ChipFind - документация

Электронный компонент: UPD784035GC-XXX-3B9

Скачать:  PDF   ZIP

Document Outline

MOS INTEGRATED CIRCUIT
PD784035, 784036, 784037, 784038
16/8-BIT SINGLE-CHIP MICROCONTROLLER
The
PD784038 is a product of the
PD784038 sub-series in the 78K/IV series. It contains various peripheral
hardware such as ROM, RAM, I/O ports, 8-bit resolution A/D and D/A converters, timers, serial interface, and interrupt
functions, as well as a high-speed, high-performance CPU.
In addition, the
PD78P4038 (one-time PROM or EPROM product), which can be operated within the same power
supply voltage ranges as masked-ROM products, and development tools are supported.
For specific functions and other detailed information, consult the following user's manual.
This manual is required reading for design work.
PD784038, 784038Y Sub-Series User's Manual, Hardware : U11316E
78K/IV Series User's Manual, Instruction
: U10905E
FEATURES
Pin-compatible with the
PD78234,
PD784026, and
PD784038Y sub-series
Expanded internal memory spaces in the
PD78234
and
PD784026 sub-series
Minimum instruction execution time: 125 ns
(at 32 MHz)
Number of I/O ports: 64
Timer/counters: 16-bit timer/counter
3 units
16-bit timer
1 unit
A/D converter: 8-bit resolution
8 channels
D/A converter: 8-bit resolution
2 channels
APPLICATIONS
LBP, automatic-focusing camera, PPC, printer, electronic typewriter, air conditioner, electronic musical instru-
ments, cellular telephone, etc.
This manual describes the
PD784038 unless otherwise specified.
DATA SHEET
Serial interface: 3 channels
UART/IOE (3-wire serial I/O): 2 channels
CSI (3-wire serial I/O, 2-wire serial I/O): 1 channel
PWM outputs: 2
Standby function
HALT/STOP/IDLE mode
Clock frequency division function
Watchdog timer: 1 channel
Clock output function
Selectable from f
CLK
, f
CLK
/2, f
CLK
/4, f
CLK
/8, or f
CLK
/16
Supply voltage: V
DD
= 2.7 to 5.5 V
Document No.
U10847EJ2V0DS00 (2nd edition)
Date Published February 1998 J CP(K)
Printed in Japan
The mark shows major revised points.
The information in this document is subject to change without notice.
1995
PD784035, 784036, 784037, 784038
2
ORDERING INFORMATION
Part number
Package
Internal ROM
Internal RAM
(bytes)
(bytes)
PD784035GC-
-3B9
80-pin plastic QFP (14
14
2.7 mm)
48K
2,048
PD784035GC-
-8BT
80-pin plastic QFP (14
14
1.4 mm)
48K
2,048
PD784035GK-
-BE9
80-pin plastic TQFP (fine pitch) (12
12 mm)
48K
2,048
PD784036GC-
-3B9
80-pin plastic QFP (14
14
2.7 mm)
64K
2,048
PD784036GC-
-8BT
80-pin plastic QFP (14
14
1.4 mm)
64K
2,048
PD784036GK-
-BE9
80-pin plastic TQFP (fine pitch) (12
12 mm)
64K
2,048
PD784037GC-
-3B9
80-pin plastic QFP (14
14
2.7 mm)
96K
3,584
PD784037GC-
-8BT
80-pin plastic QFP (14
14
1.4 mm)
96K
3,584
PD784037GK-
-BE9
80-pin plastic TQFP (fine pitch) (12
12 mm)
96K
3,584
PD784038GC-
-3B9
80-pin plastic QFP (14
14
2.7 mm)
128K
4,352
PD784038GC-
-8BT
80-pin plastic QFP (14
14
1.4 mm)
128K
4,352
PD784038GK-
-BE9
80-pin plastic TQFP (fine pitch) (12
12 mm)
128K
4,352
Remark
is ROM code suffix.
3
PD784035, 784036, 784037, 784038
78K/IV SERIES PRODUCT DEVELOPMENT DIAGRAM
PD784026
PD784038Y
I
2
C bus supported
PD784038
Enhanced internal memory capacity,
pin compatible with the PD784026
PD784225Y
Multimaster I
2
C bus supported
PD784225
80 pins,
added ROM correction
PD784218Y
Multimaster I
2
C bus supported
Multimaster I
2
C bus supported
PD784218
Enhanced internal memory capacity,
added ROM correction
PD784928Y
Multimaster I
2
C bus supported
PD784928
Enhanced function of the PD784915
PD784216Y
PD784054
PD784216
PD784046
PD784908
Equipped with 10-bit A/D
100 pins,
enhanced I/O and
internal memory capacity
Enhanced A/D,
16-bit timer,
and power
management
PD784915
For software servo control,
equipped with analog circuit
for VCR,
enhanced timer
Equipped with IEBus
TM
controller
PD78F4943
For CD-ROM
Flash memory 56K bytes
Standard models
ASSP models
: Under mass production
: Under development
PD784955
For DC inverter control
PD784035, 784036, 784037, 784038
4
Note
Additional function pins are included in the I/O pins.
