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Электронный компонент: UPD753204

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1996
DATA SHEET
4-BIT SINGLE-CHIP MICROCONTROLLERS
The
PD753208 is one of the 75XL Series 4-bit single-chip microcontrollers and has a data processing
capability comparable to that of an 8-bit microcontroller.
The
PD753208 has an on-chip LCD controller/driver and is based on the
PD75308B of the 75X Series.
However, the
PD75308B is supplied in an 80-pin package, whereas the
PD753208 is supplied in a 48-
pin package (375 mils, 0.65-mm pitch) and therefore is suitable for small-scale application systems. In
addition, the
PD753208 features expanded CPU functions and performs high-speed operations at a low
voltage of 1.8 V.
Detailed information about functions can be found in the following user's manual. Be sure to read it
before designing.
PD753208 User's Manual: U10158E
Document No. U10166EJ2V0DS00 (2nd edition)
Date Published March 1997 N
Printed in Japan
MOS INTEGRATED CIRCUIT
PD753204, 753206, 753208
The information in this document is subject to change without notice.
The mark shows major revised points.
Features
Low-voltage operation: V
DD
= 1.8 to 5.5 V
Can be driven by two 1.5-V batteries
Internal memory
Program memory (ROM):
4096
8 bits (
PD753204)
6144
8 bits (
PD753206)
8192
8 bits (
PD753208)
Data memory (RAM):
512
4 bits
Variable instruction execution time for high-speed
operation and power saving operation
0.95, 1.91, 3.81, 15.3
s (@ 4.19-MHz operation)
0.67, 1.33, 2.67, 10.7
s (@ 6.0-MHz operation)
Internal programmable LCD controller/driver
Small package:
48-pin plastic shrink SOP (375 mils, 0.65-mm pitch)
One-time PROM version:
PD75P3216
Applications
Remote controllers, Cameras, Sphygnomamometers, Compact-disc radio cassette player compo systems,
gas meters, etc.
Ordering Information
Part number
Package
ROM (
8 bits)
PD753204GT-
48-pin plastic shrink SOP (375 mils, 0.65-mm pitch)
4096
PD753206GT-
48-pin plastic shrink SOP (375 mils, 0.65-mm pitch)
6144
PD753208GT-
48-pin plastic shrink SOP (375 mils, 0.65-mm pitch)
8192
Remark
indicates ROM code suffix.
Unless otherwise specified, references in this data sheet to the
PD753208 mean the
PD753204 and the
PD753206.
2
PD753204, 753206, 753208
Function Outline
Parameter
Function
Instruction execution time
0.95, 1.91, 3.81, 15.3
s (@ 4.19-MHz operation with system clock)
0.67, 1.33, 2.67, 10.7
s (@ 6.0-MHz operation with system clock)
Internal memory
ROM
4096
8 bits (
PD753204)
6144
8 bits (
PD753206)
8192
8 bits (
PD753208)
RAM
512
4 bits
General-purpose register
4-bit operation: 8
4 banks
8-bit operation: 4
4 banks
Input/
CMOS input
6
Connecting on-chip pull-up resistors can be specified by software: 5
output
CMOS input/output
20
Connecting on-chip pull-up resistors can be specified by software: 20
port
Also used for segment pins: 8
N-ch open-drain
4
On-chip pull-up resistors can be specified by mask option
input/output
13-V withstand voltage
Total
30
LCD controller/driver
Segment selection:
4/8/12 segments (can be changed to CMOS input/
output port in 4-time units; max. 8)
Display mode selection:
Static
1/2 duty (1/2 bias)
1/3 duty (1/2 bias)
1/3 duty (1/3 bias)
1/4 duty (1/3 bias)
On-chip split resistor for LCD drive can be specified by mask option
Timer
5 channels
8-bit timer/event counter: 1 channel
8-bit timer counter: 2 channels (can be used as the 16-bit timer counter, carrier
generator, and timer with gate)
Basic interval timer/watchdog timer: 1 channel
Watch timer: 1 channel
Serial interface
3-wire serial I/O mode ... MSB or LSB can be selected for transferring first bit
2-wire serial I/O mode
SBI mode
Bit sequential buffer (BSB)
16 bits
Clock output (PCL)
, 524, 262, 65.5 kHz (@ 4.19-MHz operation with system clock)
, 750, 375, 93.8 kHz (@ 6.0-MHz operation with system clock)
Buzzer output (BUZ)
2, 4, 32 kHz (@ 4.19-MHz operation with system clock)
2.93, 5.86, 46.9 kHz (@ 6.0-MHz with system clock)
Vectored interrupts
External: 2, Internal: 5
Test input
External: 1, Internal: 1
System clock oscillator
Ceramic or crystal oscillator for system clock oscillation
Standby function
STOP/HALT mode
Power supply voltage
V
DD
= 1.8 to 5.5 V
Package
48-pin plastic shrink SOP (375 mils, 0.65-mm pitch)
3
PD753204, 753206, 753208
CONTENTS
1.
PIN CONFIGURATION (TOP VIEW) .................................................................................................... 5
2.
BLOCK DIAGRAM ................................................................................................................................ 6
3. PIN FUNCTIONS .................................................................................................................................... 7
3.1
Port Pins ...................................................................................................................................... 7
3.2
Non-Port Pins .............................................................................................................................. 9
3.3
Pin Input/Output Circuits ......................................................................................................... 11
3.4
Recommended Connections for Unused Pins ....................................................................... 13
4.
SWITCHING FUNCTION BETWEEN Mk I MODE AND Mk II MODE ................................................ 14
4.1
Difference Between Mk I and Mk II Modes .............................................................................. 14
4.2
Setting Method of Stack Bank Select Register (SBS) ........................................................... 15
5.
MEMORY CONFIGURATION ............................................................................................................. 16
6.
PERIPHERAL HARDWARE FUNCTION ........................................................................................... 21
6.1
Digital I/O Port ........................................................................................................................... 21
6.2
Clock Generator ........................................................................................................................ 22
6.3
Clock Output Circuit ................................................................................................................. 23
6.4
Basic Interval Timer/Watchdog Timer ..................................................................................... 24
6.5
Watch Timer .............................................................................................................................. 25
6.6
Timer/Event Counter ................................................................................................................. 26
6.7
Serial Interface .......................................................................................................................... 30
6.8
LCD Controller/Driver ............................................................................................................... 32
6.9
Bit Sequential Buffer ................................................................................................................ 34
7.
INTERRUPT FUNCTION AND TEST FUNCTION .............................................................................. 35
8.
STANDBY FUNCTION ........................................................................................................................ 37
9.
RESET FUNCTION ............................................................................................................................. 38
10. MASK OPTION ................................................................................................................................... 41
11. INSTRUCTION SET ............................................................................................................................ 42
12. ELECTRICAL SPECIFICATIONS ....................................................................................................... 56
13. CHARACTERISTIC CURVES (REFERENCE VALUES) ................................................................... 68
14. PACKAGE DRAWINGS ..................................................................................................................... 70
15. RECOMMENDED SOLDERING CONDITIONS ................................................................................. 71
4
PD753204, 753206, 753208
APPENDIX A
PD753108, 753208, AND 75P3216 FUNCTIONAL LIST ............................................. 72
APPENDIX B
DEVELOPMENT TOOLS ................................................................................................. 74
APPENDIX C
RELATED DOCUMENTS ................................................................................................ 77
5
PD753204, 753206, 753208
1. PIN CONFIGURATION (TOP VIEW)
48-pin plastic shrink SOP (375 mils, 0.65-mm pitch)
PD753204GT-
,
PD753206GT-
,
PD753208GT-
Note Connect IC (Internally Connected) pin directly to V
DD
.
Pin Identification
P00 to P03
: Port0
S12 to S23
: Segment Output 12 to 23
P10, P13
: Port1
V
LC0
to V
LC2
: LCD Power Supply 0 to 2
P20 to P23
: Port2
BIAS
: LCD Power Supply Bias Control
P30 to P33
: Port3
LCDCL
: LCD Clock
P50 to P53
: Port5
SYNC
: LCD Synchronization
P60 to P63
: Port6
TI0
: Timer Input 0
P80 to P83
: Port8
PTO0 to PTO2 : Programmable Timer Output 0 to 2
P90 to P93
: Port9
BUZ
: Buzzer Clock
KR0 to KR3
: Key Return 0 to 3
PCL
: Programmable Clock
COM0 to COM3 : Common Output 0 to 3
INT0, INT4
: External Vectored Interrupt 0, 4
SCK
: Serial Clock
X1, X2
: System Clock Oscillation 1, 2
SI
: Serial Input
RESET
: Reset
SO
: Serial Output
IC
: Internally Connected
SB0, SB1
: Serial Data Bus 0, 1
V
DD
: Positive Power Supply
V
SS
: Ground
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
COM0
COM1
COM2
COM3
BIAS
V
LC0
V
LC1
V
LC2
P30/LCDCL
P31/SYNC
P32
P33
V
SS
P50
P51
P52
P53
P60/KR0
P61/KR1
P62/KR2
P63/KR3
V
DD
X1
X2
S12
S13
S14
S15
P93/S16
P92/S17
P91/S18
P90/S19
P83/S20
P82/S21
P81/S22
P80/S23
P23/BUZ
P22/PCL/PTO2
P21/PTO1
P20/PTO0
P13/TI0
P10/INT0
P03/SI/SB1
P02/SO/SB0
P01/SCK
P00/INT4
RESET
IC
Note
6
PD753204, 753206, 753208
2. BLOCK DIAGRAM
Note The ROM capacity depends on the product.
PORT0
PORT1
PORT2
PORT3
PORT5
PORT6
PORT8
PORT9
4
2
4
4
4
4
4
4
P00 to P03
P10,P13
P20 to P23
P30 to P33
P50 to P53
P60 to P63
P80 to P83
P90 to P93
S12 to S15
4
4
4
4
S16/P93 to
S19/P90
S20/P83 to
S23/P80
COM0 to COM3
V
LC0
V
LC1
V
LC2
BIAS
LCDCL/P30
SYNC/P31
f
LCD
LCD
CONTROLLER/
DRIVER
INT0/P10
4
INTW
CPU CLOCK
IC
V
DD
V
SS
RESET
STANDBY
CONTROL
SYSTEM
CLOCK
GENERATOR
X1 X2
CLOCK
DIVIDER
CLOCK
OUTPUT
CONTROL
PCL/PTO2/P22
f
X
/2
N
INTERRUPT
CONTROL
BIT SEQ
BUFFER (16)
INTCSI TOUT
INTT2
CLOCKED
SERIAL
INTERFACE
8-BIT
TIMER
COUNTER #1
8-BIT
TIMER
COUNTER #2
CASCADED
16-BIT
TIMER
COUNTER
PTO1/P21
TOUT
PTO2/PCL/P22
SP (8)
SBS
BANK
GENERAL REG.
DATA
MEMORY
(RAM)
512
4 BITS
CY
ALU
PROGRAM
COUNTER
PROGRAM
MEMORY
Note
(ROM)
f
LCD
WATCH
TIMER
BASIC
INTERVAL
TIMER/
WATCHDOG
TIMER
BUZ/P23
TI0/P13
TPO0/P20
8-BIT
TIMER/EVENT
COUNTER #0
INTT1
INTT0 TOUT
SI/SB1/P03
SO/SB0/P02
SCK/P01
INT4/P00
KR0/P60 to
KR3/P63
DECODE
AND
CONTROL
INTBT
7
PD753204, 753206, 753208
3. PIN FUNCTION
3.1 Port Pins (1/2)
Pin Name
Input/Output
Alternate
Function
8-bit
After Reset
I/O Circuit
Function
I/O
TYPE
Note 1
P00
Input
INT4
No
Input
(B)
P01
Input/Output
SCK
(F)-A
P02
Input/Output
SO/SB0
(F)-B
P03
Input/Output
SI/SB1
(M)-C
P10
Input
INT0
No
Input
(B)-C
P13
TI0
P20
Input/Output
PTO0
No
Input
E-B
P21
PTO1
P22
PCL/PTO2
P23
BUZ
P30
Input/Output
LCDCL
No
Input
E-B
P31
SYNC
P32
P33
P50 to
Input/Output
No
M-D
P53
Note 2
Notes 1. Characters in parentheses indicate the Schmitt-trigger input.
2. If on-chip pull-up resistors are not specified by mask option (when used as N-ch open-drain input port),
low level input leakage current increases when input or bit manipulation instruction is executed.
4-bit input port (PORT0).
For P01 to P03, on-chip pull-up resistors can
be specified by software in 3-bit units.
High level
(when pull-
up resistors
are
provided) or
high-
impedance
Input port in 1 bit unit (PORT1).
On-chip pull-up resistors can be specified by
software in 2-bit units.
Noise elimination circuit can be specified with
P10/INT0.
4-bit input/output port (PORT2).
On-chip pull-up resistors can be specified by
software in 4-bit units.
Programmable 4-bit input/output port (PORT3).
This port can be specified input/output bit-
wise. On-chip pull-up resistor can be speci-
fied by software in 4-bit units.
N-ch open-drain 4-bit input/output port (PORT5).
A pull-up resistor can be contained bit-wise
(mask option).
Withstand voltage is 13 V in open-drain mode.
8
PD753204, 753206, 753208
3.1 Port Pins (2/2)
Pin Name
Input/Output
Alternate
Function
8-bit
After Reset
I/O Circuit
Function
I/O
TYPE
Note 1
P60
Input/Output
KR0
No
Input
(F)-A
P61
KR1
P62
KR2
P63
KR3
P80
Input/Output
S23
Yes
Input
H
P81
S22
P82
S21
P83
S20
P90
Input/Output
S19
Input
H
P91
S18
P92
S17
P93
S16
Notes 1. Characters in parentheses indicate the Schmitt-trigger input.
2. Do not connect on-chip pull-up resistors specified by software when using as segment signal output
pins.
Programmable 4-bit input/output port (PORT6).
This port can be specified for input/output bit-
wise.
On-chip pull-up resistors can be specified by
software in 4-bit units.
4-bit input/output port (PORT8).
On-chip pull-up resistors can be specified by
software in 4-bit units.
Note 2
4-bit input/output port (PORT9).
On-chip pull-up resistors can be specified by
software in 4-bit units.
Note 2
9
PD753204, 753206, 753208
3.2 Non-Port Pins (1/2)
Pin Name
Input/Output
Alternate
Function
After Reset
I/O Circuit
Function
TYPE
Note 1
TI0
Input
P13
Inputs external event pulses to the timer/event
Input
(B)-C
counter.
