MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
249
REV 5
Motorola, Inc. 1996
3/93
Dual Latch
The MC10H130 is a MECL 10H part which is a functional/pinout duplication
of the standard MECL 10K family part, with 100% improvement in clock speed
and propagation delay and no increase in powersupply current.
Propagation Delay, 1.0 ns Typical
Power Dissipation, 155 mW Typical
Improved Noise Margin 150 mV (Over Operating Voltage and
Temperature Range)
Voltage Compensated
MECL 10KCompatible
MAXIMUM RATINGS
Characteristic
Symbol
Rating
Unit
Power Supply (VCC = 0)
VEE
8.0 to 0
Vdc
Input Voltage (VCC = 0)
VI
0 to VEE
Vdc
Output Current -- Continuous
-- Surge
Iout
50
100
mA
Operating Temperature Range
TA
0 to +75
C
Storage Temperature Range -- Plastic
-- Ceramic
Tstg
55 to +150
55 to +165
C
C
ELECTRICAL CHARACTERISTICS (VEE = 5.2 V
5%) (See Note)
0
25
75
Characteristic
Symbol
Min
Max
Min
Max
Min
Max
Unit
Power Supply Current
IE
--
38
--
35
--
38
mA
Input Current High
Pins 6, 11
Pins 7, 9, 10
Pins 4, 5, 12, 13
IinH
--
--
--
468
545
434
--
--
--
275
320
255
--
--
--
275
320
255
A
Input Current Low
IinL
0.5
--
0.5
--
0.3
--
A
High Output Voltage
VOH
1.02
0.84
0.98
0.81
0.92
0.735
Vdc
Low Output Voltage
VOL
1.95
1.63
1.95
1.63
1.95
1.60
Vdc
High Input Voltage
VIH
1.17
0.84
1.13
0.81
1.07
0.735
Vdc
Low Input Voltage
VIL
1.95
1.48
1.95
1.48
1.95
1.45
Vdc
AC PARAMETERS
Propagation Delay
Data
Set, Reset
Clock, CE
tpd
0.4
0.6
0.5
1.6
1.7
1.6
0.4
0.7
0.5
1.7
1.8
1.7
0.4
0.8
0.6
1.8
1.9
1.8
ns
Rise Time
tr
0.5
1.6
0.5
1.7
0.5
1.8
ns
Fall Time
tf
0.5
1.6
0.5
1.7
0.5
1.8
ns
Setup Time
tset
2.2
--
2.2
--
2.2
--
ns
Hold Time
thold
0.7
--
0.7
--
0.7
--
ns
NOTE:
Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table,
after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit
board and transverse air flow greater than 500 Iinear fpm is maintained. Outputs are terminated through
a 50ohm resistor to 2.0 volts.
VCC1 = PIN 1
VCC2 = PIN 16
VEE = PIN 8
S1 5
D1 7
CE1 6
R1 4
C 9
R2 13
CE2 11
D2 10
S2 12
Q1
Q1
Q2
Q2
2
3
14
15
LOGIC DIAGRAM
MC10H130
DIP
PIN ASSIGNMENT
VCC1
Q1
Q1
R1
S1
CE1
D1
VEE
VCC2
Q2
Q2
R2
S2
CE2
D2
C
16
15
14
13
12
11
10
9
1
2
3
4
5
6
7
8
TRUTH TABLE
D
C
CE
Qn+1
L
H
L
L
L
H
H
L
L
H
L
H
L
H
Qn
Qn
Qn
X
X
X
L SUFFIX
CERAMIC PACKAGE
CASE 62010
P SUFFIX
PLASTIC PACKAGE
CASE 64808
FN SUFFIX
PLCC
CASE 77502
Pin assignment is for DualinLine Package.
For PLCC pin assignment, see the Pin Conversion
Tables on page 611 of the Motorola MECL Data
Book (DL122/D).
MC10H130
MOTOROLA
MECL Data
DL122 -- Rev 6
250
APPLICATION INFORMATION
The MC10H130 is a clocked dual D type latch. Each
latch may be clocked separately by holding the common
clock in the low state, and using the clock enable inputs
for the clocking function. If the common clock is to be used
to clock the latch, the clock enable (CE) inputs must be
in the low state. In this mode, the enable inputs perform
the function of controlling the common clock (C).