FUNCTIONS
PD784035
PD784036
PD784037
PD784038
113
8 bits
16 registers
8 banks, or 16 bits
8 registers
8 banks (memory mapping)
125 ns/250 ns/500 ns/1,000 ns (at 32 MHz)
48K bytes
64K bytes
96K bytes
128K bytes
2,048 bytes
3,584 bytes
4,352 bytes
Program and data: 1M byte
64
8
56
54
24
8
4 bits
2, or 8 bits
1
Timer/counter 0:
Timer register
1
Pulse output capability
(16 bits)
Capture register
1
Toggle output
Compare register
2
PWM/PPG output
One-shot pulse output
Timer/counter 1:
Timer register
1
Pulse output capability
(8/16 bits)
Capture register
1
Real-time output (4 bits
2)
Capture/compare register
1
Compare register
1
Timer/counter 2:
Timer register
1
Pulse output capability
(8/16 bits)
Capture register
1
Toggle output
Capture/compare register
1
PWM/PPG output
Compare register
1
Timer 3
:
Timer register
1
(8/16 bits)
Compare register
1
12-bit resolution
2 channels
UART/IOE (3-wire serial I/O)
: 2 channels (incorporating baud rate generator)
CSI (3-wire serial I/O, 2-wire serial I/O): 1 channel
8-bit resolution
8 channels
8-bit resolution
2 channels
Selected from f
CLK
, f
CLK
/2, f
CLK
/4, f
CLK
/8, or f
CLK
/16 (can be used as a 1-bit output port)
1 channel
HALT/STOP/IDLE mode
23 (16 internal, 7 external (sampling clock variable input: 1))
BRK instruction, BRKCS instruction, operand error
1 internal, 1 external
15 internal, 6 external
4-level programmable priority
3 operation statuses: vectored interrupt, macro service, context switching
V
DD
= 2.7 to 5.5 V
80-pin plastic QFP (14
14
2.7 mm)
80-pin plastic QFP (14
14
1.4 mm)
80-pin plastic TQFP (fine pitch) (12
12 mm)
Product
Item
Number of basic instructions
(mnemonics)
General-purpose register
Minimum instruction execution
time
Internal
memory
Memory space
I/O ports
Additional
function
pins
Note
Real-time output ports
Timer/counter
PWM outputs
Serial interface
A/D converter
D/A converter
Clock output
Watchdog timer
Standby
Interrupt
Hardware source
Software source
Nonmaskable
Maskable
Supply voltage
Package
ROM
RAM
Total
Input
Input/output
Pins with pull-
up resistor
LED direct
drive outputs
Transistor
direct drive
5
PD784035, 784036, 784037, 784038
CONTENTS
1.
DIFFERENCES BETWEEN
PD784038 SUB-SERIES ...........................................................
7
2.
MAIN DIFFERENCES BETWEEN
PD784038,
PD784038Y,
PD784026,
AND
PD78234 SUB-SERIES ...................................................................................................
8
3.
PIN CONFIGURATION (TOP VIEW) .........................................................................................
9
4.
SYSTEM CONFIGURATION EXAMPLE (PPC) ........................................................................
11
5.
BLOCK DIAGRAM .....................................................................................................................
12
6.
PIN FUNCTIONS ........................................................................................................................
13
6.1
Port Pins .........................................................................................................................................
13
6.2
Non-Port Pins .................................................................................................................................
15
6.3
I/O Circuits for Pins and Handling of Unused Pins ..................................................................
17
7.
CPU ARCHITECTURE ...............................................................................................................
20
7.1
Memory Space ................................................................................................................................
20
7.2
CPU Registers ................................................................................................................................
25
7.2.1
General-purpose registers ............................................................................................
25
7.2.2
Control registers ............................................................................................................
26
7.2.3
Special function registers (SFRs) ...............................................................................
27
8.
PERIPHERAL HARDWARE FUNCTIONS ................................................................................
32
8.1
Ports ................................................................................................................................................
32
8.2
Clock Generator .............................................................................................................................
33
8.3
Real-Time Output Port ..................................................................................................................
35
8.4
Timers/Counters ............................................................................................................................
36
8.5
PWM Output (PWM0, PWM1) ........................................................................................................
38
8.6
A/D Converter .................................................................................................................................
39
8.7
D/A Converter .................................................................................................................................
40
8.8
Serial Interface ...............................................................................................................................
41
8.8.1
Asynchronous serial interface/three-wire serial I/O (UART/IOE) ............................
42
8.8.2
Synchronous serial interface (CSI) .............................................................................
44
8.9
Clock Output Function ..................................................................................................................
45
8.10
Edge Detection Function ..............................................................................................................
46
8.11
Watchdog Timer .............................................................................................................................
46
9.
INTERRUPT FUNCTION ............................................................................................................
47
9.1
Interrupt Source .............................................................................................................................
47
9.2
Vectored Interrupt ..........................................................................................................................
49
9.3
Context Switching .........................................................................................................................
50
9.4
Macro Service .................................................................................................................................
50
9.5
Examples of Macro Service Applications ..................................................................................
51
PD784035, 784036, 784037, 784038
6
10. LOCAL BUS INTERFACE .........................................................................................................
53
10.1
Memory Expansion ........................................................................................................................
53
10.2
Memory Space ................................................................................................................................
54
10.3
Programmable Wait .......................................................................................................................
55
10.4
Pseudo-Static RAM Refresh Function ........................................................................................
55
10.5
Bus Hold Function .........................................................................................................................
55
11. STANDBY FUNCTION ...............................................................................................................
56
12. RESET FUNCTION .....................................................................................................................
57
13. INSTRUCTION SET ....................................................................................................................
58
14. ELECTRICAL CHARACTERISTICS .........................................................................................
63
15. PACKAGE DRAWINGS .............................................................................................................
84
16. RECOMMENDED SOLDERING CONDITIONS ........................................................................
87
APPENDIX A DEVELOPMENT TOOLS ..........................................................................................
89
APPENDIX B RELATED DOCUMENTS .........................................................................................
92
7
PD784035, 784036, 784037, 784038
1. DIFFERENCES BETWEEN
PD784038 SUB-SERIES
The only difference between the
PD784035,
PD784036,
PD784037, and
PD784038 is their capacity of
internal memory.
The
PD78P4038 is produced by replacing the masked ROM in the
PD784035,
PD784036,
PD784037, or
PD784038 with 128K-byte one-time PROM or EPROM. Table 1-1 shows the differences between these products.
