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Электронный компонент: D485505G

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1994,1996
DATA SHEET
MOS INTEGRATED CIRCUIT
Description
The
PD485505 is a 5,048 words by 8 bits high speed FIFO (First In First Out) line buffer. Its CMOS static circuitry
provides high speed access and low power consumption.
The
PD485505 can be used for one line delay and time axis conversion in high speed facsimile machines and
digital copiers.
Moreover, the
PD485505 can execute read and write operations independently on an asynchronous basis. Thus
the
PD485505 is suitable as a buffer for data transfer between units with different transfer rates and as a buffer for
the synchronization of multiple input signals. There are three versions, E, K, P, and L. This data sheet can be applied
to the version P and L. These versions operate with different specifications. Each version is identified with its lot
number (refer to 7. Example of Stamping).
Features
5,048 words by 8 bits
Asynchronous read/write operations available
Variable length delay bits; 21 to 5,048 bits (Cycle time: 25 ns)
15 to 5,048 bits (Cycle time: 35 ns)
Power supply voltage V
CC
= 5.0 V
0.5 V
Suitable for sampling one line of A3 size paper (16 dots/mm)
All input/output TTL compatible
3-state output
Full static operation; data hold time = infinity
Ordering Information
Part Number
R/W Cycle Time
Package
PD485505G-25
25 ns
24-pin plastic SOP
PD485505G-35
35 ns
(11.43 mm (450))
PD485505
LINE BUFFER
5K-WORD BY 8-BIT
The mark shows major revised points.
Document No. M10059EJ7V0DSJ1 (7th edition)
Date Published December 2000 N CP(K)
Printed in Japan
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for availability
and additional information.
PD485505
2
Data Sheet M10059EJ7V0DS00
Pin Configuration (Marking side)
24-pin plastic SOP (11.43 mm (450))
[
PD485505G]
D
OUT0
D
OUT1
D
OUT2
D
OUT3
RE
RSTR
GND
RCK
D
OUT4
D
OUT5
D
OUT6
D
OUT7
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
D
IN0
D
IN1
D
IN2
D
IN3
WE
RSTW
V
CC
WCK
D
IN4
D
IN5
D
IN6
D
IN7
D
IN0
- D
IN7
: Data Inputs
D
OUT0
- D
OUT7
: Data Outputs
WCK
: Write Clock Input
RCK
: Read Clock Input
WE
: Write Enable Input
RE
: Read Enable Input
RSTW
: Reset Write Input
RSTR
: Reset Read Input
V
CC
: +5.0 V Power Supply
GND
: Ground
Remark
Refer to 5. Package Drawing for the 1-pin index mark.
PD485505
3
Data Sheet M10059EJ7V0DS00
Block Diagram
D
IN0
D
IN1
D
IN2
D
IN3
D
IN4
D
IN5
D
IN6
D
IN7
WE
RSTR
WCK
D
OUT0
D
OUT1
D
OUT2
D
OUT3
D
OUT4
D
OUT5
D
OUT6
D
OUT7
RCK
RSTW
RE
V
CC
GND
Write Address Pointer
Read Address Pointer
Input Buffer
Output Buffer
Memory Cell Array
40,384 bits
(5,048 words by 8 bits)
PD485505
4
Data Sheet M10059EJ7V0DS00
1. Input/Output Pin Function
Pin
Pin
Symbol
Pin
Number
Name
24 - 21
D
IN0
Data
|
Input
16 - 13
D
IN7
1 - 4
D
OUT0
Data
|
Output
9 - 12
D
OUT7
19
RSTW
Reset
Write
Input
6
RSTR
Reset
Read
Input
20
WE
Write
Enable
Input
5
RE
Read
Enable
Input
17
WCK
Write
Clock
Input
8
RCK
Read
Clock
Input
I/O
Function
In
Write data input pins.
The data inputs are strobed by the rising edge of WCK at the end of a cycle
and the setup and hold times (t
DS
, t
DH
) are defined at this point.
Out
Read data output pins.
The access time is regulated from the rising edge of RCK at the beginning of a
cycle and defined by t
AC
.
In
Reset input pin for the initialization of the write address pointer.
The state of RSTW is strobed by the rising edge of WCK at the beginning of a
cycle and the setup and hold times (t
RS
, t
RH
) are defined.
In
Reset input pin for the initialization of the read address pointer.