PTO0
Output
P20
Timer/event counter output
Input
E-B
PTO1
P21
Timer counter output
PTO2
P22/PCL
PCL
P22/PTO2
Clock output
BUZ
P23
Optional frequency output (for buzzer output
or system clock trimming)
SCK
Input/Output
P01
Serial clock input/output
Input
(F)-A
SO/SB0
P02
Serial data output
(F)-B
Serial data bus input/output
SI/SB1
P03
Serial data input
(M)-C
Serial data bus input/output
INT4
Input
P00
Edge detection vectored interrupt input (both
Input
(B)
rising edge and falling edge detection)
INT0
Input
P10
Input
(B)-C
KR0 to KR3
Input/Output
P60 to P63
Falling edge detection testable input
Input
(F)-A
S12 to S15
Output
Segment signal output
Note 2
G-A
S16 to S19
Output
P93 to P90
Segment signal output
Input
H
S20 to S23
Output
P83 to P80
Segment signal output
Input
H
COM0 to COM3
Output
Common signal output
Note 2
G-B
V
LC0
to V
LC2
LCD drive power
On-chip split resistor is enable (mask option).
BIAS
Output
Output for external split resistor disconnect
Note 3
LCDCL
Note 4
Input/Output
P30
Clock output for externally expanded driver
Input
E-B
SYNC
Note 4
Input/Output
P31
Clock output for externally expanded driver sync
Input
E-B
Notes 1. Characters in parentheses indicate the Schmitt trigger input.
2. Each display output selects the following VLCX as input source.
S12 to S15: V
LC1
, COM0 to COM2: V
LC2
, COM3: V
LC0
.
3. When a split resistor is contained ....... Low level
When no split resistor is contained ...... High-impedance
4. These pins are provided for future system expansion.
At present, these pins are used only as pins P30 and P31.
Edge detection vectored
With clock elimination
interrupt input (detection
circuit/asynchronous
edge can be selected).
selectable
Noise elimination circuit
can be specified.
10
PD753204, 753206, 753208
3.2 Non-Port Pins (2/2)
Pin Name
Input/Output
Alternate
Function
After Reset
I/O Circuit
Function
TYPE
Note 1
X1
Input
Crystal/ceramic connection pin for the system
clock oscillator. When inputting the external
clock, input the external clock to pin X1, and
X2
the reverse phase of the external clock to pin
X2.
RESET
Input
System reset input (low-level active)
(B)
IC
Internally connected. Connect directly to V
DD
.
V
DD
Positive power supply
V
SS
Ground potential
Note Characters in parentheses indicate the Schmitt-trigger input.
11
PD753204, 753206, 753208
3.3 Pin Input/Output Circuits
The
PD753208 pin input/output circuits are shown schematically.
TYPE A
TYPE B
TYPE D
TYPE E-B
TYPE B-C
TYPE F-A
V
DD
IN
P-ch
N-ch
data
output
disable
N-ch
P-ch
IN
OUT
V
DD
P-ch
output
disable
data
P.U.R.
enable
Type D
Type A
IN/OUT
V
DD
P.U.R.
enable
P.U.R.
P-ch
IN
V
DD
P.U.R.
P.U.R.
enable
P-ch
IN/OUT
Type D
Type B
output
disable
data
P.U.R. : Pull-Up Resistor
P.U.R. : Pull-Up Resistor
P.U.R. : Pull-Up Resistor
Schmitt trigger input having hysteresis characteristic.
CMOS specification input buffer.
Push-pull output that can be placed in output
high-impedance (both P-ch, N-ch off).
P.U.R.
V
DD
(1/2)
12
PD753204, 753206, 753208
TYPE F-B
TYPE H
TYPE G-A
TYPE M-D
TYPE M-C
V
DD
P.U.R
enable
P.U.R
P-ch
P-ch
V
DD
N-ch
output
disable
(P)
data
output
disable
output
disable
(N)
IN/OUT
P.U.R : Pull-Up Resistor
data
output
disable
P.U.R.
enable
P.U.R
V
DD
P-ch
IN/OUT
N-ch
P.U.R : Pull-Up Resistor
V
LC1
P-ch
N-ch
OUT
N-ch
V
LC2
N-ch
COM
data
P-ch
IN/OUT
N-ch
(+13-V
withstand)
V
DD
data
output
disable
P.U.R.
(Mask Option)
P.U.R. : Pull-Up Resistor
Voltage
control
circuit
Pull-up resistor that only operates upon the execution
of an input instruction when the pull-up resistor is not
connected via the mask option (it is available during
low-voltage).
Note
V
DD
P-ch
P.U.R.
Note
input
instruction
TYPE G-B
V
LC0
V
LC1
SEG
data
V
LC2
N-ch
SEG
data
data
output
disable
TYPE G-A
TYPE E-B
IN/OUT
(2/2)
P-ch
N-ch
V
LC0
P-ch
N-ch
P-ch
N-ch
P-ch
N-ch
OUT
N-ch
P-ch
N-ch
P-ch
N-ch
P-ch
N-ch
13
PD753204, 753206, 753208
3.4 Recommended Connections for Unused Pins
Table 3-1. List of Recommended Connections for Unused Pins
Pin
Recommended Connection
P00/INT4
Connect to V
SS
or V
DD
P01/SCK
Connect individually to V
SS
or V
DD
via a resistor
P02/SO/SB0
P03/SI/SB1
Connect to V
SS
P10/INT0
Connect to V
SS
or V
DD
P13/TI0
P20/PTO0
Input state: Connect individually to V
SS
or V
DD
via a resistor
P21/PTO1
Output state: No connection
P22/PCL/PTO2
P23/BUZ
P30/LCDCL
P31/SYNC
P32
P33
P50 to P53
Input state
: Connect to V
SS
Output state : Connect to V
SS
(Do not connect pull-up
resistor in the mask option)
P60/KR0 to P63/KR3
Input state
: Connect individually to V
SS
or V
DD
via a
resistor
Output state : No connection
S0 to S15
No connection
COM0 to COM3
S16/P93 to S19/P90
Input state: Connect individually to V
SS
or V
DD
via a resistor
S20/P83 to S23/P80
Output state: No connection
V
LC0
to V
LC2
Connect to V
SS
BIAS
Only if all of V
LC0
to V
LC2
are unused, connect to V
SS
.
In other cases, no connection.
IC
Connect to V
DD
directly
14
PD753204, 753206, 753208
4
SWITCHING FUNCTION BETWEEN Mk I MODE AND Mk II MODE
4.1 Difference Between Mk I and Mk II Modes
The CPU of the
PD753208 has the following two modes: Mk I and Mk II, either of which can be selected.
The mode can be switched by bit 3 of the Stack Bank Select register (SBS).
Mk I mode:
Upward compatible with the
PD75308B. Can be used in the 75XL CPU with a ROM
capacity of up to 16 Kbytes.
Mk II mode:
Incompatible with
PD75308B. Can be used in all the 75XL CPU including those products
whose ROM capacity is more than 16 Kbytes.
Table 4-1. Differences between Mk I Mode and Mk II Mode
Mk I mode
Mk II mode
Number of stack bytes
2 bytes
3 bytes
for subroutine instructions
BRA ! addr1 instruction
Not available
Available
CALLA ! addr1 instruction
CALL ! addr instruction
3 machine cycles
4 machine cycles
CALLF ! faddr instruction
2 machine cycles
3 machine cycles
Caution
The MkII mode supports a program area exceeding 16 Kbytes for the 75X and 75XL Series.
Software compatibility with products whose program memory exceeds 16 Kbytes can be raised
by using this mode.
When the MkII mode is selected, the number of stack bytes increases by one byte per stack
during subroutine call instruction execution compared with the MkI mode. When the !faddr
instruction is used, the length of each machine cycle increases by 1 machine cycle. Therefore,
if RAM efficiency or processing speed is emphasized over software compatibility, use of the MkI
mode is recommended.
15
PD753204, 753206, 753208
Caution
Since SBS. 3 is set to "1" after a RESET signal is generated, the CPU operates in the Mk I mode.
When executing an instruction in the Mk II mode, set SBS. 3 to "0" to select the Mk II mode.
4.2 Setting Method of Stack Bank Select Register (SBS)
Switching between the Mk I mode and Mk II mode can be done by the SBS. Figure 4-1 shows the format.
The SBS is set by a 4-bit memory manipulation instruction. When using the Mk I mode, the SBS must be
initialized to 100
B
Note
at the beginning of a program. When using the Mk II mode, it must be initialized to 000
B
Note
.
Note The desired numbers must be set in the
positions.
Figure 4-1. Stack Bank Select Register Format
SBS3
SBS2
SBS1
SBS0
3
2
1
0
Symbol
SBS
Address
F84H
0
0
0
1
0
1
0
Memory bank 0
Memory bank 1
Other than
above
0 must be set in the bit 2 position.
Stack area specification
Mk II mode
Mk I mode
Mode switching specification
Setting prohibited
16
PD753204, 753206, 753208
5. MEMORY CONFIGURATION
Program Memory (ROM)
.... 4096
8 bits (
PD753204)
.... 6144
8 bits (
PD753206)
.... 8192
8 bits (
PD753208)
Addresses 0000H and 0001H
Vector table wherein the program start address and the values set for the RBE and MBE at the time a RESET
signal is generated are written. Reset and start are possible at an arbitrary address.
Addresses 0002H to 000DH
Vector table wherein the program start address and values set for the RBE and MBE by the vectored
interrupts are written. Interrupt execution can be started at an arbitrary address.
Addresses 0020H to 007FH
Table area referenced by the GETI instruction
Note
.
Note The GETI instruction realizes a 1-byte instruction on behalf of an arbitrary 2-byte instruction, 3-byte
instruction, or two 1-byte instructions. It is used to decrease the program steps.
Data Memory (RAM)
Data area ... 512 words
4 bits (000H to 1FFH)
Peripheral hardware area ... 128 words
4 bits (F80H to FFFH)
17
PD753204, 753206, 753208
Figure 5-1. Program Memory Map (1/3)
(a)
PD753204
Note Can be used only in the Mk II mode.
Remark In addition to the above, a branch can be taken to the address indicated by changing only the low-order
eight bits of PC by executing the BR PCDE or BR PCXA instruction.
0 0 0 H
Address
7
6
5
4
MBE RBE
0
0
Internal reset start address
(high-order 4 bits)
0
0 0 2 H MBE RBE
0
0
INTBT/INT4
(high-order 4 bits)
start address
0 0 4 H MBE RBE
0
0
INT0
(high-order 4 bits)
start address
0 0 6 H
0 0 8 H MBE RBE
0
0
INTCSI
(high-order 4 bits)
start address
0 0 A H MBE RBE
0
0
INTT0
(high-order 4 bits)
start address
0 0 C H MBE RBE
0
0
INTT1/INTT2
(high-order 4 bits)
start address
0 2 0 H
0 7 F H
0 8 0 H
7 F F H
8 0 0 H
F F F H
GETI instruction reference table
(low-order 8 bits)
(low-order 8 bits)
(low-order 8 bits)
(low-order 8 bits)
(low-order 8 bits)
(low-order 8 bits)
BRCB
! caddr instruction
branch address
CALL !addr instruction
subroutine entry address
BR $addr instruction
relative branch address
15 to 1,
+2 to +16
Branch destination
address and
subroutine entry
address when GETI
instruction is executed
Internal reset start address
INTBT/INT4
start address
INT0
start address
INTCSI
start address
INTT0
start address
INTT1/INTT2
start address
Branch address of
BR BCXA, BR BCDE,
BR !addr, BRA !addr1
Note
or
CALLA !addr1
Note
instructions
CALLF
! faddr
instruction
entry
address
18
PD753204, 753206, 753208
Figure 5-1. Program Memory Map (2/3)
(b)
PD753206
0 0 0 0 H
Address
0 0 0 2 H MBE RBE
0
INTBT/INT4
(high-order 5 bits)
start address
0 0 0 4 H MBE RBE
0
INT0
(high-order 5 bits)
start address
0 0 0 6 H
0 0 0 8 H MBE RBE
0
INTCSI
(high-order 5 bits)
start address
0 0 0 A H MBE RBE
0
INTT0
(high-order 5 bits)
start address
0 0 2 0 H
0 0 7 F H
0 0 8 0 H
0 7 F F H
0 8 0 0 H
MBE RBE
0
Internal reset start address
(high-order 5 bits)
0 F F F H
1 0 0 0 H
1 7 F F H
GETI instruction reference table
0 0 0 C H MBE RBE
0
INTT1/INTT2
(high-order 5 bits)
start address
(low-order 8 bits)
(low-order 8 bits)
(low-order 8 bits)
(low-order 8 bits)
(low-order 8 bits)
(low-order 8 bits)
CALLF
! faddr
instruction
entry
address
BRCB ! caddr
instruction
branch
address
Branch address
of BR BCXA, BR
BCDE, BR ! addr,
BRA ! addr1
Note
or
CALLA ! addr1
Note
instructions
CALL ! addr
instruction
subroutine entry
address
BR $ addr
instruction relative
branch address
15 to 1,
+2 to +16
Branch destination
address and
subroutine entry
address when GETI
instruction is executed
BRCB ! caddr
instruction
branch
address
7
6
5
0
Internal reset start address
INTBT/INT4
INT0
INTCSI
INTT0
INTT1/INTT2
start address
start address
start address
start address
start address
Note Can be used only in the Mk II mode.
Remark In addition to the above, a branch can be taken to the address indicated by changing only the low-order
eight bits of PC by executing the BR PCDE or BR PCXA instruction.
19
PD753204, 753206, 753208
Figure 5-1. Program Memory Map (3/3)
(c)
PD753208
0 0 0 0 H
Address
0 0 0 2 H MBE RBE
0
INTBT/INT4
(high-order 5 bits)
start address
0 0 0 4 H MBE RBE
0
INT0
(high-order 5 bits)
start address
0 0 0 6 H
0 0 0 8 H MBE RBE
0
INTCSI
(high-order 5 bits)
start address
0 0 0 A H MBE RBE
0
INTT0
(high-order 5 bits)
start address
0 0 2 0 H
0 0 7 F H
0 0 8 0 H
0 7 F F H
0 8 0 0 H
MBE RBE
0
Internal reset start address
(high-order 5 bits)
0 F F F H
1 0 0 0 H
1 F F F H
GETI instruction reference table
0 0 0 C H MBE RBE
0
INTT1/INTT2
(high-order 5 bits)
start address
(low-order 8 bits)
(low-order 8 bits)
(low-order 8 bits)
(low-order 8 bits)
(low-order 8 bits)
(low-order 8 bits)
CALLF
! faddr
instruction
entry
address
BRCB ! caddr
instruction
branch
address
Branch address
of BR BCXA, BR
BCDE, BR ! addr,
BRA ! addr1
Note
or
CALLA ! addr1
Note
instructions
CALL ! addr
instruction
subroutine entry
address
BR $ addr
instruction relative
branch address
15 to 1,
+2 to +16
Branch destination
address and
subroutine entry
address when GETI
instruction is executed
BRCB ! caddr
instruction
branch
address
7
6
5
0
Internal reset start address
INTBT/INT4
INT0
INTCSI
INTT0
INTT1/INTT2
start address
start address
start address
start address
start address
Note Can be used only in the Mk II mode.
Remark In addition to the above, a branch can be taken to the address indicated by changing only the low-order
eight bits of PC by executing the BR PCDE or BR PCXA instruction.
