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Электронный компонент: MC10H124L

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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
25
REV 6
Motorola, Inc. 1996
9/96
Quad TTL-to-MECL Translator
With TTL Strobe Input
The MC10H124 is a quad translator for interfacing data and control
signals between a saturated logic section and the MECL section of digital
systems. The 10H part is a functional/pinout duplication of the standard
MECL 10K family part, with 100% improvement in propagation delay, and
no increase in powersupply current.
Propagation Delay, 1.5 ns Typical
Improved Noise Margin 150 mV (Over Operating Voltage and
Temperature Range)
Voltage Compensated
MECL 10KCompatible
MAXIMUM RATINGS
Characteristic
Symbol
Rating
Unit
Power Supply (VCC = 5.0 V)
VEE
8.0 to 0
Vdc
Power Supply (VEE = 5.2 V)
VCC
0 to +7.0
Vdc
Input Voltage (VCC = 5.0 V) TTL
VI
0 to VCC
Vdc
Output Current -- Continuous
-- Surge
Iout
50
100
mA
Operating Temperature Range
TA
0 to +75
C
Storage Temperature Range -- Plastic
-- Ceramic
Tstg
55 to +150
55 to +165
C
ELECTRICAL CHARACTERISTICS (VEE = 5.2 V
5%, VCC = 5.0 V
5.0%)
0
25
75
Characteristic
Symbol
Min
Max
Min
Max
Min
Max
Unit
Negative Power
Supply Drain
Current
IE
--
72
--
66
--
72
mA
Positive Power Supply
D i C
t
ICCH
--
16
--
16
--
18
mA
pp y
Drain Current
ICCL
--
25
--
25
--
25
mA
Reverse Current
Pin 6
Pin 7
IR
--
--
200
50
--
--
200
50
--
--
200
50
A
Forward Current
Pin 6
Pin 7
IF
--
--
12.8
3.2
--
--
12.8
3.2
--
--
12.8
3.2
mA
Input Breakdown
Voltage
V(BR)in
5.5
--
5.5
--
5.5
--
Vdc
Input Clamp Voltage
VI
--
1.5
--
1.5
--
1.5
Vdc
High Output Voltage
VOH
1.02
0.84
0.98
0.81
0.92
0.735
Vdc
Low Output Voltage
VOL
1.95
1.63
1.95
1.63
1.95
1.60
Vdc
High Input Voltage
VIH
2.0
--
2.0
--
2.0
--
Vdc
Low Input Voltage
VIL
--
0.8
--
0.8
--
0.8
Vdc
NOTE:
Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table,
after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit
board and transverse air flow greater than 500 Ifpm is maintained. Outputs are terminated through a
50ohm resistor to 2.0 volts.
MC10H124
LOGIC DIAGRAM
DIP
PIN ASSIGNMENT
BOUT
AOUT
BOUT
AOUT
AIN
COMMON
STROBE
BIN
VEE
GND
COUT
DOUT
DOUT
COUT
DIN
CIN
VCC
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
GND = PIN 16
VCC ( +5.0 VDC) = PIN 9
VEE ( 5.2 VDC) = PIN 8
11
13
14
10
12
15
7
3
1
6
5
4
2
L SUFFIX
CERAMIC PACKAGE
CASE 62010
P SUFFIX
PLASTIC PACKAGE
CASE 64808
FN SUFFIX
PLCC
CASE 77502
Pin assignment is for DualinLine Package.
For PLCC pin assignment, see the Pin Conversion
Tables on page 636 of the Motorola MECL Data
Book (DL122/D).
MC10H124
MOTOROLA
MECL Data
DL122 -- Rev 6
26
ELECTRICAL CHARACTERISTICS (VEE = 5.2 V
5%, VCC = 5.0 V
5.0%)
0
25
75
Characteristic
Symbol
Min
Max
Min
Max
Min
Max
Unit
AC PARAMETERS
Propagation Delay
tpd
0.55
2.25
0.55
2.4
0.85
2.95
ns
Rise Time
tr
0.5
1.5
0.5
1.6
0.5
1.7
ns
Fall Time
tf
0.5
1.5
0.5
1.6
0.5
1.7
ns
APPLICATIONS INFORMATION
The MC10H124 has TTLcompatible inputs and
MECL complementary openemitter outputs that allow
use as an inverting/noninverting translator or as a
differential line driver. When the common strobe input is
at the lowlogic level, it forces all true outputs to a MECL
lowlogic state and all inverting outputs to a MECL
highlogic state.