The state of RSTR is strobed by the rising edge of RCK at the beginning of a
cycle and the setup and hold times (t
RS
, t
RH
) are defined.
In
Write operation control signal input pin.
When WE is in the disable mode ("H" level), the internal write operation is
inhibited and the write address pointer stops at the current position.
In
Read operation control signal input pin.
When RE is in the disable mode ("H" level), the internal read operation is
inhibited and the read address pointer stops at the current position. The output
changes to high impedance.
In
Write clock input pin.
When WE is enabled ("L" level), the write operation is executed in
synchronization with the write clock. The write address pointer is incremented
simultaneously.
In
Read clock input pin.
When RE is enabled ("L" level), the read operation is executed in synchroniza-
tion with the read clock. The read address pointer is incremented
simultaneously.
PD485505
5
Data Sheet M10059EJ7V0DS00
2. Operation Mode
PD485505 is a synchronous memory. All signals are strobed at the rising edge of the clock (RCK, WCK).
For this reason, setup time and hold time are specified for the rising edge of the clock (RCK, WCK).
2.1 Write Cycle
When the WE input is enabled ("L" level), a write cycle is executed in synchronization with the WCK clock
input.
The data inputs are strobed by the rising edge of the clock at the end of a cycle so that read data after a one-
line (5,048 bits) delay and write data can be processed with the same clock. Refer to Write Cycle Timing Chart.
When WE is disabled ("H" level) in a write cycle, the write operation is not performed during the cycle which
the WCK rising edge is in the WE = "H" level (t
WEW
). The WCK does not increment the write address pointer
at this time.
Unless inhibited by WE, the internal write address will automatically wrap around from 5,047 to 0 and begin
incrementing again.
2.2 Read Cycle
When the RE input is enabled ("L" level), a read cycle is executed in synchronization with the RCK clock input
and data is output after t
AC
. Refer to Read Cycle Timing Chart.
When RE is disabled ("H" level) in a read cycle, the read operation is not performed during the cycle which
the RCK rising edge is in the RE = "H" level (t
REW
). The RCK does not increment the read address pointer at
this time.
2.3 Write Reset Cycle/Read Reset Cycle
After power up, the
PD485505 requires the initialization of internal circuits because the read and write
address pointers are not defined at that time.
It is necessary to satisfy setup requirements and hold times as measured from the rising edge of WCK and
RCK, and then input the RSTW and RSTR signals to initialize the circuit.
Write and read reset cycles can be executed at any time and the address pointer returns zero. Refer to Write
Reset Cycle Timing Chart, Read Reset Cycle Timing Chart.
Remark
Write and read reset cycles can be executed at any time and do not depend on the state of RE or WE.
PD485505
6
Data Sheet M10059EJ7V0DS00
Operation-related Restriction
Following restriction exists to read data written in a write cycle.
Read the written data after an elapse of 1/2 write cycle + t
WAR
since the write cycle ends (see Figure 2.1).
If t
WAR
is not satisfied, the output data may undefined.
Figure 2.1 Delay Bits Restriction Timing Chart
Remark
This timing chart describes only the delay bits restriction, and does not defines the WE, RE, RSTW, RSTR
signals.
0
1
2
3
0
1
2
0
1
2
3
0
1
2
3
WCK
RCK
D
IN
D
OUT
1/2 write cycle
t
WAR
t
AC
High
impedance
High impedance
PD485505
7
Data Sheet M10059EJ7V0DS00
3. Electrical Specifications
All voltages are referenced to GND.
Absolute Maximum Ratings
Parameter
Symbol
Condition
Rating
Unit
Voltage on any pin relative to GND
V
T
0.5
Note
to V
CC
+ 0.5
V
Supply voltage
V
CC
0.5 to +7.0
V
Output current
I
O
20
mA
Operating ambient temperature
T
A
0 to 70
C
Storage temperature
T
stg
55 to +125
C
Note
3.0 V MIN. (Pulse width = 10 ns)
Caution
Exposing the device to stress above those listed in Absolute Maximum Ratings could cause
permanent damage. The device is not meant to be operated under conditions outside the limits
described in the operational section of this specification. Exposure to Absolute Maximum Rating
conditions for extended periods may affect device reliability.
Recommended Operating Conditions
Parameter
Symbol
Condition
MIN.
TYP.
MAX.