20
PD753204, 753206, 753208
Figure 5-2. Data Memory Map
Note As a stack area, either memory bank 0 or 1 can be selected.
Data area
static RAM
(512
4)
Stack area
Note
General-purpose
register area
0 0 0 H
0 1 F H
0 F F H
1 0 0 H
1 E B H
1 E C H
1 F 7 H
1 F 8 H
1 F F H
F 8 0 H
F F F H
Display data
memory area
Peripheral hardware area
Data memory
Memory bank
0
(32
4)
256
4
(224
4)
256
4
(236
4)
(12
4)
(8
4)
Not incorporated
128
4
15
1
0 2 0 H
21
PD753204, 753206, 753208
6. PERIPHERAL HARDWARE FUNCTION
6.1 Digital I/O Port
There are three kinds of I/O ports.
CMOS input ports (Ports 0, 1)
: 6
CMOS input/output ports (Ports 2, 3, 6, 8, 9)
: 20
N-ch open-drain input/output ports (Port 5)
: 4
Total
30
Table 6-1. Types and Features of Digital Ports
Port
Function
Operation and features
Remarks
PORT0
4-bit input
The alternate function pins have an output function
Also used for the INT4, SCK,
with operation mode when using the serial interface
SO/SB0, and SI/SB1 pins.
function.
PORT1
1-bit input
2-bit input dedicated port
Also used for the INT0 and
TI0.
PORT2
4-bit I/O
Can be set to input mode or output mode in 4-bit
Also used for the PTO0 to
units.
PTO2, PCL, and BUZ pins.
PORT3
Can be set to input mode or output mode bit-wise.
Also used for the LCDCL
and SYNC pins.
PORT5
4-bit I/O (N-
Can be set to input mode or output mode in 4-bit
--
channel open-
units. On-chip pull-up resistor can be specified
drain, 13-V
by mask option bit-wise.
withstand)
PORT6
4-bit I/O
Can be set to input mode or output mode bit-wise.
Also used for the KR0 to
KR3 pins.
PORT8
Can be set to input mode
Ports 8 and 9 are paired
Also used for the S20 to
or output mode in 4-bit
and data can be input/
S23 pins.
units.
output in 8-bit units.
PORT9
Also used for the S16 to
S19 pins.
22
PD753204, 753206, 753208
6.2 Clock Generator
The clock generator provides the clock signals to the CPU and peripheral hardware and its configuration is
shown in Figure 6-1.
The operation of the clock generator is determined by the Processor Clock Control Register (PCC).
The instruction execution time can also be changed.
0.95, 1.91, 3.81, 15.3
s (system clock: @ 4.19-MHz operation)
0.67, 1.33, 2.67, 10.7
s (system clock: @ 6.0-MHz operation)
Figure 6-1. Clock Generator Block Diagram
Note Instruction execution
4
V
DD
X2
X1
f
X
Oscillation stop
System clock
oscillator
1/2 1/4 1/16
1/1 to 1/4096
Divider
Selector
Divider
1/4
CPU
INT0 noise eliminator
Clock output circuit
HALT
F/F
S
R
Q
Wait release signal from BT
RESET Signal
Standby release signal from
interrupt control circuit
S
R
Q
F/F
STOP
PCC2,
PCC3
Clear
STOP
Note
PCC2
PCC3
PCC1
PCC0
PCC
HALT
Note
Internal bus
Basic interval timer (BT)
Timer/event counter 0
Timer counter 1, 2
Watch timer
LCD controller/driver
Serial interface
INT0 noise eliminator
Clock output circuit
23
PD753204, 753206, 753208
From clock
generator
f
X
/2
3
f
X
/2
4
f
X
/2
6
Selector
CLOM3
0
CLOM1 CLOM0
4
CLOM
P22
output latch
Port 2 I/O mode
specification bit
PORT2.2
Bit 2 of PMGB
Internal bus
Output buffer
PCL/PTO2/P22
From timer counter
(channel 2)
Selector
Remarks
1. f
X
= System clock frequency
2.
= CPU clock
3. PCC: Processor Clock Control Register
4. One clock cycle (t
CY
) of the CPU clock is equal to one machine cycle of the instruction.
6.3 Clock Output Circuit
The clock output circuit is provided to output the clock pulses from the PCL pin (also functions as P22 or PTO2)
to the remote control wave outputs and peripheral LSIs.
Clock Output (PCL)
:
, 524, 262, 65.5 kHz (system clock: @ 4.19-MHz operation)
, 750, 375, 93.8 kHz (system clock: @ 6.0-MHz operation)
Figure 6-2. Clock Output Circuit Block Diagram
Remark Special care has been taken in designing the chip so that small-width pulses may not be output when
switching clock output enable/disable.
24
PD753204, 753206, 753208
From clock
generator
f
X
/2
5
f
X
/2
7
f
X
/2
9
f
X
/2
12
MPX
BTM3 BTM2 BTM1 BTM0 BTM
4
SET1
Note
Internal bus
8
1
Basic interval timer
(8-bit frequency divider)
Clear
BT
Wait release signal
when standby is
released.
Set
Clear
3
WDTM
SET1
Note
Internal reset
signal
Vectored
interrupt
request signal
BT
interrupt
request flag
IRQBT
6.4 Basic Interval Timer/Watchdog Timer
The basic interval timer/watchdog timer has the following functions.
Interval timer operation to generate a reference time interrupt
Watchdog timer operation to detect program runaway and reset the CPU
Selects and counts the wait time when the standby mode is released
Reads the contents of counting
Figure 6-3. Basic Interval Timer/Watchdog Timer Block Diagram
Note Instruction execution
25
PD753204, 753206, 753208
6.5 Watch Timer
The
PD753208 has one watch timer channel, whose functions are as follows.
Sets the test flag (IRQW) with 0.5 sec interval. The standby mode can be released by the IRQW.
0.5 sec interval can be created with the system clock (4.194304 MHz)
Convenient for program debugging and checking as interval becomes 128 times longer (3.91 ms) with the
fast feed mode.
Outputs a frequency (2.048, 4.096, or 32.768 kHz) to the BUZ pin (P23), usable for buzzer and trimming
of system clock frequencies.
Clears the frequency divider to make the clock start with zero seconds.
Figure 6-4. Watch Timer Block Diagram
From
clock
generator
Selector
f
X
128
(32.768 kHz)
f
W
(32.768 kHz)
Divider
4 kHz 2 kHz
f
W
2
3
f
W
2
4
Clear
Selector
f
W
2
7
f
W
2
6
(512 Hz : 1.95 ms)
(256 Hz : 3.91 ms)
f
W
2
14
Selector
2 Hz
0.5 sec
IRQW
set signal
INTW
f
LCD
Output buffer
PMGB bit 2
PORT2.3
WM
WM7
0
WM5
WM4
WM3
WM2
WM1
WM0
P23
output-latch
Port 2 input/
output mode
8
Internal bus
P23/BUZ
Note 2
Note 1
Notes 1. WM3 is undefined while reading data.
2. Be sure to set WM0 to 0.
Remark The values enclosed in parentheses are applied when f
X
= 4.194304 MHz.
26
PD753204, 753206, 753208
6.6 Timer/Event Counter
The
PD753208 provides one channel for timer/event counters and two channels for timer counters. Figures
6-5 to 6-7 show the block diagrams. Timer/event counter functions are as follows.
Programmable interval timer operation
Square wave output of any frequency to the PTO0 pin (n = 0 to 2).
Event counter operation (Channel 0 only)
Divides the frequency of signal input via the TI0 pin to 1-nth of the original signal and outputs the divided
frequency to the PTO0 pin (frequency divider operation).
Supplies the shift clock to the serial interface circuit.
Reads the counting status.
The timer/event counter operates in the following four modes as set by the mode register.
Table 6-2. Operation Modes of Timer/Event Counter
Channel
Channel 0
Channel 1
Channel 2
Mode
8-bit timer/event counter mode
Note 1
A
A
A
Gate control function
N/A
Note 2
N/A
A
PWM pulse generator mode
N/A
N/A
A
16-bit timer counter mode
N/A
A
Gate control function
N/A
Note 2
A
Carrier generator mode
N/A
A
Notes 1. Channel 0 only. 8-bit timer counter mode for channel 1 and channel 2
2. Used for gate control signal generation
Remark A:
Available
N/A:
Not available
27
PD753204, 753206, 753208
Figure 6-5. Timer/Event Counter Block Diagram (channel 0)
Note
Execution of instruction
Caution
When data is set to TM0, always set bit 1 to 0.
PORT1.3
Input
buffer
TI0/P13
f
X
/2
4
f
X
/2
6
f
X
/2
8
f
X
/2
10
From
clock
generator
MPX
TM06
TM05
TM04
TM03
TM02
88
8
8
8
TM0
SET1
Note
Modulo register (8)
Comparator (8)
Count register (8)
TMOD0
T0
CP
Timer operation start
Clear
Match
TOUT
F/F
Reset
T0
enable flag
P20
output latch
Port 2
input/output
mode
TOE0
PORT2.0
PMGB bit 2
To serial interface
PTO0/P20
INTT0
IRQT0
set signal
RESET
IRQT0
clear signal
To timer counter (channel 2)
Internal bus
Output buffer
TOUT0
28
PD753204, 753206, 753208
Figure 6-6. Timer/Event Counter Block Diagram (channel 1)
Note
Execution of instruction
From clock
generator
MPX
TM16
TM15
TM14
TM13
TM12
TM11
TM10
TM1
Decoder
16 bit timer counter mode
CP
Timer operation start
Selector
Clear
8
8
8
8
Modulo register (8)
Comparator (8)
Count register (8)
Timer counter match signal (channel 2)
(During 16-bit timer counter mode)
Timer counter comparator (channel 2)
(During 16-bit timer counter mode)
Timer counter reload signal (channel 2)
T1
TMOD1
Match
TOUT
F/F
Reset
T1
enable flag
P21
output latch
Port 2
input/output
mode
INTT1
IRQT1
set signal
IRQT1 clear signal
RESET
TOE1
PORT2.1
PMGB bit 2
P21/PTO1
Output buffer
Internal bus
Timer counter
(channel 2) output
f
X
/2
5
f
X
/2
6
f
X
/2
8
f
X
/2
10
f
X
/2
12
SET1
Note
29
PD753204, 753206, 753208
Figure 6-7. Timer Counter Block Diagram (channel 2)
Note
Execution of instruction
TM25
TM26
TM24
TM23
TM22
TM21
TM20
TM2
8
8
TC2
Decoder
High-level period setting
modulo register (8)
Modulo register (8)
TGCE
TOE2
REMC
NRZB
NRZ
Reload
MPX (8)
Comparator (8)
Count register (8)
8
8
Clear
16-bit timer counter mode
Timer operation start
Timer counter match signal (channel 1) (During 16-bit timer counter mode)
Timer counter clear signal (channel 1) (During 16-bit timer counter mode)
Timer counter match signal (channel 1) (When carrier generator mode)
Match
Overflow
Carrier generator mode
PORT2.2
PMGB bit 2
P22
output latch
Output buffer
P22/PCL/PTO2
Timer clock
input (channel 1)
INTT2
IRQT2
set signal
IRQT2 clear signal
RESET
T2
TMOD2
TMOD2H
Internal bus
CP
Timer event counter
TOUT F/F (channel 0)
Reset
8
8
8
Selector
Selector
Port 2
input/output
TOUT
F/F
8
From clock
generator
MPX
Selector
From clock generator
f
X
/2
4
f
X
/2
2
f
X
/2
f
X
/2
6
f
X
/2
8
f
X
/2
10
SET1
Note
30
PD753204, 753206, 753208
6.7 Serial Interface
The
PD753208 incorporates a clock-synchronous 8-bit serial interface and can be used in the following four
modes.
Operation stop mode
3-wire serial I/O mode
2-wire serial I/O mode
SBI mode (serial bus interface mode)
31
PD753204, 753206, 753208
Figure 6-8. Serial Interface Block Diagram
Internal bus
8
8
8
8/4
Bit manipulation
Bit test
SBIC
Slave address register (SVA)
Address comparator
Shift
register
(SIO)
(8)
(8)
(8)
RELT
CMDT
SO latch
SET
CLR
DQ
CSIM
P03/SI/SB1
P02/SO/SB0
P01/SCK
P01
output Iatch
Bus release/
command/
acknowledge
detection circuit
RELD
CMDD
ACKD
ACKT
Serial clock counter
Serial clock control
circuit
Serial clock
selector
INTCSI
control circuit
ACKE
BSYE
Busy/
acknowledge
output circuit
INTCSI
IRQCSI
set signal
f
X
/2
3
f
X
/2
4
f
X
/2
6
TOUT0
(from timer/event counter
(channel 0))
Bit test
Match signal
Selector
Selector
External SCK
32
PD753204, 753206, 753208
6.8 LCD Controller/Driver
The
PD753208 incorporates a display controller which generates segment and common signals according
to the display data memory contents and incorporates segment and common drivers which can drive the panel
directly.
The
PD753208 LCD controller/driver functions are as follows:
Display data memory is read automatically by DMA operation and segment and common signals are
generated.
Display mode can be selected from among the following five:
<1>
Static
<2>
1/2 duty (time multiplexing by 2), 1/2 bias
<3>
1/3 duty (time multiplexing by 3), 1/2 bias
<4>
1/3 duty (time multiplexing by 3), 1/3 bias
<5>
1/4 duty (time multiplexing by 4), 1/3 bias
A frame frequency can be selected from among four in each display mode.
A maximum of 12 segment signal output pins (S12 to S23) and four common signal output pins (COM0 to
COM3).
The segment signal output pins (S16 to S23) can be changed to the I/O ports (PORT8 and PORT9).
Split-resistor can be incorporated to supply LCD drive power. (Mask option)
Various bias methods and LCD drive voltages can be applicable.
When display is off, current flowing through the split resistor is cut.
Display data memory not used for display can be used for normal data memory.
33
PD753204, 753206, 753208
Figure 6-9. LCD Controller/Driver Block Diagram
Port 8
output latch
3 2 1 0
Port 9
output latch
3 2 1 0
Port mode
register group C
0 1
LCD/port
selection
register
1F7H
3210
1F0H
3210
1EFH
3210
1ECH
3210
Display mode register
Display
control
register
Port 3
output latch
10
Port mode
register group A
10
4
4
4
8
4
8
4
4
4
4
Internal bus
4
Port 8
Input/Output buffer
01
2
3
Port 9
Input/Output buffer
01
2
3
S23/P80
S16/P93
S15
S0
COM3
COM2
COM1
COM0
V
LC2
V
LC1
V
LC0
P31/SYNC
P30/LCDCL
LCD drive
mode
switching
LCD drive
voltage control
Common driver
Segment driver
Segment driver
3210
3210
3210
3210
Timing
controller
f
LCD
Decoder
34
PD753204, 753206, 753208
Address
Bit
Symbol
L register
L = FH
L = CH L = BH
L = 8H L = 7H
L = 4H L = 3H
L = 0H
DECS L
INCS L
BSB3
BSB2
BSB1
BSB0
3
2
1
0
3
2
1
0
3
2
1
0
3
2
1
0
FC3H
FC2H
FC1H
FC0H
6.9 Bit Sequential Buffer ....... 16 Bits
The bit sequential buffer (BSB) is a special data memory for bit manipulation and the bit manipulation can be
easily performed by changing the address specification and bit specification in sequence, therefore it is useful
when processing large data bit-wise.
