400 mW DHD ZENER DIODE
(DO-34)
DESCRIPTION
NEC Type RD2.0ES to RD39ES Series are planar type diodes into DO-34
Package (Body length 2.4 mm MAX.) with DHD (Double Heatsink Diode)
construction having allowable power dissipation of 400 mW.
FEATURES
DO-34 Glass sealed package
This diode can be inserted into a PC board with a shorter pitch (5 mm)
Planar process
DHD (Double Heatsink Diode) construction
V
Z
Applied E24 standard
ORDERING INFORMATION
RD2.0ES to RD39ES with suffix "AB1", "AB2", or "AB3" should be applied
for orders for suffix "AB".
APPLICATIONS
Circuits for Constant Voltage, Constant Current, Waveform clipper, Surge absorber, etc.
ABSOLUTE MAXIMUM RATINGS (T
A
= 25
C)
Forward Current
I
F
150 mA
Power Dissipation
P
400 mW
to see Fig. 6
Surge Reverse Power
P
RSM
100 W (t = 10
s)
to see Fig. 10
Junction Temperature
T
j
175
C
Storage Temperature
T
stg
65 to +175
C
ZENER DIODES
RD2.0ES to RD39ES
Document No. D13935EJ6V0DS00 (6th edition)
(Previous No. DC-2140)
Date Published March 1999 N CP(K)
Printed in Japan
1984
DATA SHEET
0.4
Cathode
indication
2.0 MAX.
25 MIN.
25 MIN.
2.4 MAX.
DO-34 (JEDEC)
Marking color: Black
PACKAGE DIMENSIONS
(in millimeters)
5 mm
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for availability
and additional information.
5
RD2.0ES to RD39ES
Data Sheet D13935EJ6V0DS00
Fig. 6
POWER DISSIPATION vs.
AMBIENT TEMPERATURE
Fig. 7
THERMAL RESISTANCE vs.
SIZE OF P.C BOARD
Fig. 8
DYNAMIC IMPEDANCE vs.
ZENER CURRENT
Fig. 9
ZENER VOLTAGE TEMPERATURE
COEFFICIENT vs. ZENER VOLTAGE
Fig. 10 SURGE REVERSE POWER RATINGS
0.08
0.06
0.04
0.02
0
0.02
0.04
0.06
32
0.1
TYP.
40
24
16
8
0
8
16
24
0.08
32
0.1
40
8
4
12
16
20
Z
V
Z
Temperature Coefficience %/
C
Z
V
Z
Temperature Coefficience mV/
C
24
28
32
36
40
mV/
C
RD2.0ES to RD39ES
%/
C
V
Z
Zener Voltage V
44
0
500
400
300
200
100
0
20
40
60
80
100
T
A
Ambient Temperature
C
P Power Dissipation mW
120 140 160 180 200
= 5 mm
= 10 mm
7 mm P.C. Board
t = 0.035 mm
= 5 mm
= 10 mm
= 3 mm
= 3 mm
3 mm P.C. Board
t = 0.035 mm
500
400
300
200
100
0
20
40
S Size of P.C. Board mm
2
R
th
Thermal Resistance
C/W
60
80
100
= 10 mm
= 5mm
= 3mm
S
Junction to ambient
1000
100
10
TYP.
1
0.01
0.1
I
Z
Zener Current mA
Z
Z
Dynamic Impedance
10
1
100
RD3.3ES
RD15ES
RD39ES
RD20ES
RD5.6ES
RD10ES
RD7.5ES
RD5.1ES
RD2.0ES
RD3.9ES
RD4.7ES
1000
T
A
=25
C
Non-Repetitive
t
T
P
RSM
100
10
1
1
10
100 m
100
1 m
10 m
t
T
Pulse Width s
P
RSM
Surge Reverse Power W
2
RD2.0ES to RD39ES
[MEMO]
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from use of a device described herein or any other liability arising
from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights
or other intellectual property rights of NEC Corporation or others.
Descriptions of circuits, software, and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these circuits,
software, and information in the design of the customer's equipment shall be done under the full responsibility
of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third
parties arising from the use of these circuits, software, and information.
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the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
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"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated "quality assurance program" for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special:
Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific:
Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
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M7 98.8
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