Caution: Electro-static sensitive devices
BIPOLAR ANALOG INTEGRATED CIRCUITS
m
m
PC2745TB,
m
m
PC2746TB
3 V, SUPER MINIMOLD SILICON MMIC
WIDEBAND AMPLIFIER FOR MOBILE COMMUNICATIONS
1996
Document No. P11511EJ2V0DS00 (2nd edition)
Date Published April 1997 N
DATA SHEET
DESCRIPTION
The
m
PC2745TB and
m
PC2746TB are silicon monolithic integrated circuits designed as buffer amplifier for mobile
communications. These ICs are packaged in super minimold package which is smaller than conventional minimold.
The
m
PC2745TB and
m
PC2746TB have each compatible pin connections and performance to
m
PC2745T/
m
PC2746T of conventional minimold version. So, in the case of reducing your system size,
m
PC2745TB/
m
PC2746TB
are suitable to replace from
m
PC2745T/
m
PC2746T.
These ICs are manufactured using NEC's 20 GHz f
T
NESAT
III silicon bipolar process. This process uses silicon
nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and
prevent corrosion/migration. Thus, these IC have excellent performance, uniformity and reliability.
FEATURES
High-density surface mounting : 6 pin super minimold package
Supply voltage : Recommended V
CC
= 2.7 to 3.3 V
Circuit operation V
CC
= 1.8 to 3.3 V
Wideband response : f
u
= 2.7 GHz
TYP
. @
m
PC2745TB
f
u
= 1.5 GHz
TYP
. @
m
PC2746TB
High isolation : ISL = 38 dB
TYP
. @
m
PC2745TB
ISL = 45 dB
TYP.
@
m
PC2746TB
APPLICATION
1.5 GHz to 2.5 GHz communication system (PHS, wireless LAN; etc.):
m
PC2745TB
800 MHz to 900 MHz cellular telephone (CT2, GSM, etc.) :
m
PC2746TB
ORDERING INFORMATION
PART NUMBER PACKAGE MARKING SUPPLYING FORM f
U
m
PC2745TB-E3 6 pin super C1Q Embossed tape 8 mm wide. 2.7 GHz
TYP
.
m
PC2746TB-E3
minimold
C1R
1, 2, 3 pins face to perforation side of the tape. Qty 3 kp/reel.
1.5 GHz
TYP
.
Remarks To order evaluation samples, please contact your local NEC sales office.
(Part number:
m
PC2745TB,
m
PC2746TB)
2
m
m
PC2745TB,
m
m
PC2746TB
PIN CONNECTIONS
Pin NO.
Pin name
1
INPUT
2
GND
3
GND
4
OUTPUT
5
GND
6
V
CC
PRODUCT LINE-UP OF
m
m
PC2745,
m
m
PC2746 (T
A
= +25
C, V
CC
= 3.0 V, Z
L
= Z
s
= 50
W
W
)
PART NO.
f
u
(GHz)
P
O(sat)
(dBm)
G
P
(dB)
NF (dB)
I
CC
(mA)
PACKAGE
MARKING
m
PC2745T
6 pin minimold
m
PC2745TB
6 pin super minimold
m
PC2746T
6 pin minimold
m
PC2746TB
6 pin super minimold
Remarks Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail.
Notice The package size distinguish between minimold and super minimold.
SYSTEM APPLICATION EXAMPLE
Digital Cellular System Block Diagram
SW
PA
PLL
PLL
I
Q
DEMO
I
Q
0
90
TX
RX
Digital Cellular System Block Diagram
: PC2745TB, PC2746TB applicable
To know the associated products, please refer to each latest data sheet.
2.7
-
1
12
6.0
7.5
1.5
0
19
4.0
7.5
C1Q
C1R
3
2
1
4
5
6
(Top View)
C1
Q
4
5
6
3
2
1
(Bottom View)
Marking is an example of PC2745TB
3
m
m
PC2745TB,
m
m
PC2746TB
PIN EXPLANATION
Pin
NO.
Pin Name
Applied
voltage
V
Pin
voltage
V
Note
Function and applications
Internal equivalent circuit
1
INPUT
0.87
0.82
Signal input pin. A internal matching circuit,
configured with resistors, enables 50
W
connection over a wide band. this pin must be
coupled to signal source with capacitor for DC
cut.
4
OUTPUT
1.95
2.54
Signal output pin. A internal matching circuit,
configured with resistors, enables 50
W
connection over a wide band. This pin must
be coupled to next stage with capacitor for DC
cut.
6
V
CC
2.7 to 3.3
Power supply pin. This pin should be
externally equipped with bypass capacity to
minimize ground impedance.
2
3
5
GND
0
Ground pin. This pin should be connected to
system ground with minimum inductance.
Ground pattern on the board should be formed
as wide as possible. All the ground pins must
be connected together with wide ground
pattern to decrease impedance difference.
