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Электронный компонент: MC12022TSAP

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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
1
REV 3
Motorola, Inc. 1997
1/97
1.1GHz Low Power Dual
Modulus Prescaler
With On-Chip Output Termination
The MC12022TSA can be used with CMOS synthesizers requiring
positive edges to trigger internal counters such as Motorola's MC145XXX
series in a PLL to provide tuning signals up to 1.1GHz in programmable
frequency steps. This device is a reduced current drain version of the
MC12022A/B with the addition of onchip output termination.
The MC12022TSB can be used with CMOS synthesizers requiring
negative edges to trigger internal counters.
A Divide Ratio Control (SW) permits selection of a 64/65 or 128/129
divide ratio as desired.
The Modulus Control (MC) selects the proper divide number after SW
has been biased to select the desired divide ratio.
NOTE: The "B" Version Is Not Recommended for New Designs
1.1 GHz Toggle Frequency
Supply Voltage of 4.5 to 5.5V
LowPower 4.0mA Typical
Operating Temperature Range of 40 to +85
C
Short Setup Time (tset) 16ns Maximum @ 1.1GHz
Modulus Control Input Level Is Compatible With Standard CMOS
and TTL
Output Load Resistor on Die
FUNCTIONAL TABLE
SW
MC
Divide Ratio
H
H
64
H
L
65
L
H
128
L
L
129
Note: SW: H = VCC, L = Open
MC: H = 2.0 V to VCC, L = GND to 0.8 V
DESIGN GUIDE
Criteria
Value
Unit
Internal Gate Count*
67
ea
Internal Gate Propagation Delay
200
ps
Internal Gate Power Dissipation
0.75
mW
Speed Power Product
0.15
pJ
* Equivalent to a twoinput NAND gate
MAXIMUM RATINGS
Symbol
Characteristic
Range
Unit
VCC
Power Supply Voltage, Pin 2
0.5 to + 7.0
Vdc
TA
Operating Temperature Range
40 to + 85
C
Tstg
Storage Temperature Range
65 to + 150
C
MECL PLL COMPONENTS
64/65,
128/129
DUAL MODULUS
PRESCALER
MC12022TSA
MC12022TSB
Pinout: 8Lead Plastic (Top View)
8
1
IN
IN
7
2
NC
VCC
6
3
MC
SW
5
4
GND
OUT
P SUFFIX
8LEAD PLASTIC PACKAGE
CASE 62605
D SUFFIX
8LEAD PLASTIC SOIC PACKAGE
CASE 75105
MC12022TSA MC12022TSB
MOTOROLA
HIPERCOMM
BR1334 -- Rev 4
2
ELECTRICAL CHARACTERISTICS
(VCC = 4.5 to 5.5V; TA = 40
C to +85
C)
Symbol
Characteristic
Min
Typ
Max
Unit
ft
Toggle Frequency (Sine Wave Input)
0.1
1.4
1.1
GHz
ICC
Supply Current (Pin 2)
4.6
6.5
mA
VIH1
Modulus Control Input High (MC)
2.0
VCC
V
VIL1
Modulus Control Input Low (MC)
0.8
V
VIH2
Divide Ratio Control Input High (SW)
VCC
VCC
VCC
Vdc
VIL2
Divide Ratio Control Input Low (SW)
Open
Open
Open
--
Vout
Output Voltage Swing (CL = 8pF)
1.0
1.4
Vpp
tset
Modulus Setup Time MC to Out
11
16
ns
Vin
Input Voltage Sensitivity 2501100 MHz
100250 MHz
100
400
1500
1500
mVpp
A
H
G
F
E
D
In
MC
In
SW
Out
Q
S
Q
C
QB
D
Q
C
QB
D
QB
C
Q
D
C
QB
D
QB
C
Q
D
QB
C
Q
D
B
QB
C
Q
D
C
QB
C
Q
D
M
Modulus setup time MC to out is the MC
setup or MC release plus the prop delay.
Prop. Delay
In
Out
MC
MC Setup
MC Release
Figure 1. Logic Diagram (MC12022TSA)
Figure 2. Modulus Setup Time
Figure 3. Typical Output Waveforms
(
128, 1.1GHz Input Frequency, VCC = 5.0V, TA = 25
C,
Output Loaded)
(
64, 500MHz Input Frequency, VCC = 5.0V, TA = 25
C,
Output Loaded)
500 m
20 ns
500 m
20 ns
MC12022TSA MC12022TSB
HIPERCOMM
BR1334 -- Rev 4
3
MOTOROLA
Figure 4. AC Test Circuit
EXTERNAL COMPONENTS
C1 = C2 = 1000pF
C3 = 0.1
F
CL = 8pF (Including Scope
and jig capacitance)
CL
MC Input
C2
C1
C3
VCC = 4.5 to 5.5Vdc
50
Sine Wave Generator
SW
VCC
OUT
GND
MC
IN
IN
650
600
550
500
450
400
350
300
250
200
150
100
50
0
50
100
150
200
100
200
300
400
500
600
700
800
900
1000
1100
1200
Figure 5. Typical Input Impedance versus Input Frequency
MHz
OHMS
jX
R
MC12022TSA MC12022TSB
MOTOROLA
HIPERCOMM
BR1334 -- Rev 4
4
OUTLINE DIMENSIONS
P SUFFIX
PLASTIC PACKAGE
CASE 62605
ISSUE K
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 75105
ISSUE R
SEATING
PLANE
1
4
5
8
A
0.25
M
C B
S
S
0.25
M
B
M
h
q
C
X 45
_
L
DIM
MIN
MAX
MILLIMETERS
A
1.35
1.75
A1
0.10
0.25
B
0.35
0.49
C
0.18
0.25
D
4.80
5.00
E
1.27 BSC
e
3.80
4.00
H
5.80
6.20
h
0
7
L
0.40
1.25
q
0.25
0.50
_
_
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. DIMENSIONS ARE IN MILLIMETERS.
3. DIMENSION D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS
OF THE B DIMENSION AT MAXIMUM MATERIAL
CONDITION.
D
E
H
A
B
e
B
A1
C
A
0.10
NOTES:
1. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
2. PACKAGE CONTOUR OPTIONAL (ROUND OR
SQUARE CORNERS).
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
1
4
5
8
F
NOTE 2
A
B
T
SEATING
PLANE
H
J
G
D
K
N
C
L
M
M
A
M
0.13 (0.005)
B
M
T
DIM
MIN
MAX
MIN
MAX
INCHES
MILLIMETERS
A
9.40
10.16
0.370
0.400
B
6.10
6.60
0.240
0.260
C
3.94
4.45
0.155
0.175
D
0.38
0.51
0.015
0.020
F
1.02
1.78
0.040
0.070
G
2.54 BSC
0.100 BSC
H
0.76
1.27
0.030
0.050
J
0.20
0.30
0.008
0.012
K
2.92
3.43
0.115
0.135
L
7.62 BSC
0.300 BSC
M
10
10
N
0.76
1.01
0.030
0.040
_
_
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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals"
must be validated for each customer application by customer's technical experts. Motorola does not convey any license under its patent rights nor the rights of
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arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
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Opportunity/Affirmative Action Employer.
How to reach us:
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MC12022TSA/D