Table 1-1. Differences between the
PD784038 Sub-Series
Product
Item
Internal ROM
Internal RAM
Package
PD784036
64K bytes
(masked ROM)
PD784038
128K bytes
(masked ROM)
4,352 bytes
PD78P4038
128K bytes
(one-time PROM
or EPROM)
80-pin ceramic
WQFN
(14
14mm)
80-pin plastic QFP (14
14
2.7 mm)
80-pin plastic QFP (14
14
1.4 mm)
80-pin plastic TQFP (fine pitch) (12
12 mm)
2,048 bytes
PD784035
48K bytes
(masked ROM)
PD784037
96K bytes
(masked ROM)
3,584 bytes
PD784031
Unavailable
PD784035, 784036, 784037, 784038
8
Series
PD784038 sub-series
PD784026 sub-series
PD78234 sub-series
Item
PD784038Y sub-series
Number of basic instructions
113
65
(mnemonics)
Minimum instruction execution
125 ns
160 ns
333 ns
time
(at 32 MHz)
(at 25 MHz)
(at 12 MHz)
Memory space (program/data)
1M byte in total
64K bytes/1M byte
Timer/counter
16-bit timer/counter
1
16-bit timer/counter
1
8/16-bit timer/counter
2
8-bit timer/counter
2
8/16-bit timer
1
8-bit timer
1
Clock output function
Available
Unavailable
Watchdog timer
Available
Unavailable
Serial interface
UART/IOE (3-wire serial I/O)
UART/IOE (3-wire serial I/O)
UART
1 channel
2 channels
2 channels
CSI (3-wire serial I/O, SBI)
CSI (3-wire serial I/O, 2-wire
CSI (3-wire serial I/O, SBI)
1 channel
serial I/O, I
2
C bus
Note
)
1 channel
1 channel
Interrupt
Context switching
Available
Unavailable
Priority
4 levels
2 levels
Standby function
3 modes (HALT, STOP, IDLE)
2 modes (HALT, STOP)
Operation clock switching
Selectable from f
XX
/2, f
XX
/4, f
XX
/8, or f
XX
/16
Fixed to f
XX
/2
Pin
MODE pin
Unavailable
To specify ROM-less mode
functions
(always in the high level for
the
PD78233 or
PD78237)
TEST pin
Pin for testing the device
Unavailable
Low level during ordinary use
Package
80-pin plastic QFP
80-pin plastic QFP
80-pin plastic QFP
(14
14
2.7 mm)
(14
14
2.7 mm)
(14
14
2.7 mm)
80-pin plastic QFP
80-pin plastic TQFP
94-pin plastic QFP
(14
14
1.4 mm)
(fine pitch) (12
12 mm):
(20
20 mm)
80-pin plastic TQFP
for the
PD784021 only
84-pin plastic QFJ
(fine pitch) (12
12 mm)
80-pin ceramic WQFN
(1,150
1,150 mil)
80-pin ceramic WQFN
(14
14 mm):
94-pin ceramic WQFN
(14
14 mm):
for the
PD78P4026 only
(20
20 mm):
for the
PD78P4038 and
for the
PD78P238 only
PD78P4038Y only
2. MAIN DIFFERENCES BETWEEN
PD784038,
PD784038Y,
PD784026, AND
PD78234 SUB-
SERIES
Note
For the
PD784038Y sub-series only.
9
PD784035, 784036, 784037, 784038
3. PIN CONFIGURATION (TOP VIEW)
80-pin plastic QFP (14
14
2.7 mm)
PD784035GC-
-3B9,
PD784036GC-
-3B9,
PD784037GC-
-3B9,
PD784038GC-
-3B9
80-pin plastic QFP (14
14
1.4 mm)
PD784035GC-
-8BT,
PD784036GC-
-8BT,
PD784037GC-
-8BT,
PD784038GC-
-8BT
80-pin plastic TQFP (fine pitch) (12
12 mm)
PD784035GK-
-BE9,
PD784036GK-
-BE9,
PD784037GK-
-BE9,
PD784038GK-
-BE9
Note
Connect the TEST pin to the V
SS0
pin directly.
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40
80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61
P74/ANI4
P73/ANI3
P72/ANI2
P71/ANI1
P70/ANI0
V
DD0
P17
P16
P15
P14/T
X
D2/SO2
P13/R
X
D2/SI2
P12/ASCK2/SCK2
P11/PWM1
P10/PWM0
TEST
Note
V
SS0
ASTB/CLKOUT
P40/AD0
P41/AD1
P42/AD2
P32/SCK0/SCL
P33/SO0/SDA
P34/ TO0
P35/ TO1
P36/ TO2
P37/ TO3
RESET
V
DD1
X2
X1
V
SS1
P00
P01
P02
P03
P04
P05
P06
P07
P67/REFRQ/HLDAK
P66/
WAIT/HLDRQ
P65/
WR
P64
/RD
P63/A19
P62
/A18
P61/A17
P60/A16
P57/A15
P56/A14
P55/A13
P54
/A12
P53/A11
P52
/A10
P51/A9
P50/A8
P47/AD7
P46/AD6
P45/AD5
P44
/AD4
P43/AD3
P31/
TxD/SO1
P30/RxD/SI1
P27/SI0
P26/INTP5
P25/INTP4
/ASCK/SCK1
P24
/INTP3
P23/INTP2
/CI
P22
/INTP1
P21/INTP0
P20/NMI
AV
REF3
AV
REF2
ANO1
ANO0
AV
SS
AV
REF1
AV
DD
P77/ANI7
P76/ANI6
P75/ANI5
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
PD784035, 784036, 784037, 784038
10
P60-P67
: Port 6
P70-P77
: Port 7
PWM0, PWM1 : Pulse width modulation output
RD
: Read strobe
REFRQ
: Refresh request
RESET
: Reset
RxD, RxD2
: Receive data
SCK0-SCK2
: Serial clock
SCL
: Serial clock
SDA
: Serial data
SI0-SI2
: Serial input
SO0-SO2
: Serial output
TEST
: Test
TO0-TO3
: Timer output
TxD, TxD2
: Transmit data
V
DD0
, V
DD1
: Power supply
V
SS0
, V
SS1
: Ground
WAIT
: Wait
WR
: Write strobe
X1, X2
: Crystal
A8-A19
: Address bus
AD0-AD7
: Address/data bus
ANI0-ANI7
: Analog input
ANO0, ANO1
: Analog output
ASCK, ASCK2 : Asynchronous serial clock
ASTB
: Address strobe
AV
DD
: Analog power supply
AV
REF1
-AV
REF3
: Reference voltage
AV
SS
: Analog ground
CI
: Clock input
CLKOUT
: Clock output
HLDAK
: Hold acknowledge
HLDRQ
: Hold request
INTP0-INTP5
: Interrupt from peripherals
NMI
: Non-maskable interrupt
P00-P07
: Port 0
P10-P17
: Port 1
P20-P27
: Port 2
P30-P37
: Port 3
P40-P47
: Port 4
P50-P57
: Port 5
11
PD784035, 784036, 784037, 784038
4. SYSTEM CONFIGURATION EXAMPLE (PPC)
Sensing paper presence
P11
Sensing paper feed
P15
Sensing paper ejection
P16
Sensing the position of the scanner station
P17
SCK1
Operator panel
P04
High voltage
control circuit
P07
Fusing heater
control circuit
P66
Lamp regulator
Charging the drum to attract
the toner on it
Fusing roller
Lamp for lighting the original
Lamp for discharging
SI1
SO1
PWM0
Driver
Main motor
P00-P03
P33
P34
P35
P36
P37
P06
SL
Clutch for stopping
the scanner station
SL
Clutch for forward-
ing the scanner
station
SL
Clutch for the
resist shutter
SL
Clutch for manual
feeding
SL
Clutch for cassette
feeding
(DC stepping motor)
RxD
TxD
INTP0
ANI0
Serial communi-
cation
Sensing paper
transport
Temperature
of the fusing
heater
ANI1
Brightness of
the lamp
ANI2
Lever for ad-
justing the
tone of the
copy
RESET
Reset circuit
ANI3
Lever for com-
pensating the
tone of the
copy
M
Solenoid
PD784038
PD784035, 784036, 784037, 784038
12
5. BLOCK DIAGRAM
Remark The internal ROM or RAM capacity differs for each product.
