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confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
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MOS INTEGRATED CIRCUIT
PD16877
MONOLITHIC QUAD H-BRIDGE DRIVER CIRCUIT
Document No. S13964EJ1V0DS00 (1st edition)
Date Published March 2000 N CP(K)
Printed in Japan
DATA SHEET
2000
DESCRIPTION
The
PD16877 is monolithic quad H-bridge driver LSI which uses power MOSFETs in the output stages. By using
the MOS process, this driver IC has substantially improved saturation voltage and power consumption as compared
with conventional driver circuits using bipolar transistors.
By eliminating the charge pump circuit, the current during power-OFF is drastically decreased.
In addition, a low-voltage malfunction prevention circuit is also provided that prevents the IC from malfunctioning
when the supply voltage drops.
As the package, a 24-pin plastic TSSOP is adopted to enable the creation of compact, slim application sets.
This driver IC can drive two stepping motor at the same time, and is ideal for driving stepping motors in the lens of
a camcorder.
FEATURES
Four H bridge circuits employing power MOSFETs
Low current consumption by eliminating charge pump
V
M
pin current when power-OFF: 10
A MAX. V
DD
pin current: 10
A MAX.
Input logic frequency: 100 kHz
3-V power supply
Minimum operating supply voltage: 2.5 V
Low voltage malfunction prevention circuit
24-pin plastic TSSOP (5.72 mm (225))
ORDERING INFORMATION
Part Number
Package
PD16877MA-6A5
24-pin plastic TSSOP (5.72 mm (225))
Data Sheet S13964EJ1V0DS00
2
PD16877
ABSOLUTE MAXIMUM RATINGS (T
A
= 25
C)
When mounted on a glass epoxy board (10 cm
10 cm
1 mm, 15% copper foil)
Parameter
Symbol
Condition
Rating
Unit
Control block supply voltage
V
DD
-
0.5 to +6.0
V
Output block supply voltage
V
M
-
0.5 to +6.0
V
Input voltage
V
IN
-
0.5 to V
DD
+ 0.5
V
Output terminal voltage
V
OUT
6.2
V
I
D(DC)
DC
0.3
A/ch
Output current
I
D(pulse)
PW
10 ms, Duty
5%
0.7
A/ch
Power consumption
P
T
0.7
W
Peak junction temperature
T
CH(MAX)
150
C
Storage temperature range
T
stg
-
55 to +150
C
RECOMMENDED OPERATING CONDITIONS
When mounted on a glass epoxy board (10 cm
10 cm
1 mm, 15% copper foil)
Parameter
Symbol
Condition
MIN.
TYP.
MAX.
Unit
Control block supply voltage
V
DD
2.5
5.5
V
Output block supply voltage
V
M
2.7
5.5
V
Output current
I
D(DC)
DC
-
0.2
+0.2
A
Operating frequency
f
IN
IN, EN terminal
100
kHz
Operating temperature range
T
A
-
10
85
C
Peak junction temperature
T
CH(MAX)
125
C
CHARACTERISTICS (Unless otherwise specified, V
DD
= V
M
= 3 V, T
A
= 25
C)
Parameter
Symbol
Condition
MIN.
TYP.
MAX.