Any change at the D input will be reflected at the output
while the clock is low. The outputs are latched on the
positive transition of the clock. While the clock is in the
high state, a change in the information present at the data
inputs will not affect the output information.
The set and reset inputs do not override the clock and
D inputs. They are effective only when either C or CE or
both are high.
MC10H130
251
MOTOROLA
MECL Data
DL122 -- Rev 6
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 77502
ISSUE C
NOTES:
1. DATUMS L, M, AND N DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM T, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
M
N
L
Y BRK
W
V
D
D
S
LM
M
0.007 (0.180)
N
S
T
S
LM
M
0.007 (0.180)
N
S
T
S
LM
S
0.010 (0.250)
N
S
T
X
G1
B
U
Z
VIEW DD
20
1
S
LM
M
0.007 (0.180)
N
S
T
S
LM
M
0.007 (0.180)
N
S
T
S
LM
S
0.010 (0.250)
N
S
T
C
G
VIEW S
E
J
R
Z
A
0.004 (0.100)
T
SEATING
PLANE
S
LM
M
0.007 (0.180)
N
S
T
S
LM
M
0.007 (0.180)
N
S
T
H
VIEW S
K
K1
F
G1
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
0.385
0.395
9.78
10.03
B
0.385
0.395
9.78
10.03
C
0.165
0.180
4.20
4.57
E
0.090
0.110
2.29
2.79
F
0.013
0.019
0.33
0.48
G
0.050 BSC
1.27 BSC
H
0.026
0.032
0.66
0.81
J
0.020
0.51
K
0.025
0.64
R
0.350
0.356
8.89
9.04
U
0.350
0.356
8.89
9.04
V
0.042
0.048
1.07
1.21
W
0.042
0.048
1.07
1.21
X
0.042
0.056
1.07
1.42
Y
0.020
0.50
Z
2
10
2
10
G1
0.310
0.330
7.88
8.38
K1
0.040
1.02
_
_
_
_
MC10H130
MOTOROLA
MECL Data
DL122 -- Rev 6
252
OUTLINE DIMENSIONS
P SUFFIX
PLASTIC DIP PACKAGE
CASE 64808
ISSUE R
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
A
B
F
C
S
H
G
D
J
L
M
16 PL
SEATING
1
8
9
16
K
PLANE
T
M
A
M
0.25 (0.010)
T
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
0.740
0.770
18.80
19.55
B
0.250
0.270
6.35
6.85
C
0.145
0.175
3.69
4.44
D
0.015
0.021
0.39
0.53
F
0.040
0.70
1.02
1.77
G
0.100 BSC
2.54 BSC
H
0.050 BSC
1.27 BSC
J
0.008
0.015
0.21
0.38
K
0.110
0.130
2.80
3.30
L
0.295
0.305
7.50
7.74
M
0
10
0
10
S
0.020
0.040
0.51
1.01
_
_
_
_
L SUFFIX
CERAMIC DIP PACKAGE
CASE 62010
ISSUE V
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
A
B
T
F
E
G
N
K
C
SEATING
PLANE
16 PL
D
S
A
M
0.25 (0.010)
T
16 PL
J
S
B
M
0.25 (0.010)
T
M
L
DIM
MIN
MAX
MIN
MAX
MILLIMETERS
INCHES
A
0.750
0.785
19.05
19.93
B
0.240
0.295
6.10
7.49
C
0.200
5.08
D
0.015
0.020
0.39
0.50
E
0.050 BSC
1.27 BSC
F
0.055
0.065
1.40
1.65
G
0.100 BSC
2.54 BSC
H
0.008
0.015
0.21
0.38
K
0.125
0.170
3.18
4.31
L
0.300 BSC
7.62 BSC
M
0
15
0
15
N
0.020
0.040
0.51
1.01
_
_
_
_
16
9
1
8
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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals"
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Opportunity/Affirmative Action Employer.
How to reach us:
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MC10H130/D
*MC10H130/D*
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