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Электронный компонент: MC2006

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Product Data Sheet_01
April 2002
Product Data Sheet
MC2006
CMOS Pre-amplifier with AGC for Long-reach 155 Mbps
Fiber-optics Based Receiver
Data Sheet
Features
Description
Applications
Pin Descriptions
Measurement Tables
Functional Description
Features
Description
Applications
Pin Descriptions
Measurement Tables
Functional Description
Information provided in this Product Data Sheet is subject to change without notice.
MindspeedTM Technologies, Inc, Proprietary and Confidential
Product Data Sheet _01
Page 2 of 12
MC2006
CMOS Pre-amplifier with AGC for Long-reach 155 Mbps Fiber-optics Based Receiver
Product Data Sheet
Information provided in this Product Data Sheet is subject to change without notice.
MindspeedTM Technologies, Proprietary and Confidential
T
ABLE
OF
C
ONTENTS
Features ...........................................................................................................................................................3
Applications ......................................................................................................................................................3
Connections (diagram) .....................................................................................................................................3
Description ........................................................................................................................................................3
Table 1 Ordering Information ............................................................................................................................3
Top Level Diagram ...........................................................................................................................................3
Table 2 Pin Description ....................................................................................................................................4
Table 3 Absolute Maximum Ratings .................................................................................................................4
Table 4 DC Characteristics ...............................................................................................................................4
Table 5 AC Characteristics ...............................................................................................................................5
Typical Performance Curves ............................................................................................................................6
Functional Block Diagram .................................................................................................................................7
Functional Description ......................................................................................................................................7
TZA ...................................................................................................................................................................7
AGC ..................................................................................................................................................................7
Output Stage .....................................................................................................................................................7
Typical Applications Circuit ...............................................................................................................................8
Applications Information ...................................................................................................................................8
Typical TO-can Assembly .................................................................................................................................8
Bare Die Information (diagram) .........................................................................................................................9
Table 6 Pad Co-ordinates .................................................................................................................................9
Package Information (diagram) .........................................................................................................................10
Disclaimer .........................................................................................................................................................11
World Wide Sales Offices..................................................................................................................................12
Product Data Sheet _01
Page 3 of 12
MC2006
CMOS Pre-amplifier with AGC for Long-reach 155 Mbps Fiber-optics Based Receiver
Product Data Sheet
Information provided in this Product Data Sheet is subject to change without notice.
MindspeedTM Technologies, Proprietary and Confidential
F
EATURES
Low-cost IC, fabricated in advanced sub-micron pure-
CMOS process
Receiver sensitivity typically -40 dBm at 155 Mbps, when
integrated into a module with suitable photodiode and
post-amplifier
115 MHz bandwidth allows wide range of operation;
suitable for e.g. 51 Mbps/DS-3, 100, 125 and 155 Mbps
Typical differential gain of 200 k
at low signal levels
AGC gives continuous operation to >0 dBm
65 mW power consumption at +5 V supply
> 35 dB Power-supply noise rejection
Available as die
Also available in SOIC8 package for evaluation purposes
only
A
PPLICATIONS
SDH/SONET/ATM
Fast Ethernet
C
ONNECTIONS
D
ESCRIPTION
The MC2006 is a low-noise, transimpedance amplifier
with AGC, manufactured in an advanced, yet low-cost,
sub-micron CMOS process. Its wide dynamic range,
differential output and high PIN bias make it well suited for
telecommunications, especially OC-3/STM-1. However,
the MC2006 is intended to meet the needs of both
Telecom and Datacom users.
The MC2006 is available in die packaged form. For
optimum system performance die should be mounted in
close proximity with the photodetector. The MC2006 is
also available in SOIC8 package in sample quantities to
ease customer evaluation.
The MC2006 is designed to be used with the Microcosm
MC2045 postamplifier IC. When combined with a
photodiode, the chip set forms a high performance, low
cost 5 V receiver.
