1
Rectifier Device Data
SWITCHMODE
TM
Schottky Power Rectifier
The SWITCHMODE Power Rectifier employs the Schottky Barrier principle in
a large area metaltosilicon power diode. Stateoftheart geometry features
epitaxial construction with oxide passivation and metal overlay contact. Ideally
suited for use as rectifiers in very lowvoltage, highfrequency switching power
supplies, free wheeling diodes and polarity protection diodes.
Highly Stable Oxide Passivated Junction
Very Low Forward Voltage Drop
Matched Dual Die Construction
High Junction Temperature Capability
High dv/dt Capability
Excellent Ability to Withstand Reverse Avalanche Energy
Transients
Guardring for Stress Protection
Epoxy Meets UL94, VO at 1/8
Electrically Isolated. No Isolation Hardware Required.
UL Recognized File #E69369(1)
Mechanical Characteristics
Case: Epoxy, Molded
Weight: 1.9 grams (approximately)
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
Lead Temperature for Soldering Purposes: 260
C Max. for 10
Seconds
Shipped 50 units per plastic tube
Marking: B2060
MAXIMUM RATINGS, PER LEG
Rating
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
60
Volts
Average Rectified Forward Current
(Rated VR), TC = 133
C Total
Device
IF(AV)
10
20
Amps
Peak Repetitive Forward Current
(Rated VR, Square Wave, 20 kHz), TC = 133
C
IFRM
20
Amps
Nonrepetitive Peak Surge Current
(Surge applied at rated load conditions halfwave, single phase, 60 Hz)
IFSM
150
Amps
Peak Repetitive Reverse Surge Current (2.0
s, 1.0 kHz)
IRRM
0.5
Amp
Operating Junction and Storage Temperature
TJ, Tstg
65 to +150
C
Voltage Rate of Change (Rated VR)
dv/dt
10000
V/
s
RMS Isolation Voltage (t = 1.0 second, R.H.
30%, TA = 25
C)(2)
Per Figure 3
Per Figure 4(1)
Per Figure 5
Viso1
Viso2
Viso3
4500
3500
1500
Volts
THERMAL CHARACTERISTICS, PER LEG
Maximum Thermal Resistance, Junction to Case
R
JC
4.0
C/W
Lead Temperature for Soldering Purposes: 1/8
from Case for 5 Seconds
TL
260
C
(1) UL Recognized mounting method is per Figure 4.
(2) Proper strike and creepage distance must be provided.
SWITCHMODE is a trademark of Motorola, Inc.
Preferred devices are Motorola recommended choices for future use and best overall value.
Motorola, Inc. 1996
Order this document
by MBRF2060CT/D
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
2
1
3
MBRF2060CT
SCHOTTKY BARRIER
RECTIFIER
20 AMPERES
60 VOLTS
CASE 221D02
ISOLATED TO220
Motorola Preferred Device
1
3
2
Rev 1
MBRF2060CT
2
Rectifier Device Data
ELECTRICAL CHARACTERISTICS, PER LEG
Characteristic
Symbol
Max
Unit
Maximum Instantaneous Forward Voltage (3)
(iF = 10 Amp, TC = 25
C)
(iF = 10 Amp, TC = 125
C)
(iF = 20 Amp, TC = 25
C)
(iF = 20 Amp, TC = 125
C)
vF
0.85
0.75
0.95
0.85
Volts
Maximum Instantaneous Reverse Current (3)
(Rated DC Voltage, TC = 25
C)
(Rated DC Voltage, TC = 125
C)
iR
0.15
150
mA
(3) Pulse Test: Pulse Width = 300
s, Duty Cycle
2.0%
Figure 1. Typical Forward Voltage Per Diode
Figure 2. Typical Reverse Current Per Diode
0.01
0.1
1.0
10
120
100
80
60
40
20
0
VR, REVERSE VOLTAGE (VOLTS)
I R
, REVERSE CURRENT
(mA)
TJ = 150
C
TJ = 125
C
TJ = 100
C
TJ = 25
C
0.5
0
vF, INSTANTANEOUS VOLTAGE (VOLTS)
1.0
3.0
5.0
10
20
50
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
i F
, INST
ANT
ANEOUS
FOR
W
ARD
CURRENT
(AMPS)
TJ = 25
C
100
C
150
C
MBRF2060CT
3
Rectifier Device Data
TEST CONDITIONS FOR ISOLATION TESTS*
MOUNTED
FULLY ISOLATED
PACKAGE
LEADS
HEATSINK
0.110
MIN
Figure 3. Clip Mounting Position
for Isolation Test Number 1
* Measurement made between leads and heatsink with all leads shorted together.
CLIP
MOUNTED
FULLY ISOLATED
PACKAGE
LEADS
HEATSINK
CLIP
0.107
MIN
MOUNTED
FULLY ISOLATED
PACKAGE
LEADS
HEATSINK
0.107
MIN
Figure 4. Clip Mounting Position
for Isolation Test Number 2
Figure 5. Screw Mounting Position
for Isolation Test Number 3
MOUNTING INFORMATION**
440 SCREW
PLAIN WASHER
HEATSINK
COMPRESSION WASHER
NUT
CLIP
HEATSINK
Laboratory tests on a limited number of samples indicate, when using the screw and compression washer mounting technique, a screw torque of 6 to 8 in . lbs is sufficient to provide
maximum power dissipation capability. The compression washer helps to maintain a constant pressure on the package over time and during large temperature excursions.
Destructive laboratory tests show that using a hex head 440 screw, without washers, and applying a torque in excess of 20 in . lbs will cause the plastic to crack around the mounting
hole, resulting in a loss of isolation capability.
Additional tests on slotted 440 screws indicate that the screw slot fails between 15 to 20 in . lbs without adversely affecting the package. However, in order to positively ensure
the package integrity of the fully isolated device, Motorola does not recommend exceeding 10 in . lbs of mounting torque under any mounting conditions.
Figure 6. Typical Mounting Techniques
6a. ScrewMounted
6b. ClipMounted
**For more information about mounting power semiconductors see Application Note AN1040.
MBRF2060CT
4
Rectifier Device Data
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM
A
MIN
MAX
MIN
MAX
MILLIMETERS
0.621
0.629
15.78
15.97
INCHES
B
0.394
0.402
10.01
10.21
C
0.181
0.189
4.60
4.80
D
0.026
0.034
0.67
0.86
F
0.121
0.129
3.08
3.27
G
0.100 BSC
2.54 BSC
H
0.123
0.129
3.13
3.27
J
0.018
0.025
0.46
0.64
K
0.500
0.562
12.70
14.27
L
0.045
0.060
1.14
1.52
N
0.200 BSC
5.08 BSC
Q
0.126
0.134
3.21
3.40
R
0.107
0.111
2.72
2.81
S
0.096
0.104
2.44
2.64
U
0.259
0.267
6.58
6.78
B
Y
G
N
D
L
K
H
A
F
Q
3 PL
1 2 3
M
B
M
0.25 (0.010)
Y
SEATING
PLANE
T
U
C
S
J
R
STYLE 3:
PIN 1. ANODE
2. CATHODE
3. ANODE
CASE 221D02
(ISOLATED TO220)
ISSUE D
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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
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Opportunity/Affirmative Action Employer.
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MBRF2060CT/D
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