This document is primarily concerned with the MPC7455; however, unless otherwise noted,
all information here also applies to the MPC7445. The MPC7455 and MPC7445 are reduced
instruction set computing (RISC) microprocessors that implement the PowerPC instruction
set architecture. This document describes pertinent electrical and physical characteristics of
the MPC7455. For functional characteristics of the processor, refer to the MPC7450 RISC
Microprocessor Family User's Manual.

This document contains the following topics:

Topic

Page

Section 1.1, "Overview"

Section 1.2, "Features"

Section 1.3, "Comparison with the MPC7400, MPC7410, MPC7450, MPC7451,

and MPC7441"

Section 1.4, "General Parameters"

Section 1.5, "Electrical and Thermal Characteristics"

Section 1.6, "Pin Assignments"

Section 1.7, "Pinout Listings"

Section 1.8, "Package Description"

Section 1.9, "System Design Information"

Section 1.10, "Document Revision History"

Section 1.11, "Ordering Information"

To locate any published updates for this document, refer to the website at
http://www.motorola.com/semiconductors.

1.1

Overview

The MPC7455 is the third implementation of the fourth generation (G4) microprocessors from
Motorola. The MPC7455 implements the full PowerPC 32-bit architecture and is targeted at
networking and computing systems applications. The MPC7455 consists of a processor core,
a 256-Kbyte L2, and an internal L3 tag and controller which support a glueless backside L3
cache through a dedicated high-bandwidth interface. The MPC7445 is identical to the
MPC7455 except it does not support the L3 cache interface.

Advance Information

MPC7455EC/D
Rev. 2, 1/2003

MPC7455
RISC Microprocessor
Hardware Specifications

MPC7455 RISC Microprocessor Hardware Specifications

MOTOROLA

Features

Figure 1 shows a block diagram of the MPC7455. The core is a high-performance superscalar design
supporting a double-precision floating-point unit and a SIMD multimedia unit. The memory storage
subsystem supports the MPX bus interface to main memory and other system resources. The L3 interface
supports 1 or 2 Mbytes of external SRAM for L3 cache data.

Note that the MPC7455 is footprint-compatible with the MPC7450 and MPC7451, and the MPC7445 is
footprint-compatible with the MPC7441.

1.2

Features

This section summarizes features of the MPC7455 implementation of the PowerPC architecture.

Major features of the MPC7455 are as follows:

High-performance, superscalar microprocessor

-- As many as four instructions can be fetched from the instruction cache at a time

-- As many as three instructions can be dispatched to the issue queues at a time

-- As many as 12 instructions can be in the instruction queue (IQ)

-- As many as 16 instructions can be at some stage of execution simultaneously

-- Single-cycle execution for most instructions

-- One instruction per clock cycle throughput for most instructions

-- Seven-stage pipeline control

Eleven independent execution units and three register files

-- Branch processing unit (BPU) features static and dynamic branch prediction

128-entry (32-set, four-way set-associative) branch target instruction cache (BTIC), a

cache of branch instructions that have been encountered in branch/loop code sequences. If
a target instruction is in the BTIC, it is fetched into the instruction queue a cycle sooner
than it can be made available from the instruction cache. Typically, a fetch that hits the
BTIC provides the first four instructions in the target stream.

2048-entry branch history table (BHT) with two bits per entry for four levels of

prediction--not-taken, strongly not-taken, taken, and strongly taken

Up to three outstanding speculative branches

Branch instructions that do not update the count register (CTR) or link register (LR) are

often removed from the instruction stream.

Eight-entry link register stack to predict the target address of Branch Conditional to Link

-- Four integer units (IUs) that share 32 GPRs for integer operands

Three identical IUs (IU1a, IU1b, and IU1c) can execute all integer instructions except

multiply, divide, and move to/from special-purpose register instructions

IU2 executes miscellaneous instructions including the CR logical operations, integer

multiplication and division instructions, and move to/from special-purpose register
instructions

MOTOROLA

MPC7455 RISC Microprocessor Hardware Specifications

Features

Figure 1. MPC7455 Block Diagram

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MPC7455 RISC Microprocessor Hardware Specifications

MOTOROLA

Features

-- Five-stage FPU and a 32-entry FPR file

Fully IEEE 754-1985-compliant FPU for both single- and double-precision operations

Supports non-IEEE mode for time-critical operations

Hardware support for denormalized numbers

Thirty-two 64-bit FPRs for single- or double-precision operands

-- Four vector units and 32-entry vector register file (VRs)

Vector permute unit (VPU)

Vector integer unit 1 (VIU1) handles short-latency AltiVec integer instructions, such as

vector add instructions (vaddsbs, vaddshs, and vaddsws, for example)

Vector integer unit 2 (VIU2) handles longer-latency AltiVec integer instructions, such as

vector multiply add instructions (vmhaddshs, vmhraddshs, and vmladduhm, for
example)

Vector floating-point unit (VFPU)

-- Three-stage load/store unit (LSU)

Supports integer, floating-point, and vector instruction load/store traffic

Four-entry vector touch queue (VTQ) supports all four architected AltiVec data stream

operations

Three-cycle GPR and AltiVec load latency (byte, half-word, word, vector) with one-cycle

throughput

Four-cycle FPR load latency (single, double) with one-cycle throughput

No additional delay for misaligned access within double-word boundary

Dedicated adder calculates effective addresses (EAs)

Supports store gathering

Performs alignment, normalization, and precision conversion for floating-point data

Executes cache control and TLB instructions

Performs alignment, zero padding, and sign extension for integer data

Supports hits under misses (multiple outstanding misses)

Supports both big- and little-endian modes, including misaligned little-endian accesses

Three issue queues FIQ, VIQ, and GIQ can accept as many as one, two, and three instructions,
respectively, in a cycle. Instruction dispatch requires the following:

-- Instructions can be dispatched only from the three lowest IQ entries--IQ0, IQ1, and IQ2

-- A maximum of three instructions can be dispatched to the issue queues per clock cycle

-- Space must be available in the CQ for an instruction to dispatch (this includes instructions that

are assigned a space in the CQ but not in an issue queue)

Rename buffers

-- 16 GPR rename buffers

-- 16 FPR rename buffers

-- 16 VR rename buffers

Dispatch unit

-- Decode/dispatch stage fully decodes each instruction

MOTOROLA

MPC7455 RISC Microprocessor Hardware Specifications

Features

Completion unit

-- The completion unit retires an instruction from the 16-entry completion queue (CQ) when all

instructions ahead of it have been completed, the instruction has finished execution, and no
exceptions are pending.

-- Guarantees sequential programming model (precise exception model)

-- Monitors all dispatched instructions and retires them in order

-- Tracks unresolved branches and flushes instructions after a mispredicted branch

-- Retires as many as three instructions per clock cycle

Separate on-chip L1 instruction and data caches (Harvard architecture)

-- 32-Kbyte, eight-way set-associative instruction and data caches

-- Pseudo least-recently-used (PLRU) replacement algorithm

-- 32-byte (eight-word) L1 cache block

-- Physically indexed/physical tags

-- Cache write-back or write-through operation programmable on a per-page or per-block basis

-- Instruction cache can provide four instructions per clock cycle; data cache can provide four

words per clock cycle

-- Caches can be disabled in software

-- Caches can be locked in software

-- MESI data cache coherency maintained in hardware

-- Separate copy of data cache tags for efficient snooping

-- Parity support on cache and tags

-- No snooping of instruction cache except for icbi instruction

-- Data cache supports AltiVec LRU and transient instructions

-- Critical double- and/or quad-word forwarding is performed as needed. Critical quad-word

forwarding is used for AltiVec loads and instruction fetches. Other accesses use critical
double-word forwarding.

Level 2 (L2) cache interface

-- On-chip, 256-Kbyte, eight-way set-associative unified instruction and data cache

-- Fully pipelined to provide 32 bytes per clock cycle to the L1 caches

-- A total nine-cycle load latency for an L1 data cache miss that hits in L2

-- PLRU replacement algorithm

-- Cache write-back or write-through operation programmable on a per-page or per-block basis

-- 64-byte, two-sectored line size

-- Parity support on cache

Level 3 (L3) cache interface (not implemented on MPC7445)

-- Provides critical double-word forwarding to the requesting unit

-- Internal L3 cache controller and tags

-- External data SRAMs

-- Support for 1- and 2-Mbyte L3 caches

MPC7455 RISC Microprocessor Hardware Specifications

MOTOROLA

Features

-- Cache write-back or write-through operation programmable on a per-page or per-block basis

-- 64-byte (1M) or 128-byte (2M) sectored line size

-- Private memory capability for half (1-Mbyte minimum) or all of the L3 SRAM space

-- Supports MSUG2 dual data rate (DDR) synchronous Burst SRAMs, PB2 pipelined

synchronous Burst SRAMs, and pipelined (register-register) late write synchronous Burst
SRAMs

-- Supports parity on cache and tags

-- Configurable core-to-L3 frequency divisors

-- 64-bit external L3 data bus sustains 64 bits per L3 clock cycle

Separate memory management units (MMUs) for instructions and data

-- 52-bit virtual address; 32- or 36-bit physical address

-- Address translation for 4-Kbyte pages, variable-sized blocks, and 256-Mbyte segments

-- Memory programmable as write-back/write-through, caching-inhibited/caching-allowed, and

memory coherency enforced/memory coherency not enforced on a page or block basis

-- Separate IBATs and DBATs (eight each) also defined as SPRs

-- Separate instruction and data translation lookaside buffers (TLBs)

Both TLBs are 128-entry, two-way set-associative, and use LRU replacement algorithm

TLBs are hardware- or software-reloadable (that is, on a TLB miss a page table search is

performed in hardware or by system software)

Efficient data flow

-- Although the VR/LSU interface is 128 bits, the L1/L2/L3 bus interface allows up to 256 bits

-- The L1 data cache is fully pipelined to provide 128 bits/cycle to or from the VRs

-- L2 cache is fully pipelined to provide 256 bits per processor clock cycle to the L1 cache

-- As many as eight outstanding, out-of-order, cache misses are allowed between the L1 data

cache and L2/L3 bus

-- As many as 16 out-of-order transactions can be present on the MPX bus

-- Store merging for multiple store misses to the same line. Only coherency action taken

(address-only) for store misses merged to all 32 bytes of a cache block (no data tenure
needed).

-- Three-entry finished store queue and five-entry completed store queue between the LSU and

the L1 data cache

-- Separate additional queues for efficient buffering of outbound data (such as castouts and write

through stores) from the L1 data cache and L2 cache

Multiprocessing support features include the following:

-- Hardware-enforced, MESI cache coherency protocols for data cache

-- Load/store with reservation instruction pair for atomic memory references, semaphores, and

other multiprocessor operations

MOTOROLA

MPC7455 RISC Microprocessor Hardware Specifications

Comparison with the MPC7400, MPC7410, MPC7450, MPC7451, and MPC7441

Power and thermal management

-- 1.3-V processor core

-- The following three power-saving modes are available to the system:

Nap--Instruction fetching is halted. Only those clocks for the time base, decrementer, and

JTAG logic remain running. The part goes into the doze state to snoop memory operations
on the bus and then back to nap using a QREQ/QACK processor-system handshake
protocol.

Sleep--Power consumption is further reduced by disabling bus snooping, leaving only the

PLL in a locked and running state. All internal functional units are disabled.

Deep sleep--When the part is in the sleep state, the system can disable the PLL. The

system can then disable the SYSCLK source for greater system power savings. Power-on
reset procedures for restarting and relocking the PLL must be followed on exiting the deep
sleep state.

-- Thermal management facility provides software-controllable thermal management. Thermal

management is performed through the use of three supervisor-level registers and an
MPC7455-specific thermal management exception.

-- Instruction cache throttling provides control of instruction fetching to limit power

consumption

Performance monitor can be used to help debug system designs and improve software efficiency

In-system testability and debugging features through JTAG boundary-scan capability

Testability

-- LSSD scan design

-- IEEE 1149.1 JTAG interface

-- Array built-in self test (ABIST)--factory test only

Reliability and serviceability

-- Parity checking on system bus and L3 cache bus

-- Parity checking on the L2 and L3 cache tag arrays

1.3

Comparison with the MPC7400, MPC7410,
MPC7450, MPC7451, and MPC7441

Table 1 compares the key features of the MPC7455 with the key features of the earlier MPC7400,
MPC7410, MPC7450, MPC7451, and MPC7441. To achieve a higher frequency, the number of logic levels
per cycle is reduced. Also, to achieve this higher frequency, the pipeline of the MPC7455 is extended
(compared to the MPC7400), while maintaining the same level of performance as measured by the number
of instructions executed per cycle (IPC).

MPC7455 RISC Microprocessor Hardware Specifications

MOTOROLA

Comparison with the MPC7400, MPC7410, MPC7450, MPC7451, and MPC7441

Table 1. Microarchitecture Comparison

Microarchitectural Specs

MPC7455/MPC7445

MPC7450/MPC7451/

MPC7441

MPC7400/MPC7410

Basic Pipeline Functions

Logic inversions per cycle

Pipeline stages up to execute

Total pipeline stages (minimum)

Pipeline maximum instruction
throughput

3 + Branch

2 + Branch

Pipeline Resources

Instruction buffer size

Completion buffer size

Renames (integer, float, vector)

16, 16, 16

6, 6, 6

Maximum Execution Throughput

SFX

Vector

2 (Any 2 of 4 Units)

2 (Permute/Fixed)

Scalar floating-point

Out-of-Order Window Size in Execution Queues

SFX integer units

1 Entry

3 Queues

1 Entry

3 Queues

1 Entry

2 Queues

Vector units

In Order, 4 Queues

In Order, 2 Queues

Scalar floating-point unit

In Order

Branch Processing Resources

Prediction structures

BTIC, BHT, Link Stack

BTIC, BHT

BTIC size, associativity

128-Entry, 4-Way

64-Entry, 4-Way

BHT size

2K-Entry

512-Entry

Link stack depth

None

Unresolved branches supported

Branch taken penalty (BTIC hit)

Minimum misprediction penalty

Execution Unit Timings (Latency-Throughput)

Aligned load (integer, float, vector)

3-1, 4-1, 3-1

2-1, 2-1, 2-1

Misaligned load (integer, float, vector)

4-2, 5-2, 4-2

3-2, 3-2, 3-2

L1 miss, L2 hit latency

9 Data/13 Instruction

9 (11)

SFX (aDd Sub, Shift, Rot, Cmp, logicals)

1-1

Integer multiply (32

8, 32

16, 32

32)

3-1, 3-1, 4-2

2-1, 3-2, 5-4

Scalar float

5-1

3-1

VSFX (vector simple)

1-1

MOTOROLA

MPC7455 RISC Microprocessor Hardware Specifications

Comparison with the MPC7400, MPC7410, MPC7450, MPC7451, and MPC7441

VCFX (vector complex)

4-1

3-1

VFPU (vector float)

4-1

VPER (vector permute)

2-1

1-1

MMUs

TLBs (instruction and data)

128-Entry, 2-Way

Tablewalk mechanism

Hardware + Software

Hardware

Instruction BATs/data BATs

8/8

4/4

L1 I Cache/D Cache Features

Size

32K/32K

Associativity

8-Way

Locking granularity

Way

Full Cache

Parity on I cache

Word

None

Parity on D cache

Byte

None

Number of D cache misses (load/store)

5/1

8 (Any Combination)

Data stream touch engines

4 Streams

On-Chip Cache Features

Cache level

L2 tags and controller

only (see off-chip cache

support below)

Size/associativity

256-Kbyte/8-Way

Access width

256 Bits

Number of 32-byte sectors/line

Parity

Byte

Off-Chip Cache Support

Cache level

On-chip tag logical size

1MB, 2MB

0.5MB, 1MB, 2MB

Associativity

8-Way

2-Way

Number of 32-byte sectors/line

2, 4

1, 2, 4

Off-chip data SRAM support

MSUG2 DDR, LW, PB2 MSUG2 DDR, LW, PB2

LW, PB2, PB3

Data path width

Direct mapped SRAM sizes

1 Mbyte, 2 Mbytes

0.5 Mbyte, 1 Mbyte,

2 Mbytes

Parity

Byte

Notes:
1. Numbers in parentheses are for 2:1 SRAM.
2. Not implemented on MPC7445 or MPC7441.
3. Private memory feature not implemented on MPC7400.