Unit
Off state V
M
pin current
I
M(OFF)
All control terminal: L level
10
A
V
DD
pin current
I
DD
All control terminal: L level
10
A
High level input current
I
IH
V
IN
= V
DD
0.06
mA
Low level input current
I
IL
V
IN
= 0 V
-
1.0
A
Input pull down resistance
R
IND
50
200
k
High level input voltage
V
IH
0.7
V
DD
V
DD
+0.3
V
Low level input voltage
V
IL
2.5 V
V
DD
5.5 V
-
3.0
0.3
V
DD
V
H-bridge ON resistance
R
ON
2.5 V
V
M
, V
DD
5.5 V
Upper + lower
3.0
V
DDS1
V
M
= 5 V
-
10
C
T
A
+85
C
0.8
2.5
V
Low voltage malfunction
prevention circuit operating voltage
V
DDS2
V
M
= 3 V
-
10
C
T
A
+85
C
0.65
2.5
V
H bridge output turn-on time
t
ONH
0.7
20
s
H bridge output turn-off time
t
OFFH
0.2
0.5
s
H bridge output rise time
t
r
0.1
0.4
1.0
s
H bridge output fall time
t
f
R
M
= 20
Figure 1
70
200
ns
Data Sheet S13964EJ1V0DS00
3
PD16877
Figure 1. Switching time condition
100%
50%
0%
100%
100%
90%
90%
-
10%
0%
-
10%
-
50%
-
50%
-
90%
-
90%
-
100%
50%
The current flowing in the direction from
OUT_
A
to OUT_
B
is assumed to be (+).
50%
10%
10%
t
ONH
t
ONH
t
OFFH
t
OFFH
I
D
V
IN
t
f
t
r
t
f
t
r
50%
FUNCTION TABLE
Channel 1
Channel 2
EN
1
IN
1
OUT
1A
OUT
1B
EN
2
IN
2
OUT
2A
OUT
2B
H
L
H
L
H
L
H
L
H
H
L
H
H
H
L
H
L
L
Z
Z
L
L
Z
Z
L
H
Z
Z
L
H
Z
Z
Channel 3
Channel 4
EN
3
IN
3
OUT
3A
OUT
3B
EN
4
IN
4
OUT
4A
OUT
4B
H
L
H
L
H
L
H
L
H
H
L
H
H
H
L
H
L
L
Z
Z
L
L
Z
Z
L
H
Z
Z
L
H
Z
Z
H: High-level, L: Low-level, Z: High impedance
Data Sheet S13964EJ1V0DS00
4
PD16877
PIN CONNECTION
1
2
3
4
5
6
7
8
9
10
11
12
V
DD
OUT
1B
PGND
OUT
2B
V
M23
OUT
3B
PGND
OUT
4B
EN
4
IN
4
EN
3
IN
3
24
23
22
21
20
19
18
17
16
15
14
13
V
M1
OUT
1A
PGND
OUT
2A
OUT
3A
PGND
OUT
4A
V
M4
IN
1
EN
1
IN
2
EN
2
Pin No.
Pin name
Pin function
Pin No.
Pin name
Pin function
1
V
M1
Output block supply voltage input
terminal
13
IN
3
Control terminal (channel 3)
2
OUT
1A
Output terminal
14
EN
3
Enable terminal (channel 3)
3
PGND
Ground terminal
15
IN
4
Control terminal (channel 4)
4
OUT
2A
Output terminal
16
EN
4
Enable terminal (channel 4)
5
OUT
3A
Output terminal
17
OUT
4B
Output terminal
6
PGND
Ground terminal
18
PGND
Ground terminal
7
OUT
4A
Output terminal
19
OUT
3B
Output terminal
8
V
M4
Output block supply voltage input
terminal
20
V
M23
Output block supply voltage input
terminal
9
IN
1
Control terminal (channel 1)
21
OUT
2B
Output terminal
10
EN
1
Enable terminal (channel 1)
22
PGND
Ground terminal
11
IN
2
Control terminal (channel 2)
23
OUT
1B
Output terminal
12
EN
2
Enable terminal (channel 2)
24
V
DD
Control block supply voltage input
terminal
Data Sheet S13964EJ1V0DS00
5
PD16877
BLOCK DIAGRAM
Low volatge
malfunction
prevention
circuit
V
DD
IN
1
EN
1
V
M1
OUT
1A
OUT
1B
PGND
V
M23
OUT
2A
OUT
2B
PGND
OUT
3A
OUT
3B
PGND
V
M4
OUT
4A
OUT
4B
PGND
IN
2
EN
2
IN
3
EN
3
IN
4
EN
4
Control
circuit (4)
H-bridge
(1)
H-bridge
(2)
H-bridge
(4)
H-bridge
(3)
Control
circuit (1)
Control
circuit (2)
Control
circuit (3)
9
10
11
12
13
14
15
16
1
24
2
23
3
20
4
21
22
5
19
6
8
7
17
18
Remark Plural terminal (V
M
, PGND) is not only 1 terminal and connect all terminals.