Figure 6-10. Bit Sequential Buffer Format
Remarks
1. In pmem.@L addressing, the specified bit moves corresponding to the L register.
2. In pmem.@L addressing, the BSB can be manipulated regardless of MBE/MSB specification.
35
PD753204, 753206, 753208
7. INTERRUPT FUNCTION AND TEST FUNCTION
There are seven interrupt sources and two test sources in the
PD753208.
The interrupt control circuit of the
PD753208 has the following functions.
(1) Interrupt function
Vectored interrupt function for hardware control, enabling/disabling the interrupt acceptance by the
interrupt enable flag (IE
) and interrupt master enable flag (IME).
Can set any interrupt start address.
Multiple interrupts wherein the order of priority can be specified by the interrupt priority select register
(IPS).
Test function of interrupt request flag (IRQ
). An interrupt generated can be checked by software.
Release the standby mode. A release interrupt can be selected by the interrupt enable flag.
(2) Test function
Test request flag (IRQ
) generation can be checked by software.
Release the standby mode. The test source to be released can be selected by the test enable flag.
36
PD753204, 753206, 753208
Internal bus
Interruput enable flag (IE
)
IRQBT
IRQ4
IRQ0
IRQCSI
IRQT0
IRQT1
IRQT2
IRQW
IRQ2
INTCSI
INTT0
INTT1
INTT2
INTW
Both edge
detector
Edge
detector
Selec-
tor
INT4/P00
INT0/P10
KR0/P60
KR3/P63
Falling edge
detector
Selec-
tor
IM2
Standby release
signal
Priority control
circuit
Vector table
address
generator
Decoder
IME
IPS
IST0
VRQn
Note
IM2
IM0
24
INTBT
IST1
Figure 7-1. Interrupt Control Circuit Block Diagram
Note
Noise eliminator (Standby release is disabled when noise eliminator is selected.)
37
PD753204, 753206, 753208
8. STANDBY FUNCTION
In order to save power dissipation while a program is in standby mode, two types of standby modes (STOP
mode and HALT mode) are provided for the
PD753208.
Table 8-1. Operation Status in Standby Mode
Item
Mode
STOP mode
HALT mode
Set instruction
STOP instruction
HALT instruction
Operation
Clock generator
The system clock stops oscillation.
Only the CPU clock
halts (oscillation
status
continues).
Basic interval timer/
Operation stops.
Operable only when the system clock
Watchdog timer
is oscillated. (The IRQBT is set in the
reference interval).
Serial interface
Operable only when an external SCK
Operable
input is selected as the serial clock.
Timer/event counter
Operable only when a signal input to
Operable
the TI0 pin is specified as the count
clock.
Watch timer
Operation stops.
Operable
LCD controller/driver
Operation stops.
Operable
External interrupt
The INT4 is operable.
Only the INT0 is not operated
Note
.
CPU
Operation stops.
Release signal
Interrupt request signal sent from the operable hardware enabled by the
interrupt enable flag or RESET signal input.
Note Can operate only when the noise eliminator is not used (IM02 = 1) by bit 2 of the edge detection mode register
(IM0).
38
PD753204, 753206, 753208
RESET
Internal RESET signal
RESET signal sent from the
basic interval timer/watchdog timer
WDTM
Internal bus
Operation mode or
standby mode
Wait
Note
RESET
signal
generated
Operation mode
HALT mode
Internal reset operation
9. RESET FUNCTION
There are two reset inputs: external RESET signal and RESET signal sent from the basic interval timer/
watchdog timer. When either one of the RESET signals are input, an internal RESET signal is generated. Figure
9-1 shows the circuit diagram of the above two inputs.
Figure 9-1. Configuration of Reset Function
Each hardware is initialized by the RESET signal generation as listed in Table 9-1. Figure 9-2 shows the
timing chart of the reset operation.
Figure 9-2. Reset Operation by RESET Signal Generation
Note The following two times can be selected by the mask option.
2
17
/f
X
(21.8 ms: @ 6.0-MHz operation, 31.3 ms: @ 4.19-MHz operation)
2
15
/f
X
(5.46 ms: @ 6.0-MHz operation, 7.81 ms: @ 4.19-MHz operation)
39
PD753204, 753206, 753208
Table 9-1. Status of Each Device After Reset (1/2)
Hardware
RESET signal generation
RESET signal generation
in the standby mode
during operation
Program counter (PC)
PD753204
Sets the low-order 4 bits of
Sets the low-order 4 bits of
program memory's address
program memory's address
0000H to PC11 to PC8 and
0000H to PC11 to PC8 and
the contents of address 0001H
the contents of address 0001H
to PC7 to PC0.
to PC7 to PC0.
PD753206, Sets the low-order 5 bits of
Sets the low-order 5 bits of
PD753208
program memory's address
program memory's address
0000H to PC12 to PC8 and
0000H to PC12 to PC8 and
the contents of address 0001H
the contents of address 0001H
to PC7 to PC0.
to PC7 to PC0.
PSW
Carry flag (CY)
Held
Undefined
Skip flag (SK0-SK2)
0
0
Interrupt status flag (IST0, IST1)
0
0
Bank enable flag (MBE, RBE)
Sets bit 6 of program memory's
Sets bit 6 of program memory's
address 0000H to RBE and bit
address 0000H to RBE and bit
7 to MBE.
7 to MBE.
Stack pointer (SP)
Undefined
Undefined
Stack bank select register (SBS)
1000B
1000B
Data memory (RAM)
Held
Undefined
General-purpose register (X, A, H, L, D, E, B, C)
Held
Undefined
Bank select register (MBS, RBS)
0, 0
0, 0
Basic interval
Counter (BT)
Undefined
Undefined
timer/watchdog
Mode register (BTM)
0
0
timer
Watchdog timer enable flag (WDTM)
0
0
Timer/event
Counter (T0)
0
0
counter (T0)
Modulo register (TMOD0)
FFH
FFH
Mode register (TM0)
0
0
TOE0, TOUT F/F
0, 0
0, 0
Timer
Counter (T1)
0
0
counter (T1)
Modulo register (TMOD1)
FFH
FFH
Mode register (TM1)
0
0
TOE1, TOUT F/F
0, 0
0, 0
Timer
Counter (T2)
0
0
counter (T2)
Modulo register (TMOD2)
FFH
FFH
High-level period setting modulo
FFH
FFH
register (TMOD2H)
Mode register (TM2)
0
0
TOE2, TOUT F/F
0, 0
0, 0
REMC, NRZ, NRZB
0, 0, 0
0, 0, 0
TGCE
0
0
Watch timer
Mode register (WM)
0
0
40
PD753204, 753206, 753208
Table 9-1. Status of Each Device After Reset (2/2)
Hardware
RESET signal generation
RESET signal generation
in the standby mode
during operation
Serial interface
Shift register (SIO)
Held
Undefined
Operation mode register (CSIM)
0
0
SBI control register (SBIC)
0
0
Slave address register (SVA)
Held
Undefined
Clock generator,
Processor clock control register (PCC)
0
0
clock output circuit
Clock output mode register (CLOM)
0
0
LCD controller/
Display mode register (LCDM)
0
0
driver
Display control register (LCDC)
0
0
LCD/port selection register (LPS)
0
0
Interrupt
Interrupt request flag (IRQ
)
Reset (0)
Reset (0)
function
Interrupt enable flag (IE
)
0
0
Interrupt priority selection register (IPS)
0
0
INT0, 2 mode registers (IM0, IM2)
0, 0
0, 0
Digital port
Output buffer
Off
Off
Output latch
Cleared (0)
Cleared (0)
I/O mode registers (PMGA, B, C)
0
0
Pull-up resistor setting register (POGA, B)
0
0
Bit sequential buffer (BSB0 to BSB3)
Held
Undefined
41
PD753204, 753206, 753208
10. MASK OPTION
The
PD753208 has the following mask options.
P50 to P53 mask options
Selects whether or not to connect an internal pull-up resistor.
<1> Connect pull-up resistor internally bit-wise.
<2> Do not connect pull-up resistor internally.
V
LC0
to V
LC2
pins, BIAS pins mask option
Selects whether or not to internally connect LCD-driving split resistors.
<1> Do not connect split resistor internally.
<2> Connect four 10-k
(typ.) split resistors simultaneously internally.
<3> Connect four 100-k
(typ.) split resistors simultaneously internally.
Standby function mask option
Selects the wait time with the RESET signal.
<1> 2
17
/fx (21.8 ms: When f
X
= 6.0 MHz, 31.3 ms: When f
X
= 4.19 MHz)
<2> 2
15
/fx (5.46 ms: When f
X
= 6.0 MHz, 7.81 ms: When f
X
= 4.19 MHz)
42
PD753204, 753206, 753208
11. INSTRUCTION SET
(1) Expression formats and description methods of operands
The operand is described in the operand column of each instruction in accordance with the description
method for the operand expression format of the instruction. For details, refer to "RA75X ASSEMBLER
PACKAGE USERS' MANUAL--LANGUAGE (EEU-1363)". If there are several elements, one of them
is selected. Capital letters and the + and symbols are key words and are described as they are.
For immediate data, appropriate numbers and labels are described.
Instead of the labels such as mem, fmem, pmem, and bit, the symbols of the registers can be described.
However, there are restrictions in the labels that can be described for fmem and pmem. For details, see
the user's manual.
Representation
Description method
format
reg
X, A, B, C, D, E, H, L
reg1
X, B, C, D, E, H, L
rp
XA, BC, DE, HL
rp1
BC, DE, HL
rp2
BC, DE
rp'
XA, BC, DE, HL, XA', BC', DE', HL'
rp'1
BC, DE, HL, XA', BC', DE', HL'
rpa
HL, HL+, HL, DE, DL
rpa1
DE, DL
n4
4-bit immediate data or label
n8
8-bit immediate data or label
mem
8-bit immediate data or label
Note
bit
2-bit immediate data or label
fmem
FB0H-FBFH, FF0H-FFFH immediate data or label
pmem
FC0H-FFFH immediate data or label
addr
000H-FFFH immediate data or label (
PD753204)
0000H-17FFH immediate data or label (
PD753206)
0000H-1FFFH immediate data or label (
PD753208)
addr1
000H-FFFH immediate data or label (
PD753204)
(Only in the
0000H-17FFH immediate data or label (
PD753206)
MKII mode)
0000H-1FFFH immediate data or label (
PD753208)
caddr
12-bit immediate data or label
faddr
11-bit immediate data or label
taddr
20H-7FH immediate data (where bit 0 = 0) or label
PORTn
PORT0-PORT3, PORT5, PORT6, PORT8, PORT9
IE
IEBT, IET0-IET2, IE0, IE2, IE4, IECSI, IEW
RBn
RB0-RB3
MBn
MB0, MB1, MB15
Note mem can be only used for even address in 8-bit data processing.
43
PD753204, 753206, 753208
(2) Legend in explanation of operation
A
: A register, 4-bit accumulator
B
: B register
C
: C register
D
: D register
E
: E register
H
: H register
L
: L register
X
: X register
XA
: XA register pair; 8-bit accumulator
BC
: BC register pair
DE
: DE register pair
HL
: HL register pair
XA'
: XA' expanded register pair
BC'
: BC' expanded register pair
DE'
: DE' expanded register pair
HL'
: HL' expanded register pair
PC
: Program counter
SP
: Stack pointer
CY
: Carry flag, bit accumulator
PSW
: Program status word
MBE
: Memory bank enable flag
RBE
: Register bank enable flag
PORTn
: Port n (n = 0 to 3, 5, 6, 8, 9)
IME
: Interrupt master enable flag
IPS
: Interrupt priority selection register
IE
: Interrupt enable flag
RBS
: Register bank selection register
MBS
: Memory bank selection register
PCC
: Processor clock control register
.
: Separation between address and bit
(
)
: Contents addressed by
H
: Hexadecimal data
44
PD753204, 753206, 753208
(3) Explanation of symbols under addressing area column
*1
MB = MBEMBS
(MBS = 0, 1, 15)
*2
MB = 0
*3
MBE = 0 : MB = 0 (000H-07FH)
MB = 15 (F80H-FFFH)
Data memory addressing
MBE = 1 : MB = MBS (MBS = 0, 1, 15)
*4
MB = 15, fmem = FB0H-FBFH, FF0H-FFFH
*5
MB = 15, pmem = FC0H-FFFH
*6
PD753204
addr = 000H-FFFH
PD753206
addr = 0000H-17FFH
PD753208
addr = 0000H-1FFFH
*7
addr, addr1 = (Current PC) 15 to (Current PC) 1
(Current PC) + 2 to (Current PC) + 16
*8
PD753204
caddr = 000H-FFFH
PD753206
caddr = 0000H-0FFFH(PC
12
= 0) or
Program memory addressing
1000H-17FFH(PC
12
= 1)
PD753208
caddr = 0000H-0FFFH(PC
12
= 0) or
1000H-1FFFH(PC
12
= 1)
*9
faddr = 0000H-07FFH
*10
taddr = 0020H-007FH
*11
PD753204
addr1 = 000H-FFFH
PD753206
addr1 = 0000H-17FFH
PD753208
addr1 = 0000H-1FFFH
Remarks
1. MB indicates memory bank that can be accessed.
2. In *2, MB = 0 independently of how MBE and MBS are set.
3. In *4 and *5, MB = 15 independently of how MBE and MBS are set.
4. *6 to *11 indicate the areas that can be addressed.
(4) Explanation of number of machine cycles column
S denotes the number of machine cycles required by skip operation when a skip instruction is executed.
The value of S varies as follows.
When no skip is made: S = 0
When the skipped instruction is a 1- or 2-byte instruction: S = 1
When the skipped instruction is a 3-byte instruction
Note
: S = 2
Note 3-byte instruction: BR !addr, BRA !addr1, CALL !addr or CALLA !addr1 instruction
Caution The GETI instruction is skipped in one machine cycle.
One machine cycle is equal to one cycle of CPU clock (= t
CY
); time can be selected from among four types
by setting PCC.