Table 1. Microarchitecture Comparison (continued)

Microarchitectural Specs

MPC7455/MPC7445

MPC7450/MPC7451/

MPC7441

MPC7400/MPC7410

MPC7455 RISC Microprocessor Hardware Specifications

MOTOROLA

General Parameters

1.4

General Parameters

The following list provides a summary of the general parameters of the MPC7455:

Technology

0.18 µm CMOS, six-layer metal

Die size

8.69 mm

× 12.17 mm (106 mm

)

Transistor count

33 million

Logic design

Fully-static

Packages

MPC7445: Surface mount 360 ceramic ball grid array (CBGA)
MPC7455: Surface mount 483 ceramic ball grid array (CBGA)

Core power supply

1.3 V ± 50 mV DC nominal

I/O power supply

1.8 V ± 5% DC, or
2.5 V ± 5% DC, or
1.5 V ± 5% DC (L3 interface only)

1.5

Electrical and Thermal Characteristics

This section provides the AC and DC electrical specifications and thermal characteristics for the MPC7455.

1.5.1

DC Electrical Characteristics

The tables in this section describe the MPC7455 DC electrical characteristics. Table 2 provides the absolute
maximum ratings.

Table 2. Absolute Maximum Ratings

Characteristic

Symbol

Maximum Value

Unit

Notes

Core supply voltage

0.3 to 1.95

PLL supply voltage

0.3 to 1.95

Processor bus supply voltage

BVSEL = 0

0.3 to 1.95

3, 6

BVSEL = HRESET or OV

0.3 to 2.7

3, 7

L3 bus supply voltage

L3VSEL = ¬HRESET

0.3 to 1.65

3, 8

L3VSEL = 0

0.3 to 1.95

3, 9

L3VSEL = HRESET or GV

0.3 to 2.7

3, 10

Input voltage

Processor bus

0.3 to OV

+ 0.3

2, 5

L3 bus

0.3 to GV

+ 0.3

2, 5

JTAG signals

0.3 to OV

+ 0.3

Input voltage

Processor bus

0.3 to OV

+ 0.3

2, 5

JTAG signals

0.3 to OV

+ 0.3

MOTOROLA

MPC7455 RISC Microprocessor Hardware Specifications

Electrical and Thermal Characteristics

Figure 2 shows the undershoot and overshoot voltage on the MPC7455.

Figure 2. Overshoot/Undershoot Voltage

The MPC7455 provides several I/O voltages to support both compatibility with existing systems and
migration to future systems. The MPC7455 core voltage must always be provided at nominal 1.3 V (see
Table 4 for actual recommended core voltage). Voltage to the L3 I/Os and processor interface I/Os are
provided through separate sets of supply pins and may be provided at the voltages shown in Table 3. The
input voltage threshold for each bus is selected by sampling the state of the voltage select pins at the
negation of the signal HRESET. The output voltage will swing from GND to the maximum voltage applied
to the OV

or GV

power pins.

Storage temperature range

stg

55 to 150

°C

Notes:
1.

Functional and tested operating conditions are given in Table 4. Absolute maximum ratings are stress ratings
only, and functional operation at the maximums is not guaranteed. Stresses beyond those listed may affect
device reliability or cause permanent damage to the device.

Caution: Vin must not exceed OV

or GV

by more than 0.3 V at any time including during power-on reset.

Caution: OV

/GV

must not exceed V

/AV

by more than 2.0 V during normal operation; this limit may be

exceeded for a maximum of 20 ms during power-on reset and power-down sequences.

Caution: V

/AV

must not exceed OV

/GV

by more than 1.0 V during normal operation; this limit may be

exceeded for a maximum of 20 ms during power-on reset and power-down sequences.

may overshoot/undershoot to a voltage and for a maximum duration as shown in Figure 2.

BVSEL must be set to 0, such that the bus is in 1.8 V mode.

BVSEL must be set to HRESET or 1, such that the bus is in 2.5 V mode.

L3VSEL must be set to ¬HRESET (inverse of HRESET), such that the bus is in 1.5 V mode.

L3VSEL must be set to 0, such that the bus is in 1.8 V mode.

10. L3VSEL must be set to HRESET or 1, such that the bus is in 2.5 V mode.

Table 2. Absolute Maximum Ratings

(continued)

Characteristic

Symbol

Maximum Value

Unit

Notes

GND

GND 0.3 V

GND 0.7 V

Not to Exceed 10%

/GV

+ 20%

/GV

+ 5%

of t

SYSCLK

MPC7455 RISC Microprocessor Hardware Specifications

MOTOROLA

Electrical and Thermal Characteristics

Table 4 provides the recommended operating conditions for the MPC7455.

Table 3. Input Threshold Voltage Setting

BVSEL Signal

Processor Bus Input

Threshold is Relative to:

L3VSEL Signal

L3 Bus Input Threshold is

Relative to:

Notes

1.8 V

1, 4

¬HRESET

Not Available

¬HRESET

1.5 V

1, 3

HRESET

2.5 V

HRESET

2.5 V

1, 2

2.5 V

Notes:
1. Caution: The input threshold selection must agree with the OV

/GV

voltages supplied. See notes in Table 2.

2. To select the 2.5-V threshold option for the processor bus, BVSEL should be tied to HRESET so that the two

signals change state together. Similarly, to select 2.5 V for the L3 bus, tie L3VSEL to HRESET. This is the
preferred method for selecting this mode of operation.

3. Applicable to L3 bus interface only. ¬HRESET is the inverse of HRESET.
4. If used, pulldown resistors should be less than 250

5. Not implemented on MPC7445.

Table 4. Recommended Operating Conditions

Characteristic

Symbol

Recommended Value

Unit

Notes

Min

Max

Core supply voltage

1.3 V ± 50 mV

PLL supply voltage

1.3 V ± 50 mV

Processor bus supply voltage

BVSEL = 0

1.8 V ± 5%

BVSEL = HRESET or OV

2.5 V ± 5%

L3 bus supply voltage

L3VSEL = 0

1.8 V ± 5%

L3VSEL = HRESET or GV

2.5 V ± 5%

L3VSEL = ¬HRESET

1.5 V ± 5%

Input voltage

Processor bus

GND

L3 bus

GND

JTAG signals

GND

Input voltage

Processor bus

GND

JTAG signals

GND

Die-junction temperature

105

°C

Notes:
1. These are the recommended and tested operating conditions. Proper device operation outside of these conditions

is not guaranteed.

2. This voltage is the input to the filter discussed in Section 1.9.2, "PLL Power Supply Filtering," and not necessarily

the voltage at the AV

pin which may be reduced from V

by the filter.

MOTOROLA

MPC7455 RISC Microprocessor Hardware Specifications

Electrical and Thermal Characteristics

Table 5 provides the package thermal characteristics for the MPC7455.

Table 6 provides the DC electrical characteristics for the MPC7455.

Table 5. Package Thermal Characteristics

Characteristic

Symbol

Value

Unit

Notes

MPC7445 MPC7455

Junction-to-ambient thermal resistance, natural
convection

°C/W

1, 2

Junction-to-ambient thermal resistance, natural
convection, four-layer (2s2p) board

JMA

°C/W

1, 3

Junction-to-ambient thermal resistance, 200 ft/min
airflow, single-layer (1s) board

JMA

°C/W

1, 3

Junction-to-ambient thermal resistance, 200 ft/min
airflow, four-layer (2s2p) board

JMA

°C/W

1, 3

Junction-to-board thermal resistance

°C/W

Junction-to-case thermal resistance

<0.1

°C/W

Notes:
1. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, airflow, power dissipation of other components on the board, and board
thermal resistance.

2. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
3. Per JEDEC JESD51-6 with the board horizontal.
4. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is

measured on the top surface of the board near the package.

5. Thermal resistance between the die and the case top surface as measured by the cold plate method

(MIL SPEC-883 Method 1012.1) with the calculated case temperature. The actual value of R

for the part is less

than 0.1°C/W.

6. Refer to Section 1.9.8, "Thermal Management Information," for more details about thermal management.

Table 6. DC Electrical Specifications

At recommended operating conditions. See Table 4.

Characteristic

Nominal

Bus

Voltage

Symbol

Min

Max

Unit

Notes

Input high voltage
(all inputs except SYSCLK)

1.5

0.65

+ 0.3

1.8

/GV

0.65 OV

/GV

+ 0.3

2.5

1.7

/GV

+ 0.3

Input high voltage
(all inputs except SYSCLK)

1.8

/GV

0.65

+ 0.3

2.5

1.7

+ 0.3

Input low voltage
(all inputs except SYSCLK)

1.5

0.3

0.35

1.8

0.3

/GV

0.35

2.5

0.3

0.7

MPC7455 RISC Microprocessor Hardware Specifications

MOTOROLA

Electrical and Thermal Characteristics

Input low voltage
(all inputs except SYSCLK)

1.8

0.3

0.35

2.5

0.3

0.7

SYSCLK input high voltage

1.4

+ 0.3

SYSCLK input low voltage

0.3

0.4

Input leakage current,
V

= GV

/OV

+ 0.3 V

µA

2, 3

High impedance (off-state) leakage
current, V

= GV

/OV

+ 0.3 V

TSI

µA

2, 3, 5

Output high voltage, I

= 5 mA

1.5

/GV

0.45

1.8

/GV

0.45

2.5

1.7

Output high voltage, I

= 5 mA

1.8

/GV

0.45

2.5

1.7

Output low voltage, I

= 5 mA

1.5

0.45

1.8

0.45

2.5

0.7

Output low voltage, I

= 5 mA

1.8

0.45

2.5

0.7

Capacitance,
V

= 0 V,

f = 1 MHz

L3 interface

9.5

All other inputs

8.0

Capacitance,
V

= 0 V,

f = 1 MHz

All inputs

8.0

Notes:
1. Nominal voltages; see Table 4 for recommended operating conditions.
2. For processor bus signals, the reference is OV

while GV

is the reference for the L3 bus signals.

3. Excludes test signals and IEEE 1149.1 boundary scan (JTAG) signals.
4. Capacitance is periodically sampled rather than 100% tested.
5. The leakage is measured for nominal OV

/GV

and V

, or both OV

/GV

and V

must vary in the same

direction (for example, both OV

and V

vary by either +5% or 5%).

6. Applicable to L3 bus interface only.

Table 6. DC Electrical Specifications (continued)

At recommended operating conditions. See Table 4.

Characteristic

Nominal

Bus

Voltage

Symbol

Min

Max

Unit

Notes

MOTOROLA

MPC7455 RISC Microprocessor Hardware Specifications

Electrical and Thermal Characteristics

Table 7 provides the power consumption for the MPC7455.

1.5.2

AC Electrical Characteristics

This section provides the AC electrical characteristics for the MPC7455. After fabrication, functional parts
are sorted by maximum processor core frequency as shown in Section 1.5.2.1, "Clock AC Specifications,"
and tested for conformance to the AC specifications for that frequency. The processor core frequency is
determined by the bus (SYSCLK) frequency and the settings of the PLL_CFG[0:4] signals. Parts are sold
by maximum processor core frequency; see Section 1.11, "Ordering Information."

1.5.2.1

Clock AC Specifications

Table 8 provides the clock AC timing specifications as defined in Figure 3.

Table 7. Power Consumption for MPC7455

Processor (CPU) Frequency

Unit

Notes

733 MHz

867 MHz

933 MHz

1 GHz

Full-Power Mode

Typical 11.5

12.9

13.6

15.0

Maximum 17.0

19.0

20.0

22.0

Doze Mode

Typical

Nap Mode

Typical

8.0

1, 3

Sleep Mode

Typical

7.6

1, 3

Deep Sleep Mode (PLL Disabled)

Typical

7.3

1, 3

Notes:
1. These values apply for all valid processor bus and L3 bus ratios. The values do not include I/O supply power

(OV

and GV

) or PLL supply power (AV

). OV

and GV

power is system dependent, but is typically <5%

of V

power. Worst case power consumption for AV

< 3 mW.

2. Maximum power is measured at nominal V

(see Table 4) while running an entirely cache-resident, contrived

sequence of instructions which keep the execution units, with or without AltiVec, maximally busy.

3. Typical power is an average value measured at the nominal recommended V

(see Table 4) and 65

C in a

system while running a typical code sequence.

4. Doze mode is not a user-definable state; it is an intermediate state between full-power and either nap or sleep

mode. As a result, power consumption for this mode is not tested.

MPC7455 RISC Microprocessor Hardware Specifications

MOTOROLA

Electrical and Thermal Characteristics

Figure 3 provides the SYSCLK input timing diagram.

Figure 3. SYSCLK Input Timing Diagram

1.5.2.2

Processor Bus AC Specifications

Table 9 provides the processor bus AC timing specifications for the MPC7455 as defined in Figure 4 and
Figure 5. Timing specifications for the L3 bus are provided in Section 1.5.2.3, "L3 Clock AC
Specifications."

Table 8. Clock AC Timing Specifications

At recommended operating conditions. See Table 4.

