MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
1
REV 0.1
Motorola, Inc. 1997
3/97
Advance Information
Hex 3-State Noninverting
Buffer with Separate 2-Bit
and 4-Bit Sections
HighPerformance SiliconGate CMOS
The MC74HC367A is identical in pinout to the LS367. The device inputs
are compatible with standard CMOS outputs; with pullup resistors, they are
compatible with LSTTL outputs.
This device is arranged into 2bit and 4bit sections, each having its own
activelow Output Enable. When either of the enables is high, the affected
buffer outputs are placed into highimpedance states. The HC367A has
noninverting outputs.
Output Drive Capability: 15 LSTTL Loads
Outputs Directly Interface to CMOS, NMOS, and TTL
Operating Voltage Range: 2 to 6 V
Low Input Current: 1
A
High Noise Immunity Characteristic of CMOS Devices
In Compliance with the Requirements Defined by JEDEC Standard
No. 7A
Chip Complexity: 92 FETs or 23 Equivalent Gates
LOGIC DIAGRAM
3
5
7
9
11
13
2
4
6
10
12
14
OUTPUT ENABLE 1
OUTPUT ENABLE 2
PIN 16 = VCC
PIN 8 = GND
Y5
Y4
Y3
Y2
Y1
Y0
A0
A1
A2
A3
A4
A5
1
15
This document contains information on a new product. Specifications and information herein are subject to
change without notice.
MC74HC367A
PIN ASSIGNMENT
13
14
15
16
9
10
11
12
5
4
3
2
1
8
7
6
A4
Y5
A5
OUTPUT
ENABLE 2
VCC
Y3
A3
Y4
A1
Y0
A0
OUTPUT
ENABLE 1
GND
Y2
A2
Y1
FUNCTION TABLE
Inputs
Output
Enable 1,
Enable 2
A
Y
L
L
L
L
H
H
H
X
Z
X = don't care
Z = high impedance
D SUFFIX
SOIC PACKAGE
16LEAD
CASE 751B05
N SUFFIX
PLASTIC PACKAGE
16LEAD
CASE 64808
ORDERING INFORMATION
MC74HCXXXAN
MC74HCXXXAD
MC74HCXXXADT
Plastic
SOIC
TSSOP
DT SUFFIX
TSSOP PACKAGE
16LEAD
CASE 948F01
MC74HC367A
MOTOROLA
HighSpeed CMOS Logic Data
DL129 -- Rev 6
2
MAXIMUM RATINGS*
Symbol
Parameter
Value
Unit
VCC
DC Supply Voltage (Referenced to GND)
0.5 to + 7.0
V
Vin
DC Input Voltage (Referenced to GND)
0.5 to VCC + 0.5
V
Vout
DC Output Voltage (Referenced to GND)
0.5 to VCC + 0.5
V
Iin
DC Input Current, per Pin
20
mA
Iout
DC Output Current, per Pin
25
mA
ICC
DC Supply Current, VCC and GND Pins
50
mA
PD
Power Dissipation in Still Air,
Plastic DIP
SOIC Package
TSSOP Package
750
500
450
mW
Tstg
Storage Temperature
65 to + 150
_
C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
Plastic DIP, SOIC or TSSOP Package
260
_
C
* Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
Derating -- Plastic DIP: 10 mW/
_
C from 65
_
to 125
_
C
SOIC Package: 7 mW/
_
C from 65
_
to 125
_
C
TSSOP Package: 6.1 mW/
_
C from 65
_
to 125
_
C
For high frequency or heavy load considerations, see Chapter 2 of the Motorola HighSpeed CMOS Data Book (DL129/D).