NMI
INTP3
TO0
TO1
INTP0
INTP1
INTP2/CI
TO2
TO3
P00-P03
P04-P07
PWM0
PWM1
ANO0
ANO1
AV
REF2
AV
REF3
INTP5
ANI0-ANI7
TxD/SO1
ASCK/SCK1
RxD/SI1
ASCK2/SCK2
SCK0/SCL
SO0/SDA
SI0
A8-A15
P00-P07
P20-P27
P10-P17
P30-P37
P40-P47
P50-P57
P60-P67
P70-P77
ASTB /CLKOUT
REFRQ/HLDAK
WR
WAIT/HLDRQ
AD0-AD7
RD
A16-A19
X1
X2
RESET
TEST
V
DD0
, V
DD1
V
SS0
, V
SS1
AV
DD
AV
REF1
AV
SS
UART/IOE2
Baud-rate
generator
UART/IOE1
Clocked serial
interface
Clock output
Bus interface
Port 0
Port 1
Port 2
Port 3
Port 4
Port 5
Port 6
Port 7
System control
Programmable
interrupt controller
Timer/counter 0
Timer/counter 1
Timer/counter 2
Timer 3
Real-time output
port
PWM
D /A converter
A /D converter
INTP0-INTP5
(16 bits)
(16 bits)
(16 bits)
(16 bits)
ROM
78K /IV
CPU core
Watchdog timer
Baud-rate
generator
TxD2/SO2
RxD2/SI2
RAM
13
PD784035, 784036, 784037, 784038
6. PIN FUNCTIONS
6.1 Port Pins (1/2)
Function
Port 0 (P0):
8-bit I/O port.
Functions as a real-time output port (4 bits
2).
Inputs and outputs can be specified bit by bit.
The use of the pull-up resistors can be specified by software for the pins
in the input mode together.
Can drive a transistor.
Port 1 (P1):
8-bit I/O port.
Inputs and outputs can be specified bit by bit.
The use of the pull-up resistors can be specified by software for the pins
in the input mode together.
Can drive LED.
Port 2 (P2):
8-bit input-only port.
P20 does not function as a general-purpose port (nonmaskable inter-
rupt). However, the input level can be checked by an interrupt service
routine.
The use of the pull-up resistors can be specified by software for pins
P22 to P27 (in units of 6 bits).
The P25/INTP4/ASCK/SCK1 pin functions as the SCK1 output pin by
CSIM1.
Port 3 (P3):
8-bit I/O port.
Inputs and outputs can be specified bit by bit.
The use of the pull-up resistors can be specified by software for the pins
in the input mode together.
Port 4 (P4):
8-bit I/O port.
Inputs and outputs can be specified bit by bit.
The use of the pull-up resistors can be specified by software for the pins
in the input mode together.
Can drive LED.
Port 5 (P5):
8-bit I/O port.
Inputs and outputs can be specified bit by bit.
The use of the pull-up resistors can be specified by software for the pins
in the input mode together.
Can drive LED.
I/O
I/O
I/O
Input
I/O
I/O
I/O
Pin
P00-P07
P10
P11
P12
P13
P14
P15-P17
P20
P21
P22
P23
P24
P25
P26
P27
P30
P31
P32
P33
P34-P37
P40-P47
P50-P57
Dual-function
-
PWM0
PWM1
ASCK2/SCK2
RxD2/SI2
TxD2/SO2
-
NMI
INTP0
INTP1
INTP2/CI
INTP3
INTP4/ASCK/SCK1
INTP5
SI0
RxD/SI1
TxD/SO1
SCK0/SCL
SO0/SDA
TO0-TO3
AD0-AD7
A8-A15
PD784035, 784036, 784037, 784038
14
6.1 Port Pins (2/2)
Pin
P60-P63
P64
P65
P66
P67
P70-P77
I/O
I/O
I/O
Dual-function
A16-A19
RD
WR
WAIT/HLDRQ
REFRQ/HLDAK
ANI0-ANI7
Function
Port 6 (P6):
8-bit I/O port.
Inputs and outputs can be specified bit by bit.
The use of the pull-up resistors can be specified by software for the pins
in the input mode together.
Port 7 (P7):
8-bit I/O port.
Inputs and outputs can be specified bit by bit.