Characteristic

Symbol

Maximum Processor Core Frequency

Unit

Notes

733 MHz

867 MHz

933 MHz

1 GHz

Min

Max

Min

Max

Min

Max

Min

Max

Processor frequency

core

500

733

500

867

500

933

500

1000

MHz

VCO frequency

VCO

1000

1466

1000

1734

1000

1866

1000

2000

MHz

SYSCLK frequency

SYSCLK

133

MHz

SYSCLK cycle time

SYSCLK

7.5

SYSCLK rise and fall time

, t

1.0

SYSCLK duty cycle
measured at OV

KHKL

SYSCLK

SYSCLK jitter

± 150

4, 6

Internal PLL relock time

100

Notes:
1. Caution: The SYSCLK frequency and PLL_CFG[0:4] settings must be chosen such that the resulting SYSCLK

(bus) frequency, CPU (core) frequency, and PLL (VCO) frequency do not exceed their respective maximum or
minimum operating frequencies. Refer to the PLL_CFG[0:4] signal description in Section 1.9.1, "PLL
Configuration," for valid PLL_CFG[0:4] settings.

2. Rise and fall times for the SYSCLK input measured from 0.4 to 1.4 V.
3. Timing is guaranteed by design and characterization.
4. This represents total input jitter--short term and long term combined--and is guaranteed by design.
5. Relock timing is guaranteed by design and characterization. PLL-relock time is the maximum amount of time

required for PLL lock after a stable V

and SYSCLK are reached during the power-on reset sequence. This

specification also applies when the PLL has been disabled and subsequently re-enabled during sleep mode. Also
note that HRESET must be held asserted for a minimum of 255 bus clocks after the PLL-relock time during the
power-on reset sequence.

6. The SYSCLK driver's closed loop jitter bandwidth should be <500 kHz at 20 dB. The bandwidth must be set low

to allow cascade connected PLL-based devices to track SYSCLK drivers with the specified jitter.

SYSCLK

VM = Midpoint Voltage (OV

/2)

SYSCLK

KHKL

MOTOROLA

MPC7455 RISC Microprocessor Hardware Specifications

Electrical and Thermal Characteristics

Table 9. Processor Bus AC Timing Specifications

At recommended operating conditions. See Table 4.

Parameter

Symbol

All Speed Grades

Unit

Notes

Min

Max

Mode select input setup to HRESET

MVRH

SYSCLK

3, 4, 5, 6

HRESET to mode select input hold

MXRH

3, 6

Input setup times:

A[0:35], AP[0:4], GBL, TBST, TSIZ[0:2], TT[0:3],

D[0:63], DP[0:7]

AACK, ARTRY, BG, CKSTP_IN, DBG, DTI[0:3],

QACK, TA, TBEN, TEA, TS, EXT_QUAL,

PMON_IN, SHD[0:1]

AVKH

IVKH

2.0

Input hold times:

A[0:35], AP[0:4], GBL, TBST, TSIZ[0:2], TT[0:3],

D[0:63], DP[0:7]

AACK, ARTRY, BG, CKSTP_IN, DBG, DTI[0:3],

QACK, TA,TBEN, TEA, TS,EXT_QUAL,
PMON_IN, SHD[0:1]

AXKH

IXKH

Output valid times:

A[0:35], AP[0:4], GBL, TBST, TSIZ[0:2], TT[0:3], WT, CI
TS
D[0:63], DP[0:7]
ARTRY/SHD0/SHD1
BR, CKSTP_OUT, DRDY, HIT, PMON_OUT, QREQ]

KHAV

KHTSV

KHDV

KHARV

KHOV

--
--
--
--
--

2.5
2.5
2.5
2.5
2.5

Output hold times:

A[0:35], AP[0:4], GBL, TBST, TSIZ[0:2], TT[0:3], WT, CI
TS
D[0:63], DP[0:7]
ARTRY/SHD0/SHD1
BR, CKSTP_OUT, DRDY, HIT, PMON_OUT, QREQ

KHAX

KHTSX

KHDX

KHARX

KHOX

0.5
0.5
0.5
0.5
0.5

--
--
--
--
--

SYSCLK to output enable

KHOE

0.5

SYSCLK to output high impedance (all except TS, ARTRY,
SHD0, SHD1)

KHOZ

3.5

SYSCLK to TS high impedance after precharge

KHTSPZ

SYSCLK

5, 7, 10

Maximum delay to ARTRY/SHD0/SHD1 precharge

KHARP

SYSCLK

5, 8,

9, 10

MPC7455 RISC Microprocessor Hardware Specifications

MOTOROLA

Electrical and Thermal Characteristics

Figure 4 provides the AC test load for the MPC7455.

Figure 4. AC Test Load

SYSCLK to ARTRY/SHD0/SHD1 high impedance after
precharge

KHARPZ

SYSCLK

5, 8,

9, 10

Notes:
1.

All input specifications are measured from the midpoint of the signal in question to the midpoint of the rising edge
of the input SYSCLK. All output specifications are measured from the midpoint of the rising edge of SYSCLK to
the midpoint of the signal in question. All output timings assume a purely resistive 50-

load (see Figure 4). Input

and output timings are measured at the pin; time-of-flight delays must be added for trace lengths, vias, and
connectors in the system.

The symbology used for timing specifications herein follows the pattern of t

(signal)(state)(reference)(state)

for inputs

and t

(reference)(state)(signal)(state)

for outputs. For example, t

IVKH

symbolizes the time input signals (I) reach the valid

state (V) relative to the SYSCLK reference (K) going to the high (H) state or input setup time. And t

KHOV

symbolizes the time from SYSCLK(K) going high (H) until outputs (O) are valid (V) or output valid time. Input hold
time can be read as the time that the input signal (I) went invalid (X) with respect to the rising clock edge (KH)
(note the position of the reference and its state for inputs) and output hold time can be read as the time from the
rising edge (KH) until the output went invalid (OX).

The setup and hold time is with respect to the rising edge of HRESET (see Figure 5).

This specification is for configuration mode select only.

SYSCLK

is the period of the external clock (SYSCLK) in ns. The numbers given in the table must be multiplied by

the period of SYSCLK to compute the actual time duration (in ns) of the parameter in question.

Mode select signals are: BVSEL, L3VSEL, PLL_CFG[0:4], BMODE[0:1].

According to the bus protocol, TS is driven only by the currently active bus master. It is asserted low then
precharged high before returning to high impedance as shown in Figure 6. The nominal precharge width for TS is
0.5

SYSCLK

, that is, less than the minimum t

SYSCLK

period, to ensure that another master asserting TS on the

following clock will not contend with the precharge. Output valid and output hold timing is tested for the signal
asserted. Output valid time is tested for precharge.The high-impedance behavior is guaranteed by design.

According to the bus protocol, ARTRY can be driven by multiple bus masters through the clock period
immediately following AACK. Bus contention is not an issue because any master asserting ARTRY will be driving
it low. Any master asserting it low in the first clock following AACK will then go to high impedance for one clock
before precharging it high during the second cycle after the assertion of AACK. The nominal precharge width for
ARTRY is 1.0 t

SYSCLK

; that is, it should be high impedance as shown in Figure 6 before the first opportunity for

another master to assert ARTRY. Output valid and output hold timing is tested for the signal asserted. The
high-impedance behavior is guaranteed by design.

According to the MPX bus protocol, SHD0 and SHD1 can be driven by multiple bus masters beginning the cycle
of TS. Timing is the same as ARTRY, that is, the signal is high impedance for a fraction of a cycle, then negated
for up to an entire cycle (crossing a bus cycle boundary) before being three-stated again. The nominal precharge
width for SHD0 and SHD1 is 1.0 t

SYSCLK

. The edges of the precharge vary depending on the programmed ratio

of core to bus (PLL configurations).

10. Guaranteed by design and not tested.

Table 9. Processor Bus AC Timing Specifications

(continued)

At recommended operating conditions. See Table 4.

Parameter

Symbol

All Speed Grades

Unit

Notes

Min

Max

Output

= 50

MPC7455 RISC Microprocessor Hardware Specifications

MOTOROLA

Electrical and Thermal Characteristics

1.5.2.3

L3 Clock AC Specifications

The L3_CLK frequency is programmed by the L3 configuration register (L3CR[6:8]) core-to-L3 divisor
ratio. See Table 18 for example core and L3 frequencies at various divisors. Table 10 provides the potential
range of L3_CLK output AC timing specifications as defined in Figure 7.

The maximum L3_CLK frequency is the core frequency divided by two. Given the high core frequencies
available in the MPC7455, however, most SRAM designs will be not be able to operate in this mode using
current technology and, as a result, will select a greater core-to-L3 divisor to provide a longer L3_CLK
period for read and write access to the L3 SRAMs. Therefore, the maximum L3_CLK frequency shown in
Table 10 is considered to be the practical maximum in a typical system. The maximum L3_CLK frequency
for any application of the MPC7455 will be a function of the AC timings of the MPC7455, the AC timings
for the SRAM, bus loading, and printed-circuit board trace length, and may be greater or less than the value
given in Table 10.

Motorola is similarly limited by system constraints and cannot perform tests of the L3 interface on a
socketed part on a functional tester at the maximum frequencies of Table 10. Therefore, functional operation
and AC timing information are tested at core-to-L3 divisors which result in L3 frequencies at 200 MHz or
less.

Table 10. L3_CLK Output AC Timing Specifications

At recommended operating conditions. See Table 4.

Parameter

Symbol

All Speed Grades

Unit

Notes

Min

Max

L3 clock frequency

L3_CLK

266

MHz

L3 clock cycle time

L3_CLK

3.75

13.3

L3 clock duty cycle

CHCL

L3_CLK

L3 clock output-to-output skew (L1_CLK0 to L1_CLK1)

L3CSKW1

200

L3 clock output-to-output skew (L1_CLK[0:1] to
L1_ECHO_CLK[2:3])

L3CSKW2

100

L3 clock jitter

±50

Notes:
1. The maximum L3 clock frequency will be system dependent. See Section 1.5.2.3, "L3 Clock AC Specifications,"

for an explanation that this maximum frequency is not functionally tested at speed by Motorola.

2. The nominal duty cycle of the L3 output clocks is 50% measured at midpoint voltage.
3. Maximum possible skew between L3_CLK0 and L3_CLK1. This parameter is critical to the address and control

signals which are common to both SRAM chips in the L3.

4. Maximum possible skew between L3_CLK0 and L3_ECHO_CLK1 or between L3_CLK1 and L3_ECHO_CLK3 for

PB2 or late write SRAM. This parameter is critical to the write data signals which are separately latched onto each
SRAM part by these pairs of signals.

5. Guaranteed by design and not tested. The input jitter on SYSCLK affects L3 output clocks and the L3

address/data/control signals equally and, therefore, is already comprehended in the AC timing and does not have
to be considered in the L3 timing analysis. The clock-to-clock jitter shown here is uncertainty in the internal clock
period caused by supply voltage noise or thermal effects. This must be accounted for, along with clock skew, in
any L3 timing analysis.

MOTOROLA

MPC7455 RISC Microprocessor Hardware Specifications

Electrical and Thermal Characteristics

The L3_CLK timing diagram is shown in Figure 7.

Figure 7. L3_CLK_OUT Output Timing Diagram

1.5.2.4

L3 Bus AC Specifications

The MPC7455 L3 interface supports three different types of SRAM: source-synchronous, double data rate
(DDR) MSUG2 SRAM, late write SRAMs, and pipeline burst (PB2) SRAMs. Each requires a different
protocol on the L3 interface and a different routing of the L3 clock signals. The type of SRAM is
programmed in L3CR[22:23] and the MPC7455 then follows the appropriate protocol for that type. The
designer must connect and route the L3 signals appropriately for each type of SRAM. Following are some
observations about the chip-to-SRAM interface.

The routing for the point-to-point signals (L3_CLK[0:1], L3DATA[0:63], L3DP[0:7], and
L3_ECHO_CLK[0:3]) to a particular SRAM should be delay matched. If necessary, the length of
traces can be altered in order to intentionally skew the timing and provide additional setup or hold
time margin.

For a 1-Mbyte L3, use address bits 16:0 (bit 0 is LSB)

No pull-up resistors are required for the L3 interface

For high speed operations, L3 interface address and control signals should be a `T' with minimal
stubs to the two loads; data and clock signals should be point-to-point to their single load. Figure 8
shows the AC test load for the L3 interface.

Figure 8. AC Test Load for the L3 Interface

In general, if routing is short, delay-matched, and designed for incident wave reception and minimal
reflection, there is a high probability that the AC timing of the MPC7455 L3 interface will meet the
maximum frequency operation of appropriately chosen SRAMs. This is despite the pessimistic,
guard-banded AC specifications (see Table 12, Table 13, and Table 14), the limitations of functional testers

L3_CLK0

L3CR

L3CF

L3_CLK1

L3_CLK

CHCL

L3CSKW1

L3_ECHO_CLK1

L3_ECHO_CLK3

L3CSKW2

For PB2 or Late Write:

Output

= 50

MPC7455 RISC Microprocessor Hardware Specifications

MOTOROLA

Electrical and Thermal Characteristics

described in Section 1.5.2.3, "L3 Clock AC Specifications," and the uncertainty of clocks and signals which
inevitably make worst-case critical path timing analysis pessimistic.

More specifically, certain signals within groups should be delay-matched with others in the same group
while intergroup routing is less critical. Only the address and control signals are common to both SRAMs
and additional timing margin is available for these signals. The double-clocked data signals are grouped
with individual clocks as shown in Figure 9 or Figure 11, depending on the type of SRAM. For example,
for the MSUG2 DDR SRAM (see Figure 9); L3DATA[0:31], L3DP[0:3], and L3_CLK[0] form a closely
coupled group of outputs from the MPC7455; while L3DATA[0:15], L3DP[0:1], and L3_ECHO_CLK[0]
form a closely coupled group of inputs.

The MPC7450 RISC Microprocessor Family User's Manual refers to logical settings called `sample points'
used in the synchronization of reads from the receive FIFO. The computation of the correct value for this
setting is system-dependent and is described in the MPC7450 RISC Microprocessor Family User's Manual.
Three specifications are used in this calculation and are given in Table 11. It is essential that all three
specifications are included in the calculations to determine the sample points, as incorrect settings can result
in errors and unpredictable behavior. For more information, see the MPC7450 RISC Microprocessor Family
User's Manual.

1.5.2.4.1

L3 Bus AC Specifications for DDR MSUG2 SRAMs

When using DDR MSUG2 SRAMs at the L3 interface, the parts should be connected as shown in Figure 9.

Outputs from the MPC7455 are actually launched on the edges of an internal clock phase-aligned to
SYSCLK (adjusted for core and L3 frequency divisors). L3_CLK0 and L3_CLK1 are this internal clock
output with 90° phase delay, so outputs are shown synchronous to L3_CLK0 and L3_CLK1. Output valid
times are typically negative when referenced to L3_CLKn because the data is launched one-quarter period
before L3_CLKn to provide adequate setup time at the SRAM after the delay-matched address, control,
data, and L3_CLKn signals have propagated across the printed-wiring board.

