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Электронный компонент: MRFIC0912

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MRFIC0912
MOTOROLA RF DEVICE DATA
The MRFIC Line
900 MHz GaAs
Integrated Power Amplifier
Designed primarily for use in high efficiency Analog Cellular applications,
the MRFIC0912 is a twostage power amplifier in Motorola's proprietary
Power Flat Pack 16lead package. This integrated circuit requires minimal
off-chip matching while allowing for the maximum in flexibility in optimizing
gain and efficiency. The design employs Motorola's planar, selfaligned GaAs
MESFET IC process to give the highest efficiency possible.
Usable Frequency Range = 800 1000 MHz, Specified for 824 905 MHz
30.8 dBm Minimum Output Power
470 mA Maximum Supply Current at 30.8 dBm Output
23.8 dB Minimum Gain
Simple Offchip Matching for Maximum Power/Efficiency Flexibility
4.6 Volt Supply
45 dB/Volt Typical Power Output Control
Order MRFIC0912R2 for Tape and Reel Option.
R2 Suffix = 1,500 Units per 16 mm, 13 inch Reel.
Device Marking = M0912
RF IN
1
2
3
4
7
6
5
GND
Pin Connections and Functional Block Diagram
8
9
10
11
12
13
14
15
16
VG1
RF OUT/VD2
VG2
VD1
GND
N/C
N/C
N/C
N/C
N/C
N/C
N/C
RF OUT/VD2
RF OUT/VD2
Order this document
by MRFIC0912/D
MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
MRFIC0912
900 MHz
GaAs INTEGRATED
POWER AMPLIFIER
CASE 97802
(PFP16)
Motorola, Inc. 1997
REV 1
MRFIC0912
2
MOTOROLA RF DEVICE DATA
MAXIMUM RATINGS
(TA = 25
C unless otherwise noted)
Ratings
Symbol
Limit
Unit
Supply Voltage
VD1, VD2
8
Vdc
RF Input Power
PRF
20
dBm
Gate Voltage
VG1, VG2, VGG
5
Vdc
Storage Temperature Range
Tstg
65 to +150
C
Operating Case Temperature
TC
35 to +100
C
Thermal Resistance, Junction to Case
R
JC
18
C/W
RECOMMENDED OPERATING RANGES
Parameter
Symbol
Value
Unit
RF Frequency
fRF
824905
MHz
Supply Voltage
VD1, VD2
4.06.0
Vdc
Gate Voltage
VG1, VG2
2.3 to 1.5
Vdc
ELECTRICAL CHARACTERISTICS
(VD1, VD2 = 4.6 V, TA = 25
C, fRF = 840 MHz, Pin = 7 dBm, VGG set for ID2Q = 200 mA, Tested in
Circuit Shown in Figure 1)
Characteristic
Min
Typ
Max
Unit
RF Output Power
30.8
31.2
--
dBm
Power Slump (VD1, VD2 = 4.0 V, TC = 100
_
C)
28.5
--
--
dBm
Load Mismatch Survival (VD1, VD2 = 7 V, Load VSWR = 10:1, all phases,
10 sec)
No Degradation
Spurious Output (VD1,VD2 = 0 to 7 V, Pin = 5 to 9 dBm, Load
VSWR = 10:1)
--
--
60
dBc
Input Return Loss
--
10
--
dB
Harmonic Output (Pout = 30.8 dBm)
2f0
3f0
4f0
--
--
--
--
--
--
25
40
40
dBc
Noise Power (VDD = 0 to 7 V, 45 MHz Above fRF at 30 kHz BW)
--
--
93
dBm
Maximum Power Control Voltage Slope (Change in Pout for Change on
VD1)
--
45
--
dB/V
Total Supply Current (VD1 set for Pout = 30.8 dBm)
--
430
470
mA
VGG Required for ID2Q = 200 mA
2.3
2.0
1.7
Vdc
Gate Current during RF Operation
2
--
2
mA
DESIGN AND APPLICATIONS INFORMATION
The MRFIC0912 has been designed for high efficiency
900 MHz applications such as analog cellular and Industrial,
Medical and Scientific (ISM) equipment. The two stage MES-
FET design utilizes Motorola's planar refractory gate process
to allow high performance GaAs to be applied to consumer
applications. The proprietary PFP16 package assures good
grounding and low thermal resistance.
As shown in Figure 1, the gate voltage pins can be ganged
together and one voltage applied to both gates to set the
quiescent operating current. Alternatively, VG1 and VG2 can
be set separately. VD1 can be used as power control with a
45 dB per volt sensitivity. The placement of C3 in the VD1
supply line can be varied to optimize RF performance since
T2 is part of a shunt L matching section. On the output, pins
11, 12 and 13, the placement of C11 is adjusted for best RF
performance.
Layout is important for amplifier stability and RF perfor-
mance. Ground vias must be located as close to circuit
ground connections as possible. Power supply bypassing
C3, C6, C9, and C10 must be included to reduce outof
band gain and prevent spurious output.
Evaluation Boards
Evaluation boards are available for RF Monolithic Inte-
grated Circuits by adding a "TF" suffix to the device type.
For a complete list of currently available boards and ones
in development for newly introduced product, please con-
tact your local Motorola Distributor or Sales Office.
