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Электронный компонент: CM300DU-24F

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Aug. 1999
CM300DU-24F
G1
E1
E2
G2
C1
E2
C2E1
RTC
RTC
CIRCUIT DIAGRAM
3-M6 NUTS
Tc measured point
4-
6.5 MOUNTING HOLES
L A B E L
G1
G2
E2
E1
CM
C1
E2
C2E1
(8.25)
18.25
(18.5)
62
0.25
80
110
93
0.25
2.5
21.5
61
56
14
14
29
+1.0 0.5
18
7
18
7
18
14
21
8.5
7.5
2.8
4
0.5
0.5
0.5
0.5
4
25
25
APPLICATION
General purpose inverters & Servo controls, etc
MITSUBISHI IGBT MODULES
CM300DU-24F
HIGH POWER SWITCHING USE
I
C ...................................................................
300A
V
CES .........................................................
1200V
Insulated Type
2-elements in a pack
OUTLINE DRAWING & CIRCUIT DIAGRAM
Dimensions in mm
Aug. 1999
V
CE
= V
CES
, V
GE
= 0V
V
GE
= V
CES
, V
CE
= 0V
T
j
= 25
C
T
j
= 125
C
V
CC
= 600V, I
C
= 300A, V
GE
= 15V
V
CC
= 600V, I
C
= 300A
V
GE1
= V
GE2
= 15V
R
G
= 1.0
, Inductive load switching operation
I
E
= 300A
I
E
= 300A, V
GE
= 0V
IGBT part (1/2 module)
FWDi part (1/2 module)
Case to fin, Thermal compoundapplied
*2
(1/2 module)
Tc measured point is just under the chips
I
C
= 30mA, V
CE
= 10V
I
C
= 300A, V
GE
= 15V
V
CE
= 10V
V
GE
= 0V
1200
20
300
600
300
600
960
40 ~ +150
40 ~ +125
2500
3.5 ~ 4.5
3.5 ~ 4.5
580
MITSUBISHI IGBT MODULES
CM300DU-24F
HIGH POWER SWITCHING USE
V
V
W
C
C
V
N m
N m
g
A
A
1
40
2.4
--
120
5.1
3
--
300
80
500
300
250
--
3.2
0.13
0.18
--
0.065
V
3
10
mA
A
nF
nC
C
V
C/W
--
--
1.8
1.9
--
--
--
3300
--
--
--
--
--
17.6
--
--
--
0.02
--
--
--
--
--
--
--
--
--
--
--
--
--
--
--
--
--
--
--
--
--
1.0
6
V
V
ns
5
7
ns
Collector cutoff current
Gate leakage current
Input capacitance
Output capacitance
Reverse transfer capacitance
Total gate charge
Turn-on delay time
Turn-on rise time
Turn-off delay time
Turn-off fall time
Reverse recovery time
Reverse recovery charge
Emitter-collector voltage
Contact thermal resistance
Thermal resistance
External gate resistance
Gate-emitter threshold voltage
Collector-emitter saturation voltage
Thermal resistance
*1
I
CES
I
GES
C
ies
C
oes
C
res
Q
G
t
d(on)
t
r
t
d(off)
t
f
t
rr (Note 1)
Q
rr (Note 1)
V
EC(Note 1)
R
th(j-c)
Q
R
th(j-c)
R
R
th(c-f)
R
th(j-c')
Q
R
G
Symbol
Parameter
V
GE(th)
V
CE(sat)
Note 1. I
E
, V
EC
, t
rr
, Q
rr
, die/dt represent characteristics of the anti-parallel, emitter to collector free-wheel diode. (FWDi).
2. Pulse width and repetition rate should be such that the device junction temp. (T
j
) does not exceed T
jmax
rating.
3. Junction temperature (T
j
) should not increase beyond 150
C.
4. Pulse width and repetition rate should be such as to cause negligible temperature rise.
*
1 : Tc measured point is indicated in OUTLINE DRAWING.
*
2 : Typical value is measured by using Shin-etsu Silicone "G-746".
*
3 : If you use this value, R
th(f-a)
should be measured just under the chips.
Collector-emitter voltage
Gate-emitter voltage
Maximum collector dissipation
Junction temperature
Storage temperature
Isolation voltage
Weight
G-E Short
C-E Short
T
C
= 25
C
Pulse
(Note 2)
T
C
= 25
C
Pulse
(Note 2)
T
C
= 25
C
Main terminal to base plate, AC 1 min.
Main Terminal M6
Mounting holes M6
Typical value
Symbol
Parameter
Collector current
Emitter current
Torque strength
Conditions
Unit
Ratings
V
CES
V
GES
I
C
I
CM
I
E (Note 1)
I
EM (Note 1)
P
C (Note 3)
T
j
T
stg
V
iso
--
Unit
Typ.
Limits
Min.
Max.