Inputs to the MPC7455 are source-synchronous with the CQ clock generated by the DDR MSUG2 SRAMs.
These CQ clocks are received on the L3_ECHO_CLKn inputs of the MPC7455. An internal circuit delays
the incoming L3_ECHO_CLKn signal such that it is positioned within the valid data window at the internal
receiving latches. This delayed clock is used to capture the data into these latches which comprise the

Table 11. Sample Points Calculation Parameters

Parameter

Symbol

Max

Unit

Notes

Delay from processor clock to internal_L3_CLK

3/4

L3_CLK

Delay from internal_L3_CLK to L3_CLKn output pins

Delay from L3_ECHO_CLKn to receive latch

ECI

Notes:
1. This specification describes a logical offset between the internal clock edge used to launch the L3 address and

control signals (this clock edge is phase-aligned with the processor clock edge) and the internal clock edge used
to launch the L3_CLKn signals. With proper board routing, this offset ensures that the L3_CLKn edge will arrive at
the SRAM within a valid address window and provide adequate setup and hold time. This offset is reflected in the
L3 bus interface AC timing specifications, but must also be separately accounted for in the calculation of sample
points and, thus, is specified here.

2. This specification is the delay from a rising or falling edge on the internal_L3_CLK signal to the corresponding

rising or falling edge at the L3CLKn pins.

3. This specification is the delay from a rising or falling edge of L3_ECHO_CLKn to data valid and ready to be

sampled from the FIFO.

MOTOROLA

MPC7455 RISC Microprocessor Hardware Specifications

Electrical and Thermal Characteristics

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D

t
a

r
i
t
y

DXEH

L3D

_CLK

+ 0.

--t

_CLK

+ 0.3

--t

_CLK

+ 0.3

--t

_CLK

+ 0.3

--n

,
4

l
i
d

tim

:
D

t
a

d p

CHDV

CLDV

--(

_CL

)

+ 0

.
4 0

--(

L3_CLK

)

+ 0.

--(

3_CL

)

+ 0.7

--(

3_CL

)

+ 0.9

5, 6,

l
i
d

tim

:
All

her o

--t

L3_

CLK

+ 0.8

--t

L3_

CLK

+ 0.9

--t

_CLK

+ 1.1

--t

_CLK

+ 1.2

t
put

hol

d t

i
m

t
a

r
i
t
y

L3C

HDX

L3C

LDX

L3_

CLK

.
40

--t

L3_

CLK

0.2

--t

L3_

CLK

.
08

--t

_CLK

+ 0.0

--n

,
6

t
put

hol

d t

i
m

All

oth

t
p

t
s

L3_

CLK

.
20

--t

L3_

CLK

.
04

--t

L3_

CLK

+ 0

.
12

--t

_CLK

+ 0.2

--n

,
7

3_C

hig

eda

t
a

L3C

LDZ

--t

L3_

CLK

L3_

CLK

_CLK

MPC7455 RISC Microprocessor Hardware Specifications

MOTOROLA

Electrical and Thermal Characteristics

3_C

ped

anc

All

t
he

r ou

tput

CHO

--t

L3_

CLK

+ 2

.
0

--t

L3_

CLK

+ 2

.
0

L3_

CLK

+ 2

.
0

--t

_CLK

+ 2

.
0

--n

i
se

d fa

tim

for

the

L3_

K o

ut a

r
e m

ure

r
om

20%

% of

r DDR,

l
l
i

t

s

i
f
i
c

t
i
o

r
e

r
o

i
d

i
n

t
o

f

th

i
g

l
i

i
n

t
vo

l
t
a

f

th

ing

fall

g ed

of t

he i

L3_

gure

)
. In

put

tim

i
ng

are

mea

r
ed

at t

he p

i
n

r DDR,

t

d

t
a

l
l

ty

i
ca

l
l
y

l
l
o

f
L

CHO_

how

Fig

. Fo

r co

tenc

i
th

oth

inp

t s

p t

i
m

pec

atio

, th

i
ll
be

trea

ted

neg

ati

put

tup

tim

3_CL

/
4

e-fo

urth

the

riod

L3_

.
Thi

ter i

ndi

tes

tha

t
th

e M

745

5 c

tch

inp

t s

i
g

nal

tha

t
i

l
i
d f

r o

a s

r
t ti

fore

and

a s

hort

tim

fte

r the

oin

t
be

n th

e ri

sin

fal

lin

g (o

r fal

lin

g a

ris

i
ng

) ed

ges

L3_

at a

freq

uen

l

o

t
p

t sp

i
f
i
c

t
i
o

r
e

fro

i
d

i
n

t
v

l
t
a

f
th

i
n

r fo

r DDR wri

t
e

t
a

,
a

l
so

l
l
i
n

)
e

L3_

K to

the

oin

t
of

the

sig

l
in

tio

. Th

e o

ut t

i
mi

s a

r
e m

ed a

t
th

e p

i
ns

. Al

l o

tpu

t
ti

ngs

pure

l
y

res

i
s

t
iv

e 5

oad

ee F

i
gu

)
.

r DDR,

t
p

t
a

l
l
typ

i
c

l
l
y

f
L

how

Fig

10.

For

con

i
s

y w

i
th o

t
he

r ou

tpu

t
va

li
d ti

ifi

ion

thi

i
ll b

trea

ted

neg

ati

out

put

lid

tim

3_CL

/
4

ne-fo

urth

the

rio

L3_

. Thi

ter i

i
ca

tes

at t

he s

i
f
ie

d ou

tpu

t
s

i
gn

tual

unc

d b

tern

k d

d i

pha

°. The

r
efo

r
e,

ther

e is

freq

uen

pon

ent

to t

he o

ut v

l
i
d

and

tput

ld t

i
m

tha

t
the

pec

ifi

outp

i
gn

i
ll
be

l
i
d

app

rox

i
m

tel

one

LK p

od s

t
a

r
tin

ree-f

ourt

of a

k p

r
io

r to

the

edg

e o

i
c

the

ill

it a

end

ing

e-fo

urth

of a

l
oc

k peri

afte

r the

it w

i
ll b

l
ed.

.
Th

e c

onf

igu

r
ati

bit

llo

the

ng o

f
th

e L

terf

ace

alt

red

a s

re.

L3O

[
12]

, L3

[
12]

.
R

i
s

i
on

s o

f
th

e M

not

des

cri

cum

t
m

ent

thes

bit

i
f
f
e

ren

t
ly

.
See

Sec

t
io

.
1

1.1,

art

bers

lly

dres

d b

t," a

Sec

t
ion

.
2, "

art N

ers

t Full

y Addre

Thi

nt," for

form

ati

on w

i
c

s are add

res

doc

ble

.

L

Bus

r
f
a

AC T

i
ming S

ific

t
ions

r
M

UG2

ontinue

t

recom

ended

operat

ing c

ondit

i
ons.

ee T

able

rame

ter

l
l
Spee

d G

r
ade

Unit

Note

0 =

0, L

1 =

= 0

,
L3O

0 =

1, L3

1 = 0

1, L3

= 1

Min

MOTOROLA

MPC7455 RISC Microprocessor Hardware Specifications

Electrical and Thermal Characteristics

Figure 9 shows the typical connection diagram for the MPC7455 interfaced to MSUG2 SRAMs such as the
Motorola MCM64E836.

Figure 9. Typical Source Synchronous 2-Mbyte L3 Cache DDR Interface

{L3DATA[0:15],

{L3DATA[16:31],

{L3_DATA[32:47],

L3ADDR[17:0]

L3_CNTL[0]

L3_CLK[0]

L3_CLK[1]

L3_ECHO_CLK[0]

L3_ECHO_CLK[1]

L3ECHO_CLK[2]

L3_ECHO_CLK[3]

{L3DATA[48:63],

L3DP[0:1]}

L3DP[2:3]}

L3DP[4:5]}

L3DP[6:7]}

SA[17:0]

SRAM 0

SRAM 1

D[0:17]

D[18:35]

SA[17:0]

B1
B2

D[0:17]

D[18:35]

L3_CNTL[1]

GND

MPC7455

Denotes

Receive (SRAM

to MPC7455)

Aligned Signals

Denotes

Transmit

(MPC7455 to

SRAM)

Aligned Signals

LBO

Note:
1. Or as recommended by SRAM manufacturer for single-ended clocking.

MPC7455 RISC Microprocessor Hardware Specifications

MOTOROLA

Electrical and Thermal Characteristics

Figure 10 shows the L3 bus timing diagrams for the MPC7455 interfaced to MSUG2 SRAMs.

Figure 10. L3 Bus Timing Diagrams for L3 Cache DDR SRAMs

1.5.2.4.2

L3 Bus AC Specifications for PB2 and Late Write SRAMs

When using PB2 or late write SRAMs at the L3 interface, the parts should be connected as shown in
Figure 11. These SRAMs are synchronous to the MPC7455; one L3_CLKn signal is output to each SRAM
to latch address, control, and write data. Read data is launched by the SRAM synchronous to the delayed
L3_CLKn signal it received. The MPC7455 needs a copy of that delayed clock which launched the SRAM
read data to know when the returning data will be valid. Therefore, L3_ECHO_CLK1 and
L3_ECHO_CLK3 must be routed halfway to the SRAMs and then returned to the MPC7455 inputs
L3_ECHO_CLK0 and L3_ECHO_CLK2, respectively. Thus, L3_ECHO_CLK0 and L3_ECHO_CLK2 are
phase-aligned with the input clock received at the SRAMs. The MPC7455 will latch the incoming data on
the rising edge of L3_ECHO_CLK0 and L3_ECHO_CLK2.

Table 13 provides the L3 bus interface AC timing specifications for the configuration shown in Figure 11,
assuming the timing relationships of Figure 12 and the loading of Figure 8.

L3_ECHO_CLK[0,1,2,3]

L3 Data and Data

VM = Midpoint Voltage (GV

/2)

Parity Inputs

L3_CLK[0,1]

ADDR, L3CNTL

L3CHOV

L3CHOX

L3DATA WRITE

L3CHOZ

L3CHDV

L3CHDX

Outputs

Inputs

L3CLDV

L3CLDX

L3CLDZ

L3DVEH

L3DXEL

L3DVEL

L3DXEH

Note: t

L3DVEH

and t

L3DVEL

as drawn here will be negative numbers, that is, input setup time will be

time after the clock edge.

Note: t

L3CHDV

and t

L3CLDV

as drawn here will be negative numbers, that is, output valid time will be

time before the clock edge.

VM = Midpoint Voltage (GV

/2)

MOTOROLA

MPC7455 RISC Microprocessor Hardware Specifications

Electrical and Thermal Characteristics

ble

.

L3

Bus

Int

r
f
a

AC T

i
ming Spe

i
fic

tions

for

PB2

r
it

t

recom

ended

operat

ing c

ondit

i
ons.

ee T

able

rame

ter

l
l
Spee

d G

r
ade

Unit

Note

0 =

0, L

1 =

= 0

,
L3O

0 =

1, L3

1 = 0

1, L3

= 1

Min

3_CL

ris

fall

--1

.
0

--1

.
0

--1

.
0

--1

.
0

,
5

tup

tim

:
Dat

nd p

L3D

.
5--

,
5

put

ld t

i
m

s: D

t
a

d p

rit

L3D

--0

.
5

--0

.
5

--0

.
5

--0

.
5

,
5

l
i
d t

i
m

s: D

t
a

d p

rit

CHD

--t

L3_

CLK

+ 1.0

--t

L3_

CLK

+ 1.

--t

_CLK

+ 1.3

--t

_CLK

+ 1.4

4, 5

l
i
d t

i
m

s: A

l
l
oth

r o

--t

L3_

CLK

+ 1.0

--t

L3_

CLK

+ 1.

--t

_CLK

+ 1.3

--t

_CLK

+ 1.4

ut hol

s: D

t
a

and

r
i
t
y

CHD

L3_

CLK

.
40

--t

L3_

CLK

0.2

--t

L3_

CLK

--t

_CLK

+ 0.0

--n

,
4

,
5

ut hol

s: All othe

outpu

t
s

L3_

CLK

.
40

--t

L3_

CLK

0.2

--t

L3_

CLK

--t

_CLK

+ 0.0

--n

,
5

3_C

t
o

hig

dan

ce: D

t
a

nd p

L3C

HDZ

--2

.
0

--2

.
0

--2

.
0

--2

.
0

MPC7455 RISC Microprocessor Hardware Specifications

MOTOROLA

Electrical and Thermal Characteristics

3_C

hig

nce

:
Al

t
her

out

put

CHO

--2

.
0

--2

.
0

--2

.
0

--2

.
0

Note

i
se

and

ll t

i
m

for t

L3_

K ou

tpu

t
ar

e m

eas

ure

fro

20%

80%

l i

npu

t s

pec

ica

t
io

are

ured

fro

e m

i
d

poi

of th

e s

i
g

nal

que

ion

the

dpo

int

ge o

f
th

e ri

edg

the

put

L3_

i
gu

). I

npu

t ti

ngs

are

eas

ure

the

out

put

pec

ifi

t
io

r
e

mea

r
ed

fro

the

i
d

poi

ris

i
ng

dge

f
L

3_C

to the

i
d

poi

nt of th

i
g

nal

i
n

que

ion

.

T

he ou

tpu

t

ti

s are

r
ed

at th

e p

i
ns

. Al

l o

ut ti

s a

pur

ely

res

i
s

t
iv

e 5

(

i
gu

r
e

)
.

3_C

e-fo

urth

the

riod

L3_

.
Thi

ter i

ndi

tes

tha

t
th

e s

ied

tput

gna

l i

t
ual

lau

hed

tern

clo

yed

has

90°.

The

r
efo

r
e, t

here

frequ

one

nt t

e o

ut v

l
i
d a

out

put

hol

d ti

s s

hat

the

ifi

ed o

t s

i
g

nal

wil

l
b

li
d fo

ppr

oxi

t
el

y o

L3_

K p

rio

t
art

i
ng

thre

e-fo

urth

s o

f
a

k p

r
ior

to t

he e

i
c

the

i
ll
sa

it a

end

ing

e-fo

urth

of a

k p

fter

the

edg

e i

t
wil

l
b

i
mi

beh

ior

and

ara

riz

tio

r
e c

rre

ntl

g e

l
ua

ted

.
Th

ese

onfi

gur

atio

n b

i
t
s

low

the

tim

i
n

f
the

terfa

be a

l
te

red

a s

ftw

r
e. L

[
12],

L30

L3C

[
1

visi

s o

f
th

e M

745

t d

bed

doc

t m

ple

t t

hes

e b

i
t
s

f
f
e

ren

t
ly

See

Sec

t
ion

.
1

.
1,

"Part

ers

lly

Add

r
es

d b

ent

," an

ion

.
2, "Part N

ers

t F

ll
y Ad

dre

Thi

nt," f

r m

form

ati

on w

h d

s a

r
e a

ddr

ess

thi

doc

ble

.