3
MRFIC0912
MOTOROLA RF DEVICE DATA
Figure 1. Applications Circuit Configuration
L2
22 nH
T1
50
, 13
@ 840 MHz
T2
50
, 8
@ 840 MHz
BOARD MATERIAL -- GLASS/EPOXY,
r =
4.45, THICKNESS = 18 MIL
1
2
3
4
7
6
5
8
9
10
11
12
13
14
15
16
VD1
RF IN
RF OUT
VD2
C5
C6 C3
C4
R1
C2
L1
T1
C9
C10
C11
C8
VG2
VG1
L2
T2
VGG
C1
R1
1 k
C1
3.3 pF
C2, C3, C8, C9 100 pF
C11
8.2 pF
C6
0.01
F
C10
1
F
C4, C5
1000 pF
L1
10 nH
TYPICAL CHARACTERISTICS
Figure 2. Output Power versus Input Power
30
Pin, INPUT POWER (dBm)
15
20
25
Figure 3. Output Power versus Input Power
15
5
Pin, INPUT POWER (dBm)
35
20
10
P
out
,
OUTPUT
POWER (dBm)
10
10
10
0
5
f = 837 MHz
TEMP = 25
C
35
25
30
5
VDD = 4.0 V
VDD = 4.6 V
0
5
P
out
,
OUTPUT
POWER (dBm)
VDD = 5.8 V
VDD = 4.6 V
f = 837 MHz
T = 25
C
35
C
85
C
MRFIC0912
4
MOTOROLA RF DEVICE DATA
TYPICAL CHARACTERISTICS
T = 25
C
Figure 4. Output Power versus Control Voltage
35
Vcntrl, CONTROL VOLTAGE (VOLTS)
5
Figure 5. Output Power versus Control Voltage
25
Vcntrl, CONTROL VOLTAGE (VOLTS)
5
2
4
6
Figure 6. Power Added Efficiency versus
Input Power
10
Pin, INPUT POWER (dBm)
30
0
5
60
Figure 7. Power Added Efficiency versus
Input Power
Pin, INPUT POWER (dBm)
0
5
60
5
5
10
10
10
0
20
40
15
5
1
2
0
20
50
70
P
AE, POWER
ADDED
EFFICIENCY
(%)
3
4
5
70
35
5
15
25
10
1
3
5
0
0
P
out
,
OUTPUT
POWER (dBm)
P
out
,
OUTPUT
POWER (dBm)
f = 837 MHz
Pin = 7.0 dBm
TEMP = 25
C
VDD = 4.0 V
VDD = 4.6 V
VDD = 5.8 V
VDD = 4.6 V
f = 837 MHz
Pin = 7.0 dBm
35
C
85
C
VDD = 4.0 V
VDD = 4.6 V
VDD = 5.8 V
f = 837 MHz
TEMP = 25
C
40
P
AE, POWER
ADDED
EFFICIENCY
(%)
VDD = 4.6 V
f = 837 MHz
T = 25
C
35
C
85
C
50
10
30
P
AE, POWER
ADDED
EFFICIENCY
(%)
P
AE, POWER
ADDED
EFFICIENCY
(%)
Figure 8. Power Added Efficiency versus
Control Voltage
60
Vcntrl, CONTROL VOLTAGE (VOLTS)
10
0
20
40
30
Figure 9. Power Added Efficiency versus
Control Voltage
0
1
Vcntrl, CONTROL VOLTAGE (VOLTS)
70
40
10
6
60
0
5
0
50
2
3
70
20
50
30
5
f = 837 MHz
Pin = 7.0 dBm
TEMP = 25
C
VDD = 4.0 V
VDD = 4.6 V
VDD = 5.8 V
VDD = 4.6 V
f = 837 MHz
Pin = 7.0 dBm
4
3
2
1
4
35
C
T = 25
C
85
C
5
MRFIC0912
MOTOROLA RF DEVICE DATA
TYPICAL CHARACTERISTICS
85
C
P
AE, POWER
ADDED
EFFICIENCY
(%)
P
AE, POWER
ADDED
EFFICIENCY
(%)
Figure 10. Output Power versus Frequency
34
f, FREQUENCY (MHz)
29
Figure 11. Output Power versus Frequency
31.6
f, FREQUENCY (MHz)
31.2
850
30.6
Figure 12. Power Added Efficiency
versus Frequency
825
f, FREQUENCY (MHz)
59
840
61
Figure 13. Power Added Efficiency
versus Frequency
f, FREQUENCY (MHz)
55
830
61
840
830
850
850
825
825
57
59
31.4
31
30.4
830
835
825
62
840
845
850
63
31.8
30
31
32
33
60
835
830
840
845
T = 25
C
35
C
P
out
,
OUTPUT
POWER (dBm)
P
out
,
OUTPUT
POWER (dBm)
835
845
845
835
VDD = 5.8 V
VDD = 4.0 V
VDD = 4.6 V
Pin = 7.0 dBm
TEMP = 25
C
30.8
Pin = 7.0 dBm
TEMP = 25
C
VDD = 5.8 V
VDD = 4.0 V
VDD = 4.6 V
T = 25
C
35
C
85
C
VDD = 4.6 V
Pin = 7.0 dBm
VDD = 4.6 V
Pin = 7.0 dBm
Figure 14. Drain Current versus Control
Voltage
400
Vcntrl, CONTROL VOLTAGE (VOLTS)
0
50
200
100
5
I D2
, DRAIN CURRENT

(mA)
0
300
450
4
VDD = 4.6 V
f = 837 MHz
Pin = 7.0 dBm
ID2
3
2
1
350
150
250
I , D1
ID1