1
MOTOROLA
MMQA5V6T1 MMQA20VT1
5.6 Volt SC 59 Quad Monolithic
Common Anode
Transient Voltage Suppressor
for ESD Protection
This quad monolithic silicon voltage suppressor is designed for applications
requiring transient overvoltage protection capability. It is intended for use in
voltage and ESD sensitive equipment such as computers, printers, business
machines, communication systems, medical equipment, and other applica-
tions. Its quad junction common anode design protects four separate lines
using only one package. These devices are ideal for situations where board
space is at a premium.
Specification Features:
SC-59 Package Allows Four Separate Unidirectional Configurations
Peak Power -- 24 Watts @ 1.0 ms (Unidirectional), per Figure 7 Waveform
Maximum Clamping Voltage @ Peak Pulse Current
Low Leakage < 2.0
A
ESD Rating of Class N (exceeding 16 kV) per the Human Body Model
Mechanical Characteristics:
Void Free, Transfer-Molded, Thermosetting Plastic Case
Corrosion Resistant Finish, Easily Solderable
Package Designed for Optimal Automated Board Assembly
Small Package Size for High Density Applications
Available in 8 mm Tape and Reel
Use the Device Number to order the 7 inch/3,000 unit reel. Replace
with "T3" in the Device Number to order the 13 inch/10,000 unit reel.
THERMAL CHARACTERISTICS
(TA = 25
C unless otherwise noted)
Characteristic
Symbol
Value
Unit
Peak Power Dissipation @ 1.0 ms (1)
@ TA
25
C
Ppk
24
Watts
Total Power Dissipation on FR-5 Board (2) @ TA = 25
C
Derate above 25
C
PD
225
1.8
mW
mW/
C
Thermal Resistance Junction to Ambient
R
JA
556
C/W
Total Power Dissipation on Alumina Substrate (3) @ TA = 25
C
Derate above 25
C
PD
300
2.4
mW
mW/
C
Thermal Resistance Junction to Ambient
R
JA
417
C/W
Junction and Storage Temperature Range
TJ
Tstg
55 to +150
C
Lead Solder Temperature -- Maximum (10 Second Duration)
TL
260
C
1. Non-repetitive current pulse per Figure 7 and derate above TA = 25
C per Figure 8.
2. FR-5 = 1.0 x 0.75 x 0.62 in.
3. Alumina = 0.4 x 0.3 x 0.024 in., 99.5% alumina
4. Other voltages are available
Thermal Clad is a trademark of the Bergquist Company
Preferred devices are Motorola recommended choices for future use and best overall value.
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Order this document
by MMQA5V6T1/D
Motorola, Inc. 1996
Rev 3
MMQA5V6T1
MMQA20VT1
SC-59 QUAD
TRANSIENT VOLTAGE
SUPPRESSOR
5.6 VOLTS (4)
24 WATTS PEAK POWER
CASE 318F-01
STYLE 1
SC-59 PLASTIC
4
5
6
Motorola Preferred Devices
PIN 1. CATHODE
2. ANODE
3. CATHODE
4. CATHODE
5. ANODE
6. CATHODE
1
2
3
1
2
3
4
5
6
MOTOROLA
2
MMQA5V6T1 MMQA20VT1
ELECTRICAL CHARACTERISTICS
(TA = 25
C unless otherwise noted)
UNIDIRECTIONAL
(Circuit tied to pins 1, 2, and 5; Pins 2, 3, and 5; Pins 2, 4, and 5; or Pins 2, 5, and 6) (VF = 0.9 V Max @ IF = 10 mA)
Breakdown Voltage
Max Reverse
Leakage Current
Max Zener Impedance (5)
Max
Reverse
Surge
Current
IRSM(4)
(A)
Max Reverse
Voltage @
IRSM(4)
(Clamping
Voltage)
VRSM
(V)
Maximum
Temperature
Coefficient of
VZ
(mV/
C)
VZT(3)
(V)
@ I ZT
(mA)
1
IR @ VR
(
A) (V)
ZZT @ IZT
(
) (mA)
Surge
Current
IRSM(4)
(A)
IRSM(4)
(Clamping
Voltage)
VRSM
(V)
Temperature
Coefficient of
VZ
(mV/
C)
Min
Nom
Max
(mA)
1
(
A) (V)
(
) (mA)
IRSM(4)
(A)
VRSM
(V)
(mV/
C)
5.32
5.6
5.88
1.0
2.0
3.0
400
3.0
8.0
1.26
19
20
21
1.0
0.1
15
125
0.84
28.6
20.07
(3) VZ measured at pulse test current IT at an ambient temperature of 25
C.
(4) Surge current waveform per Figure 5 and derate per Figure 6.
(5) ZZT is measured by dividing the AC voltage drop across the device by the AC current supplied. The specfied limits are IZ(AC) = 0.1 IZ(DC), with AC frequency = 1 kHz.