Unit
Supply voltage
V
CC
4.5
5.0
5.5
V
High level input voltage
V
IH
2.4
V
CC
+ 0.5
V
Low level input voltage
V
IL
0.3
Note
+0.8
V
Operating ambient temperature
T
A
0
70
C
Note
3.0 V MIN. (Pulse width = 10 ns)
DC Characteristics (Recommended Operating Conditions unless otherwise noted)
Parameter
Symbol
Test Condition
MIN.
TYP.
MAX.
Unit
Operating current
I
CC
80
mA
Input leakage current
I
I
V
I
= 0 to V
CC
, Other Input 0 V
10
+10
A
Output leakage current
I
O
V
O
= 0 to V
CC
,
10
+10
A
D
OUT
: High impedance
High level output voltage
V
OH
I
OH
= 1 mA
2.4
V
Low level output voltage
V
OL
I
OL
= 2 mA
0.4
V
Capacitance (T
A
= 25 C, f = 1 MHz)
Parameter
Symbol
Test Condition
MIN.
TYP.
MAX.
Unit
Input capacitance
C
I
10
pF
Output capacitance
C
O
10
pF
PD485505
8
Data Sheet M10059EJ7V0DS00
AC Characteristics (Recommended Operating Conditions unless otherwise noted)
Notes 1, 2, 3
Parameter
Symbol
PD485505-25
PD485505-35
Unit
Notes
MIN.
MAX.
MIN.
MAX.
Write clock cycle time
t
WCK
25
35
ns
Write clock pulse width
t
WCW
11
12
ns
Write clock precharge time
t
WCP
11
12
ns
Read clock cycle time
t
RCK
25
35
ns
Read clock pulse width
t
RCW
11
12
ns
Read clock precharge time
t
RCP
11
12
ns
Access time
t
AC
18
25
ns
Write data-read delay time
t
WAR
470
470
ns
Output hold time
t
OH
5
5
ns
Output low-impedance time
t
LZ
5
18
5
25
ns
4
Output high-impedance time
t
HZ
5
18
5
25
ns
4
Input data setup time
t
DS
7
10
ns
Input data hold time
t
DH
3
3
ns
RSTW/RSTR Setup time
t
RS
7
10
ns
5
RSTW/RSTR Hold time
t
RH
3
3
ns
5
RSTW/RSTR Deselected time (1)
t
RN1
3
3
ns
6
RSTW/RSTR Deselected time (2)
t
RN2
7
10
ns
6
WE Setup time
t
WES
7
10
ns
7
WE Hold time
t
WEH
3
3
ns
7
WE Deselected time (1)
t
WEN1
3
3
ns
8
WE Deselected time (2)
t
WEN2
7
10
ns
8
RE Setup time
t
RES
7
10
ns
9
RE Hold time
t
REH
3
3
ns
9
RE Deselected time (1)
t
REN1
3
3
ns
10
RE Deselected time (2)
t
REN2
7
10
ns
10
WE Disable time
t
WEW
0
0
ms
RE Disable time
t
REW
0
0
ms
Write reset time
t
RSTW
0
0
ms
Read reset time
t
RSTR
0
0
ms
Transition time
t
T
3
35
3
35
ns
PD485505
9
Data Sheet M10059EJ7V0DS00
Notes 1. AC measurements assume t
T
= 5 ns.
2. AC Characteristics test condition
Input Timing Specification
Output Timing Specification
Output Loads for Timing
3. Input timing reference levels = 1.5 V. Output timing reference levels; V
OH
= 2.0 V, V
OL
= 0.8 V.
4. t
LZ
and t
HZ
are measured at
200 mV from the steady state voltage. Under any conditions, t
LZ
t
HZ
.
5. If either t
RS
or t
RH
is less than the specified value, reset operations are not guaranteed.
6. If either t
RN1
or t
RN2
is less than the specified value, reset operations may extend to cycles preceding or
following the period of reset operations.
7. If either t
WES
or t
WEH
is less than the specified value, write disable operations are not guaranteed.
8. If either t
WEN1
or t
WEN2
is less than the specified value, internal write disable operations may extend to cycles
preceding or following the period of write disable operations.
9. If either t
RES
or t
REH
is less than the specified value, read disable operations are not guaranteed.
10. If either t
REN1
or t
REN2
is less than the specified value, internal read disable operations may extend to cycles
preceding or following the period of read disable operations.