Data Sheet S13964EJ1V0DS00
6
PD16877
TYPICAL CHARACTERISTICS
-
10 0
0
0.2
0.4
0.6
Total power dissipation P
T
(W)
0.8
1.0
20
40
60
Ambient temperature T
A
(
C)
80
100
120
0.7W
178
C/W
P
T
vs. T
A
characteristics
6
5
4
3
2
1
0
5
10
15
20
25
OFF state V
M
Pin current I
M (OFF)
( A)
30
35
Output block supply voltage V
M
(V)
I
M (OFF)
vs. V
M
characteristics
T
A
= 25
C
control : "L"
T
A
= 25
C
control : "L"
T
A
= 25
C
T
A
= 25
C
T
A
= 25
C
6
5
4
3
2
1
0
10
20
30
40
50
Input current I
IH
I
IL
( A)
60
Control block supply voltage V
DD
(V)
I
IH
, I
IL
vs. V
DD
characteristics
6
5
4
3
2
1
0
0.1
0.2
0.3
0.4
0.5
V
DD
pin current I
DD
( A)
0.6
0.7
Control block supply voltage V
DD
(V)
I
DD
vs. V
DD
characteristics
6
5
4
3
2
1
0.5
1.0
1.5
2.0
Low voltage detection voltage V
DDS
(V)
Output block supply voltage V
M
(V)
V
DDS
vs. V
M
characteristics
6
5
4
3
2
1
0
0
1.0
2.0
3.0
4.0
Input voltage V
IH
, V
IL
(V)
Control block supply voltage V
DD
(V)
V
IH
, V
IL
vs. V
DD
characteristics
I
IH
I
IL
V
IH
, V
IL
V
DD
(L H)
V
DD
(H L)
Data Sheet S13964EJ1V0DS00
7
PD16877
T
A
= 25
C
T
A
= 25
C
6
5
4
3
2
1
0
0.2
0.4
0.6
H-bridge Output turn-off time t
OFFH
( s)
H-bridge Output turn-on time t
ONH
( s)
0.8
1.0
Output block supply voltage V
M
(V)
t
ONH
, t
OFFH
vs. V
M
characteristics
6
5
4
3
2
1
0
0.5
1.0
1.5
2.0
2.5
H-bridge ON resistance R
ON
(
)
3.0
Output block supply voltage V
M
(V)
R
ON
vs. V
M
characteristics
t
OFFH
T
A
= 25
C
6
5
4
3
2
1
0
0.2
0.1
0.6
0.8
1.0
Output block supply voltage V
M
(V)
t
r
, t
f
vs. V
M
characteristics
t
r
t
f
t
ONH
H-bridge Output fall time t
f
( s)
H-bridge Output rise time t
r
( s)
Data Sheet S13964EJ1V0DS00
8
PD16877
STANDARD CONNECTION EXAMPLE
DC/DC CONVERTER
CPU
motor1
OUT
1A
V
M4
V
DD
= V
M
= 2.7 V to 5.5 V
low voltage
malfunction
prevention
circuit
V
M4
V
M2 3
H-bridge
(1)
H-bridge
(2)
level
shift
circuit
control
circuit
H-bridge
(3)
H-bridge
(4)
OUT
2A
IN
1
V
DD
EN
1
IN
2
EN
2
IN
3
EN
3
IN
4
EN
4
OUT
2B
OUT
1B
PGND
OUT
3A
OUT
3B
PGND
OUT
4A
OUT
4B
PGND
PGND
1 to 10 F
1 to 10 F
motor2
Data Sheet S13964EJ1V0DS00
9
PD16877
PACKAGE DIMENSION
S
24-PIN PLASTIC TSSOP (5.72 mm (225))
NOTE
Each lead centerline is located within 0.10 mm of
its true position (T.P.) at maximum material condition.