45
PD753204, 753206, 753208
Instruction
Number
Number
Addressing
Mnemonic
Operand
of machine
Operation
Skip condition
group
of bytes
cycles
area
Transfer
MOV
A, #n4
1
1
A
n4
String effect A
instruction
reg1, #n4
2
2
reg1
n4
XA, #n8
2
2
XA
n8
String effect A
HL, #n8
2
2
HL
n8
String effect B
rp2, #n8
2
2
rp2
n8
A, @HL
1
1
A
(HL)
*1
A, @HL+
1
2+S
A
(HL), then L
L+1
*1
L = 0
A, @HL
1
2+S
A
(HL), then L
L1
*1
L = FH
A, @rpa1
1
1
A
(rpa1)
*2
XA, @HL
2
2
XA
(HL)
*1
@HL, A
1
1
(HL)
A
*1
@HL, XA
2
2
(HL)
XA
*1
A, mem
2
2
A
(mem)
*3
XA, mem
2
2
XA
(mem)
*3
mem, A
2
2
(mem)
A
*3
mem, XA
2
2
(mem)
XA
*3
A, reg
2
2
A
reg
XA, rp'
2
2
XA
rp'
reg1, A
2
2
reg1
A
rp'1, XA
2
2
rp'1
XA
XCH
A, @HL
1
1
A
(HL)
*1
A, @HL+
1
2+S
A
(HL), then L
L+1
*1
L = 0
A, @HL
1
2+S
A
(HL), then L
L1
*1
L = FH
A, @rpa1
1
1
A
(rpa1)
*2
XA, @HL
2
2
XA
(HL)
*1
A, mem
2
2
A
(mem)
*3
XA, mem
2
2
XA
(mem)
*3
A, reg1
1
1
A
reg1
XA, rp'
2
2
XA
rp'
46
PD753204, 753206, 753208
Instruction
Number
Number
Addressing
Mnemonic
Operand
of machine
Operation
Skip condition
group
of bytes
cycles
area
Table
MOVT
XA, @PCDE
1
3
q
PD753204
reference
XA
(PC
118
+DE)
ROM
q
PD753206, 753208
XA
(PC
128
+DE)
ROM
XA, @PCXA
1
3
q
PD753204
XA
(PC
118
+XA)
ROM
q
PD753206, 753208
XA
(PC
128
+XA)
ROM
XA, @BCDE
1
3
XA
(BCDE)
ROM
Note
*6
XA, @BCXA
1
3
XA
(BCXA)
ROM
Note
*6
Bit transfer
MOV1
CY, fmem.bit
2
2
CY
(fmem.bit)
*4
CY, pmem.@L
2
2
CY
(pmem
72
+L
32
.bit(L
10
))
*5
CY, @H+mem.bit
2
2
CY
(H+mem
30
.bit)
*1
fmem.bit, CY
2
2
(fmem.bit)
CY
*4
pmem.@L, CY
2
2
(pmem
72
+L
32
.bit(L
10
))
CY
*5
@H+mem.bit, CY
2
2
(H+mem
30
.bit)
CY
*1
Operation
ADDS
A, #n4
1
1+S
A
A+n4
carry
XA, #n8
2
2+S
XA
XA+n8
carry
A, @HL
1
1+S
A
A+(HL)
*1
carry
XA, rp'
2
2+S
XA
XA+rp'
carry
rp'1, XA
2
2+S
rp'1
rp'1+XA
carry
ADDC
A, @HL
1
1
A, CY
A+(HL)+CY
*1
XA, rp'
2
2
XA, CY
XA+rp'+CY
rp'1, XA
2
2
rp'1, CY
rp'1+XA+CY
SUBS
A, @HL
1
1+S
A
A(HL)
*1
borrow
XA, rp'
2
2+S
XA
XArp'
borrow
rp'1, XA
2
2+S
rp'1
rp'1XA
borrow
SUBC
A, @HL
1
1
A, CY
A(HL)CY
*1
XA, rp'
2
2
XA, CY
XArp'CY
rp'1, XA
2
2
rp'1, CY
rp'1XACY
Note Set "0" to register B if the
PD753204 is used. Only the low-order one bit of register B will be valid if the
PD753206 or 753208 is used.
47
PD753204, 753206, 753208
Instruction
Number
Number
Addressing
Mnemonic
Operand
of machine
Operation
Skip condition
group
of bytes
cycles
area
Operation
AND
A, #n4
2
2
A
A
n4
A, @HL
1
1
A
A
(HL)
*1
XA, rp'
2
2
XA
XA
rp'
rp'1, XA
2
2
rp'1
rp'1
XA
OR
A, #n4
2
2
A
A
n4
A, @HL
1
1
A
A
(HL)
*1
XA, rp'
2
2
XA
XA
rp'
rp'1, XA
2
2
rp'1
rp'1
XA
XOR
A, #n4
2
2
A
A
v
n4
A, @HL
1
1
A
A
v
(HL)
*1
XA, rp'
2
2
XA
XA
v
rp'
rp'1, XA
2
2
rp'1
rp'1
v
XA
Accumulator
RORC
A
1
1
CY
A
0
, A
3
CY, A
n1
A
n
manipulation
instructions
NOT
A
2
2
A
A
Increment
INCS
reg
1
1+S
reg
reg+1
reg=0
and
Decrement
rp1
1
1+S
rp1
rp1+1
rp1=00H
instructions
@HL
2
2+S
(HL)
(HL)+1
*1
(HL)=0
mem
2
2+S
(mem)
(mem)+1
*3
(mem)=0
DECS
reg
1
1+S
reg
reg1
reg=FH
rp'
2
2+S
rp'
rp'1
rp'=FFH
Comparison
SKE
reg, #n4
2
2+S
Skip if reg = n4
reg=n4
instruction
@HL, #n4
2
2+S
Skip if (HL) = n4
*1
(HL) = n4
A, @HL
1
1+S
Skip if A = (HL)
*1
A = (HL)
XA, @HL
2
2+S
Skip if XA = (HL)
*1
XA = (HL)
A, reg
2
2+S
Skip if A = reg
A=reg
XA, rp'
2
2+S
Skip if XA = rp'
XA=rp'
Carry flag
SET1
CY
1
1
CY
1
manipulation
instruction
CLR1
CY
1
1
CY
0
SKT
CY
1
1+S
Skip if CY = 1
CY=1
NOT1
CY
1
1
CY
CY
48
PD753204, 753206, 753208
Instruction
Number
Number
Addressing
Mnemonic
Operand
of machine
Operation
Skip condition
group
of bytes
cycles
area
Memory bit
SET1
mem.bit
2
2
(mem.bit)
1
*3
manipulation
instructions
fmem.bit
2
2
(fmem.bit)
1
*4
pmem.@L
2
2
(pmem
72
+L
32
.bit(L
10
))
1
*5
@H+mem.bit
2
2
(H+mem
30
.bit)
1
*1
CLR1
mem.bit
2
2
(mem.bit)
0
*3
fmem.bit
2
2
(fmem.bit)
0
*4
pmem.@L
2
2
(pmem
72
+L
32
.bit(L
10
))
0
*5
@H+mem.bit
2
2
(H+mem
30
.bit)
0
*1
SKT
mem.bit
2
2+S
Skip if (mem.bit)=1
*3
(mem.bit)=1
fmem.bit
2
2+S
Skip if (fmem.bit)=1
*4
(fmem.bit)=1
pmem.@L
2
2+S
Skip if (pmem
72
+L
32
.bit(L
10
))=1
*5
(pmem.@L)=1
@H+mem.bit
2
2+S
Skip if (H+mem
30
.bit)=1
*1
(@H+mem.bit)=1
SKF
mem.bit
2
2+S
Skip if (mem.bit)=0
*3
(mem.bit)=0
fmem.bit
2
2+S
Skip if (fmem.bit)=0
*4
(fmem.bit)=0
pmem.@L
2
2+S
Skip if (pmem
72
+L
32
.bit(L
10
))=0
*5
(pmem.@L)=0
@H+mem.bit
2
2+S
Skip if (H+mem
30
.bit)=0
*1
(@H+mem.bit)=0
SKTCLR
fmem.bit
2
2+S
Skip if (fmem.bit)=1 and clear
*4
(fmem.bit)=1
pmem.@L
2
2+S
Skip if (pmem
72
+L
32
.bit(L
10
))=1 and clear
*5
(pmem.@L)=1
@H+mem.bit
2
2+S
Skip if (H+mem
30
.bit)=1 and clear
*1
(@H+mem.bit)=1
AND1
CY, fmem.bit
2
2
CY
CY
(fmem.bit)
*4
CY, pmem.@L
2
2
CY
CY
(pmem
72
+L
32
.bit(L
10
))
*5
CY, @H+mem.bit
2
2
CY
CY
(H+mem
30
.bit)
*1
OR1
CY, fmem.bit
2
2
CY
CY
(fmem.bit)
*4
CY, pmem.@L
2
2
CY
CY
(pmem
72
+L
32
.bit(L
10
))
*5
CY, @H+mem.bit
2
2
CY
CY
(H+mem
30
.bit)
*1
XOR1
CY, fmem.bit
2
2
CY
CY
v
(fmem.bit)
*4
CY, pmem.@L
2
2
CY
CY
v
(pmem
72
+L
32
.bit(L
10
))
*5
CY, @H+mem.bit
2
2
CY
CY
v
(H+mem
30
.bit)
*1
49
PD753204, 753206, 753208
Instruction
Number
Number
Addressing
Mnemonic
Operand
of machine
Operation
Skip condition
group
of bytes
cycles
area
Branch
BR
Note
addr
PD753204
*6
instructions
PC
110
addr
Select the most appropriate instruction from
among BR !addr, BRCB !caddr and BR $addr
according to the assembler being used.
PD753206, 753208
PC
120
addr
Select the most appropriate instruction
from among BR !addr, BRCB !caddr
and BR $addr according to the
assembler being used.
addr1
PD753204
*11
PC
11-0
addr1
Select the most appropriate instruction
from among BR !addr, BRA !addr1,
BRCB !caddr and BR $addr1 according
to the assembler being used.
PD753206, 753208
PC
120
addr1
Select the most appropriate instruction
from among BR !addr, BRA !addr1,
BRCB !caddr and BR $addr1 according
to the assembler being used.
! addr
3
3
PD753204
*6
PC
110
addr
PD753206, 753208
PC
120
addr
$addr
1
2
PD753204
*7
PC
110
addr
PD753206, 753208
PC
120
addr
$addr1
1
2
PD753204
PC
110
addr1
PD753206, 753208
PC
120
addr1
Note The above operations in the double boxes can be performed only in the Mk II mode. The other operations
can be performed only in the Mk I mode.
50
PD753204, 753206, 753208
Instruction
Number
Number
Addressing
Mnemonic
Operand
of machine
Operation
Skip condition
group
of bytes
cycles
area
Branch
BR
PCDE
2
3
PD753204
instruction
PC
110
PC
11-8
+DE
PD753206, 753208
PC
120
PC
12-8
+DE
PCXA
2
3
PD753204
PC
110
PC
11-8
+XA
PD753206, 753208
PC
120
PC
12-8
+XA
BCDE
2
3
PD753204
*6
PC
110
BCDE
Note 1
PD753206, 753208
PC
120
BCDE
Note 2
BCXA
2
3
PD753204
*6
PC
110
BCXA
Note 1
PD753206, 753208
PC
120
BCXA
Note 2
BRA
Note 3
!addr1
3
3
PD753204
*6
PC
110
addr1
PD753206, 753208
PC
120
addr1
BRCB
!caddr
2
2
PD753204
*8
PC
110
caddr
110
PD753206, 753208
PC
120
PC
12
+caddr
110
Subroutine
CALLA
Note 3
!addr1
3
3
PD753204
*11
stack control
(SP2)
,
, MBE, RBE
instructions
(SP6) (SP3) (SP4)
PC
110
(SP5)
0, 0, 0, 0
PC
110
addr1, SP
SP6
PD753206, 753208
(SP2)
,
, MBE, RBE
(SP6) (SP3) (SP4)
PC
110
(SP5)
0, 0, 0, PC
12
PC
120
addr1, SP
SP6
Notes 1. "0" must be set to the B register.
2. Only the low-order one bit is valid in the B register.
3. The above operations in the double boxes can be performed only in the Mk II mode. The other
operations can be performed only in the Mk I mode.
51
PD753204, 753206, 753208
Instruction
Number
Number
Addressing
Mnemonic
Operand
of machine
Operation
Skip condition
group
of bytes
cycles
area
Subroutine
CALL
Note
!addr
3
3
PD753204
*6
stack control
(SP3)
MBE, RBE, 0, 0
instructions
(SP4) (SP1) (SP2)
PC
110
PC
110
addr, SP
SP4
PD753206, 753208
(SP3)
MBE, RBE, 0, PC
12
(SP4) (SP1) (SP2)
PC
110
PC
120
addr, SP
SP4
4
PD753204
(SP2)
,
, MBE, RBE
(SP6) (SP3) (SP4)
PC
110
(SP5)
0, 0, 0, 0
PC
110
addr, SP
SP6
PD753206, 753208
(SP2)
,
, MBE, RBE
(SP6) (SP3) (SP4)
PC
110
(SP5)
0, 0, 0, PC
12
PC
120
addr, SP
SP6
CALLF
Note
!faddr
2
2
PD753204
*9
(SP3)
MBE, RBE, 0, 0
(SP4) (SP1) (SP2)
PC
110
PC
110
0+faddr, SP
SP4
PD753206, 753208
(SP3)
MBE, RBE, 0, PC
12
(SP4) (SP1) (SP2)
PC
110
PC
120
00+faddr, SP
SP4
3
PD753204
(SP2)
,
, MBE, RBE
(SP6) (SP3) (SP4)
PC
110
(SP5)
0, 0, 0, 0
PC
110
0+faddr, SP
SP6
PD753206, 753208
(SP2)
,
, MBE, RBE
(SP6) (SP3) (SP4)
PC
110
(SP5)
0, 0, 0, PC
12
PC
120
00+faddr, SP
SP6
Note The above operations in the double boxes can be performed only in the Mk II mode. The other operations
can be performed only in the Mk I mode.
52
PD753204, 753206, 753208
Instruction
Number
Number
Addressing
Mnemonic
Operand
of machine
Operation
Skip condition
group
of bytes
cycles
area
Subroutine
RET
Note
1
3
PD753204
stack control
PC
110
(SP) (SP+3) (SP+2)
instructions
MBE, RBE, 0, 0
(SP+1), SP
SP+4
PD753206, 753208
PC
110
(SP) (SP+3) (SP+2)
MBE, RBE, 0, PC
12
(SP+1), SP
SP+4
PD753204
,
, MBE, RBE
(SP+4)
0, 0, 0, 0,
(SP+1)
PC
110
(SP) (SP+3) (SP+2), SP
SP+6
PD753206, 753208
,
, MBE, RBE
(SP+4)
MBE, 0, 0, PC
12
(SP+1)
PC
110
(SP) (SP+3) (SP+2), SP
SP+6
RETS
Note
1
3+S
PD753204
Unconditional
MBE, RBE, 0, 0
(SP+1)
PC
110
(SP) (SP+3) (SP+2)
SP
SP+4
then skip unconditionally
PD753206, 753208
MBE, RBE, 0, PC
12
(SP+1)
PC
110
(SP) (SP+3) (SP+2)
SP
SP+4
then skip unconditionally
PD753204
0, 0, 0, 0
(SP+1)
PC
110
(SP) (SP+3) (SP+2)
,
, MBE, RBE
(SP+4)
SP
SP+6
then skip unconditionally
PD753206, 753208
0, 0, 0, PC
12
(SP+1)
PC
110
(SP) (SP+3) (SP+2)
,
, MBE, RBE
(SP+4)
SP
SP+4
then skip unconditionally
Note The above operations in the double boxes can be performed only in the Mk II mode. The other operations
can be performed only in the Mk I mode.