1.8 k
1.1 k
D
OUT
V
CC
5 pF
(t
LZ
, t
HZ
)
1.8 k
1.1 k
D
OUT
V
CC
30 pF
(t
AC
, t
OH
)
3.0 V
0 V
t
T
= 5 ns
t
T
= 5 ns
1.5 V
Test points
0.8 V
2.0 V
High impedance
High impedance
Test points
PD485505
10
Data Sheet M10059EJ7V0DS00
Write Cycle Timing Chart
Cycle n
Cycle n+1
Cycle n+2
Disable Cycle
Cycle n+3
t
WCW
t
WEN1
t
WES
t
WEW
t
WEH
t
WEN2
t
WCP
t
WCK
t
DS
t
DH
(n+1)
(n)
t
DS
t
DH
(n+2)
(n+3)
WCK (Input)
WE (Input)
D
IN
(Input)
Remark
RSTW = "H" level
Read Cycle Timing Chart
Cycle n
Cycle n+1
Cycle n+2
Disable Cycle
Cycle n+3
t
RCW
t
REN1
t
RES
t
REW
t
REH
t
REN2
t
RCP
t
RCK
(n+1)
(n)
t
AC
t
OH
(n+2)
(n+3)
t
HZ
t
LZ
t
AC
t
LZ
High impedance
RCK (Input)
RE (Input)
D
OUT
(Output)
High impedance
Remark
RSTR = "H" level
PD485505
11
Data Sheet M10059EJ7V0DS00
Write Reset Cycle Timing Chart (WE = Active)
Cycle n
Reset Cycle
Cycle 0
Cycle 1
t
RN2
t
RH
t
RSTW
Note
t
RS
t
RN1
"L" Level
t
DS
t
DH
t
DS
t
DH
(1)
(0)
(n)
(n1)
D
IN
(Input)
WE (Input)
RSTW (Input)
WCK (Input)
Note
In write reset cycle, reset operation is executed even without a reset cycle (t
RSTW
).
WCK can be input any number of times in a reset cycle.
Write Reset Cycle Timing Chart (WE = Inactive)
Cycle n
Disable Cycle
Cycle 0
t
RN2
t
RH
t
RSTW
Note
t
RS
t
RN1
t
DS
t
DH
t
DS
(0)
(n)
(n1)
D
IN
(Input)
WE (Input)
RSTW (Input)
WCK (Input)
Reset Cycle
t
WEW
t
WEN1
t
WES
t
WEH
t
WEN2
Note
In write reset cycle, reset operation is executed even without a reset cycle (t
RSTW
).
WCK can be input any number of times in a reset cycle.
PD485505
12
Data Sheet M10059EJ7V0DS00
Read Reset Cycle Timing Chart (RE = Active)
Cycle n
Reset Cycle
Cycle 0
Cycle 1
t
RN2
t
RH
t
RSTR
Note
t
RS
t
RN1
"L" Level
t
AC
t
OH
t
AC
t
OH
(1)
(0)
(n)
(n1)
D
OUT
(Output)
RE (Input)
RSTR (Input)
RCK (Input)
t
OH
t
AC
t
AC
(0)
Note
In read reset cycle, reset operation is executed even without a reset cycle (t
RSTR
).
RCK can be input any number of times in a reset cycle.
Read Reset Cycle Timing Chart (RE = Inactive)
Cycle n
Disable Cycle
Cycle 0
t
RN2
t
RH
t
RSTR
Note
t
RS
t
RN1
t
HZ
t
AC
(0)
(n)
(n1)
D
OUT
(Output)
RE (Input)
RSTR (Input)
RCK (Input)
t
LZ
t
REH
t
AC
Reset Cycle
t
REN1
t
RES
t
REW
t
REN2
High impedance
t
OH
t
OH
Note
In read reset cycle, reset operation is executed even without a reset cycle (t
RSTR
).
RCK can be input any number of times in a reset cycle.
PD485505
13
Data Sheet M10059EJ7V0DS00
4. Application
4.1 1 H Delay Line
PD485505 easily allows a 1 H (5,048 bits) delay line (see Figure 4.1).