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
Max
Unit
VCC
DC Supply Voltage (Referenced to GND)
2.0
6.0
V
Vin, Vout
DC Input Voltage, Output Voltage (Referenced to GND)
0
VCC
V
TA
Operating Temperature, All Package Types
55
+ 125
_
C
tr, tf
Input Rise and Fall Time
VCC = 2.0 V
(Figure 1)
VCC = 4.5 V
VCC = 6.0 V
0
0
0
1000
500
400
ns
DC ELECTRICAL CHARACTERISTICS
(Voltages Referenced to GND)
S
b l
P
T
C
di i
V
Guaranteed Limit
U i
Symbol
Parameter
Test Conditions
VCC
V
55 to
25
_
C
v
85
_
C
v
125
_
C
Unit
VIH
Minimum HighLevel Input
Voltage
Vout = VCC 0.1 V
|Iout|
v
20
A
2.0
3.0
4.5
6.0
1.5
2.1
3.15
4.2
1.5
2.1
3.15
4.2
1.5
2.1
3.15
4.2
V
VIL
Maximum LowLevel Input
Voltage
Vout = 0.1 V
|Iout|
v
20
A
2.0
3.0
4.5
6.0
0.50
0.90
1.35
1.80
0.50
0.90
1.35
1.80
0.50
0.90
1.35
1.80
V
VOH
Minimum HighLevel Output
Voltage
Vin = VIH
|Iout|
v
20
A
2.0
4.5
6.0
1.9
4.4
5.9
1.9
4.4
5.9
1.9
4.4
5.9
V
Vin = VIH
|Iout|
v
3.6 mA
|Iout|
v
6.0 mA
|Iout|
v
7.8 mA
3.0
4.5
6.0
2.48
3.98
5.48
2.34
3.84
5.34
2.20
3.70
5.20
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this highimpedance cir-
cuit. For proper operation, Vin and
Vout should be constrained to the
range GND
v
(Vin or Vout)
v
VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.
MC74HC367A
HighSpeed CMOS Logic Data
DL129 -- Rev 6
3
MOTOROLA
DC ELECTRICAL CHARACTERISTICS
(Voltages Referenced to GND)
Unit
Guaranteed Limit
VCC
V
Test Conditions
Parameter
Symbol
Unit
v
125
_
C
v
85
_
C
55 to
25
_
C
VCC
V
Test Conditions
Parameter
Symbol
VOL
Maximum LowLevel Output
Voltage
Vin = VIL
|Iout|
v
20
A
2.0
4.5
6.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
V
Vin = VIL
|Iout|
v
3.6 mA
|Iout|
v
6.0 mA
|Iout|
v
7.8 mA
3.0
4.5
6.0
0.26
0.26
0.26
0.33
0.33
0.33
0.40
0.40
0.40
Iin
Maximum Input Leakage Current
Vin = VCC or GND
6.0
0.1
1.0
1.0
A
IOZ
Maximum ThreeState
Leakage Current
Output in HighImpedance State
Vin = VIL or VIH
Vout = VCC or GND
6.0
0.5
5.0
10
A
ICC
Maximum Quiescent Supply
Current (per Package)
Vin = VCC or GND
Iout = 0
A
6.0
4
40
160
A
NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola HighSpeed CMOS Data Book (DL129/D).
AC ELECTRICAL CHARACTERISTICS
(CL = 50 pF, Input tr = tf = 6 ns)
S
b l
P
V
Guaranteed Limit
U i
Symbol
Parameter
VCC
V
55 to
25
_
C
v
85
_
C
v
125
_
C
Unit
tPLH,
tPHL
Maximum Propagation Delay, Input A to Output Y
(Figures 1 and 3)
2.0
3.0
4.5
6.0
120
60
24
20
150
75
30
26
180
90
36
31
ns
tPLZ,
tPHZ
Maximum Propagation Delay, Output Enable to Output Y
(Figures 2 and 4)
2.0
3.0
4.5
6.0
175
90
35
30
220
110
44
37
265
135
53
45
ns
tPZL,
tPZH
Maximum Propagation Delay, Output Enable to Output Y
(Figures 2 and 4)
2.0
3.0
4.5
6.0
190
95
38
32
240
120
48
21
285
150
57
48
ns
tTLH,
tTHL
Maximum Output Transition Time, Any Output
(Figures 1 and 3)
2.0
3.0
4.5
6.0
60
22
12
10
75
28
15
13
90
34
18
15
ns
Cin
Maximum Input Capacitance
--
10
10
10
pF
Cout
Maximum ThreeState Output Capacitance
(Output in HighImpedance State)
--
15
15
15
pF
NOTES:
1. For propagation delays with loads other than 50 pF, see Chapter 2 of the Motorola HighSpeed CMOS Data Book (DL129/D).
2. Information on typical parametric values can be found in Chapter 2 of the Motorola HighSpeed CMOS Data Book (DL129/D).
C
P
Di
i
i
C
i
(P
B ff )*
Typical @ 25
C, VCC = 5.0 V
F
CPD
Power Dissipation Capacitance (Per Buffer)*
35
pF
* Used to determine the noload dynamic power consumption: PD = CPD VCC2f + ICC VCC. For load considerations, see Chapter 2 of the
Motorola HighSpeed CMOS Data Book (DL129/D).