15
PD784035, 784036, 784037, 784038
6.2 Non-Port Pins (1/2)
Pin
I/O
Dual-function
Function
TO0-TO3
Output
P34-P37
Timer output
CI
Input
P23/INTP2
Input of a count clock for timer/counter 2
R
X
D
Input
P30/SI1
Serial data input (UART0)
R
X
D2
P13/SI2
Serial data input (UART2)
T
X
D
Output
P31/SO1
Serial data output (UART0)
T
X
D2
P14/SO2
Serial data output (UART2)
ASCK
Input
P25/INTP4/SCK1
Baud rate clock input (UART0)
ASCK2
P12/SCK2
Baud rate clock input (UART2)
SDA
I/O
P33/SO0
Serial data I/O (2-wire serial I/O)
SI0
Input
P27
Serial data input (3-wire serial I/O0)
SI1
P30/R
X
D
Serial data input (3-wire serial I/O1)
SI2
P13/R
X
D2
Serial data input (3-wire serial I/O2)
SO0
Output
P33/SDA
Serial data output (3-wire serial I/O0)
SO1
P31/T
X
D
Serial data output (3-wire serial I/O1)
SO2
P14/T
X
D2
Serial data output (3-wire serial I/O2)
SCK0
I/O
P32/SCL
Serial clock I/O (3-wire serial I/O0)
SCK1
P25/INTP4/ASCK
Serial clock I/O (3-wire serial I/O1)
SCK2
P12/ASCK2
Serial clock I/O (3-wire serial I/O2)
SCL
P32/SCK0
Serial clock I/O (2-wire serial I/O)
NMI
Input
P20
External interrupt request
-
INTP0
P21
Input of a count clock for timer/counter 1
Capture/trigger signal for CR11 or CR12
INTP1
P22
Input of a count clock for timer/counter 2
Capture/trigger signal for CR22
INTP2
P23/CI
Input of a count clock for timer/counter 2
Capture/trigger signal for CR21
INTP3
P24
Input of a count clock for timer/counter 0
Capture/trigger signal for CR02
INTP4
P25/ASCK/SCK1
-
INTP5
P26
Input of a conversion start trigger for A/D converter
AD0-AD7
I/O
P40-P47
Time multiplexing address/data bus (for connecting external memory)
A8-A15
Output
P50-P57
High-order address bus (for connecting external memory)
A16-A19
Output
P60-P63
High-order address bus during address expansion (for connecting external memory)
RD
Output
P64
Strobe signal output for reading the contents of external memory
WR
Output
P65
Strobe signal output for writing on external memory
WAIT
Input
P66/HLDRQ
Wait signal insertion
REFRQ
Output
P67/HLDAK
Refresh pulse output to external pseudo static memory
HLDRQ
Input
P66/WAIT
Input of bus hold request
HLDAK
Output
P67/REFRQ
Output of bus hold response
ASTB
Output
CLKOUT
Latch timing output of time multiplexing address (A0-A7) (for
connecting external memory)
CLKOUT
Output
ASTB
Clock output
PD784035, 784036, 784037, 784038
16
6.2 Non-Port Pins (2/2)
Notes 1. The potential of the V
DD0
pin must be equal to that of the V
DD1
pin.
2. The potential of the V
SS0
pin must be equal to that of the V
SS1
pin.
Pin
I/O
Dual-function
Function
RESET
Input
-
Chip reset
X1
Input
-
Crystal input for system clock oscillation (A clock pulse can also be
X2
-
input to the X1 pin.)
ANI0-ANI7
Input
P70-P77
Analog voltage inputs for the A/D converter
ANO0, ANO1
Output
-
Analog voltage inputs for the D/A converter
AV
REF1
-
-
Application of A/D converter reference voltage
AV
REF2
, AV
REF3
Application of D/A converter reference voltage
AV
DD
Positive power supply for the A/D converter
AV
SS
Ground for the A/D converter
V
DD0
Note 1
Positive power supply of the port part
V
DD1
Note 1
Positive power supply except for the port part
V
SS0
Note 2
Ground of the port part
V
SS1
Note 2
Ground except for the port part
TEST
Directly connect to the V
SS
pin. (The TEST pin is for the IC test.)
17
PD784035, 784036, 784037, 784038
6.3 I/O Circuits for Pins and Handling of Unused Pins
Table 6-1 describes the types of I/O circuits for pins and the handling of unused pins.
Figure 6-1 shows the configuration of these various types of I/O circuits.
Table 6-1. Types of I/O Circuits for Pins and Handling of Unused Pins (1/2)
Pin
I/O circuit type
I/O
Recommended connection method for unused pins
P00-P07
5-H
I/O
Input state : Connect these pins to the V
DD0
pin.
P10/PWM0
Output state: Leave open.
P11/PWM1
P12/ASCK2/SCK2
8-C
P13/RxD2/SI2
5-H
P14/TxD2/SO2
P15-P17
P20/NMI
2
Input
Connect these pins to the V
DD0
or V
SS0
pin.
P21/INTP0
P22/INTP1
2-C
Connect these pins to the V
DD0
pin.
P23/INTP2/CI
P24/INTP3
P25/INTP4/ASCK/SCK1
8-C
I/O
Input state : Connect this pin to the V
DD0
pin.
Output state: Leave open.
P26/INTP5
2-C
Input
Connect these pins to the V
DD0
pin.
P27/SI0
P30/RxD/SI1
5-H
I/O
Input state : Connect these pins to the V
DD0
pin.
P31/TxD/SO1
Output state: Leave open.
P32/SCK0/SCL
10-B
P33/SO0/SDA
P34/TO0-P37/TO3
5-H
P40/AD0-P47/AD7
P50/A8-P57/A15
P60/A16-P63/A19
P64/RD
P65/WR
P66/WAIT/HLDRQ
P67/REFRQ/HLDAK
P70/ANI0-P77/ANI7
20-A
I/O
Input state : Connect this pin to the V
DD0
or V
SS0
pin.
Output state: Leave open.
ANO0, ANO1
12
Output
Leave open.
ASTB/CLKOUT
4-B
PD784035, 784036, 784037, 784038
18
Table 6-1. Types of I/O Circuits for Pins and Handling of Unused Pins (2/2)
Pin
I/O circuit type
I/O
Recommended connection method for unused pins
RESET
2
Input
-
TEST
1-A
Connect this pin to the V
SS0
pin directly.
AV
REF1
-AV
REF3
-
Connect these pins to the V
SS0
pin.
AV
SS
AV
DD
Connect this pin to the V
DD0
pin.
Caution When the I/O mode of an I/O dual-function pin is unpredictable, connect the pin to V
DD0
through
a resistor of 10 to 100 kilohms (particularly when the voltage of the reset input pin becomes higher
than that of the low-level input at power-on or when I/O is switched by software).
Remark Since type numbers are consistent in the 78K series, those numbers are not always serial in each product.
(Some circuits are not included.)
19
PD784035, 784036, 784037, 784038
Figure 6-1. I/O Circuits for Pins
Type 1-A
Type 2-C
Type 2
Type 4-B
Type 8-C
Type 10-B
Type 5-H
Type 12
Type 20-A
IN
V
DD0
V
SS0
P
N
IN
Schmitt trigger input with hysteresis characteristics
Data
V
DD0
V
SS0
P
N
OUT
Output
disable
Push-pull output which can output high impedance
(both the positive and negative channels are off.)
Data
V
DD0
V
SS0
P
N
IN/OUT
Output
disable
V
DD0
P
Pull-up
enable
Data
V
DD0
V
SS0
P
N
IN/OUT
Output
disable
V
DD0
P
Pull-up
enable
Open
drain
N
P
Analog output
voltage
OUT
Schmitt trigger input with hysteresis characteristics
IN
V
DD0
P
Pull-up
enable
Data
Comparator
V
DD0
AV
SS
V
SS0
AV
REF
P
(Threshold voltage)
P
N
N
IN/OUT
Output
disable
Input
enable
+
Data
V
DD0
V
SS0
P
N
IN/OUT
Output
disable
V
DD0
P
Pull-up
enable
Input
enable
PD784035, 784036, 784037, 784038
20
7. CPU ARCHITECTURE
7.1 Memory Space
A 1M-byte memory space can be accessed. By using a LOCATION instruction, the mode for mapping internal
data areas (special function registers and internal RAM) can be selected. A LOCATION instruction must always be
executed after a reset, and can be used only once.