An advantage of this device is that TTLlevel
information can be transmitted differentially, via balanced
twisted pair lines, to MECL equipment, where the signal
can be received by the MC10H115 or MC10H116
differential line receivers. The power supply
requirements are ground, +5.0 volts, and 5.2 volts.
MC10H124
27
MOTOROLA
MECL Data
DL122 -- Rev 6
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 77502
ISSUE C
NOTES:
1. DATUMS L, M, AND N DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM T, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
M
N
L
Y BRK
W
V
D
D
S
LM
M
0.007 (0.180)
N
S
T
S
LM
M
0.007 (0.180)
N
S
T
S
LM
S
0.010 (0.250)
N
S
T
X
G1
B
U
Z
VIEW DD
20
1
S
LM
M
0.007 (0.180)
N
S
T
S
LM
M
0.007 (0.180)
N
S
T
S
LM
S
0.010 (0.250)
N
S
T
C
G
VIEW S
E
J
R
Z
A
0.004 (0.100)
T
SEATING
PLANE
S
LM
M
0.007 (0.180)
N
S
T
S
LM
M
0.007 (0.180)
N
S
T
H
VIEW S
K
K1
F
G1
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
0.385
0.395
9.78
10.03
B
0.385
0.395
9.78
10.03
C
0.165
0.180
4.20
4.57
E
0.090
0.110
2.29
2.79
F
0.013
0.019
0.33
0.48
G
0.050 BSC
1.27 BSC
H
0.026
0.032
0.66
0.81
J
0.020
0.51
K
0.025
0.64
R
0.350
0.356
8.89
9.04
U
0.350
0.356
8.89
9.04
V
0.042
0.048
1.07
1.21
W
0.042
0.048
1.07
1.21
X
0.042
0.056
1.07
1.42
Y
0.020
0.50
Z
2
10
2
10
G1
0.310
0.330
7.88
8.38
K1
0.040
1.02
_
_
_
_
MC10H124
MOTOROLA
MECL Data
DL122 -- Rev 6
28
OUTLINE DIMENSIONS
P SUFFIX
PLASTIC DIP PACKAGE
CASE 64808
ISSUE R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
A
B
F
C
S
H
G
D
J
L
M
16 PL
SEATING
1
8
9
16
K
PLANE
T
M
A
M
0.25 (0.010)
T
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
0.740
0.770
18.80
19.55
B
0.250
0.270
6.35
6.85
C
0.145
0.175
3.69
4.44
D
0.015
0.021
0.39
0.53
F
0.040
0.70
1.02
1.77
G
0.100 BSC
2.54 BSC
H
0.050 BSC
1.27 BSC
J
0.008
0.015
0.21
0.38
K
0.110
0.130
2.80
3.30
L
0.295
0.305
7.50
7.74
M
0
10
0
10
S
0.020
0.040
0.51
1.01
_
_
_
_
L SUFFIX
CERAMIC DIP PACKAGE
CASE 62010
ISSUE V
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
A
B
T
F
E
G
N
K
C
SEATING
PLANE
16 PL
D
S
A
M
0.25 (0.010)
T
16 PL
J
S
B
M
0.25 (0.010)
T
M
L
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
0.750
0.785
19.05
19.93
B
0.240
0.295
6.10
7.49
C
0.200
5.08
D
0.015
0.020
0.39
0.50
E
0.050 BSC
1.27 BSC
F
0.055
0.065
1.40
1.65
G
0.100 BSC
2.54 BSC
H
0.008
0.015
0.21
0.38
K
0.125
0.170
3.18
4.31
L
0.300 BSC
7.62 BSC
M
0
15
0
15
N
0.020
0.040
0.51
1.01
_
_
_
_
16
9
1
8
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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals"
must be validated for each customer application by customer's technical experts. Motorola does not convey any license under its patent rights nor the rights of
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Opportunity/Affirmative Action Employer.
How to reach us:
USA/EUROPE/Locations Not Listed
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MC10H124/D
*MC10H124/D*