ITEM
MILLIMETERS
A
A'
C
D
6.65
0.10
6.5
0.1
0.1
0.05
F
0.5 (T.P.)
G
B
0.575
E
0.22
0.05
1.2 MAX.
H
1.0
0.05
I
6.4
0.1
J
4.4
0.1
K
0.145
0.025
L
0.5
M
0.10
N
0.08
R
0.25
1.0
0.1
S
0.6
0.15
S24MA-50-6A5
P
3
+
5
-
3
24
13
1
12
M
S
N
K
F
G
L
R
S
E
P
J
D
M
C
A
B
A'
H
I
detail of lead end
Data Sheet S13964EJ1V0DS00
10
PD16877
RECOMMENDED SOLDERING CONDITIONS
Solder this product under the following recommended conditions.
For soldering methods and conditions other than those recommended, consult NEC.
For details of the recommended soldering conditions, refer to information document "Semiconductor Device
Mounting Technology Manual".
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
C; Time: 30 secs. max. (210
C min.);
Number of times: 3 times max; Number of day: none;
Flux: Rosin-based flux with little chlorine content (chlorine: 0.2Wt% max.) is
recommended.
IR35-00-3
VPS
Package peak temperature: 215
C; Time: 40 secs. max. (200
C min.);
Number of times: 3 times max.; Number of day: none;
Flux: Rosin-based flux with little chlorine content (chlorine: 0.2 Wt% max.) is
recommended.
VP15-00-3
Wave soldering
Package peak temperature: 260
C; Time: 10 secs. max.;
Preheating temperature: 120
C max.; Number of times: once;
Flux: Rosin-based flux with little chlorine content (chlorine: 0.2 Wt% max.) is
recommended.
WS60-00-1
Caution Do not use two or more soldering methods in combination.
Data Sheet S13964EJ1V0DS00
11
PD16877
NOTES FOR CMOS DEVICES
1
PRECAUTION AGAINST ESD FOR SEMICONDUCTORS
Note:
Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and
ultimately degrade the device operation. Steps must be taken to stop generation of static electricity
as much as possible, and quickly dissipate it once, when it has occurred. Environmental control
must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using
insulators that easily build static electricity. Semiconductor devices must be stored and transported
in an anti-static container, static shielding bag or conductive material. All test and measurement
tools including work bench and floor should be grounded. The operator should be grounded using
wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need
to be taken for PW boards with semiconductor devices on it.
2
HANDLING OF UNUSED INPUT PINS FOR CMOS
Note:
No connection for CMOS device inputs can be cause of malfunction. If no connection is provided
to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence
causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels
of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused
pin should be connected to V
DD
or GND with a resistor, if it is considered to have a possibility of
being an output pin. All handling related to the unused pins must be judged device by device and
related specifications governing the devices.
3
STATUS BEFORE INITIALIZATION OF MOS DEVICES
Note:
Power-on does not necessarily define initial status of MOS device. Production process of MOS
does not define the initial operation status of the device. Immediately after the power source is
turned ON, the devices with reset function have not yet been initialized. Hence, power-on does
not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the
reset signal is received. Reset operation must be executed immediately after power-on for devices
having reset function.
PD16877
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property
rights of third parties by or arising from use of a device described herein or any other liability arising from use
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of NEC Corporation or others.
Descriptions of circuits, software, and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these circuits,
software, and information in the design of the customer's equipment shall be done under the full responsibility
of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third
parties arising from the use of these circuits, software, and information.
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated "quality assurance program" for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
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