T
ABLE
1
O
RDERING
I
NFORMATION
T
OP
L
EVEL
D
IAGRAM
1
2
3
4
8
7
6
5
MC2006
Date Code
D
OUT
V
CC
V
CC
PIN K
PIN A
D
OUT
Gnd
Gnd
SO8 Package
S
am
pl
es
O
nl
y
Fig. 1
Part
Pin-package
MC2006DIE
Waffle pack
MC2006DIE
Expanded whole wafer on a ring
MC2006S8
SOIC8 (Evaluation samples only)
MC2045-P6-EVM
Evaluation board with an
MC2045-2Y and an MC2006S8
V
CC
D
OUT
GND
PINK
PINA
GND
V
CC
D
OUT
Fig. 2
Product Data Sheet _01
Page 4 of 12
MC2006
CMOS Pre-amplifier with AGC for Long-reach 155 Mbps Fiber-optics Based Receiver
Product Data Sheet
Information provided in this Product Data Sheet is subject to change without notice.
MindspeedTM Technologies, Proprietary and Confidential
T
ABLE
2
P
IN
D
ESCRIPTION
T
ABLE
3
A
BSOLUTE
M
AXIMUM
R
ATINGS
These are the absolute maximum ratings at or beyond which the IC can be expected to fail or be damaged.
Reliable operation at these extremes for any length of time is not implied.
T
ABLE
4
DC C
HARACTERISTICS
Die Pad No
Pin Number
Name
Function
1, 8
6, 7
GND
Ground pin. Connect to the most negative supply, Both pins should be used
2
8
D
OUT
Non-inverted data output. Differential output with D
OUT
(goes high as light
increases)
3, 6
1, 4
V
CC
Power pin. Connect to most positive supply. Either or both pins may be used
4
2
PINK
PIN cathode connection. Connect between this pin and PINA. Connect a
decoupling capacitor to ground
5
3
PINA
PIN anode connection. Connect between this pin and PINK
7
5
D
OUT
Inverted data output. Differential output with D
OUT
Symbol
Parameter
Rating
Units
V
CC
Power supply (V
CC
-GND)
6
V
T
A
Operating ambient (SOIC8)
-40 to +85
C
T
STG
Storage temperature
-65 to +150
C
Symbol
Parameter
Min.
Typ.
Max.
Units
V
B
PIN bias voltage (PINK - PINA)
2
2.3
2.6
V
V
CM
Common mode output voltage
-
V
CC
/2
-
V
I
CC
Supply current (no loads)
-
-
35
mA
Product Data Sheet _01
Page 5 of 12
MC2006
CMOS Pre-amplifier with AGC for Long-reach 155 Mbps Fiber-optics Based Receiver
Product Data Sheet
Information provided in this Product Data Sheet is subject to change without notice.
MindspeedTM Technologies, Proprietary and Confidential
T
ABLE
5
AC C
HARACTERISTICS
NOTE:
(1)
Measured with input capacitance, C
IN
= 0.7 pF
(2)
Assuming photodiode response of 0.9 A/W, extinction ratio of 10 dB and BER of 10
-10
(3)
The 2006 is designed to drive a load >500
. Measurements are taken into high Z.
(4)
Measured at 10 MHz.
(5)
Input level 2
App
Symbol
Parameter
Min.
Typ.
Max.
Units
R
OUT
Output impedance (single ended)
-
35
-
I
NOISE
Input noise current
(1), (2)
-
7.5
12
nA
rms
Pin(mean), Min.
Optical sensitivity
(1), (2)
-37
-
-40
dBm
I
MAX
Input overload current
2.2
4.5
-
mApp
Pin(mean), Max.
Optical saturation
(2)
-
+3
-
dBm
G
Small signal transimpedance
(3), (4), (5)
Single ended :
Differential :
-
-
110
-
130
260
k
V
D
Differential output voltage
(3)
-
-
800
mV
BW
Bandwidth to -3 dB point (electrical)
100
-
-
MHz
T
r
T
f
Data out rise/fall times (20% - 80% points)
-
-
2
ns
T
PWD
Pulse width distortion
(5)
-
-
1
%
OS
PULSE
Pulse overshoot
(5)
-
-
3
%
T
AGC
AGC setting time
-
-
100
s
OS
AGC
AGC overshoot
-
-
12
%
PSRR
Power supply rejection ratio (<4 MHz)
40
-
-
dB