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Электронный компонент: 2SK2597

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1995
PRELIMINARY DATA SHEET
SILICON POWER MOS FIELD EFFECT TRANSISTOR
2SK2597
N-CHANNEL SILICON POWER MOSFET
FOR BASE STATION OF 900 MHz BAND CELLULAR PHONE
POWER AMPLIFICATION
FEATURES
PACKAGE DRAWING (Unit: mm)
High output, high gain
P
O
= 100 W, G
L
= 13 dB (TYP.) (f = 900 MHz)
P
O
= 90 W, G
L
= 12 dB (TYP.) (f = 960 MHz)
Low intermodulation distortion
Covers all base station frequencies such as 800-MHz PDC
and GSM
High-reliability gold electrodes
Hermetic sealed package
Internal matching circuit
Push-pull structure
ABSOLUTE MAXIMUM RATINGS (T
A
= 25
C)
Parameter
Symbol
Ratings
Unit
Drain-source voltage
V
DS
60
V
Gate-source voltage
V
GS
7
V
Drain current (D.C.)
I
D
15
Note
A
Total power dissipation
P
T
290
W
Thermal resistance
R
th
0.6
C/W
Channel temperature
T
ch
200
C
Storage temperature
T
stg
65 to +150
C
Note Per side
ELECTRICAL CHARACTERISTICS (T
A
= 25 C)
Parameter
Symbol
Condition
MIN.
TYP.
MAX.
Unit
Gate leakage current
I
GSS
V
GS
= 7 V
1
A
Cut-off voltage
V
GS(off)
V
DS
= 5 V, I
D
= 50 mA
1.5
4
V
Drain current
I
DSS
V
DS
= 60 V
2
mA
Mutual conductance
g
m
V
DS
= 5 V, I
D
= 3 A,
I
D
= 100 mA
2.0
S
Output power
P
O
f = 960 MHz, V
DD
= 30 V
80
90
W
Drain efficiency
D
I
DQ
= 200 mA
2, P
in
= 40 dBm
35
40
%
Linear gain
G
L
f = 960 MHz, V
DD
= 30 V
11
12
dB
I
DQ
= 200 mA
2, P
in
= 30 dBm
Third intermodulation distortion
IM
3
f = 900 MHz,
f = 0.1 MHz, V
DD
= 30 V
38
dBc
I
DQ
= 200 mA
2, P
O
= 42 dBm
G1
G2
D1
D2
3.30.3
S
45
45
28.00.3
13.50.3
3.20.2
3.20.2
1.4
0.3
11.40.3
19.40.4
21.50.3
4.7MAX.
1.50.2
0.1
2.50.2
G
1
, G
2
: gate
D
1
, D
2
: drain
S : source
Flange is connected to the source.
Document No. P10252EJ1V0DS00 (1st edition)
Date Published October 1995 P
Printed in Japan
The information in this document is subject to change without notice.
2SK2597
2
OUTPUT v.s. IM
3
, I
D
CHARACTERISTICS
20
30
40
50
60
5
4
3
2
1
0
28
32
36
40
44
48
30
34
38
42
46
THIRD ORDER INTERMODULATION DISTORTION / DRAIN
CURRENT v.s. OUTPUT POWER
IM
3
(dBc)
I
D
(A)
P
OUT
(dBm)
(AVERAGE POWER)
Vds = 30 V CLASS AB
f1 = 900.0 MHz Idq = 200 mA
2
f2 = 900.1 MHz Idq = 500 mA
2




IM
3
I
D
INPUT v.s. OUTPUT, POWER GAIN, EFFICIENCY
(1) f = 960 MHz
1000
100
10
1
.1
100
10
12
20
28
36
44
52
16
24
32
40
48
f = 960 MHz
V
DD
= 30 V
I
DQ
= 200 mA
2
P
out
G
P
OUTPUT POWER / DRAIN EFFICIENCY /
POWER GAIN vs. INPUT POWER
P
in
(dBm)
P
out
(W)
G
P
(dB)
D
(%)
D
2SK2597
3
(2) f = 900 MHz
100
10
12
20
28
36
44
52
16
24
32
40
48
f = 900 MHz
V
DD
= 30 V
I
DQ
= 200 mA
2
P
out
G
P
OUTPUT POWER / DRAIN EFFICIENCY /
POWER GAIN vs. INPUT POWER
P
in
(dBm)
P
out
(w)
G
P
(dB)
D
(%)
D
1000
100
10
1
.1
(3) f = 820 MHz
1000
100
10
1
.1
100
10
12
20
28
36
44
52
16
24
32
40
48
f = 820 MHz
V
DD
= 30 V
I
DQ
= 200 mA
2
P
out
G
P
OUTPUT POWER / DRAIN EFFICIENCY /
POWER GAIN vs. INPUT POWER
P
in
(dBm)
P
out
(W)
G
P
(dB)
D
(%)
D
2SK2597
4
Z
IN
, Z
OUT
0
0.49
0.48
0.47
0.46
0.45
0.44
0.43
0.42
0.41
0.40
0.39
0.38
0.37
0.36
0.35
0.34
0.33
0.32
0.31
0.30
0.29
0.28
0.27
0.26
0.25
0.24
0.23
0.22
0.21
0.20
0.19
0.18
0.17
0.16
0.15
0.14
0.13
0.12
0.11
0.10
0.09
0.08
0.07
0.06
0.05
0.04
0.03
0.02
0.01
0
0.01
0.02
0.03.
0.04
0.05
0.06
0.07
0.08
0.09
0.10
0.11
0.12
0.13
0.14
0.15
0.16
0.17
0.18
0.19
0.20
0.21
0.22
0.23
0.24
0.25
0.26
0.27
0.28
0.29
0.30
0.31
0.32
0.33
0.34
0.35
0.36
0.37
0.38
0.39
0.40
0.41
0.42
0.43
0.44
0.45
0.46
0.47
0.48
0.49
-160
-150
-140
-130
-120
-110
-100
-90
-80
-70
-60
-50
-40
-30
-20
-10
0
10
20
30
40
50
60
70
80
90
100
110
120
130
140
150
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.2
1.4
1.6
1.8
2.0
3.0
4.0
5.0
10
20
50
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.2
1.4
1.6
1.8
2.0
3.0
4.0
5.0
10
20
50
0.2
0.1
0.3
0.4
0.5
0
0.6
0.7
0.8
0.9
1.0
1.2
1.4
1.6
1.8
2.0
3.0
4.0
5.0
10
20
50
0.2
0.4
0.6
0.8
1.0
0.2
0.4
0.6
0.8
1.0
0.2
0.4
0.6
0.8
1.0
0.2
0.4
0.6
0.8
1.0
RESISTANCE COMPONENT
R
Zo
JX
Zo
+JX
Zo
960
900
820 900
Z
IN
820
(MHz)
960 (MHz)
Z
OUT
V
DD
= 30 V, I
DQ
= 200 mA
2, P
in
= 40 dBm
f (MHz)
Z
IN
(
)
Z
OUT
(
)
820
6.52 + j5.52
2.34 + j0.91
900
8.86 + j5.49
2.78 + j3.23
960
10.36 + j4.79
2.95 + j3.37