Figure 4.1 1 H Delay Line Circuit
WCK
D
IN
WE
RSTW
RCK
D
OUT
RE
RSTR
40 MHz Clock
Reset
Data Output
Data Input
8
8
Figure 4.2 1 H Delay Line Timing Chart
t
WCK
t
RCK
Cycle 0
Cycle 1
Cycle 2
1 H
(5,048 Cycles)
Cycle 5,047
Cycle 0'
2 H
(5,048 Cycles)
t
WCW
t
RCW
t
WCP
t
RCP
t
RS
t
RH
t
DH
t
DS
(0)
(1)
(2)
(5,046)
(5,047)
(0')
(1')
t
DH
t
OH
t
AC
(0)
(1)
(2')
(3')
(2)
(3)
WCK/RCK
(Input)
RSTW /
RSTR
(Input)
D
IN
(Input)
D
OUT
(Output)
t
DS
Cycle 1'
Cycle 2'
Cycle 3'
Write
Cycle 0
Read
Cycle 1
Cycle 2
Cycle 3
Remark
RE, WE = "L" level
PD485505
14
Data Sheet M10059EJ7V0DS00
4.2 n Bit Delay
It is possible to make delay read from the write data with the
PD485505.
(1) Perform a reset operation in the cycle proportionate to the delay length. (Figure 4.3)
(2) Shift the input timing of write reset (RSTW) and read reset (RSTR) depending on the delay length. (Figure 4.4)
(3) Shift the address by disabling RE for the period proportionate to the delay length. (Figure 4.5)
n bit: Delay bits from write cycle to read cycle correspond to a same address cell.
Restrictions
Delay bits n can be set from minimum bits to maximum bits depending on the operating cycle time. Refer
to 2. Operation Mode Operation-related Restriction.
Cycle time
MIN.
MAX.
25 ns
21 bits
5,048 bits
35 ns
15 bits
5,048 bits
Figure 4.3 n-Bit Delay Line Timing Chart (1)
t
WCK
t
RCK
Cycle 0
Cycle 1
Cycle 2
1 H
(n Cycles)
Cycle n1
2 H
(n Cycles)
t
WCW
t
RCW
t
WCP
t
RCP
t
RS
t
RH
t
DH
t
DS
(0)
(1)
(n2)
(n1)
(0')
(1')
t
DS
t
DH
t
OH
t
AC
(0)
(1)
(2')
(3')
(2)
(3)
WCK/RCK
(Input)
D
IN
(Input)
D
OUT
(Output)
t
RS
t
RH
(2)
RSTW /
RSTR
(Input)
Cycle 0'
Write
Cycle 0
Read
Cycle 1'
Cycle 1
Cycle 2'
Cycle 2
Cycle 3'
Cycle 3
t
WAR
Remark
RE, WE = "L" level
PD485505
15
Data Sheet M10059EJ7V0DS00
Figure 4.4 n-Bit Delay Line Timing Chart (2)
t
WCK
t
RCK
Cycle 0
Cycle 1
Cycle 2
Cycle n1
t
WCW
t
RCW
t
WCP
t
RCP
t
RS
t
RH
t
DH
t
DS
(0)
(1)
(2)
(n2)
(n1)
(n)
(n+1)
t
DS
t
DH
t
OH
t
AC
(0)
(1)
(n+2)
(n+3)
(2)
(3)
WCK/RCK
(Input)
RSTW
(Input)
D
IN
(Input)
D
OUT
(Output)
Cycle n+1
Cycle n+2
Cycle n+3
t
RH
t
RS
n Cycles
RSTR
(Input)
Cycle n
Write
Cycle 0
Read
Cycle 1
Cycle 2
Cycle 3
t
WAR
Remark
RE, WE = "L" level
Figure 4.5 n-Bit Delay Line Timing Chart (3)
t
WCK
t
RCK
Cycle 0
Cycle 1
Cycle 2
Cycle n1
t
WCW
t
RCW
t
WCP
t
RCP
t
RS
t
RH
t
DH
t
DS
(0)
(1)
(2)
(n2)
(n1)
(n)
(n+1)
t
DS
t
DH
t
OH
t
AC
(0)
(1)
(n+2)
(n+3)
(2)
(3)
WCK/RCK
(Input)
RSTW/
RSTR
(Input)
D
IN
(Input)
D
OUT
(Output)
Cycle n+1
Cycle n+2
Cycle n+3
t
REH
n Cycles
RE
(Input)
t
REN2
Cycle n
Write
Cycle 0
Read
Cycle 1
Cycle 2
Cycle 3
t
WAR
High impedance
Remark
WE = "L" level
PD485505
16
Data Sheet M10059EJ7V0DS00
4.3 Double-speed Conversion
Figure 4.6 shows an example timing chart of double-speed and twice reading operation (f
R
= 2f
W
, 5,048 by
2 cycle) for a write operation (f
W
= 5,048 cycle).