(1) When the LOCATION 0 instruction is executed
Internal memory
The table below indicates the internal data areas and internal ROM areas of each product.
Caution The following internal ROM areas, existing at the same addresses as the internal data areas,
cannot be used when the LOCATION 0 instruction is executed:
External memory
External memory is accessed in external memory expansion mode.
(2) When the LOCATION 0FH instruction is executed
-
Internal memory
The table below lists the internal data areas and internal ROM areas for each product.
External memory
External memory is accessed in external memory expansion mode.
Product name
Unusable area
PD784035
-
PD784036
0F700H-0FFFFH (2,304 bytes)
PD784037
0F100H-0FFFFH (3,840 bytes)
PD784038
0EE00H-0FFFFH (4,608 bytes)
Product name
Internal data area
Internal ROM area
PD784035
0F700H-0FFFFH
00000H-0BFFFH
PD784036
00000H-0F6FFH
PD784037
0F100H-0FFFFH
00000H-0F0FFH
10000H-17FFFH
PD784038
0EE00H-0FFFFH
00000H-0FDFFH
10000H-1FFFFH
Product name
Internal data area
Internal ROM area
PD784035
FF700H-FFFFFH
00000H-0BFFFH
PD784036
00000H-0FFFFH
PD784037
0F100H-FFFFFH
00000H-17FFFH
PD784038
FEE00H-FFFFFH
00000H-1FFFFH
21
PD784035,
784036,
784037,
784038
Figure 7-1.
PD784035 Memory Map
Notes 1. Accessed in external memory expansion mode.
2. Base area, or entry area based on a reset or interrupt. Internal RAM is excluded in the case of a reset.
FFE FFH
FFE FFH
F F F F F H
F F F D F H
F F F D 0 H
F F F 0 0 H
FFE 8 0H
FFE 7FH
FF7 0 0H
FF6 FFH
1 00 0 0H
0FF FFH
0C0 0 0H
0BF FFH
0 00 0 0H
FFE 2FH
FFE 0 6H
FFD 0 0H
FFC FFH
FF7 0 0H
When the LOCATION 0
instruction is executed
External memory
(960K bytes)
Note 1
Special function registers (SFRs)
Note 1
(256 bytes)
Internal RAM
(2,048 bytes)
Note 2
External memory
(14,080 bytes)
Note 1
Internal ROM
(48K bytes)
0 F FFH
E
0 F 8 0H
E
0 F 7FH
E
0 F 0 0H
D
0 F FFH
C
0 1 0 0H
0
0 0 FFH
F
0 0 0 0H
8
0 0 FFH
7
0 0 8 0H
0
0 0 7FH
0
0 0 4 0H
0
0 0 3FH
0
0 0 0 0H
0
0 F 0 0H
7
0B FFH
F
0 F 2FH
E
0 F 0 6H
E
FF F F H
F
0 F F F H
F
1 0 0 0 H
0
0 F DF H
F
0 F D0 H
F
0 F 0 0 H
F
0 F F F H
E
0 F 0 0 H
7
0 F F F H
6
0C 0 0 H
0
0B F F H
F
0 0 0 0 H
0
Note 2
General-purpose
registers (128 bytes)
Macro service control
word area (42 bytes)
Data area (512 bytes)
Program/data area
(1,536 bytes)
Program/data area
(48K bytes)
CALLF entry area
(2K bytes)
CALLT table area
(64 bytes)
Vector table area
(64 bytes)
When the LOCATION
0FH instruction is executed
Special function registers (SFRs)
(256 bytes)
Note 1
Internal RAM
(2,048 bytes)
External memory
(997,120 bytes)
Note 1
Internal ROM
(48K bytes)
PD784035,
784036,
784037,
784038
22
Figure 7-2.
PD784036 Memory Map
Notes 1. Accessed in external memory expansion mode.
2. This 2,304-byte area can be used as an internal ROM area only when the LOCATION 0FH instruction is executed.
3. When the LOCATION 0 instruction is executed
: 63,232 bytes
When the LOCATION 0FH instruction is executed: 65,536 bytes
4. Base area, or entry area based on a reset or interrupt. Internal RAM is excluded in the case of a reset.
F FFF FH
0 FFF FH
0 FFDFH
0 FFD0 H
0 FF 0 0 H
0 FEF FH
1 0 0 0 0 H
0 F 7 0 0 H
0 F 6 F FH
0 0 0 0 0 H
0 FEF FH
0 FE8 0 H
0 FE7 FH
0 FE2 FH
0 FE0 6 H
0 FD0 0 H
0 FCF FH
0 F 7 0 0 H
0 F 6 F FH
0 1 0 0 0 H
0 0 FF FH
0 0 8 0 0 H
0 0 7 F FH
0 0 0 8 0 H
0 0 0 7 FH
0 0 0 4 0 H
0 0 0 3 FH
0 0 0 0 0 H
F FEF FH
F FE8 0 H
F FE7 FH
F FE2 FH
F FE0 6 H
F FD0 0 H
F FCF FH
F F 7 0 0 H
0 FFF FH
1 0 0 0 0 H
0 FFF FH
0 0 0 0 0 H
F F 6 F FH
F F 7 0 0 H
F FEF FH
F F F 0 0 H
F F F D 0 H
F F F D F H
F F F F F H
When the LOCATION 0
instruction is executed
External memory
(960K bytes)
Note 1
Special function registers (SFRs)
Note 1
(256 bytes)
Internal RAM
(2,048 bytes)
Note 4
Internal ROM
(63,232 bytes)
General-purpose
registers (128 bytes)
Macro service control
word area (42 bytes)
Data area (512 bytes)
Program/data area
(1,536 bytes)
Program/data area
Note 3
Note 2
CALLF entry
area (2K bytes)
CALLT table area
(64 bytes)
Vector table area
(64 bytes)
Internal ROM
(64K bytes)
Note 4
External memory
(980,736 bytes)
Note 1
When the LOCATION 0FH
instruction is executed
Special function registers (SFRs)
(256 bytes)
Internal RAM
(2,048 bytes)
Note 1
23
PD784035,
784036,
784037,
784038
Figure 7-3.