L

Bus

r
f
a

AC T

i
ming S

ific

t
ions

r
P

nd La

r
ite

RAM

ontinue

t

recom

ended

operat

ing c

ondit

i
ons.

ee T

able

rame

ter

l
l
Spee

d G

r
ade

Unit

Note

0 =

0, L

1 =

= 0

,
L3O

0 =

1, L3

1 = 0

1, L3

= 1

Min

MOTOROLA

MPC7455 RISC Microprocessor Hardware Specifications

Electrical and Thermal Characteristics

Figure 11 shows the typical connection diagram for the MPC7455 interfaced to PB2 SRAMs, such as the
Motorola MCM63R737, or late write SRAMs, such as the Motorola MCM63R836A.

Figure 11. Typical Synchronous 1-MByte L3 Cache Late Write or PB2 Interface

L3_ADDR[16:0]

L3_CNTL[0]

SA[16:0]

SRAM 0

DQ[0:17]

DQ[18:36

]

L3_CNTL[1]

GND

SRAM 1

GND

{L3_DATA[0:15],

{L3_DATA[16:31],

{L3_DATA[32:47],

L3_CLK[0]

L3_CLK[1]

L3_ECHO_CLK[0]

L3_ECHO_CLK[1]

L3_ECHO_CLK[2]

{L3_DATA[48:63],

L3_DP[0:1]}

L3_DP[2:3]}

L3_DP[4:5]}

L3_DP[6:7]}

Denotes

Receive (SRAM

to MPC7455)

Aligned Signals

MPC7455

Denotes

Transmit

(MPC7455 to

SRAM)

Aligned Signals

L3_ECHO_CLK[3]

SA[16:0]

DQ[0:17]

DQ[18:36

]

Note:
1. Or as recommended by SRAM manufacturer for single-ended clocking.

MPC7455 RISC Microprocessor Hardware Specifications

MOTOROLA

Electrical and Thermal Characteristics

Figure 12 shows the L3 bus timing diagrams for the MPC7455 interfaced to PB2 or late write SRAMs.

Figure 12. L3 Bus Timing Diagrams for Late Write or PB2 SRAMs

1.5.2.5

IEEE 1149.1 AC Timing Specifications

Table 14 provides the IEEE 1149.1 (JTAG) AC timing specifications as defined in Figure 14 through
Figure 17.

Table 14. JTAG AC Timing Specifications (Independent of SYSCLK)

At recommended operating conditions. See Table 4.

Parameter

Symbol

Min

Max

Unit

Notes

TCK frequency of operation

TCLK

33.3

MHz

TCK cycle time

TCLK

TCK clock pulse width measured at 1.4 V

JHJL

TCK rise and fall times

and t

TRST assert time

TRST

Input setup times:

Boundary-scan data
TMS, TDI

DVJH

IVJH

4
0

--
--

Input hold times:

Boundary-scan data
TMS, TDI

DXJH

IXJH

20
25

--
--

L3_ECHO_CLK[0,2]

L3 Data and Data

VM = Midpoint Voltage (GV

/2)

L3DVEH

L3DXEH

Parity Inputs

L3_CLK[0,1]

ADDR, L3_CNTL

L3CHOV

L3CHOX

L3DATA WRITE

L3CHDZ

Outputs

Inputs

L3_ECHO_CLK[1,3]

L3CHDV

L3CHDX

L3CHOZ

MOTOROLA

MPC7455 RISC Microprocessor Hardware Specifications

Electrical and Thermal Characteristics

Figure 13

provides the AC test load for TDO and the boundary-scan outputs of the MPC7455.

Figure 13. Alternate AC Test Load for the JTAG Interface

Figure 14 provides the JTAG clock input timing diagram.

Figure 14. JTAG Clock Input Timing Diagram

Figure 15 provides the TRST timing diagram.

Figure 15. TRST Timing Diagram

Valid times:

Boundary-scan data
TDO

JLDV

JLOV

4
4

20
25

Output hold times:

Boundary-scan data
TDO

JLDX

JLOX

TBD
TBD

TCK to output high impedance:

Boundary-scan data
TDO

JLDZ

JLOZ

3
3

4, 5

Notes:

1. All outputs are measured from the midpoint voltage of the falling/rising edge of TCLK to the midpoint of the signal

in question. The output timings are measured at the pins. All output timings assume a purely resistive 50-

load

(see Figure 13). Time-of-flight delays must be added for trace lengths, vias, and connectors in the system.

2. TRST is an asynchronous level sensitive signal. The setup time is for test purposes only.
3. Non-JTAG signal input timing with respect to TCK.
4. Non-JTAG signal output timing with respect to TCK.
5. Guaranteed by design and characterization.

Table 14. JTAG AC Timing Specifications (Independent of SYSCLK)

(continued)

At recommended operating conditions. See Table 4.

Parameter

Symbol

Min

Max

Unit

Notes

Output

= 50

VM = Midpoint Voltage (OV

/2)

TCLK

JHJL

TCLK

TRST

VM = Midpoint Voltage (OV

/2)

MOTOROLA

MPC7455 RISC Microprocessor Hardware Specifications

Pinout Listings

1.7

Pinout Listings

Table 15 provides the pinout listing for the MPC7445, 360 CBGA package. Table 16 provides the pinout
listing for the MPC7455, 483 CBGA package.

NOTE

This pinout is not compatible with the MPC750, MPC7400, or MPC7410,
360 BGA package.

Table 15. Pinout Listing for the MPC7445, 360 CBGA Package

Signal Name

Pin Number

Active

I/O

I/F Select

Notes

A[0:35]

E11, H1, C11, G3, F10, L2, D11, D1, C10,
G2, D12, L3, G4, T2, F4, V1, J4, R2, K5,
W2, J2, K4, N4, J3, M5, P5, N3, T1, V2,
U1, N5, W1, B12, C4, G10, B11

High

I/O

BVSEL

AACK

Low

Input

BVSEL

AP[0:4]

C1, E3, H6, F5, G7

High

I/O

BVSEL

ARTRY

Low

I/O

BVSEL

Input

N/A

Low

Input

BVSEL

BMODE0

Low

Input

BVSEL

BMODE1

Low

Input

BVSEL

Low

Output

BVSEL

High

Input

BVSEL

1, 7

Low

Output

BVSEL

CKSTP_IN

Low

Input

BVSEL

CKSTP_OUT

Low

Output

BVSEL

CLK_OUT

High

Output

BVSEL

D[0:63]

R15, W15, T14, V16, W16, T15, U15,
P14, V13, W13, T13, P13, U14, W14,
R12, T12, W12, V12, N11, N10, R11, U11,
W11, T11, R10, N9, P10, U10, R9, W10,
U9, V9, W5, U6, T5, U5, W7, R6, P7, V6,
P17, R19, V18, R18, V19, T19, U19, W19,
U18, W17, W18, T16, T18, T17, W3, V17,
U4, U8, U7, R7, P6, R8, W8, T8

High

I/O

BVSEL

DBG

Low

Input

BVSEL

DP[0:7]

T3, W4, T4, W9, M6, V3, N8, W6

High

I/O

BVSEL

DRDY

Low

Output

BVSEL

DTI[0:3]

G1, K1, P1, N1

High

Input

BVSEL

EXT_QUAL

A11

High

Input

BVSEL

GBL

Low

I/O

BVSEL

MPC7455 RISC Microprocessor Hardware Specifications

MOTOROLA

Pinout Listings

GND

B5, C3, D6, D13, E17, F3, G17, H4, H7,
H9, H11, H13, J6, J8, J10, J12, K7, K3,
K9, K11, K13, L6, L8, L10, L12, M4, M7,
M9, M11, M13, N7, P3, P9, P12, R5, R14,
R17, T7, T10, U3, U13, U17, V5, V8, V11,
V15

N/A

HIT

Low

Output

BVSEL

HRESET

Low

Input

BVSEL

INT

Low

Input

BVSEL

L1_TSTCLK G8

High

Input

BVSEL

L2_TSTCLK

High

Input

BVSEL

No Connect

A6, A13, A14, A15, A16, A17, A18, A19,
B13, B14, B15, B16, B17, B18, B19, C13,
C14, C15, C16, C17, C18, C19, D14, D15,
D16, D17, D18, D19, E12, E13, E14, E15,
E16, E19, F12, F13, F14, F15, F16, F17,
F18, F19, G11, G12, G13, G14, G15,
G16, G19, H14, H15, H16, H17, H18,
H19, J14, J15, J16, J17, J18, J19, K15,
K16, K17, K18, K19, L14, L15, L16, L17,
L18, L19, M14, M15, M16, M17, M18,
M19, N12, N13, N14, N15, N16, N17,
N18, N19, P15, P16, P18, P19

LSSD_MODE

Low

Input

BVSEL

2, 7

MCP

Low

Input

BVSEL

B4, C2, C12, D5, E18, F2, G18, H3, J5,
K2, L5, M3, N6, P2, P8, P11, R4, R13,
R16, T6, T9, U2, U12, U16, V4, V7, V10,
V14

N/A

PLL_CFG[0:4]

B8, C8, C7, D7, A7

High

Input

BVSEL

PMON_IN

Low

Input

BVSEL

PMON_OUT

Low

Output

BVSEL

QACK

Low

Input

BVSEL

QREQ

Low

Output

BVSEL

SHD[0:1]

E4, H5

Low

I/O

BVSEL

SMI

Low

Input

BVSEL

SRESET

Low

Input

BVSEL

SYSCLK

A10

Input

BVSEL

Low

Input

BVSEL

TBEN

High

Input

BVSEL

TBST

F11

Low

Output

BVSEL

Table 15. Pinout Listing for the MPC7445, 360 CBGA Package (continued)

Signal Name

Pin Number

Active

I/O

I/F Select

Notes

MOTOROLA

MPC7455 RISC Microprocessor Hardware Specifications

Pinout Listings

TCK

High

Input

BVSEL

TDI

High

Input

BVSEL

TDO

High

Output

BVSEL

TEA

Low

Input

BVSEL

TEST[0:3]

A12, B6, B10, E10

Input

BVSEL

TEST[4]

D10

Input

BVSEL

TMS

High

Input

BVSEL

TRST

Low

Input

BVSEL

7, 14

Low

I/O

BVSEL

TSIZ[0:2]

G6, F7, E7

High

Output

BVSEL

TT[0:4]

E5, E6, F6, E9, C5

High

I/O

BVSEL

Low

Output

BVSEL

H8, H10, H12, J7, J9, J11, J13, K8, K10,
K12, K14, L7, L9, L11, L13, M8, M10, M12

N/A

Notes:
1.

supplies power to the processor bus, JTAG, and all control signals; and V

supplies power to the

processor core and the PLL (after filtering to become AV

). To program the I/O voltage, connect BVSEL to

either GND (selects 1.8 V) or to HRESET (selects 2.5 V). If used, the pulldown resistor should be less than
250

. For actual recommended value of V

or supply voltages see Table 4.

These input signals are for factory use only and must be pulled up to OV

for normal machine operation.

These signals are for factory use only and must be left unconnected for normal machine operation.

Ignored in 60x bus mode.

This signal selects between MPX bus mode (asserted) and 60x bus mode (negated) and will be sampled at
HRESET going high.

This signal must be negated during reset, by pull-up to OV

or negation by ¬HRESET (inverse of HRESET), to

ensure proper operation.

Internal pull-up on die.

These pins require weak pull-up resistors (for example, 4.7 k

) to maintain the control signals in the negated

state after they have been actively negated and released by the MPC7445 and other bus masters.

These input signals are for factory use only and must be pulled down to GND for normal machine operation.

10. This pin can externally cause a performance monitor event. Counting of the event is enabled via software.
11. Unused address pins must be pulled down to GND.
12. This test signal is recommended to be tied to HRESET; however, other configurations will not adversely affect

performance.

13. These signals must be pulled down to GND if unused, or if the MPC7445 is in 60x bus mode.
14. This signal must be asserted during reset, by pull-down to GND or assertion by HRESET, to ensure proper

operation.

Table 15. Pinout Listing for the MPC7445, 360 CBGA Package (continued)

Signal Name

Pin Number

Active

I/O

I/F Select

Notes

MPC7455 RISC Microprocessor Hardware Specifications

MOTOROLA

Pinout Listings

Table 16. Pinout Listing for the MPC7455, 483 CBGA Package

Signal Name

Pin Number

Active

I/O

I/F Select

Notes

A[0:35]

E10, N4, E8, N5, C8, R2, A7, M2, A6, M1,
A10, U2, N2, P8, M8, W4, N6, U6, R5, Y4, P1,
P4, R6, M7, N7, AA3, U4, W2, W1, W3, V4,
AA1, D10, J4, G10, D9

High

I/O

BVSEL

AACK

Low

Input

BVSEL

AP[0:4]

L5, L6, J1, H2, G5

High

I/O

BVSEL

ARTRY

Low

I/O

BVSEL

Input

N/A

Low

Input

BVSEL

BMODE0

Low

Input

BVSEL

BMODE1

Low

Input

BVSEL

Low

Output

BVSEL

High

Input

N/A

3, 7

Low

Output

BVSEL

CKSTP_IN

Low

Input

BVSEL

CKSTP_OUT

Low

Output

BVSEL

CLK_OUT

High

Output

BVSEL

D[0:63]

AB15, T14, R14, AB13, V14, U14, AB14,
W16, AA11, Y11, U12, W13, Y14, U13, T12,
W12, AB12, R12, AA13, AB11, Y12, V11, T11,
R11, W10, T10, W11, V10, R10, U10, AA10,
U9, V7, T8, AB4, Y6, AB7, AA6, Y8, AA7, W8,
AB10, AA16, AB16, AB17, Y18, AB18, Y16,
AA18, W14, R13, W15, AA14, V16, W6,
AA12, V6, AB9, AB6, R7, R9, AA9, AB8, W9

High

I/O

BVSEL

DBG

Low

Input

BVSEL

DP[0:7]

AA2, AB3, AB2, AA8, R8, W5, U8, AB5

High

I/O

BVSEL

DRDY

Low

Output

BVSEL

DTI[0:3])

P2, T5, U3, P6

High

Input

BVSEL

EXT_QUAL

High

Input

BVSEL

GBL

Low

I/O

BVSEL

MOTOROLA

MPC7455 RISC Microprocessor Hardware Specifications

Pinout Listings

GND

A22, B1, B5, B12, B14, B16, B18, B20, C3,
C9, C21, D7, D13, D15, D17, D19, E2, E5,
E21, F10, F12, F14, F16, F19, G4, G7, G17,
G21, H13, H15, H19, H5, J3, J10, J12, J14,
J17, J21, K5, K9, K11, K13, K15, K19, L10,
L12, L14, L17, L21, M3, M6, M9, M11, M13,
M19, N10, N12, N14, N17, N21, P3, P9, P11,
P13, P15, P19, R17, R21, T13, T15, T19, T4,
T7, T9, U17, U21, V2, V5, V8, V12, V15, V19,
W7, W17, W21, Y3, Y9, Y13, Y15, Y20, AA5,
AA17, AB1, AB22

