWW.
M
i
cr
o
sem
i
.
COM
LSP1000 thru LSP1012
ENHANCED PERFORMANCE
SURFACE MOUNT "EPSM" PACKAGED
DEVICES
PRODUCT PREVIEW
M I C R O W A V E P R O D U C T S D I V I S I O N
N
N
O
O
T
T
E
E
S
S
PDF 
ZIP