Note Pin voltage is measured at V
CC
= 3.0 V. Above:
m
PC2745TB, Below:
m
PC2746TB
1
6
4
3
5
2
4
m
m
PC2745TB,
m
m
PC2746TB
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
CONDITION
RATINGS
UNIT
Supply voltage
V
CC
T
A
= +25
C
4.0
V
Circuit current
I
CC
T
A
= +25
C
16
mA
Input power level
P
in
T
A
= +25
C
0
dBm
Total power dissipation
P
D
Mounted on double sided copper clad
50
50
1.6 mm epoxy glass PWB
(T
A
= +85
C)
200
mW
Operating ambient temperature
T
A
-
40 to +85
C
Storage temperature
T
STG
-
55 to +150
C
RECOMMENDED OPERATING CONDITIONS
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
UNIT
NOTICE
Supply voltage
V
CC
2.7
3.0
3.3
V
Operating ambient temperature
T
A
-
40
+25
+85
C
ELECTRICAL CHARACTERISTICS (T
A
= + 25
C, V
CC
= 3.0 V, Z
L
= Z
S
= 50
W
W
)
m
PC2745TB
m
PC2746TB
MIN.
TYP.
MAX.
MIN.
TYP.
MAX.
Circuit current
I
CC
No signals
5.0
7.5
10.0
5.0
7.5
10.0
mA
Power Gain
G
P
f = 0.5 GHz
9.0
12
14
16
19
21
dB
Noise figure
NF
f = 0.5 GHz
6
7.5
4.0
5.5
dB
Upper limit operating
frequency
f
u
3 dB down below
from gain at f = 100
MHz
2.3
2.7
1.1
1.5
GHz
Isolation
ISL
f = 0.5 GHz
33
38
40
45
dB
Input return loss
RL
in
f = 0.5 GHz
8
11
10
13
dB
Output return loss
RL
out
f = 0.5 GHz
2.5
5.5
5.5
8.5
dB
Maximum output level
P
O(sat)
f = 0.5 GHz,
Pin =
-
6 dBm
-
4
-
1
-
3
0
dBm
PARAMETER
SYMBOL
TEST CONDITION
UNIT
5
m
m
PC2745TB,
m
m
PC2746TB
STANDARD CHARACTERISTICS FOR REFERENCE (T
A
= +25
C, V
CC
= 3.0 V, Z
L
= Z
S
= 50
W
W
)
PARAMETER
SYMBOL
TEST CONDITION
m
PC2745TB
m
PC2745B
UNIT
Circuit current
I
CC
V
CC
= 1.8 V, No signals
4.5
4.5
mA
Power Gain
G
P
V
CC
= 3.0 V, f = 1 GHz
V
CC
= 3.0 V, f = 2 GHz
V
CC
= 1.8 V, f = 500 MHz
12
11
7
18.5
14
dB
Noise figure
NF
V
CC
= 3.0 V, f = 1 GHz
V
CC
= 3.0 V, f = 2 GHz
V
CC
= 1.8 V, f = 500 MHz
5.5
5.7
8.0
4.2
5.0
dB
Upper limit
operating
frequency
f
u
V
CC
= 1.8 V, 3 dB down below from gain at f = 100 MHz
1.8
1.1
GHz
Isolation
ISL
V
CC
= 3.0 V, f = 1 GHz
V
CC
= 3.0 V, f = 2 GHz
V
CC
= 1.8 V, f = 500 MHz
33
30
35
38
37
dB
Input return loss
RL
in
V
CC
= 3.0 V, f = 1 GHz
V
CC
= 3.0 V, f = 2 GHz
V
CC
= 1.8 V, f = 500 MHz
13
14
6.5
10
10
dB
Output return
loss
RL
out
V
CC
= 3.0 V, f = 1 GHz
V
CC
= 3.0 V, f = 2 GHz
V
CC
= 1.8 V, f = 500 MHz
6.5
8.5
6.0
8.5
9.5
dB
Maximum output
level
P
O(sat)
V
CC
= 3.0 V, f = 1 GHz, Pin =
-
6 dBm
V
CC
= 3.0 V, f = 2 GHz, Pin =
-
6 dBm
V
CC
= 1.8 V, f = 500 MHz, Pin =
-
10 dBm
-
2.5
-
3.5
-
11
-
1
-
8
dBm
3rd order
intermodulation
distortion
IM
3
V
CC
= 3.0 V, Pout =
-
20 dBm, f1 = 500 MHz, f2 = 502 MHz
V
CC
= 3.0 V, Pout =
-
20 dBm, f1 = 1 000 MHz, f2 = 1 002 MHz
V
CC
= 1.8 V, Pout =
-
20 dBm, f1 = 500 MHz, f2 = 502 MHz
-
54
-
50
-
31
-
51
-
37
dBc
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