N/A

B13, B15, B17, B19, B21, D12, D14, D16,
D18, D21, E19, F13, F15, F17, F21, G19,
H12, H14, H17, H21, J19, K17, K21, L19,
M17, M21, N19, P17, P21, R15, R19, T17,
T21, U19, V17, V21, W19, Y21

N/A

HIT

Low

Output

BVSEL

HRESET

Low

Input

BVSEL

INT

Low

Input

BVSEL

L1_TSTCLK H4

High

Input

BVSEL

L2_TSTCLK

High

Input

BVSEL

L3VSEL

High

Input

N/A

3, 7

L3ADDR[17:0]

F20, J16, E22, H18, G20, F22, G22, H20,
K16, J18, H22, J20, J22, K18, K20, L16, K22,
L18

High

Output

L3VSEL

L3_CLK[0:1]

V22, C17

High

Output

L3VSEL

L3_CNTL[0:1]

L20, L22

Low

Output

L3VSEL

L3DATA[0:63]

AA19, AB20, U16, W18, AA20, AB21, AA21,
T16, W20, U18, Y22, R16, V20, W22, T18,
U20, N18, N20, N16, N22, M16, M18, M20,
M22, R18, T20, U22, T22, R20, P18, R22,
M15, G18, D22, E20, H16, C22, F18, D20,
B22, G16, A21, G15, E17, A20, C19, C18,
A19, A18, G14, E15, C16, A17, A16, C15,
G13, C14, A14, E13, C13, G12, A13, E12,
C12

High

I/O

L3VSEL

L3DP[0:7]

AB19, AA22, P22, P16, C20, E16, A15, A12

High

I/O

L3VSEL

L3_ECHO_CLK[0,2]

V18, E18

High

Input

L3VSEL

L3_ECHO_CLK[1,3]

P20, E14

HIgh

I/O

L3VSEL

LSSD_MODE

Low

Input

BVSEL

2, 7

MCP

Low

Input

BVSEL

No Connect

A8, A11, B6, B11, C11, D11, D3, D5, E11, E7,
F2, F11, G11, G2, H11, H9, J8

N/A

Table 16. Pinout Listing for the MPC7455, 483 CBGA Package (continued)

Signal Name

Pin Number

Active

I/O

I/F Select

Notes

MPC7455 RISC Microprocessor Hardware Specifications

MOTOROLA

Pinout Listings

B3, C5, C7, C10, D2, E3, E9, F5, G3, G9, H7,
J5, K3, L7, M5, N3, P7, R4, T3, U5, U7, U11,
U15, V3, V9, V13, Y2, Y5, Y7, Y10, Y17, Y19,
AA4, AA15

N/A

PLL_CFG[0:4]

A2, F7, C2, D4, H8

High

Input

BVSEL

PMON_IN

Low

Input

BVSEL

PMON_OUT

Low

Output

BVSEL

QACK

Low

Input

BVSEL

QREQ

Low

Output

BVSEL

SHD[0:1]

L4, L8

Low

I/O

BVSEL

SMI

Low

Input

BVSEL

SRESET

Low

Input

BVSEL

SYSCLK

Input

BVSEL

Low

Input

BVSEL

TBEN

High

Input

BVSEL

TBST

Low

Output

BVSEL

TCK

High

Input

BVSEL

TDI

High

Input

BVSEL

TDO

High

Output

BVSEL

TEA

Low

Input

BVSEL

TEST[0:5]

B10, H6, H10, D8, F9, F8

Input

BVSEL

TEST[6]

Input

BVSEL

TMS

High

Input

BVSEL

TRST

Low

Input

BVSEL

7, 14

Low

I/O

BVSEL

TSIZ[0:2]

L1,H3,D1

High

Output

BVSEL

TT[0:4]

F1, F4, K8, A5, E1

High

I/O

BVSEL

Low

Output

BVSEL

Table 16. Pinout Listing for the MPC7455, 483 CBGA Package (continued)

Signal Name

Pin Number

Active

I/O

I/F Select

Notes

MOTOROLA

MPC7455 RISC Microprocessor Hardware Specifications

Package Description

1.8

Package Description

The following sections provide the package parameters and mechanical dimensions for the CBGA package.

1.8.1

Package Parameters for the MPC7445, 360 CBGA

The package parameters are as provided in the following list. The package type is 25

× 25 mm, 360-lead

ceramic ball grid array (CBGA).

Package outline

× 25 mm

Interconnects

360 (19

× 19 ball array 1)

Pitch

1.27 mm (50 mil)

Minimum module height

2.72 mm

Maximum module height

3.24 mm

Ball diameter

0.89 mm (35 mil)

J9, J11, J13, J15, K10, K12, K14, L9, L11,
L13, L15, M10, M12, M14, N9, N11, N13, N15,
P10, P12, P14

N/A

Notes:
1.

supplies power to the processor bus, JTAG, and all control signals except the L3 cache controls

(L3CTL[0:1]); GV

supplies power to the L3 cache interface (L3ADDR[0:17], L3DATA[0:63], L3DP[0:7],

L3_ECHO_CLK[0:3], and L3_CLK[0:1]) and the L3 control signals L3_CNTL[0:1]; and V

supplies power to the

processor core and the PLL (after filtering to become AV

). For actual recommended value of V

or supply

voltages, see Table 4.

These input signals are for factory use only and must be pulled up to OV

for normal machine operation.

To program the processor interface I/O voltage, connect BVSEL to either GND (selects 1.8 V) or to HRESET
(selects 2.5 V). To program the L3 interface, connect L3VSEL to either GND (selects 1.8 V) or to HRESET
(selects 2.5 V) or to HRESET (selects 1.5 V). If used, pulldown resistors should be less than 250

Ignored in 60x bus mode.

This signal selects between MPX bus mode (asserted) and 60x bus mode (negated) and will be sampled at
HRESET going high.

This signal must be negated during reset, by pull-up to OV

or negation by ¬HRESET (inverse of HRESET), to

ensure proper operation.

Internal pull-up on die.

These pins require weak pull-up resistors (for example, 4.7 k

) to maintain the control signals in the negated

state after they have been actively negated and released by the MPC7455 and other bus masters.

These input signals for factory use only and must be pulled down to GND for normal machine operation.

performance.

13. These signals must be pulled down to GND if unused or if the MPC7455 is in 60x bus mode.
14. This signal must be asserted during reset, by pull-down to GND or assertion by HRESET, to ensure proper

operation.

15. Power must be supplied to GV

, even when the L3 interface is disabled or unused.

16. These signals are for factory use only and must be left unconnected for normal machine operation.

Table 16. Pinout Listing for the MPC7455, 483 CBGA Package (continued)

Signal Name

Pin Number

Active

I/O

I/F Select

Notes

MPC7455 RISC Microprocessor Hardware Specifications

MOTOROLA

Package Description

1.8.2

Mechanical Dimensions for the MPC7445, 360 CBGA

Figure 20 provides the mechanical dimensions and

bottom surface nomenclature for the MPC7445, 360

CBGA package.

Figure 20. Mechanical Dimensions and Bottom Surface Nomenclature for the MPC7445,

360 CBGA Package

NOTES:
1. DIMENSIONING AND TOLERANCING

PER ASME Y14.5M, 1994.

2. DIMENSIONS IN MILLIMETERS.
3. TOP SIDE A1 CORNER INDEX IS A

METALIZED FEATURE WITH VARIOUS
SHAPES. BOTTOM SIDE A1 CORNER IS
DESIGNATED WITH A BALL MISSING
FROM THE ARRAY.

0.2

360X

A1 CORNER

0.2

1 2 3 4 5 6 7 8 9 10 11 1213141516

0.3

0.15

0.15 A

171819

Millimeters

DIM

MIN

MAX

2.74

3.20

0.82

1.00

1.10

1.30

0.6

0.82

0.93

25.00 BSC

6.15

12.24

12.26

1.27 BSC

25.00 BSC

10.2

8.28

9.00

9.20

Capacitor Region

MPC7455 RISC Microprocessor Hardware Specifications

MOTOROLA

Package Description

Figure 21. Mechanical Dimensions and Bottom Surface Nomenclature for the MPC7455,

483 CBGA Package

0.2

NOTES:
1. DIMENSIONING AND TOLERANCING

PER ASME Y14.5M, 1994.

2. DIMENSIONS IN MILLIMETERS.
3. TOP SIDE A1 CORNER INDEX IS A

METALIZED FEATURE WITH VARIOUS
SHAPES. BOTTOM SIDE. A1 CORNER
IS DESIGNATED WITH A BALL
MISSING FROM THE ARRAY.

A1 CORNER

0.2

1 2 3 4 5 6 7 8 9 10 11 1213141516

0.15 A

17 18 19

W
V

Millimeters

DIM

MIN

MAX

2.74

3.20

0.82

1.00

1.10

1.30

0.60

0.82

0.93

29.00 BSC

11.6

8.94

6.9

12.24

12.26

1.27 BSC

29.00 BSC

11.6

8.94

6.9

9.00

9.20

483X

0.3

0.15

2021 22

Capacitor Region

MOTOROLA

MPC7455 RISC Microprocessor Hardware Specifications

System Design Information

1.9

System Design Information

This section provides system and thermal design recommendations for successful application of the
MPC7455.

1.9.1

PLL Configuration

The MPC7455 PLL is configured by the PLL_CFG[0:4] signals. For a given SYSCLK (bus) frequency, the
PLL configuration signals set the internal CPU and VCO frequency of operation. The PLL configuration
for the MPC7455 is shown in Table 17 for a set of example frequencies. In this example, shaded cells
represent settings that, for a given SYSCLK frequency, result in core and/or VCO frequencies that do not
comply with the 1-GHz column in Table 8. Note that these configurations were different in devices prior to
Rev F; see Section 1.11.2, "Part Numbers Not Fully Addressed by This Document," for more information
regarding documentation of prior revisions.

Table 17. MPC7455 Microprocessor PLL Configuration Example for 1.0 GHz Parts

PLL_

CFG[0:4]

Example Bus-to-Core Frequency in MHz (VCO Frequency in MHz)

Bus-to-

Core

Multiplier

Core-to-

VCO

Multiplier

Bus (SYSCLK) Frequency

33.3

MHz

66.6

MHz

100

MHz

133

MHz

01000

10000 3x

10100 4x

532

(1064)

10110

500

(1000)

667

(1333)

10010

5.5x

550

(1100)

733

(1466)

11010

600

(1200)

800

(1600)

01010

6.5x

540

(1080)

650

(1300)

866

(1730)

00100

525

(1050)

580

(1160)

700

(1400)

931

(1862)

00010

7.5x

500

(1000)

563

(1125)

623

(1245)

750

(1500)

1000

(2000)

11000

533

(1066)

600

(1200)

664

(1328)

800

(1600)

01100

8.5x

566

(1132)

638

(1276)

706

(1412)

850

(1700)

01111

600

(1200)

675

(1350)

747

(1494)

900

(1800)

MPC7455 RISC Microprocessor Hardware Specifications

MOTOROLA

System Design Information

01110

9.5x

633

(1266)

712

(1524)

789

(1578)

950

(1900)

10101

10x

500

(1000)

667

(1333)

750

(1500)

830

(1660)

1000

(2000)

10001

10.5x

525

(1050)

700

(1400)

938

(1876)

872

(1744)

10011

11x

550

(1100)

733

(1466)

825

(1650)

913

(1826)

00000

11.5x

575

(1150)

766

(532)

863

(1726)

955

(1910)

10111

12x

600

(1200)

800

(1600)

900

(1800)

996

(1992)

11111

12.5x

600

(1200)

833

(1666)

938

(1876)

01011

13x

650

(1300)

865

(1730)

975

(1950)

11100

13.5x

675

(1350)

900

(1800)

11001

14x

700

(1400)

933

(1866)

00011

15x

500

(1000)

750

(1500)

1000

(2000)

11011

16x

533

(1066)

800

(1600)

00001

17x

566

(1132)

850

(1900)

00101

18x

600

(1200)

900

(1800)

00111

20x

667

(1334)

1000

(2000)

01001

21x

700

(1400)

01101

24x

800

(1600)

11101

28x

933

(1866)

00110

PLL bypass

PLL off, SYSCLK clocks core circuitry directly

Table 17. MPC7455 Microprocessor PLL Configuration Example for 1.0 GHz Parts (continued)

PLL_

CFG[0:4]

Example Bus-to-Core Frequency in MHz (VCO Frequency in MHz)

Bus-to-

Core

Multiplier

Core-to-

VCO

Multiplier

Bus (SYSCLK) Frequency

33.3

MHz

66.6

MHz

100

MHz

133

MHz

MOTOROLA

MPC7455 RISC Microprocessor Hardware Specifications

System Design Information

The MPC7455 generates the clock for the external L3 synchronous data SRAMs by dividing the core clock
frequency of the MPC7455. The core-to-L3 frequency divisor for the L3 PLL is selected through the
L3_CLK bits of the L3CR register. Generally, the divisor must be chosen according to the frequency
supported by the external RAMs, the frequency of the MPC7455 core, and timing analysis of the circuit
board routing. Table 18 shows various example L3 clock frequencies that can be obtained for a given set of
core frequencies.

11110

PLL off

PLL off, no core clocking occurs

Notes:
1. PLL_CFG[0:4] settings not listed are reserved.
2. The sample bus-to-core frequencies shown are for reference only. Some PLL configurations may select bus, core,

or VCO frequencies which are not useful, not supported, or not tested for by the MPC7455; see Section 1.5.2.1,
"Clock AC Specifications," for valid SYSCLK, core, and VCO frequencies.

3. In PLL-bypass mode, the SYSCLK input signal clocks the internal processor directly and the PLL is disabled.

However, the bus interface unit requires a 2x clock to function. Therefore, an additional signal, EXT_QUAL, must
be driven at one-half the frequency of SYSCLK and offset in phase to meet the required input setup t

IVKH

and hold

time t

IXKH

(see Table 9). The result will be that the processor bus frequency will be one-half SYSCLK while the

internal processor is clocked at SYSCLK frequency. This mode is intended for factory use and emulator tool use
only.
Note: The AC timing specifications given in this document do not apply in PLL-bypass mode.