PD784037 Memory Map
Notes 1. Accessed in external memory expansion mode.
2. This 3,840-byte area can be used as an internal ROM area only when the LOCATION 0FH instruction is executed.
3. When the LOCATION 0 instruction is executed
: 94,464 bytes
When the LOCATION 0FH instruction is executed: 98,304 bytes
4. Base area, or entry area based on a reset or interrupt. Internal RAM is excluded in the case of a reset.
F FF F FH
1 8 0 0 0H
1 7 F F FH
0 FF F FH
0 FFDFH
0 FFD0H
0 FF 0 0H
1 0 0 0 0H
0 FEF FH
0 F 1 0 0H
0 F 0 F FH
0 0 0 0 0H
0 FEF FH
0 FE 8 0H
0 FE 7 FH
0 FE 2 FH
0 FE 0 6H
0 FD0 0H
0 FCF FH
0 F 1 0 0H
1 7 F F F H
1 0 0 0 0 H
0 F 0 F FH
0 1 0 0 0H
0 0 F F FH
0 0 8 0 0H
0 0 7 F FH
0 0 0 8 0H
0 0 0 7 FH
0 0 0 4 0H
0 0 0 3 FH
0 0 0 0 0H
F FEF FH
F FE 8 0H
F FE 7 FH
F FE 2 FH
F FE 0 6H
F FD0 0H
F FCF FH
F F 1 0 0H
F F 1 0 0H
F F 0 F FH
1 8 0 0 0H
1 7 F F FH
0 0 0 0 0H
F FEF FH
F F F D F H
F F F D 0 H
F F F 0 0 H
F F F F F H
1 7 F F FH
When the LOCATION 0
instruction is executed
External memory
(928K bytes)
Note 1
Internal ROM
(32,768 bytes)
Special function registers (SFRs)
Note 1
(256 bytes)
Internal RAM
(3,584 bytes)
Internal ROM
(61,696 bytes)
Note 4
General-purpose
registers (128 bytes)
Macro service control
word area (42 bytes)
Data area (512 bytes)
Program/data area
(3,072 bytes)
Program/data area
Note 3
Note 2
CALLF entry area
(2K bytes)
CALLT table area
(64 bytes)
Vector table area
(64 bytes)
When the LOCATION 0FH
instruction is executed
Internal RAM
(3,584 bytes)
External memory
(946,432 bytes)
Note 1
Internal ROM
(96K bytes)
Note 4
Special function registers (SFRs)
(256 bytes)
Note 1
PD784035,
784036,
784037,
784038
24
Figure 7-4.
PD784038 Memory Map
Notes 1. Accessed in external memory expansion mode.
2. This 4,608-byte area can be used as an internal ROM area only when the LOCATION 0FH instruction is executed.
3. When the LOCATION 0 instruction is executed
: 126,464 bytes
When the LOCATION 0FH instruction is executed: 131,072 bytes
4. Base area, or entry area based on a reset or interrupt. Internal RAM is excluded in the case of a reset.
FF F F FH
2 0 0 0 0H
0F F F FH
1F F F FH
0F FDFH
0F FD0H
0F F 0 0H
0FEF FH
1 0 0 0 0H
0EE 0 0H
0EDF FH
0 0 0 0 0H
0FEF FH
0FE 8 0H
0FE 7 FH
0FE 2 FH
0FE 0 6H
0FD0 0H
0FCF FH
0EE 0 0H
1 F F F F H
1 0 0 0 0 H
0EDF FH
0 0 8 0 0H
0 0 7 F FH
0 1 0 0 0H
0 0 F F FH
0 0 0 8 0H
0 0 0 7 FH
0 0 0 4 0H
0 0 0 3 FH
0 0 0 0 0H
FFEF FH
FFE 8 0H
FFE 7 FH
FFE 2 FH
FFE 0 6H
FFD0 0H
FFCF FH
FEE 0 0H
FEE 0 0H
FEDF FH
FFEF FH
F F F 0 0 H
F F F D 0 H
F F F D F H
F F F F F H
2 0 0 0 0H
1F F F FH
1F F F FH
0 0 0 0 0H
When the LOCATION 0
instruction is executed
External memory
(896K bytes)
Note 1
Internal ROM
(65,536 bytes)
Special function registers (SFRs)
Note 1
(256 bytes)
Internal RAM
(4,352 bytes)
Note 4
Internal ROM
(60,928 bytes)
General-purpose
registers (128 bytes)
Macro service control
word area (42 bytes)
Data area (512 bytes)
Program/data area
(3,840 bytes)
Note 2
Program/data area
Note 3
CALLF entry area
(2K bytes)
CALLT table area
(64 bytes)
Vector table area
(64 bytes)
When the LOCATION 0FH
instruction is executed
Special function registers (SFRs)
Note 4
Internal ROM
(128K bytes)
External memory
(912,896 bytes)
Note 1
Internal RAM
(4,352 bytes)
Note 1
(256 bytes)
25
PD784035, 784036, 784037, 784038
7.2 CPU Registers
7.2.1 General-purpose registers
A set of general-purpose registers consists of sixteen general-purpose 8-bit registers. Two 8-bit general-purpose
registers can be combined to form a 16-bit general-purpose register. Moreover, four 16-bit general-purpose registers,
when combined with an 8-bit register for address extension, can be used as 24-bit address specification registers.
Eight banks of this register set are provided. The user can switch between banks by software or the context
switching function.
General-purpose registers other than the V, U, T, and W registers used for address extension are mapped onto
internal RAM.
Figure 7-5. General-Purpose Register Format
Caution By setting the RSS bit of PSW to 1, R4, R5, R6, R7, RP2, and RP3 can be used as the X, A, C, B,
AX, and BC registers, respectively. However, this function must be used only when using
programs for the 78K/III series.
A (R1)
X (R0)
B (R3)
C (R2)
R5
R4
R7
R6
R9
R8
R11
R10
D (R13)
E (R12)
H (R15)
V
U
T
W
L (R14)
AX (RP0)
BC (RP1)
RP2
RP3
VP (RP4)
UP (RP5)
DE (RP6)
HL (RP7)
VVP (RG4)
UUP (RG5)
TDE (RG6)
WHL (RG7)
The character strings enclosed in
parentheses represent absolute names.