53
PD753204, 753206, 753208
Instruction
Number
Number
Addressing
Mnemonic
Operand
of machine
Operation
Skip condition
group
of bytes
cycles
area
Subroutine
RETI
Note 1
1
3
PD753204
stack control
MBE, RBE, 0, 0
(SP+1)
instructions
PC
110
(SP) (SP+3) (SP+2)
PSW
(SP+4) (SP+5), SP
SP+6
PD753206, 753208
MBE, RBE, 0, PC
12
(SP+1)
PC
110
(SP) (SP+3) (SP+2)
PSW
(SP+4) (SP+5), SP
SP+6
PD753204
0, 0, 0, 0
(SP+1)
PC
110
(SP) (SP+3) (SP+2)
PSW
(SP+4) (SP+5), SP
SP+6
PD753206, 753208
0, 0, 0, PC
12
(SP+1)
PC
110
(SP) (SP+3) (SP+2)
PSW
(SP+4) (SP+5), SP
SP+6
PUSH
rp
1
1
(SP1)(SP2)
rp, SP
SP2
BS
2
2
(SP1)
MBS, (SP2)
RBS, SP
SP2
POP
rp
1
1
rp
(SP+1) (SP), SP
SP+2
BS
2
2
MBS
(SP+1), RBS
(SP), SP
SP+2
Interrupt
EI
2
2
IME (IPS.3)
1
control
instructions
IE
2
2
IE
1
DI
2
2
IME (IPS.3)
0
IE
2
2
IE
0
Input/output
IN
Note 2
A, PORTn
2
2
A
PORTn
(n = 0-3, 5, 6, 8, 9)
instructions
XA, PORTn
2
2
XA
PORTn+1, PORTn
(n = 8)
OUT
Note 2
PORTn, A
2
2
PORTn
A
(n = 3, 5, 6, 8, 9)
PORTn, XA
2
2
PORTn+1, PORTn
XA
(n = 8)
CPU control
HALT
2
2
Set HALT Mode (PCC.2
1)
instructions
STOP
2
2
Set STOP Mode (PCC.3
1)
NOP
1
1
No Operation
Special
SEL
RBn
2
2
RBS
n
(n = 0-3)
instructions
MBn
2
2
MBS
n
(n = 0, 1, 15)
Notes 1. The above operations in the double boxes can be performed only in the Mk II mode. The other
operations can be performed only in the Mk I mode.
2. While the IN instruction and OUT instruction are being executed, the MBE must be set to 0 or 1 and
MBS must be set to 15.
54
PD753204, 753206, 753208
Instruction
Number
Number
Addressing
Mnemonic
Operand
of machine
Operation
Skip condition
group
of bytes
cycles
area
Special
GET
Notes 1, 2
taddr
1
3
PD753204
*10
instructions
When TBR instruction
PC
110
(taddr)
30
+ (taddr+1)
When TCALL instruction
(SP4) (SP1) (SP2)
PC
110
(SP3)
MBE, RBE, 0, 0
PC
110
(taddr)
30
+ (taddr+1)
SP
SP4
When instruction other than TBR and
Depending on
TCALL instructions
the reference
(taddr) (taddr+1) instruction is executed.
instruction
PD753206, 753208
When TBR instruction
PC
120
(taddr)
40
+ (taddr+1)
When TCALL instruction
(SP4) (SP1) (SP2)
PC
110
(SP3)
MBE, RBE, 0, PC
12
PC
120
(taddr)
40
+ (taddr+1)
SP
SP4
When instruction other than TBR and
Depending on
TCALL instructions
the reference
(taddr) (taddr+1) instruction is executed.
instruction
3
PD753204
*10
When TBR instruction
PC
110
(taddr)
30
+ (taddr+1)
4
When TCALL instruction
(SP6) (SP3) (SP4)
PC
110
(SP5)
0, 0, 0, 0
(SP2)
,
, MBE, RBE
PC
110
(taddr)
30
+ (taddr+1)
SP
SP6
3
When instruction other than TBR and
Depending on
TCALL instructions
the reference
(taddr) (taddr+1) instruction is executed.
instruction
Notes 1. The TBR and TCALL instructions are the table definition assembler pseudo instructions of the GETI
instruction.
2. The above operations in the double boxes can be performed only in the Mk II mode. The other
operations can be performed only in the Mk I mode.
-
-
55
PD753204, 753206, 753208
Instruction
Number
Number
Addressing
Mnemonic
Operand
of machine
Operation
Skip condition
group
of bytes
cycles
area
Special
GETI
Notes 1, 2
taddr
1
3
PD753206, 753208
*10
instructions
When TBR instruction
PC
120
(taddr)
40
+ (taddr+1)
4
When TCALL instruction
(SP6) (SP3) (SP4)
PC
110
(SP5)
0, 0, 0, PC
12
(SP2)
,
, MBE, RBE
PC
120
(taddr)
40
+ (taddr+1)
SP
SP6
3
When instruction other than TBR and
Depending on
TCALL instructions
the reference
(taddr) (taddr+1) instruction is executed.
instruction
Notes 1. The TBR and TCALL instructions are the table definition assembler pseudo instructions of the GETI
instruction.
2. The above operations in the double boxes can be performed only in the Mk II mode.
56
PD753204, 753206, 753208
12. ELECTRICAL SPECIFICATIONS
ABSOLUTE MAXIMUM RATINGS (T
A
= 25C)
Parameter
Symbol
Test Conditions
Rating
Unit
Supply voltage
V
DD
0.3 to +7.0
V
Input voltage
V
I1
Except port 5
0.3 to V
DD
+ 0.3
V
V
I2
Port 5
On-chip pull-up resistor
0.3 to V
DD
+ 0.3
V
When N-ch open-drain
0.3 to +14
V
Output voltage
V
O
0.3 to V
DD
+ 0.3
V
Output current high
I
OH
Per pin
10
mA
Total for all pins
30
mA
Output current low
I
OL
Per pin
30
mA
Total for all pins
220
mA
Operating ambient
T
A
40 to +85
Note
C
temperature
Storage temperature
T
stg
65 to +150
C
Note When LCD is driven in normal mode: T
A
= 10 to +85C
Caution
Product quality may suffer if the absolute maximum rating is exceeded for even a single
parameter or even momentarily. That is, the absolute ratings are rated values at which the
product is on the verge of suffering physical damage, and therefore the product must be used
under conditions which ensure that the absolute maximum ratings are not exceeded.
CAPACITANCE (T
A
= 25C, V
DD
= 0 V)
Parameter
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
Input capacitance
C
IN
f = 1 MHz
15
pF
Output capacitance
C
OUT
Unmeasured pins returned to 0 V.
15
pF
I/O capacitance
C
IO
15
pF
57
PD753204, 753206, 753208
SYSTEM CLOCK OSCILLATOR CHARACTERISTICS (T
A
= 40 to +85C, V
DD
= 1.8 to 5.5 V)
Resonator
Recommended constant
Parameter
Test conditions
MIN.
TYP.
MAX.
Unit
Ceramic
Oscillator
1.0
6.0
Note 2
MHz
resonator
frequency (f
X
)
Note 1
Oscillation
After V
DD
reaches oscil-
4
ms
stabilization time
Note 3
lation voltage range MIN.
Crystal
Oscillator
1.0
6.0
Note 2
MHz
resonator
frequency (f
X
)
Note 1
Oscillation
V
DD
= 4.5 to 5.5 V
10
ms
stabilization time
Note 3
30
External
X1 input
1.0
6.0
Note 2
MHz
clock
frequency (f
X
)
Note 1
X1 input
83.3
500
ns
high/low level width
(t
XH
, t
XL
)
Notes 1. The oscillator frequency and X1 input frequency indicate characteristics of the oscillator only. For the
instruction execution time, refer to the AC characteristics.
2. When the oscillator frequency is 4.19 MHz < fx
6.0 MHz, setting the processor clock control register
(PCC) to 0011 results in 1 machine cycle being less than the required 0.95
s. Therefore, set PCC
to a value other than 0011.
3. The oscillation stabilization time is necessary for oscillation to stabilize after applying V
DD
or releasing
the STOP mode.
Caution
When using the system clock oscillator, wiring in the area enclosed with the dotted line should
be carried out as follows to avoid an adverse effect from wiring capacitance.
Wiring should be as short as possible.
Wiring should not cross other signal lines.
Wiring should not be placed close to a varying high current.
The potential of the oscillator capacitor ground should be the same as V
DD
.
Do not ground it to the ground pattern in which a high current flows.
Do not fetch a signal from the oscillator.
X2
X1
C1
C2
V
DD
X2
X1
C1
C2
V
DD
X1
X2
58
PD753204, 753206, 753208
RECOMMENDED OSCILLATOR CONSTANTS
Ceramic resonator (TA = 40 to 85
C)
Manufacturer
Part number
Frequency
Oscillator constant (pF)
Oscillation voltage range (V
DD
)
Remark
(MHz)
C1
C2
MIN. (V)
MAX. (V)
TDK
CCR1000K2
1.0
100
100
1.8
5.5
--
CCR2.0MC33
2.0
--
--
2.0
On-chip
CCR3.58MC3
3.58
capacitor
CCR4.19MC3
4.19
FCR4.19MC5
2.2
CCR6.0MC3
6.0
FCR6.0MC5
2.5
Caution
The oscillator constant and oscillation voltage range indicate conditions of stable oscillation.
Oscillation frequency precision is not guaranteed. For applications requiring oscillation frequency
precision, the oscillaiton frequency must be adjusted on the implementation circuit. For details,
please contact directly the manufacturer of the resonator you will use.
59
PD753204, 753206, 753208
DC CHARACTERISTICS (T
A
= 40 to +85C, V
DD
= 1.8 to 5.5 V)
Parameter
Symbol
Test conditions
MIN.
TYP.
MAX.
Unit
Output voltage low
I
OL
Per pin
15
mA
Sum of the all pins
150
mA
Input voltage high
V
IH1
Ports 2, 3, 8, and 9
2.7
V
DD
5.5 V
0.7V
DD
V
DD
V
1.8
V
DD
< 2.7 V
0.9V
DD
V
DD
V
V
IH2
Ports 0, 1, 6, RESET
2.7
V
DD
5.5 V
0.8V
DD
V
DD
V
1.8
V
DD
< 2.7 V
0.9V
DD
V
DD
V
V
IH3
Port 5
When a pull-up register
2.7
V
DD
5.5 V
0.7V
DD
V
DD
V
is incorporated
1.8
V
DD
< 2.7 V
0.9V
DD
V
DD
V
When N-ch open-drain
2.7
V
DD
5.5 V
0.7V
DD
13
V
1.8
V
DD
< 2.7 V
0.9V
DD
13
V
V
IH4
X1
V
DD
0.1
V
DD
V
Input voltage low
VI
L1
Ports 2, 3, 5, 8, and 9
2.7
V
DD
5.5 V
0
0.3V
DD
V
1.8
V
DD
< 2.7 V
0
0.1V
DD
V
V
IL2
Ports 0, 1, 6, RESET
2.7
V
DD
5.5 V
0
0.2V
DD
V
1.8
V
DD
< 2.7 V
0
0.1V
DD
V
V
IL3
X1
0
0.1
V
Output voltage high
V
OH
SCK, SO, ports 2, 3, 6, 8, and 9 I
OH
= 1.0 mA
V
DD
0.5
V
Output voltage low
V
OL1
SCK, SO, ports 2, 3, 5, 6, 8,
I
OL
= 15 mA,
0.2
2.0
V
and 9
V
DD
= 4.5 to 5.5 V
I
OL
= 1.6 mA
0.4
V
V
OL2
SB0, SB1
N-ch open-drain
0.2V
DD
V
pull-up resistor
1 k
Input leakage
I
LIH1
V
IN
= V
DD
Other pins than X1
3
A
current high
I
LIH2
X1
20
A
I
LIH3
V
IN
= 13 V
Port 5 (When N-ch open-drain)
20
A
Input leakage
I
LIL1
V
IN
= 0 V
Other pins than port 5 and X1
3
A
current low
I
LIL2
X1
20
A
I
LIL3
Port 5 (When N-ch open drain)
3
A
Other than when an input instruction
is executed
Port 5 (When N-ch open-drain)
30
A
When an input instruction
V
DD
= 5.0 V
10
27
A
is executed
V
DD
= 3.0 V
3
8
A
Output leakage
I
LOH1
V
OUT
= V
DD
SCK, SO/SB0, SB1, ports 2, 3, 6, 8
3
A
current high
and 9
Port 5 (When a pull-up resistor
is incorporated.)
I
LOH2
V
OUT
= 13 V
Port 5 (When N-ch open-drain)
20
A
Output leakage
I
LOL
V
OUT
= 0 V
3
A
current low
On-chip pull-up resistor
R
L1
V
IN
= 0 V
Ports 0 to 3, 6, 8, and 9
50
100
200
k
(Excluding P00 pin)
R
L2
Port 5 (Mask option)
15
30
60
k
60
PD753204, 753206, 753208
DC CHARACTERISTICS (T
A
= 40 to +85C, V
DD
= 1.8 to 5.5 V)
Parameter
Symbol
Test conditions
MIN.
TYP.
MAX.
Unit
LCD drive voltage
V
LCD
VAC0 = 0
T
A
= 40 to +85C
2.7
V
DD
V
T
A
= 10 to +85C
2.2
V
DD
V
VAC0 = 1
1.8
V
DD
V
VAC current
Note 1
I
VAC
VAC0 = 1, V
DD
= 2.0 V
10%
1
4
A
LCD split resistor
Note 2
R
LCD1
50
100
200
k
R
LCD2
5
10
20
k
LCD output voltage
V
ODC
l
O
=
1.0
A
V
LCD0
= V
LCD
0
0.2
V
deviation
Note 3
(common)
V
LCD1
= V
LCD
2/3
LCD output voltage
V
ODS
l
O
=
0.5
A
V
LCD2
= V
LCD
1/3
0
0.2
V
deviation
Note 3
(segment)
1.8 V
V
LCD
V
DD
Supply current
Note 4
I
DD1
6.0 MHz
V
DD
= 5.0 V
10%
Note 5
1.9
6.0
mA
Crystal oscillation
V
DD
= 3.0 V
10%
Note 6
0.4
1.3
mA
I
DD2
C1 = C2 = 22 pF
HALT mode V
DD
= 5.0 V
10%
0.72
2.1
mA
V
DD
= 3.0 V
10%
0.27
0.8
mA
I
DD1
4.19 MHz
V
DD
= 5.0 V
10%
Note 5
1.5
4.0
mA
Crystal oscillation
V
DD
= 3.0 V
10%
Note 6
0.25
0.75
mA
I
DD2
C1 = C2 = 22 pF
HALT mode V
DD
= 5.0 V
10%
0.7
2.0
mA
V
DD
= 3.0 V
10%
0.23
0.7
mA
I
DD3
STOP mode
V
DD
= 5.0 V
10%
0.05
10
A
V
DD
= 3.0 V
0.02
5
A
10%
T
A
= 25C
0.02
3
A
Notes 1. Set VAC0 to 0 when setting the STOP mode. If VAC0 is set to 1, the current increases by about 1
A.