4. In PLL-off mode, no clocking occurs inside the MPC7455 regardless of the SYSCLK input.

Table 18. Sample Core-to-L3 Frequencies

Core Frequency

(MHz)

÷2

÷2.5

÷3

÷3.5

÷4

÷5

÷6

500

250

200

167

143

125

100

533

266

213

178

152

133

107

550

275

220

183

157

138

110

600

300

240

200

171

150

120

100

650

325

260

217

186

163

130

108

666

333

266

222

190

167

133

111

700

350

280

233

200

175

140

117

733

367

293

244

209

183

147

122

800

400

320

266

230

200

160

133

867

433

347

289

248

217

173

145

933

467

373

311

266

233

187

156

Table 17. MPC7455 Microprocessor PLL Configuration Example for 1.0 GHz Parts (continued)

PLL_

CFG[0:4]

Example Bus-to-Core Frequency in MHz (VCO Frequency in MHz)

Bus-to-

Core

Multiplier

Core-to-

VCO

Multiplier

Bus (SYSCLK) Frequency

33.3

MHz

66.6

MHz

100

MHz

133

MHz

MPC7455 RISC Microprocessor Hardware Specifications

MOTOROLA

System Design Information

1.9.2

PLL Power Supply Filtering

The AV

power signal is provided on the MPC7455 to provide power to the clock generation PLL. To

ensure stability of the internal clock, the power supplied to the AV

input signal should be filtered of any

noise in the 500 kHz to 10 MHz resonant frequency range of the PLL. A circuit similar to the one shown in
Figure 22 using surface mount capacitors with minimum effective series inductance (ESL) is recommended.

The circuit should be placed as close as possible to the AV

pin to minimize noise coupled from nearby

circuits. It is often possible to route directly from the capacitors to the AV

pin, which is on the periphery

of the 360 CBGA footprint and very close to the periphery of the 483 CBGA footprint, without the
inductance of vias.

Figure 22. PLL Power Supply Filter Circuit

1.9.3

Decoupling Recommendations

Due to the MPC7455 dynamic power management feature, large address and data buses, and high operating
frequencies, the MPC7455 can generate transient power surges and high frequency noise in its power
supply, especially while driving large capacitive loads. This noise must be prevented from reaching other
components in the MPC7455 system, and the MPC7455 itself requires a clean, tightly regulated source of
power. Therefore, it is recommended that the system designer place at least one decoupling capacitor at each
V

, OV

, and GV

pin of the MPC7455. It is also recommended that these decoupling capacitors

receive their power from separate V

, OV

/GV

, and GND power planes in the PCB, utilizing short

traces to minimize inductance.

These capacitors should have a value of 0.01 or 0.1 µF. Only ceramic surface mount technology (SMT)
capacitors should be used to minimize lead inductance, preferably 0508 or 0603 orientations where
connections are made along the length of the part. Consistent with the recommendations of Dr. Howard
Johnson in High Speed Digital Design: A Handbook of Black Magic (Prentice Hall, 1993) and contrary to
previous recommendations for decoupling Motorola microprocessors, multiple small capacitors of equal
value are recommended over using multiple values of capacitance.

In addition, it is recommended that there be several bulk storage capacitors distributed around the PCB,
feeding the V

, GV

, and OV

planes, to enable quick recharging of the smaller chip capacitors. These

1000

500

400

333

285

250

200

166

Notes:
1. The core and L3 frequencies are for reference only. Note that maximum L3 frequency is design dependent. Some

examples may represent core or L3 frequencies which are not useful, not supported, or not tested for the
MPC7455; see Section 1.5.2.3, "L3 Clock AC Specifications," for valid L3_CLK frequencies and for more
information regarding the maximum L3 frequency. Shaded cells do not comply with Table 10.

2. These core frequencies are not supported by all speed grades; see Table 8.

Table 18. Sample Core-to-L3 Frequencies (continued)

Core Frequency

(MHz)

÷2

÷2.5

÷3

÷3.5

÷4

÷5

÷6

2.2 µF

GND

Low ESL Surface Mount Capacitors

MOTOROLA

MPC7455 RISC Microprocessor Hardware Specifications

System Design Information

bulk capacitors should have a low equivalent series resistance (ESR) rating to ensure the quick response
time necessary. They should also be connected to the power and ground planes through two vias to minimize
inductance. Suggested bulk capacitors: 100330 µF (AVX TPS tantalum or Sanyo OSCON).

1.9.4

Connection Recommendations

To ensure reliable operation, it is highly recommended to connect unused inputs to an appropriate signal
level. Unused active low inputs should be tied to OV

. Unused active high inputs should be connected to

GND. All NC (no-connect) signals must remain unconnected.

Power and ground connections must be made to all external V

, OV

, GV

, and GND pins in the

MPC7455. If the L3 interface is not used, GV

should be connected to the OV

power phase, and

L3VSEL should be connected to BVSEL.

1.9.5

Output Buffer DC Impedance

The MPC7455 processor bus and L3 I/O drivers are characterized over process, voltage, and temperature.
To measure Z

, an external resistor is connected from the chip pad to OV

or GND. Then, the value of

each resistor is varied until the pad voltage is OV

/2 (see Figure 23).

The output impedance is the average of two components, the resistances of the pull-up and pull-down
devices. When data is held low, SW2 is closed (SW1 is open), and R

is trimmed until the voltage at the

pad equals OV

/2. R

then becomes the resistance of the pull-down devices. When data is held high, SW1

is closed (SW2 is open), and R

is trimmed until the voltage at the pad equals OV

/2. R

then becomes

the resistance of the pull-up devices. R

and R

are designed to be close to each other in value. Then, Z

+ R

)/2.

Figure 23. Driver Impedance Measurement

Table 19 summarizes the signal impedance results. The impedance increases with junction temperature and
is relatively unaffected by bus voltage.

OGND

Pad

Data

SW1

SW2

MPC7455 RISC Microprocessor Hardware Specifications

MOTOROLA

System Design Information

1.9.6

Pull-Up/Pull-Down Resistor Requirements

The MPC7455 requires high-resistive (weak: 4.7-k

) pull-up resistors on several control pins of the bus

interface to maintain the control signals in the negated state after they have been actively negated and
released by the MPC7455 or other bus masters. These pins are: TS, ARTRY, SHDO, and SHD1.

Some pins designated as being for factory test must be pulled up to OV

or down to GND to ensure proper

device operation. For the MPC7445, 360 BGA, the pins that must be pulled up to OV

are: LSSD_MODE

and TEST[0:3]; the pins that must be pulled down to GND are: L1_TSTCLK and TEST[4]. For the
MPC7455, 483 BGA, the pins that must be pulled up to OV

are: LSSD_MODE and TEST[0:5]; the pins

that must be pulled down are: L1_TSTCLK and TEST[6].

In addition, the MPC7455 has one open-drain style output that requires a pull-up resistor (weak or stronger:
4.71 k

) if it is used by the system. This pin is CKSTP_OUT.

If pull-down resistors are used to configure BVSEL or L3VSEL, the resistors should be less than 250

(see

Table 16).

During inactive periods on the bus, the address and transfer attributes may not be driven by any master and
may, therefore, float in the high-impedance state for relatively long periods of time. Because the MPC7455
must continually monitor these signals for snooping, this float condition may cause excessive power draw
by the input receivers on the MPC7455 or by other receivers in the system. It is recommended that these
signals be pulled up through weak (4.7-k

) pull-up resistors by the system, or that they may be otherwise

driven by the system during inactive periods of the bus. The snooped address and transfer attribute inputs
are: A[0:35], AP[0:4], TT[0:4], CI, WT, and GBL.

If extended addressing is not used, A[0:3] are unused and must be pulled low to GND through weak
pull-down resistors. If the MPC7455 is in 60x bus mode, DTI[0:3] must be pulled low to GND through weak
pull-down resistors.

The data bus input receivers are normally turned off when no read operation is in progress and, therefore,
do not require pull-up resistors on the bus. Other data bus receivers in the system, however, may require
pull-ups, or that those signals be otherwise driven by the system during inactive periods by the system. The
data bus signals are: D[0:63] and DP[0:7].

If address or data parity is not used by the system, and the respective parity checking is disabled through
HID0, the input receivers for those pins are disabled, and those pins do not require pull-up resistors and
should be left unconnected by the system. If all parity generation is disabled through HID0, then all parity
checking should also be disabled through HID0, and all parity pins may be left unconnected by the system.

The L3 interface does not normally require pull-up resistors.

1.9.7

JTAG Configuration Signals

Boundary-scan testing is enabled through the JTAG interface signals. The TRST signal is optional in the
IEEE 1149.1 specification, but is provided on all processors that implement the PowerPC architecture.

Table 19. Impedance Characteristics

= 1.5 V, OV

= 1.8 V ± 5%, T

= 5°85°C

Impedance

Processor Bus

L3 Bus

Unit

Typical

3342

3442

Maximum

3151

3244

MOTOROLA

MPC7455 RISC Microprocessor Hardware Specifications

System Design Information

While it is possible to force the TAP controller to the reset state using only the TCK and TMS signals, more
reliable power-on reset performance will be obtained if the TRST signal is asserted during power-on reset.
Because the JTAG interface is also used for accessing the common on-chip processor (COP) function,
simply tying TRST to HRESET is not practical.

The COP function of these processors allows a remote computer system (typically, a PC with dedicated
hardware and debugging software) to access and control the internal operations of the processor. The COP
interface connects primarily through the JTAG port of the processor, with some additional status monitoring
signals. The COP port requires the ability to independently assert HRESET or TRST in order to fully control
the processor. If the target system has independent reset sources, such as voltage monitors, watchdog timers,
power supply failures, or push-button switches, then the COP reset signals must be merged into these signals
with logic.

The arrangement shown in Figure 24 allows the COP port to independently assert HRESET or TRST, while
ensuring that the target can drive HRESET as well. If the JTAG interface and COP header will not be used,
TRST should be tied to HRESET through a 0-

isolation resistor so that it is asserted when the system reset

signal (HRESET) is asserted, ensuring that the JTAG scan chain is initialized during power-on. While
Motorola recommends that the COP header be designed into the system as shown in Figure 24, if this is not
possible, the isolation resistor will allow future access to TRST in the case where a JTAG interface may need
to be wired onto the system in debug situations.

The COP header shown in Figure 24 adds many benefits--breakpoints, watchpoints, register and memory
examination/modification, and other standard debugger features are possible through this interface--and
can be as inexpensive as an unpopulated footprint for a header to be added when needed.

The COP interface has a standard header for connection to the target system, based on the 0.025"
square-post, 0.100" centered header assembly (often called a Berg header). The connector typically has
pin 14 removed as a connector key.

There is no standardized way to number the COP header shown in Figure 24; consequently, many different
pin numbers have been observed from emulator vendors. Some are numbered top-to-bottom then
left-to-right, while others use left-to-right then top-to-bottom, while still others number the pins counter
clockwise from pin 1 (as with an IC). Regardless of the numbering, the signal placement recommended in
Figure 24 is common to all known emulators.

The QACK signal shown in Figure 24 is usually connected to the PCI bridge chip in a system and is an input
to the MPC7455 informing it that it can go into the quiescent state. Under normal operation this occurs
during a low-power mode selection. In order for COP to work, the MPC7455 must see this signal asserted
(pulled down). While shown on the COP header, not all emulator products drive this signal. If the product
does not, a pull-down resistor can be populated to assert this signal. Additionally, some emulator products
implement open-drain type outputs and can only drive QACK asserted; for these tools, a pull-up resistor can
be implemented to ensure this signal is de-asserted when it is not being driven by the tool. Note that the
pull-up and pull-down resistors on the QACK signal are mutually exclusive and it is never necessary to
populate both in a system. To preserve correct power-down operation, QACK should be merged via logic
so that it also can be driven by the PCI bridge.

MPC7455 RISC Microprocessor Hardware Specifications

MOTOROLA

System Design Information

Figure 24. JTAG Interface Connection

HRESET

From Target

Board Sources

HRESET

SRESET

VDD_SENSE

2 k

10 k

CHKSTP_IN

TMS

TDO

TDI

TCK

TMS

TDO

TDI

TCK

TRST

(if any)

COP He

Key

QACK

10 k

TRST

10 k

QACK

CHKSTP_OUT

KEY

No Pin

COP Connector

Physical Pin Out

10 k

2 k

Notes:
1. RUN/STOP, normally found on pin 5 of the COP header, is not implemented on the MPC7455. Connect

pin 5 of the COP header to OV

with a 10-k

pull-up resistor.

2. Key location; pin 14 is not physically present on the COP header.
3. Component not populated. Populate only if debug tool does not drive QACK.
4. Populate only if debug tool uses an open-drain type output and does not actively de-assert QACK.
5. If the JTAG interface is implemented, connect HRESET from the target source to TRST from the COP

header though an AND gate to TRST of the part. If the JTAG interface is not implemented, connect
HRESET from the target source to TRST of the part through a 0-

isolation reisistor.

MOTOROLA

MPC7455 RISC Microprocessor Hardware Specifications

System Design Information

1.9.8

Thermal Management Information

This section provides thermal management information for the ceramic ball grid array (CBGA) package for
air-cooled applications. Proper thermal control design is primarily dependent on the system-level
design--the heat sink, airflow, and thermal interface material. To reduce the die-junction temperature, heat
sinks may be attached to the package by several methods--spring clip to holes in the printed-circuit board
or package, and mounting clip and screw assembly (see Figure 25); however, due to the potential large mass
of the heat sink, attachment through the printed-circuit board is suggested. If a spring clip is used, the spring
force should not exceed 10 pounds.

Figure 25. Package Exploded Cross-Sectional View with Several Heat Sink Options

The board designer can choose between several types of heat sinks to place on the MPC7455. There are
several commercially available heat sinks for the MPC7455 provided by the following vendors:

Aavid Thermalloy

603-224-9988

80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com

Alpha Novatech

408-749-7601

473 Sapena Ct. #15
Santa Clara, CA 95054
Internet: www.alphanovatech.com

International Electronic Research Corporation (IERC)

818-842-7277

413 North Moss St.
Burbank, CA 91502
Internet: www.ctscorp.com

Tyco Electronics

800-522-6752

Chip CoolersTM
P.O. Box 3668
Harrisburg, PA 17105-3668
Internet: www.chipcoolers.com

Thermal Interface Material

Heat Sink

CBGA Package

Heat Sink

Clip

Printed-Circuit Board

MPC7455 RISC Microprocessor Hardware Specifications

MOTOROLA

System Design Information

Wakefield Engineering

603-635-5102

33 Bridge St.
Pelham, NH 03076
Internet: www.wakefield.com

Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal
performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost.

1.9.8.1

Internal Package Conduction Resistance

For the exposed-die packaging technology, shown in Table 3, the intrinsic conduction thermal resistance
paths are as follows:

The die junction-to-case (actually top-of-die since silicon die is exposed) thermal resistance

The die junction-to-ball thermal resistance

Figure 26 depicts the primary heat transfer path for a package with an attached heat sink mounted to a
printed-circuit board.

Figure 26. C4 Package with Heat Sink Mounted to a Printed-Circuit Board

Heat generated on the active side of the chip is conducted through the silicon, then through the heat sink
attach material (or thermal interface material), and finally to the heat sink where it is removed by forced-air
convection.