--
MAXIMUM RATINGS
(Tj = 25
C)
ELECTRICAL CHARACTERISTICS
(Tj = 25
C)
Test conditions
Aug. 1999
MITSUBISHI IGBT MODULES
CM300DU-24F
HIGH POWER SWITCHING USE
V
GE
= 20V
T
j
= 25
C
15
11
10
9.5
9
8.5
8
600
400
200
500
300
100
0
0
0.5
1
1.5
2
2.5
3
3.5
4
3
2.5
2
1.5
0.5
1
0
0
200
400
600
T
j
= 25
C
T
j
= 125
C
V
GE
= 15V
10
1
10
2
2
3
5
7
10
3
2
3
5
7
0.5
1
1.5
2
2.5
3
3.5
T
j
= 25
C
5
4
3
2
1
0
20
6
8
12
16
10
14
18
I
C
= 600A
I
C
= 300A
I
C
= 120A
T
j
= 25
C
10
1
10
0
10
1
2
3
5
7
10
2
2
3
5
7
10
3
2
3
5
7
2
10
0
3
5 7
2
10
1
3
5 7
2
10
2
3
5 7
V
GE
= 0V
C
ies
C
oes
C
res
10
1
10
2
5
7
10
3
2
3
5
7
10
1
2
3
5
7
10
2
2
3
5
7
10
3
2
3
5
7
10
0
Conditions:
V
CC
= 600V
V
GE
=
15V
R
G
= 1
T
j
= 125
C
Inductive load
2
3
t
d(off)
t
d(on)
t
f
t
r
OUTPUT CHARACTERISTICS
(TYPICAL)
COLLECTOR CURRENT I
C
(A)
COLLECTOR-EMITTER VOLTAGE V
CE
(V)
COLLECTOR-EMITTER SATURATION
VOLTAGE CHARACTERISTICS
(TYPICAL)
COLLECTOR-EMITTER
SATURATION VOLTAGE V
CE (sat)
(V)
COLLECTOR CURRENT I
C
(A)
GATE-EMITTER VOLTAGE V
GE
(V)
FREE-WHEEL DIODE
FORWARD CHARACTERISTICS
(TYPICAL)
EMITTER CURRENT I
E
(A)
EMITTER-COLLECTOR VOLTAGE V
EC
(V)
CAPACITANCEV
CE
CHARACTERISTICS
(TYPICAL)
HALF-BRIDGE
SWITCHING CHARACTERISTICS
(TYPICAL)
CAPACITANCE C
ies
, C
oes
, C
res
(nF)
COLLECTOR-EMITTER VOLTAGE V
CE
(V)
COLLECTOR-EMITTER SATURATION
VOLTAGE CHARACTERISTICS
(TYPICAL)
COLLECTOR-EMITTER
SATURATION VOLTAGE V
CE (sat)
(V)
SWITCHING TIMES (ns)
COLLECTOR CURRENT I
C
(A)
PERFORMANCE CURVES
Aug. 1999
MITSUBISHI IGBT MODULES
CM300DU-24F
HIGH POWER SWITCHING USE
10
1
10
2
2
3
5
7
10
3
2
3
5
7
10
1
10
2
2
3
5
7
10
3
2
3
5
7
t
rr
I
rr
0
6
4
2
10
8
16
14
12
20
18
0
500
1500
2500
1000
2000
V
CC
= 400V
V
CC
= 600V
I
C
= 300A
10
1
10
3
10
5
10
4
10
0
7
5
3
2
10
2
7
5
3
2
10
1
7
5
3
2
7
5
3
2
10
3
2 3 5 7
2 3 5 7
2 3 5 7
2 3 5 7
10
1
10
2
10
1
10
0
10
3
10
3
7
5
3
2
10
2
7
5
3
2
10
1
3
2
2 3 5 7
2 3 5 7
Single Pulse
T
C
= 25
C
Conditions:
V
CC
= 600V
V
GE
=
15V
R
G
= 1.0
T
j
= 25
C
Inductive load
REVERSE RECOVERY CHARACTERISTICS
OF FREE-WHEEL DIODE
(TYPICAL)
EMITTER CURRENT I
E
(A)
TRANSIENT THERMAL
IMPEDANCE CHARACTERISTICS
(IGBT part & FWDi part)
NORMALIZED TRANSIENT
THERMAL IMPEDANCE Z
th (
jc)
(
C/W)
TMIE (s)
GATE CHARGE
CHARACTERISTICS
(TYPICAL)
GATE-EMITTER VOLTAGE V
GE
(V)
GATE CHARGE Q
G
(nC)
IGBT part:
Per unit base = R
th(jc)
= 0.13
C/ W
FWDi part:
Per unit base = R
th(jc)
= 0.15
C/ W
REVERSE RECOVERY TIME t
rr
(ns)
REVERSE RECOVERY CURRENT l
rr
(A)