2. Either R
LCD1
or R
LCD2
can be selected by the mask option.
3. The voltage deviation is the difference from the output voltage corresponding to the ideal value of the
segment and common outputs (V
LCDn
; n = 0, 1, 2).
4. Not including currents flowing in on-chip pull-up resistors or LCD split resistors.
5. When the processor clock control register (PCC) is set to 0011 and the device is operated in the high-
speed mode.
6. When PCC is set to 0000 and the device is operated in the low-speed mode.
61
PD753204, 753206, 753208
AC CHARACTERISTICS (T
A
= 40 to +85C, V
DD
= 1.8 to 5.5 V)
Parameter
Symbol
Test conditions
MIN.
TYP.
MAX.
Unit
CPU clock cycle
t
CY
V
DD
= 2.7 to 5.5 V
0.67
64
s
time
Note 1
0.95
64
s
TI0 input frequency
f
TI
V
DD
= 2.7 to 5.5 V
0
1.0
MHz
0
275
kHz
TI0 input
t
TIH
, t
TIL
V
DD
= 2.7 to 5.5 V
0.48
s
high/low-level width
1.8
s
Interrupt input high/
t
INTH
,
INT0
IM02 = 0
Note 2
s
low-level width
t
INTL
IM02 = 1
10
s
INT4
10
s
KR0 to KR3
10
s
RESET low level width
t
RSL
10
s
Notes 1. The cycle time (minimum instruc-
tion execution time) of the CPU
clock (
) is determined by the
oscillation frequency of the con-
nected resonator (and external
clock) and the processor clock
control register (PCC). The figure
at the right indicates the cycle
time t
CY
versus supply voltage
V
DD
characteristic.
2. 2t
CY
or 128/f
X
is set by setting the
interrupt mode register (IM0).
1
0
2
3
4
5
6
0.5
1
3
4
5
6
30
64
Supply Voltage V
DD
[V]
t
CY
vs V
DD
Cycle Time t
CY
[ s]
Guaranteed Operation
Range
62
PD753204, 753206, 753208
SERIAL TRANSFER OPERATION
2-Wire and 3-Wire Serial I/O Mode (SCK...Internal clock output): (T
A
= 40 to +85C, V
DD
= 1.8 to 5.5 V)
Parameter
Symbol
Test conditions
MIN.
TYP.
MAX.
Unit
SCK cycle time
t
KCY1
V
DD
= 2.7 to 5.5 V
1300
ns
3800
ns
SCK high/low-level
t
KL1
, t
KH1
V
DD
= 2.7 to 5.5 V
t
KCY1
/2 50
ns
width
t
KCY1
/2 150
ns
SI
Note 1
setup time
t
SIK1
V
DD
= 2.7 to 5.5 V
150
ns
(to SCK
)
500
ns
SI
Note 1
hold time
t
KSI1
V
DD
= 2.7 to 5.5 V
400
ns
(from SCK
)
600
ns
SO
Note 1
output delay
t
KSO1
R
L
= 1 k
,
Note 2
V
DD
= 2.7 to 5.5 V
0
250
ns
time from SCK
C
L
= 100 pF
0
1000
ns
Notes 1. In the 2-wire serial I/O mode, read SB0 or SB1 instead.
2. R
L
and C
L
are the load resistance and load capacitance of the SO output lines.
2-Wire and 3-Wire Serial I/O Mode (SCK...External clock input): (T
A
= 40 to +85C, V
DD
= 1.8 to 5.5 V)
Parameter
Symbol
Test conditions
MIN.
TYP.
MAX.
Unit
SCK cycle time
t
KCY2
V
DD
= 2.7 to 5.5 V
800
ns
3200
ns
SCK high/low-level
t
KL2
, t
KH2
V
DD
= 2.7 to 5.5 V
400
ns
width
1600
ns
SI
Note 1
setup time
t
SIK2
V
DD
= 2.7 to 5.5 V
100
ns
(to SCK
)
150
ns
SI
Note 1
hold time
t
KSI2
V
DD
= 2.7 to 5.5 V
400
ns
(from SCK
)
600
ns
SO
Note 1
output delay
t
KSO2
R
L
= 1 k
,
Note 2
V
DD
= 2.7 to 5.5 V
0
300
ns
time from SCK
C
L
= 100 pF
0
1000
ns
Notes 1. In the 2-wire serial I/O mode, read SB0 or SB1 instead.
2. R
L
and C
L
are the load resistance and load capacitance of the SO output lines.
63
PD753204, 753206, 753208
SBI Mode (SCK...Internal clock output (master)): (T
A
= 40 to +85 C, V
DD
= 1.8 to 5.5 V)
Parameter
Symbol
Test conditions
MIN.
TYP.
MAX.
Unit
SCK cycle time
t
KCY3
V
DD
= 2.7 to 5.5 V
1300
ns
3800
ns
SCK high/low-level
t
KL3
, t
KH3
V
DD
= 2.7 to 5.5 V
t
KCY3
/2 50
ns
width
t
KCY3
/2 150
ns
SB0, 1 setup time
t
SIK3
V
DD
= 2.7 to 5.5 V
150
ns
(to SCK
)
500
ns
SB0, 1 hold time
t
KSI3
V
DD
= 2.7 to 5.5 V
t
KCY3
/2
ns
(from SCK
)
SB0, 1 output delay
t
KSO3
R
L
= 1 k
,
Note
V
DD
= 2.7 to 5.5 V
0
250
ns
time from SCK
C
L
= 100 pF
0
1000
ns
SB0, 1
from SCK
t
KSB
t
KCY3
ns
SCK
from SB0, 1
t
SBK
t
KCY3
ns
SB0, 1 low-level width
t
SBL
t
KCY3
ns
SB0, 1 high-level width
t
SBH
t
KCY3
ns
Note R
L
and C
L
are the load resistance and load capacitance of the SB0 and SB1 output lines.
SBI Mode (SCK...External clock input (slave)): (T
A
= 40 to +85 C, V
DD
= 1.8 to 5.5 V)
Parameter
Symbol
Test conditions
MIN.
TYP.
MAX.
Unit
SCK cycle time
t
KCY4
V
DD
= 2.7 to 5.5 V
800
ns
3200
ns
SCK high/low-level
t
KL4
, t
KH4
V
DD
= 2.7 to 5.5 V
400
ns
width
1600
ns
SB0, 1 setup time
t
SIK4
V
DD
= 2.7 to 5.5 V
100
ns
(to SCK
)
150
ns
SB0, 1 hold time
t
KSI4
V
DD
= 2.7 to 5.5 V
t
KCY4
/2
ns
(from SCK
)
SB0, 1 output delay
t
KSO4
R
L
= 1 k
,
Note
V
DD
= 2.7 to 5.5 V
0
300
ns
time from SCK
C
L
= 100 pF
0
1000
ns
SB0, 1
from SCK
t
KSB
t
KCY4
ns
SCK
from SB0, 1
t
SBK
t
KCY4
ns
SB0, 1 low-level width
t
SBL
t
KCY4
ns
SB0, 1 high-level width
t
SBH
t
KCY4
ns
Note R
L
and C
L
are the load resistance and load capacitance of the SB0 and SB1 output lines.
64
PD753204, 753206, 753208
X1 Input
1/f
X
t
XL
t
XH
0.1 V
V
DD
0.1 V
TI0
1/f
TI
t
TIL
t
TIH
AC Timing Test Point (Excluding X1 Input)
V
IH
(MIN.)
V
IL
(MAX.)
V
IH
(MIN.)
V
IL
(MAX.)
V
OH
(MIN.)
V
OL
(MAX.)
V
OH
(MIN.)
V
OL
(MAX.)
Clock Timing
TI0 Timing
65
PD753204, 753206, 753208
t
KCY1, 2
t
KL1, 2
t
KH1, 2
SCK
SI
SO
t
SIK1, 2
t
KSI1, 2
t
KSO1, 2
Input Data
Output Data
t
KSO1, 2
t
SIK1, 2
t
KL1, 2
t
KH1, 2
SCK
t
KSI1, 2
SB0, 1
t
KCY1, 2
Serial Transfer Timing
3-wire serial I/O mode
2-wire serial I/O mode
66
PD753204, 753206, 753208
t
KCY3, 4
t
KH3, 4
t
KSI3, 4
t
SIK3, 4
t
KSO3, 4
SCK
SB0, 1
t
KL3, 4
t
SBK
t
SBH
t
SBL
t
KSB
t
KCY3, 4
t
KH3, 4
t
KSI3, 4
t
SIK3, 4
t
KSO3, 4
SCK
SB0, 1
t
KL3, 4
t
SBK
t
KSB
t
RSL
RESET
t
INTL
t
INTH
INTP0, 4
KR0 to 3
Serial Transfer Timing
Bus release signal transfer
Command signal transfer
Interrupt input timing
RESET input timing
67
PD753204, 753206, 753208
DATA MEMORY STOP MODE LOW SUPPLY VOLTAGE DATA RETENTION CHARACTERISTICS
(T
A
= 40 to +85C)
Parameter
Symbol
Test conditions
MIN.
TYP.
MAX.
Unit
Release signal set time
t
SREL
0
s
Oscillation stabilization
t
WAIT
Release by RESET
Note 2
ms
wait time
Note 1
Release by interrupt
Note 3
ms
Notes 1. The oscillation stabillization wait time is the time during which the CPU operation is stopped to prevent
unstable operation at the oscillation start.
2. Either 2
17
/f
X
or 2
15
/f
X
can be selected by the mask option.
3. Depends on the basic interval timer mode register (BTM) settings (See the table below).
BTM3
BTM2
BTM1
BTM0
Wait time
When fx = 4.19-MHz operation When fx = 6.0-MHz operation
--
0
0
0
2
20
/f
X
(approx. 250 ms)
2
20
/f
X
(approx. 175 ms)
--
0
1
1
2
17
/f
X
(approx. 31.3 ms)
2
17
/f
X
(approx. 21.8 ms)
--
1
0
1
2
15
/f
X
(approx. 7.81 ms)
2
15
/f
X
(approx. 5.46 ms)
--
1
1
1
2
13
/f
X
(approx. 1.95 ms)
2
13
/f
X
(approx. 1.37 ms)
Data Retention Timing (STOP Mode Release by RESET)
Data Retention Timing (Standby Release Signal: STOP Mode Release by Interrupt Signal)
V
DD
RESET
STOP Instruction Execution
STOP Mode
Data Retention Mode
Internal Reset Operation
Halt mode
Operating Mode
t
SREL
t
WAIT
t
SREL
t
WAIT
V
DD
STOP Instruction Execution
STOP Mode
Data Retention Mode
Halt mode
Operating Mode
Standby Release Signal
(Interrupt Request)
68
PD753204, 753206, 753208
0
1
2
3
4
5
6
7
8
0.01
0.05
0.1
0.5
1.0
5.0
10
Supply Current I
DD
(mA)
(T
A
= 25
C)
I
DD
vs V
DD
(System Clock : 6.0-MHz Crystal Resonator)
Supply Voltage V
DD
(V)
PCC = 0000
System clock
HALT mode
PCC = 0001
PCC = 0010
V
DD
22 pF
Crystal
resonator
6.0 MHz
22 pF
X1
X2
PCC = 0011
13. CHARACTERISTIC CURVES (REFERENCE VALUES)
69
PD753204, 753206, 753208
0
1
2
3
4
5
6
7
8
0.01
0.05
0.1
0.5
1.0
5.0
10
Supply Current I
DD
(mA)
(T
A
= 25
C)
I
DD
vs V
DD
(System Clock : 4.19-MHz Crystal Resonator)
Supply Voltage V
DD
(V)
PCC = 0011
PCC = 0000
System clock
HALT mode
PCC = 0001
PCC = 0010
V
DD
22 pF
Crystal
resonator
4.19 MHz
22 pF
X1
X2
70
PD753204, 753206, 753208
48 PIN PLASTIC SHRINK SOP (375 mil)
C
B
D
E
F
G
A
1
24
48
25
L
I
H
J
K
detail of lead end
3
M
M
N
+7 3
P48GT-65-375B-1
ITEM
MILLIMETERS
INCHES
A
B
C
D
E
F
G
H
I
J
K
16.21 MAX.
0.65 (T.P.)
2.0 MAX.
1.70.1
10.00.3
0.63 MAX.
0.639 MAX.
0.0050.003
0.079 MAX.
0.394
0.3150.008
0.025 MAX.
NOTE
L
M
0.50.2
0.15
1.00.2
8.00.2
0.004
0.020
+0.008
0.009
Each lead centerline is located within 0.10
mm (0.004 inch) of its true position (T.P.) at
maximum material condition.
0.0670.004
0.026 (T.P.)
0.006
N
0.10
0.004
0.012
0.300.10
0.1250.075
+0.004
0.002
0.10
+0.10
0.05
+0.004
0.005
+0.012
0.013
0.039
+0.009
0.008
14. PACKAGE DRAWINGS
71
PD753204, 753206, 753208
15. RECOMMENDED SOLDERING CONDITIONS
The
PD753208 should be soldered and mounted under the conditions recommended in the table below.
For details of recommended soldering conditions, refer to the information document "Semiconductor Device
Mounting Technology Manual" (C10535E).
For soldering methods and conditions other than those recommended below, contact an NEC sales representative.
Table 15-1. Surface Mounting Type Soldering Conditions
PD753204GT-xxx
: 48-pin plastic shrink SOP (375 mils, 0.65-mm pitch)
PD753206GT-xxx
: 48-pin plastic shrink SOP (375 mils, 0.65-mm pitch)
PD753208GT-xxx
: 48-pin plastic shrink SOP (375 mils, 0.65-mm pitch)
Soldering
Soldering Conditions
Symbol
Method
Infrared rays
Peak package's surface temperature: 235C, Reflow time: 30 seconds or less
IR35-00-2
reflow
(at 210C or higher), Number of reflow processes: Twice max.
VPS
Peak package's surface temperature: 215C, Reflow time: 40 seconds or less
VP15-00-2
(at 200C or higher), Number of reflow processes: Twice max.
Wave soldering
Solder temperature: 260C or below, Flow time: 10 seconds or less, Number of
WS60-00-1
flow process: 1, Preheating temperature: 120C or below (Package surface
temperature)
Partial heating
Pin temperature: 300C or below, Time: 3 seconds or less (per device side)
--
Caution
Use of more than one soldering method should be avoided (except for partial heating).