Because the silicon thermal resistance is quite small, for a first-order analysis, the temperature drop in the
silicon may be neglected. Thus, the thermal interface material and the heat sink conduction/convective
thermal resistances are the dominant terms.

1.9.8.2

Thermal Interface Materials

A thermal interface material is recommended at the package lid-to-heat sink interface to minimize the
thermal contact resistance. For those applications where the heat sink is attached by spring clip mechanism,
Figure 27 shows the thermal performance of three thin-sheet thermal-interface materials (silicone,
graphite/oil, floroether oil), a bare joint, and a joint with thermal grease as a function of contact pressure.
As shown, the performance of these thermal interface materials improves with increasing contact pressure.

External Resistance

Internal Resistance

Radiation

Convection

Radiation

Convection

Heat Sink

Printed-Circuit Board

Thermal Interface Material

Package/Leads

Die Junction

Die/Package

(Note the internal versus external package resistance.)

MOTOROLA

MPC7455 RISC Microprocessor Hardware Specifications

System Design Information

The use of thermal grease significantly reduces the interface thermal resistance. That is, the bare joint results
in a thermal resistance approximately seven times greater than the thermal grease joint.

Often, heat sinks are attached to the package by means of a spring clip to holes in the printed-circuit board
(see Figure 25). Therefore, the synthetic grease offers the best thermal performance, considering the low
interface pressure and is recommended due to the high power dissipation of the MPC7455. Of course, the
selection of any thermal interface material depends on many factors--thermal performance requirements,
manufacturability, service temperature, dielectric properties, cost, etc.

Figure 27. Thermal Performance of Select Thermal Interface Material

The board designer can choose between several types of thermal interface. Heat sink adhesive materials
should be selected based on high conductivity, yet adequate mechanical strength to meet equipment
shock/vibration requirements. There are several commercially available thermal interfaces and adhesive
materials provided by the following vendors:

The Bergquist Company

800-347-4572

18930 West 78

St.

Chanhassen, MN 55317
Internet: www.bergquistcompany.com

Chomerics, Inc.

781-935-4850

77 Dragon Ct.
Woburn, MA 01888-4014
Internet: www.chomerics.com

0.5

1.5

Silicone Sheet (0.006 in.)
Bare Joint
Floroether Oil Sheet (0.007 in.)
Graphite/Oil Sheet (0.005 in.)
Synthetic Grease

Contact Pressure (psi)

Spe

The

r
ma

l R

sis

t
a

(K-i

/W)

MPC7455 RISC Microprocessor Hardware Specifications

MOTOROLA

System Design Information

Dow-Corning Corporation

800-248-2481

Dow-Corning Electronic Materials
2200 W. Salzburg Rd.
Midland, MI 48686-0997
Internet: www.dow.com

Shin-Etsu MicroSi, Inc.

888-642-7674

10028 S. 51st St.
Phoenix, AZ 85044
Internet: www.microsi.com

Thermagon Inc.

888-246-9050

4707 Detroit Ave.
Cleveland, OH 44102
Internet: www.thermagon.com

The following section provides a heat sink selection example using one of the commercially available heat
sinks.

1.9.8.3

Heat Sink Selection Example

For preliminary heat sink sizing, the die-junction temperature can be expressed as follows:

= T

+ T

+ (R

+ R

int

+ R

)

× P

where:

is the die-junction temperature

is the inlet cabinet ambient temperature

is the air temperature rise within the computer cabinet

is the junction-to-case thermal resistance

int

is the adhesive or interface material thermal resistance

is the heat sink base-to-ambient thermal resistance

is the power dissipated by the device

During operation, the die-junction temperatures (T

) should be maintained less than the value specified in

Table 4. The temperature of air cooling the component greatly depends on the ambient inlet air temperature
and the air temperature rise within the electronic cabinet. An electronic cabinet inlet-air temperature (T

)

may range from 30° to 40°C. The air temperature rise within a cabinet (T

) may be in the range of 5° to 10°C.

The thermal resistance of the thermal interface material (R

int

) is typically about 1.5°C/W. For example,

assuming a T

of 30°C, a T

of 5°C, a CBGA package R

= 0.1, and a typical power consumption (P

) of

15.0 W, the following expression for T

is obtained:

Die-junction temperature:

= 30°C + 5°C + (0.1°C/W + 1.5°C/W + R

)

× 15 W

For this example, a R

value of 3.1°C/W or less is required to maintain the die-junction temperature below

the maximum value of Table 4.

Though the die junction-to-ambient and the heat sink-to-ambient thermal resistances are a common
figure-of-merit used for comparing the thermal performance of various microelectronic packaging
technologies, one should exercise caution when only using this metric in determining thermal management
because no single parameter can adequately describe three-dimensional heat flow. The final die-junction
operating temperature is not only a function of the component-level thermal resistance, but the system-level
design and its operating conditions. In addition to the component's power consumption, a number of factors

MOTOROLA

MPC7455 RISC Microprocessor Hardware Specifications

System Design Information

affect the final operating die-junction temperature--airflow, board population (local heat flux of adjacent
components), heat sink efficiency, heat sink attach, heat sink placement, next-level interconnect technology,
system air temperature rise, altitude, etc.

Due to the complexity and the many variations of system-level boundary conditions for today's
microelectronic equipment, the combined effects of the heat transfer mechanisms (radiation, convection,
and conduction) may vary widely. For these reasons, we recommend using conjugate heat transfer models
for the board, as well as system-level designs.

For system thermal modeling, the MPC7445 and MPC7455 thermal model is shown in Figure 28. Four
volumes will be used to represent this device. Two of the volumes, solder ball, and air and substrate, are
modeled using the package outline size of the package. The other two, die, and bump and underfill, have the
same size as the die. Dimensions for these volumes for the MPC7445 and MPC7455 are given in Figure 20
and Figure 21, respectively. The silicon die should be modeled 9.10

× 12.25 × 0.74 mm with the heat source

applied as a uniform source at the bottom of the volume. The bump and underfill layer is modeled as 9.10

12.25

× 0.069 mm (or as a collapsed volume) with orthotropic material properties: 0.6 W/(m · K) in the

xy-plane and 2 W/(m · K) in the direction of the z-axis. The substrate volume is 25

× 25 × 1.2 mm

(MPC7445) or 29

× 29 × 1.2 mm (MPC7455), and this volume has 18 W/(m · K) isotropic conductivity.

The solder ball and air layer is modeled with the same horizontal dimensions as the substrate and is 0.9 mm
thick. It can also be modeled as a collapsed volume using orthotropic material properties: 0.034 W/(m · K)
in the xy-plane direction and 3.8 W/(m · K) in the direction of the z-axis.

Figure 28. Recommended Thermal Model of MPC7445 and MPC7455

Bump and Underfill

Die

Substrate

Solder and Air

Die

Substrate

Side View of Model (Not to Scale)

Top View of Model (Not to Scale)

Conductivity

Value

Unit

Bump and Underfill

0.6

W/(m · K)

0.6

Substrate

Solder Ball and Air

0.034

3.8

MPC7455 RISC Microprocessor Hardware Specifications

MOTOROLA

Document Revision History

1.10 Document Revision History

Table 20 provides a revision history for this hardware specification.

Table 20. Document Revision History

Rev. No.

Substantive Change(s)

Initial release.

Updated for Rev F devices; information specific to Rev C devices is now documented in a separate part
number specifications; see Section 1.11.2 for more information.

Removed 600 and 800 MHz speed grades.

Increased leakage current specifications in Table 6 from 10 to 30 µA.

Changed core voltage to 1.3 V; all instances of V

and AV

updated.

Updated power consumption specifications in Table 7.

Reduced I/O power guidance in Table 7 from <20% to <5%.

Added footnote 1 to Figures 9 and 11.

Removed CI and WT from Input Setup and Input Hold lists in Table 10; these are output-only signals.

Removed INT, HRESET, MCP, SRESET, and SMI from Input Setup and Input Hold lists in Table 10;
these are asynchronous inputs.

Added TT[0:3] to Input Setup, Input Hold, Output Valid, and Output Hold lists in Table 10; these were
mistakenly omitted in Rev 0.

Updated Tables 13 and 14 to reflect new L3 AC timing in Rev F devices.

Corrected Note 10 in Tables 16 and 17; this is an event pin, not an enable pin.

Corrected entries for L3_ECHO_CLK[1,3] in Table 17; these are I/O pins, not input-only.

Added Note 16 to Table 17; all No Connect pins must be left unconnected.

Changed name of PLL_EXT to PLL_CFG[4] and updated all instances.

Updated Table 18 to reflect PLL configuration settings for Rev F devices.

Added dimensions D2 and E3 to Figure 20.

Transposed dimensions D4 and E4 in Figure 21 (dimensions were reversed).

Revised Figure 24 and Section 1.9.7.

Revised format of Section 1.11.2 and added Tables 23 through 26.

Revised Section 1.9.8.3 and added additional thermal modeling information, including Figure 28.

Changed maximum heat sink clip spring force in Section 1.9.8, from 5.5 lbs to 10 lbs.

Changed substrate marking for MPC7445 in Figure 29; all MPC744x device substrates are marked
MPC7440.

Changed substrate marking for MPC7455 in Figure 29; all MPC745x device substrates are marked
MPC7450.

1.1

Removed reference to Note 4 for DTI signals in Tables 15 and 16: these signals are unused in 60x bus
mode and must be pulled down (see Note 13); they are not ignored.

Improved precision of die and package dimensions in Figures 20 and 21.

MOTOROLA

MPC7455 RISC Microprocessor Hardware Specifications

Document Revision History

Corrected entries in Table 17 for 33 MHz and 50 MHz bus frequencies with multipliers of 24x and higher.

Corrected typographical errors in heatsink selection example in Section 1.9.8.3.

Removed erroneous instances of PLL_EXT signal name and changed remaining instances of
PLL_CFG[0:3] to PLL_CFG[0:4]. (These were artifacts from older revisions; see entry for Rev 1.0.)

Corrected erroneous instances (artifacts) mentioning 1.6 V core voltage. Core voltage for devices
completely covered by this revision (and revisions 1.x) of this document is 1.3 V.

Corrected errors in PLL multipliers in Table 17: 32x and 25x are not supported ratios, 3x and 4x are
supported, 10.5x and 12.5x PLL settings were incorrect.

Replaced notes at bottom of Table 17 (erroneously missing in revisions 1.x).

Updated coplanarity specifications in Figures 20 and 21 from 0.2 mm to 0.15 mm.

Table 20. Document Revision History (continued)

Rev. No.

Substantive Change(s)

MPC7455 RISC Microprocessor Hardware Specifications

MOTOROLA

Ordering Information

1.11 Ordering Information

Ordering information for the parts fully covered by this specification document is provided in
Section 1.11.1, "Part Numbers Fully Addressed by This Document." Note that the individual part numbers
correspond to a maximum processor core frequency. For available frequencies, contact your local Motorola
sales office. In addition to the processor frequency, the part numbering scheme also includes an application
modifier which may specify special application conditions. Each part number also contains a revision level
code which refers to the die mask revision number. Section 1.11.2, "Part Numbers Not Fully Addressed by
This Document," lists the part numbers which do not fully conform to the specifications of this document.
These special part numbers require an additional document called a part number specification.

1.11.1 Part Numbers Fully Addressed by This Document

Table 21 provides the Motorola part numbering nomenclature for the MPC7455.

1.11.2 Part Numbers Not Fully Addressed by This Document

Parts with application modifiers or revision levels not fully addressed in this specification document are
described in separate part number specifications which supplement and supersede this document; see
Table 22 through Table 25.

Table 21. Part Numbering Nomenclature

74x5

nnnn

Product

Code

Part

Identifier

Process

Descriptor

Package

Processor

Frequency

Application

Modifier

Revision Level

7455
7445

RX = CBGA

733
867
933

1000

L: 1.3 V ± 50 mV

0 to 105

F: 3.3; PVR = 8001 0303

Notes:
1. Processor core frequencies supported by parts addressed by this specification only. Parts addressed by part

number specifications may support other maximum core frequencies.

2. The X prefix in a Motorola part number designates a "Pilot Production Prototype" as defined by Motorola SOP

3-13. These are from a limited production volume of prototypes manufactured, tested, and Q.A. inspected on a
qualified technology to simulate normal production. These parts have only preliminary reliability and
characterization data. Before pilot production prototypes may be shipped, written authorization from the customer
must be on file in the applicable sales office acknowledging the qualification status and the fact that product
changes may still occur while shipping pilot production prototypes.

MOTOROLA

MPC7455 RISC Microprocessor Hardware Specifications

Ordering Information

Table 22. Part Numbers Addressed by XPC74x5RXnnnLC Series Part Number Specification

(Document Order No. MPC7455RXLCPNS/D)

XPC

74x5

nnn

Product

Code

Part

Identifier

Package

Processor

Frequency

Application Modifier

Revision Level

XPC

7455
7445

RX = CBGA

600
733
800
867
933

L: 1.6 V ± 50 mV

0 to 105

C: 2.1; PVR = 8001 0201

PPC

1000

Table 23. Part Numbers Addressed by XPC74x5RXnnnNx Series Part Number Specification

(Document Order No. MPC7455RXNXPNS/D)

XPC

74x5

nnn

Product

Code

Part

Identifier

Package

Processor

Frequency

Application Modifier

Revision Level

XPC

7455
7445

RX = CBGA

600
733
800

N: 1.3 V ± 50 mV

0 to 105

C: 2.1; PVR = 8001 0201

Table 24. Part Numbers Addressed by XPC74x5RXnnnPx Series Part Number Specification

(Document Order No. MPC7455RXPXPNS/D)

XPC

7455

nnn

Product

Code

Part

Identifier

Package

Processor

Frequency

Application Modifier

Revision Level

XPC

7455

RX = CBGA

933

1000

P: 1.85 V ± 50 mV

0 to 65

C: 2.1; PVR = 8001 0201

Table 25. Part Numbers Addressed by XPC74x5RXnnnSx Series Part Number Specification

(Document Order No. MPC7455RXSXPNS/D)

XPC

7455

nnnn

Product

Code

Part

Identifier

Package

Processor

Frequency

Application Modifier

Revision Level

XPC

7455

RX = CBGA

1000

S: 1.85 V ± 50 mV

0 to 75

C: 2.1; PVR = 8001 0201

MPC7455EC/D

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TECHNICAL INFORMATION CENTER:

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HOME PAGE:

www.motorola.com/semiconductors

Information in this document is provided solely to enable system and software implementers to use

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Motorola reserves the right to make changes without further notice to any products herein.

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limitation consequential or incidental damages. "Typical" parameters which may be provided in

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Document Outline

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Document Outline

ÐÐ»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: XPC7445RX867LC