MC74HC367A
MOTOROLA
HighSpeed CMOS Logic Data
DL129 -- Rev 6
4
SWITCHING WAVEFORMS
VCC
GND
tf
tr
INPUT A
OUTPUT Y
10%
50%
90%
10%
50%
90%
tTLH
tPLH
tPHL
tTHL
OUTPUT ENABLE
OUTPUT Y
OUTPUT Y
50%
50%
50%
90%
10%
tPZL
tPLZ
tPZH
tPHZ
VCC
GND
HIGH
IMPEDANCE
VOL
VOH
HIGH
IMPEDANCE
Figure 1.
Figure 2.
TEST CIRCUITS
* Includes all probe and jig capacitance
CL*
TEST POINT
DEVICE
UNDER
TEST
OUTPUT
* Includes all probe and jig capacitance
CL*
TEST POINT
DEVICE
UNDER
TEST
OUTPUT
CONNECT TO VCC WHEN
TESTING tPLZ AND tPZL.
CONNECT TO GND WHEN
TESTING tPHZ AND tPZH.
1 k
Figure 3.
Figure 4.
A
OUTPUT ENABLE
VCC
TO OTHER
BUFFERS
Y
LOGIC DETAIL
ONE OF 6
BUFFERS
MC74HC367A
HighSpeed CMOS Logic Data
DL129 -- Rev 6
5
MOTOROLA
OUTLINE DIMENSIONS
N SUFFIX
PLASTIC PACKAGE
CASE 64808
ISSUE R
MIN
MIN
MAX
MAX
INCHES
MILLIMETERS
DIM
A
B
C
D
F
G
H
J
K
L
M
S
18.80
6.35
3.69
0.39
1.02
0.21
2.80
7.50
0
0.51
19.55
6.85
4.44
0.53
1.77
0.38
3.30
7.74
10
1.01
0.740
0.250
0.145
0.015
0.040
0.008
0.110
0.295
0
0.020
0.770
0.270
0.175
0.021
0.070
0.015
0.130
0.305
10
0.040
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
2.54 BSC
1.27 BSC
0.100 BSC
0.050 BSC
A
B
1
8
9
16
F
H
G
D
16 PL
S
C
T
SEATING
PLANE
K
J
M
L
T
A
0.25 (0.010)
M
M
0.25 (0.010)
T
B
A
M
S
S
MIN
MIN
MAX
MAX
MILLIMETERS
INCHES
DIM
A
B
C
D
F
G
J
K
M
P
R
9.80
3.80
1.35
0.35
0.40
0.19
0.10
0
5.80
0.25
10.00
4.00
1.75
0.49
1.25
0.25
0.25
7
6.20
0.50
0.386
0.150
0.054
0.014
0.016
0.008
0.004
0
0.229
0.010
0.393
0.157
0.068
0.019
0.049
0.009
0.009
7
0.244
0.019
1.27 BSC
0.050 BSC
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
1
8
9
16
A
B
D
16 PL
K
C
G
T
SEATING
PLANE
R
X 45
M
J
F
P
8 PL
0.25 (0.010)
B
M
M
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B05
ISSUE J
MC74HC367A
MOTOROLA
HighSpeed CMOS Logic Data
DL129 -- Rev 6
6
OUTLINE DIMENSIONS
DT SUFFIX
PLASTIC TSSOP PACKAGE
CASE 948F01
ISSUE O
DIM
MIN
MAX
MIN
MAX
INCHES
MILLIMETERS
A
4.90
5.10
0.193
0.200
B
4.30
4.50
0.169
0.177
C
1.20
0.047
D
0.05
0.15
0.002
0.006
F
0.50
0.75
0.020
0.030
G
0.65 BSC
0.026 BSC
H
0.18
0.28
0.007
0.011
J
0.09
0.20
0.004
0.008
J1
0.09
0.16
0.004
0.006
K
0.19
0.30
0.007
0.012
K1
0.19
0.25
0.007
0.010
L
6.40 BSC
0.252 BSC
M
0
8
0
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.
PROTRUSIONS OR GATE BURRS. MOLD FLASH OR
GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER
SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH OR
PROTRUSION SHALL NOT EXCEED
0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE DETERMINED AT
DATUM PLANE W.
_
_
_
_
SECTION NN
SEATING
PLANE
IDENT.
PIN 1
1
8
16
9
DETAIL E
J
J1
B
C
D
A
K
K1
H
G
DETAIL E
F
M
L
2X
L/2
U
S
U
0.15 (0.006) T
S
U
0.15 (0.006) T
S
U
M
0.10 (0.004)
V
S
T
0.10 (0.004)
T
V
W
0.25 (0.010)
16X REF
K
N
N
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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals"
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applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury
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arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
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MC74HC367A/D
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