Caution
The read operation collide with the write operation on the same line, last n bits output data
(5,048n to 5,048) in the first read operation will be undefined (see Figure 4.6 Double-speed
Conversion Timing Chart).
Undefined bits mentioned above depend on the cycle time.
Read cycle time
Undefined bits
25 ns
21 bits
35 ns
15 bits
Figure 4.6 Double-speed Conversion Timing Chart
Remark
RE, WE = "L" level
1H
(5,048 Cycle)
2H
(5,048 Cycle)
0
1
2
5046 5047
0'
1'
2'
5046' 5047'
0"
0
1
2
5046 5047
0'
1'
2'
5046'
5047'
0"
1H
(5,048 Cycle)
First read cycle
1H
(5,048 Cycle)
Second read cycle
2H
(5,048 Cycle)
First read cycle
n bits output data will be undefined.
n bits output data will be undefined.
0
1
2
5046 5047
0
1
2
5046 5047
0' 1' 2'
5046' 5047'
0' 1'
t
AC
WCK
(Input)
RSTW
(Input)
D
IN
(Input)
RCK
(Input)
RSTR
(Input)
D
OUT
(Output)
PD485505
17
Data Sheet M10059EJ7V0DS00
5. Package Drawing
24
13
1
12
K
F
G
P
detail of lead end
M
S
A
J
H
I
L
E
C
D
M
B
S
N
ITEM
B
C
H
24-PIN PLASTIC SOP (11.43 mm (450))
A
J
D
E
F
G
I
K
L
MILLIMETERS
1.27 (T.P.)
1.27 MAX.
12.2
0.3
15.5
0.2
1.9
0.2
0.42
0.08
0.1
0.1
2.0
2.1
0.2
8.4
0.2
0.17
+
0.08
-
0.07
0.9
0.2
0.12
M
NOTE
Each lead centerline is located within 0.12 mm of
its true position (T.P.) at maximum material condition.
N
0.10
5
5
P
P24GM-50-450A-4
PD485505
18
Data Sheet M10059EJ7V0DS00
6. Recommended Soldering Conditions
Please consult with our sales offices for soldering conditions of the
PD485505.
Type of Surface Mount Device
PD485505G: 24-pin plastic SOP (11.43 mm (450))
7. Example of Stamping
Letter E in the fifth character position in a lot number signifies version E, letter K, version K, letter P, version
P, and letter L, version L.
JAPAN
D485505
Lot number
PD485505
19
Data Sheet M10059EJ7V0DS00
NOTES FOR CMOS DEVICES
1
PRECAUTION AGAINST ESD FOR SEMICONDUCTORS
Note:
Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and
ultimately degrade the device operation. Steps must be taken to stop generation of static electricity
as much as possible, and quickly dissipate it once, when it has occurred. Environmental control
must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using
insulators that easily build static electricity. Semiconductor devices must be stored and trans-
ported in an anti-static container, static shielding bag or conductive material. All test and
measurement tools including work bench and floor should be grounded. The operator should be
grounded using wrist strap. Semiconductor devices must not be touched with bare hands. Similar
precautions need to be taken for PW boards with semiconductor devices on it.
2
HANDLING OF UNUSED INPUT PINS FOR CMOS
Note:
No connection for CMOS device inputs can be cause of malfunction. If no connection is provided
to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence
causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input
levels of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each
unused pin should be connected to V
DD
or GND with a resistor, if it is considered to have a
possibility of being an output pin. All handling related to the unused pins must be judged device
by device and related specifications governing the devices.
3
STATUS BEFORE INITIALIZATION OF MOS DEVICES
Note:
Power-on does not necessarily define initial status of MOS device. Production process of MOS
does not define the initial operation status of the device. Immediately after the power source is
turned ON, the devices with reset function have not yet been initialized. Hence, power-on does
not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until
the reset signal is received. Reset operation must be executed immediately after power-on for
devices having reset function.
PD485505
[MEMO]
M8E 00. 4
The information in this document is current as of December, 2000. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or
data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all
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