Typical Characteristics
50
50
100
150
8
7
6
5
4
V ,
Z
BREAKDOWN VOL
T
AGE (VOL
TS)
23
17
TA, AMBIENT TEMPERATURE (
C)
Figure 1. Typical Breakdown Voltage
versus Temperature
Figure 2. Typical Breakdown Voltage
versus Temperature
0
2
4
6
8
10
14
16
70
60
50
40
30
20
0
C, CAP
ACIT
ANCE (pF)
0
40
25
150
TA, AMBIENT TEMPERATURE (
C)
REVERSE VOLTAGE (V)
VZ @ IT
MMQA5V6T1
22
21
20
19
18
MMQA20VT1
10000
1000
100
TA, AMBIENT TEMPERATURE (
C)
I R,
REVERSE LEAKAGE CURRENT
(nA)
50
50
100
150
0
Figure 3. Typical Leakage Current
versus Temperature
Figure 4. Typical Capacitance versus
Reverse Voltage
10
12
MMQA20VT1
UNIDIRECTIONAL
V ,
Z
BREAKDOWN VOL
T
AGE (VOL
TS)
0
UNIDIRECTIONAL
3
MOTOROLA
MMQA5V6T1 MMQA20VT1
Typical Characteristics
0
1
1.5
3
300
Figure 5. Typical Capacitance versus
Reverse Voltage
0
25
50
75
100
125
150
175
300
250
200
150
100
50
0
Figure 6. Steady State Power Derating Curve
P
D
, POWER DISSIP
A
TION (mW)
0.5
REVERSE VOLTAGE (V)
TA, AMBIENT TEMPERATURE (
C)
FR-5 BOARD
ALUMINA SUBSTRATE
C, CAP
ACIT
ANCE (pF)
2
2.5
275
250
225
200
175
150
125
100
75
50
25
0
UNIDIRECTIONAL
MMQA5V6T1
V
ALUE (%)
100
50
0
0
1
2
3
4
t, TIME (ms)
Figure 7. Pulse Waveform
tr
tP
100
90
80
70
60
50
40
30
20
10
0
0
25
50
75
100
125
150
175 200
TA, AMBIENT TEMPERATURE (
C)
Figure 8. Pulse Derating Curve
PEAK PULSE DERA
TING IN % OF PEAK POWER
OR CURRENT
@
T
A
= 25
C
Figure 9. Maximum Non-repetitive Surge
Power, Ppk versus PW
Ppk PEAK SURGE POWER (W)
0.1
1.0
10
100
1000
1.0
10
100
Power is defined as VRSM x IZ(pk) where VRSM
is the clamping voltage at IZ(pk).
PW, PULSE WIDTH (ms)
PULSE WIDTH (tP) IS DEFINED
AS THAT POINT WHERE THE
PEAK CURRENT DECAYS TO 50%
OF IRSM.
tr
10
s
HALF VALUE --
IRSM
2
PEAK VALUE -- IRSM
UNIDIRECTIONAL
RECTANGULAR
WAVEFORM, TA = 25
C
MOTOROLA
4
MMQA5V6T1 MMQA20VT1
TYPICAL COMMON ANODE APPLICATIONS
A quad junction common anode design in a SC-59 pack-
age protects four separate lines using only one package.
This adds flexibility and creativity to PCB design especially
when board space is at a premium. Two simplified examples
of MMQA5V6T1 and MMQA20VT1 applications are illus-
trated below.
MMQA5V6T1
MMQA20VT1
KEYBOARD
TERMINAL
PRINTER
ETC.
FUNCTIONAL
DECODER
I/O
A
MMQA5V6T1
MMQA20VT1
GND
Computer Interface Protection
B
C
D
Microprocessor Protection
I/O
RAM
ROM
CLOCK
CPU
CONTROL BUS
ADDRESS BUS
DATA BUS
GND
VGG
VDD
5
MOTOROLA
MMQA5V6T1 MMQA20VT1
INFORMATION FOR USING THE SC-59 6 LEAD SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor packages must
be the correct size to ensure proper solder connection inter-
face between the board and the package. With the correct
pad geometry, the packages will self-align when subjected to
a solder reflow process.
inches
mm
SC-59 6 LEAD
0.028
0.7
0.074
1.9
0.037
0.95
0.037
0.95
0.094
2.4
0.039
1.0
SC-59 6 LEAD POWER DISSIPATION
The power dissipation of the SC-59 6 Lead is a function of
the pad size. This can vary from the minimum pad size for
soldering to a pad size given for maximum power dissipation.
Power dissipation for a surface mount device is determined
by TJ(max), the maximum rated junction temperature of the
die, R
JA, the thermal resistance from the device junction to
ambient, and the operating temperature, TA. Using the
values provided on the data sheet for the SC-59 6 Lead
package, PD can be calculated as follows:
PD =
TJ(max) TA
R
JA
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values into
the equation for an ambient temperature TA of 25
C, one can
calculate the power dissipation of the device which in this
case is 225 milliwatts.
PD =
150
C 25
C
556
C/W
= 225 milliwatts
The 556
C/W for the SC-59 6 Lead package assumes the
use of the recommended footprint on a glass epoxy printed
circuit board to achieve a power dissipation of 225 milliwatts.
There are other alternatives to achieving higher power
dissipation from the SC-59 6 Lead package. Another alterna-
tive would be to use a ceramic substrate or an aluminum
core board such as Thermal Clad
TM
. Using a board material
such as Thermal Clad, an aluminum core board, the power
dissipation can be doubled using the same footprint.
SOLDER STENCIL GUIDELINES
Prior to placing surface mount components onto a printed
circuit board, solder paste must be applied to the pads.
Solder stencils are used to screen the optimum amount.
These stencils are typically 0.008 inches thick and may be
made of brass or stainless steel. For packages such as the
SC-59, SC-59 6 Lead, SC-70/SOT-323, SOD-123, SOT-23,
SOT-143, SOT-223, SO-8, SO-14, SO-16, and SMB/SMC
diode packages, the stencil opening should be the same as
the pad size or a 1:1 registration.
SOLDERING PRECAUTIONS
The melting temperature of solder is higher than the rated
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within a
short time could result in device failure. Therefore, the
following items should always be observed in order to mini-
mize the thermal stress to which the devices are subjected.
Always preheat the device.
The delta temperature between the preheat and
soldering should be 100
C or less.*
When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering method,
the difference should be a maximum of 10
C.
* Soldering a device without preheating can cause excessive
thermal shock and stress which can result in damage to the
device.
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