72
PD753204, 753206, 753208
APPENDIX A
PD753108, 753208, AND 75P3216 FUNCTIONAL LIST
Parameter
PD753108
PD753208
PD75P3216
Program memory
Mask ROM
One-time PROM
0000H-1FFFH
0000H-3FFFH
(8192
8 bits)
(16384
8 bits)
Data memory
000H-1FFH
(512
4 bits)
CPU
75XL CPU
Instruction
When main system
0.95, 1.91, 3.81, 15.3
s (@ 4.19-MHz operation)
execution
clock is selected
0.67, 1.33, 2.67, 10.7
s (@ 6.0-MHz operation)
time
When subsystem
122
s (@ 32.768-kHz
None
clock is selected
operation)
I/O port
CMOS input
8 (on-chip pull-up resistors can
6 (on-chip pull-up resistors can be specified by software: 5)
be specified by software: 7)
CMOS input/output
20 (on-chip pull-up resistors can be specified by software)
N-ch open drain
4 (on-chip pull-up resistors can be specified by software,
4 (no mask option, withstand
input/output
withstand voltage is 13 V)
voltage is 13 V)
Total
32
30
LCD controller/driver
Segment selection: 16/20/24
Segment selection: 4/8/12 segments
(can be changed to CMOS
(can be changed to CMOS input/output port in 4 time-unit;
input/output port in 4 time-
max. 8)
unit; max. 8)
Display mode selection: static, 1/2 duty (1/2 bias), 1/3 duty (1/2 bias), 1/3 duty (1/3 bias),
1/4 duty (1/3 bias)
On-chip split resistor for LCD driver can be specified by
No on-chip split resistor for
using mask option.
LCD driver
Timer
5 channels
5 channels
8-bit timer/event
8-bit timer counter: 2 channels (can be used as the 16-bit
counter: 3 channels
timer counter, carrier generator, and timer with gate)
Basic interval timer/
8-bit timer/event counter: 1 channel
watchdog timer: 1 channel
Basic interval timer/watchdog timer: 1 channel
Watch timer: 1 channel
Watch timer: 1 channel
Clock output (PCL)
, 524, 262, 65.5 kHz
(Main system clock: @ 4.19-MHz operation)
, 750, 375, 93.8 kHz
(Main system clock: @ 6.0-MHz operation)
Buzzer output (BUZ)
2, 4, 32 kHz
2, 4, 32 kHz
(Main system clock: @
(Main system clock: @ 4.19-MHz operation)
4.19-MHz operation or sub-
2.93, 5.86, 46.9 kHz
system clock: @ 32.768-kHz
(Main system clock: @ 6.0-MHz operation)
operation)
2.86, 5.72, 45.8 kHz
(Main system clock: @
6.0-MHz operation)
Serial interface
3 modes are available
3-wire serial I/O mode ... MSB/LSB can be selected for transfer top bit
2-wire serial I/O mode
SBI mode
SCC register
Contained
None
SOS register
Vectored interrupt
External: 3, internal: 5
External: 2, internal: 5
73
PD753204, 753206, 753208
Parameter
PD753108
PD753208
PD75P3216
Test input
External: 1, internal: 1
Operation supply voltage
V
DD
= 1.8 to 5.5 V
Operating ambient temperature
T
A
= 40 to +85
C
Package
64-pin plastic QFP
48-pin plastic shrink SOP
(14
14 mm)
(375 mils, 0.65-mm pitch)
64-pin plastic QFP
(12
12 mm)
74
PD753204, 753206, 753208
APPENDIX B DEVELOPMENT TOOLS
The following development tools are provided for system development using the
PD753208.
In 75XL series, the relocatable assembler which is common to the
PD753208 Subseries is used in combination
with the device file of each product.
Language processor
RA75X relocatable assembler
Host machine
Part number
OS
Distribution media
(product name)
PC-9800 series
MS-DOS
TM
3.5-inch 2HD
S5A13RA75X
Ver. 3.30 to
5-inch 2HD
S5A10RA75X
Ver. 6.2
Note
IBM PC/AT
TM
and
Refer to section
3.5-inch 2HC
S7B13RA75X
compatible machines
"OS for IBM PC"
5-inch 2HC
S7B10RA75X
Device file
Host machine
Part number
OS
Distribution media
(product name)
PC-9800 series
MS-DOS
3.5-inch 2HD
S5A13DF753208
Ver. 3.30 to
5-inch 2HD
S5A10DF753208
Ver. 6.2
Note
IBM PC/AT and
Refer to section
3.5-inch 2HC
S7B13DF753208
compatible machines
"OS for IBM PC"
5-inch 2HC
S7B10DF753208
PROM write tools
Hardware
PG-1500
PG-1500 is a PROM programmer which enables you to program single chip microcomputers
including PROM by stand-alone or host machine operation by connecting an attached board
and optional programmer adapter to PG-1500. It also enables you to program typical PROM
devices of 256 Kbits to 4 Mbits.
PA-75P3216GT
PROM programmer adapter for the
PD75P3216GT. Connect the programmer adapter to
PG-1500 for use.
Software
PG-1500 controller
PG-1500 and a host machine are connected by serial and parallel interfaces and PG-1500
is controlled on the host machine.
Host machine
Part number
OS
Distribution media
(product name)
PC-9800 series
MS-DOS
3.5-inch 2HD
S5A13PG1500
Ver. 3.30 to
5-inch 2HD
S5A10PG1500
Ver. 6.2
Note
IBM PC/AT and
Refer to section
3.5-inch 2HD
S7B13PG1500
compatible machines
"OS for IBM PC"
5-inch 2HC
S7B10PG1500
Note Ver. 5.00 or later have the task swap function, but it cannot be used for this software.
Remarks
1. Operation of the assembler and device file is guaranteed only on the above host machine and OSs.
2. Operation of the PG-1500 controller is guaranteed only on the above host machine and OSs.
75
PD753204, 753206, 753208
Debugging tool
The in-circuit emulators (IE-75000-R and IE-75001-R) are available as the program debugging tool for the
PD753208.
The system configurations are described as follows.
Hardware
IE-75000-R
Note 1
In-circuit emulator for debugging the hardware and software when developing the
application systems that use the 75X series and 75XL series. When developing a
PD753208 subseries, the emulation board IE-75300-R-EM and emulation probe EP-
753208GT-R that are sold separately must be used with the IE-75000-R.
By connecting with the host machine and the PROM programmer, efficient debugging
can be made.
It contains the emulation board IE-75000-R-EM which is connected.
IE-75001-R
In-circuit emulator for debugging the hardware and software when developing the
application systems that use the 75X series and 75XL series. When developing a
PD753208 subseries, the emulation board IE-75300-R-EM and emulation probe EP-
753208GT-R which are sold separately must be used with the IE-75001-R.
It can debug the system efficiently by connecting the host machine and PROM
programmer.
IE-75300-R-EM
Emulation board for evaluating the application systems that use a
PD753208
subseries.
It must be used with the IE-75000-R or IE-75001-R.
EP-753208GT-R
Emulation probe for the
PD753208GT.
It must be connected to the IE-75000-R (or IE-75001-R) and IE-75300-R-EM.
It is supplied with the 48-pin conversion adapter EV-9500GF-48 which facilitates
EV-9500GF-48
connection to a target system.
Software
IE control program
Connects the IE-75000-R or IE-75001-R to a host machine via RS-232-C and Centronix
I/F and controls the above hardware on a host machine.
Host machine
Part No.
OS
Distribution media
(product name)
PC-9800 series
MS-DOS
3.5-inch 2HD
S5A13IE75X
Ver. 3.30 to
5-inch 2HD
S5A10IE75X
Ver. 6.2
Note 2
IBM PC/AT and its
Refer to section
3.5-inch 2HC
S7B13IE75X
compatible machine
"OS for IBM PC"
5-inch 2HC
S7B10IE75X
Notes 1. Maintenance parts.
2. Ver. 5.00 or later have the task swap function, but it cannot be used for this software.
Remarks
1. Operation of the IE control program is guaranteed only on the above host machines and OSs.
2. The
PD753204, 753206, 753208, and 75P3216 are commonly referred to as the
PD753208
Subseries.
76
PD753204, 753206, 753208
OS for IBM PC
The following IBM PC OS's are supported.
OS
Version
PC DOS
TM
Ver. 5.02 to Ver. 6.3
J6.1/V
Note
to J6.3/V
Note
MS-DOS
Ver. 5.0 to Ver. 6.22
5.0/V
Note
to 6.2/V
Note
IBM DOS
TM
J5.02/V
Note
Note English version is supported.
Caution
Ver. 5.0 and later have the task swap function, but it cannot be used for this software.
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PD753204, 753206, 753208
APPENDIX C RELATED DOCUMENTS
The related documents indicated in this publication may include preliminary versions.
However, preliminary versions are not marked as such.
Documents related to device
Document No.
Document Name
Japanese
English
PD753204, 753206, 753208 Data Sheet
U10166J
This manual
PD75P3216 Data Sheet
U10241J
U10241E
PD753208 User's Manual
U10158J
U10158E
75XL Series Selection Guide
U10453J
U10453E
Documents related to development tool
Document No.
Document Name
Japanese
English
Hardware
IE-75000-R/IE-75001-R User`s Manual
EEU-846
EEU-1416
IE-75300-R-EM User's Manual
U11354J
U11354E
EP-753208GT-R User's Manual
U10739J
U10739E
PG-1500 User's Manual
U11940J
EEU-1335
Software
RA75X Assembler Package User's Manual
Operation
EEU-731
EEU-1346
Language
EEU-730
EEU-1363
PG-1500 Controller User's Manual
PC-9800 Series
EEU-704
EEU-1291
(MS-DOS) Base
IBM PC Series
EEU-5008
U10540E
(PC DOS) Base
Other related documents
Document No.
Document Name
Japanese
English
Semiconductor Device Package Manual
C10943X
Semiconductor Device Mounting Technology Manual
C10535J
C10535E
Quality Grades on NEC Semiconductor Devices
C11531J
C11531E
NEC Semiconductor Device Reliability/Quality Control System
C10983J
C10983E
Electrostatic Discharge (ESD) Test
MEM-539
IEI-1201
Guide to Quality Assurance for Semiconductor Devices
C11893J
MEI-1202
Microcontroller Related Product Guide Third Party Products
C11416J
Caution
The contents of the documents listed above are subject to change without prior notice to users.
Make sure to use the latest edition when starting design.
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PD753204, 753206, 753208
NOTES FOR CMOS DEVICES
1
PRECAUTION AGAINST ESD FOR SEMICONDUCTORS
Note: Strong electric field, when exposed to a MOS device, can cause destruction
of the gate oxide and ultimately degrade the device operation. Steps must be
taken to stop generation of static electricity as much as possible, and quickly
dissipate it once, when it has occurred. Environmental control must be
adequate. When it is dry, humidifier should be used. It is recommended to
avoid using insulators that easily build static electricity. Semiconductor
devices must be stored and transported in an anti-static container, static
shielding bag or conductive material. All test and measurement tools including
work bench and floor should be grounded. The operator should be grounded
using wrist strap. Semiconductor devices must not be touched with bare
hands. Similar precautions need to be taken for PW boards with semiconductor
devices on it.
2
HANDLING OF UNUSED INPUT PINS FOR CMOS
Note: No connection for CMOS device inputs can be cause of malfunction. If no
connection is provided to the input pins, it is possible that an internal input
level may be generated due to noise, etc., hence causing malfunction. CMOS
device behave differently than Bipolar or NMOS devices. Input levels of CMOS
devices must be fixed high or low by using a pull-up or pull-down circuitry.
Each unused pin should be connected to V
DD
or GND with a resistor, if it is
considered to have a possibility of being an output pin. All handling related
to the unused pins must be judged device by device and related specifications
governing the devices.
3
STATUS BEFORE INITIALIZATION OF MOS DEVICES
Note: Power-on does not necessarily define initial status of MOS device. Production
process of MOS does not define the initial operation status of the device.
Immediately after the power source is turned ON, the devices with reset
function have not yet been initialized. Hence, power-on does not guarantee
out-pin levels, I/O settings or contents of registers. Device is not initialized
until the reset signal is received. Reset operation must be executed immediately
after power-on for devices having reset function.
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PD753204, 753206, 753208
NEC Electronics Inc. (U.S.)
Santa Clara, California
Tel: 800-366-9782
Fax: 800-729-9288
NEC Electronics (Germany) GmbH
Duesseldorf, Germany
Tel: 0211-65 03 02
Fax: 0211-65 03 490
NEC Electronics (UK) Ltd.
Milton Keynes, UK
Tel: 01908-691-133
Fax: 01908-670-290
NEC Electronics Italiana s.r.1.
Milano, Italy
Tel: 02-66 75 41
Fax: 02-66 75 42 99
NEC Electronics Hong Kong Ltd.
Hong Kong
Tel: 2886-9318
Fax: 2886-9022/9044
NEC Electronics Hong Kong Ltd.
Seoul Branch
Seoul, Korea
Tel: 02-528-0303
Fax: 02-528-4411
NEC Electronics Singapore Pte. Ltd.
United Square, Singapore 1130
Tel: 253-8311
Fax: 250-3583
NEC Electronics Taiwan Ltd.
Taipei, Taiwan
Tel: 02-719-2377
Fax: 02-719-5951
NEC do Brasil S.A.
Sao Paulo-SP, Brasil
Tel: 011-889-1680
Fax: 011-889-1689
NEC Electronics (Germany) GmbH
Benelux Office
Eindhoven, The Netherlands
Tel: 040-2445845
Fax: 040-2444580
NEC Electronics (France) S.A.
Velizy-Villacoublay, France
Tel: 01-30-67 58 00
Fax: 01-30-67 58 99
NEC Electronics (France) S.A.
Spain Office
Madrid, Spain
Tel: 01-504-2787
Fax: 01-504-2860
NEC Electronics (Germany) GmbH
Scandinavia Office
Taeby, Sweden
Tel: 08-63 80 820
Fax: 08-63 80 388
Regional Information
Some information contained in this document may vary from country to country. Before using any NEC
product in your application, please contact the NEC office in your country to obtain a list of authorized
representatives and distributors. They will verify:
Device availability
Ordering information
Product release schedule
Availability of related technical literature
Development environment specifications (for example, specifications for third-party tools and
components, host computers, power plugs, AC supply voltages, and so forth)
Network requirements
In addition, trademarks, registered trademarks, export restrictions, and other legal issues may also vary
from country to country.
J96. 8
80
PD753204, 753206, 753208
MS-DOS is a trademark of Microsoft Corporation.
IBM DOS, PC/AT, and PC DOS are trademarks of International Business Machines Corporation.
The export of this product from Japan is regulated by the Japanese government. To export this product may be
prohibited without governmental license, the need for which must be judged by the customer. The export or re-
export of this product from a country other than Japan may also be prohibited without a license from that country.
Please call an NEC sales representative.
No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property
rights of third parties by or arising from use of a device described herein or any other liability arising from use
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of NEC Corporation or others.
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated "quality assurance program" for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special:
Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific:
Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
Anti-radioactive design is not implemented in this product.
M4 96.5