8 banks
PD784035, 784036, 784037, 784038
26
7.2.2 Control registers
(1) Program counter (PC)
This register is a 20-bit program counter. The program counter is automatically updated by program execution.
Figure 7-6. Format of Program Counter (PC)
(2) Program Status Word (PSW)
This register holds the CPU state. The program status word is automatically updated by program execution.
Figure 7-7. Format of Program Status Word (PSW)
Note
This flag is used to maintain compatibility with the 78K/III series. This flag must be set to 0 when programs
for the 78K/III series are being used.
(3) Stack pointer (SP)
This register is a 24-bit pointer for holding the start address of the stack. The high-order 4 bits must be set
to 0.
Figure 7-8. Format of Stack Pointer (SP)
PSWH
PSWL
PSW
15
14
13
12
UF
RBS2
RBS1
RBS0
11
10
9
8
7
6
5
4
3
2
1
0
S
Z
RSS
Note
AC
IE
P/V
0
CY
19
0
PC
23
20
0
SP
0
0
0
0
27
PD784035, 784036, 784037, 784038
7.2.3 Special function registers (SFRs)
The special function registers are registers with special functions such as mode registers and control registers
for built-in peripheral hardware. The special function registers are mapped onto the 256-byte space between 0FF00H
and 0FFFFH
Note
.
Note
Applicable when the LOCATION 0 instruction is executed. FFF00H-FFFFFH when the LOCATION 0FH
instruction is executed.
Caution Never attempt to access addresses in this area where no SFR is allocated. Otherwise, the
PD784038 may be placed in the deadlock state. The deadlock state can be cleared only by a
reset.
Table 7-1 lists the special function registers (SFRs). The titles of the table columns are explained below.
Abbreviation ................... Symbol used to represent a built-in SFR. The abbreviations listed in the table are
reserved words for the NEC assembler (RA78K4). The C compiler (CC78K4) allows
the abbreviations to be used as sfr variables with the #pragma sfr command.
R/W ................................. Indicates whether each SFR allows read and/or write operations.
R/W : Allows both read and write operations.
R
: Allows read operations only.
W
: Allows write operations only.
Manipulatable bits .......... Indicates the maximum number of bits that can be manipulated whenever an SFR is
manipulated. An SFR that supports 16-bit manipulation can be described in the sfrp
operand. For address specification, an even-numbered address must be speci-
fied.
An SFR that supports 1-bit manipulation can be described in a bit manipulation
instruction.
When reset ..................... Indicates the state of each register when RESET is applied.
PD784035, 784036, 784037, 784038
28
Table 7-1. Special Function Registers (SFRs) (1/4)
Address
Note
Special function register (SFR) name
Abbreviation
R/W
Manipulatable bits
When reset
1 bit
8 bits 16 bits
0FF00H
Port 0
P0
R/W
-
Undefined
0FF01H
Port 1
P1
-
0FF02H
Port 2
P2
R
-
0FF03H
Port 3
P3
R/W
-
0FF04H
Port 4
P4
-
0FF05H
Port 5
P5
-
0FF06H
Port 6
P6
-
00H
0FF07H
Port 7
P7
-
Undefined
0FF0EH
Port 0 buffer register L P0L
-
0FF0FH
Port 0 buffer register H
P0H
-
0FF10H
Compare register (timer/counter 0)
CR00
-
-
0FF12H
Capture/compare register (timer/counter 0)
CR01
-
-
0FF14H
Compare register L (timer/counter 1)
CR10 CR10W
-
0FF15H
Compare register H (timer/counter 1)
-
-
-
0FF16H
Capture/compare register L (timer/counter 1)
CR11 CR11W
-
0FF17H
Capture/compare register H (timer/counter 1)
-
-
-
0FF18H
Compare register L (timer/counter 2)
CR20 CR20W
-
0FF19H
Compare register H (timer/counter 2)
-
-
-
0FF1AH
Capture/compare register L (timer/counter 2)
CR21 CR21W
-
0FF1BH
Capture/compare register H (timer/counter 2)
-
-
-
0FF1CH
Compare register L (timer 3)
CR30 CR30W
-
0FF1DH
Compare register H (timer 3)
-
-
-
0FF20H
Port 0 mode register
PM0
-
FFH
0FF21H
Port 1 mode register
PM1
-
0FF23H
Port 3 mode register
PM3
-
0FF24H
Port 4 mode register
PM4
-
0FF25H
Port 5 mode register
PM5
-
0FF26H
Port 6 mode register
PM6
-
0FF27H
Port 7 mode register
PM7
-
0FF2EH
Real-time output port control register
RTPC
-
00H
0FF30H
Capture/compare control register 0
CRC0
-
-
10H
0FF31H
Timer output control register
TOC
-
00H
0FF32H
Capture/compare control register 1
CRC1
-
-
0FF33H
Capture/compare control register 2
CRC2
-
-
10H
Note
Applicable when the LOCATION 0 instruction is executed. When the LOCATION 0FH instruction is
executed, F0000H is added to each address.
29
PD784035, 784036, 784037, 784038
Table 7-1. Special Function Registers (SFRs) (2/4)
Note
Applicable when the LOCATION 0 instruction is executed. When the LOCATION 0FH instruction is
executed, F0000H is added to each address.
Address
Note
Special function register (SFR) name
Abbreviation
R/W
Manipulatable bits
When reset
1 bit
8 bits 16 bits
0FF36H
Capture register (timer/counter 0)
CR02
R
-
-
0000H
0FF38H
Capture register L (timer/counter 1)
CR12 CR12W
-
0FF39H
Capture register H (timer/counter 1)
-
-
-
0FF3AH
Capture register L (timer/counter 2)
CR22 CR22W
-
0FF3BH
Capture register H (timer/counter 2)
-
-
-
0FF41H
Port 1 mode control register
PMC1
R/W
-
00H
0FF43H
Port 3 mode control register
PMC3
-
0FF4EH
Register for optional pull-up resistor
PUO
-
0FF50H
Timer register 0
TM0
R
-
-
0000H
0FF51H
-
-
0FF52H
Timer register 1
TM1
TM1W
-
0FF53H
-
-
-
0FF54H
Timer register 2
TM2
TM2W
-
0FF55H
-
-
-
0FF56H
Timer register 3
TM3
TM3W
-
0FF57H
-
-
-
0FF5CH
Prescaler mode register 0
PRM0
R/W
-
-
11H
0FF5DH
Timer control register 0
TMC0
-
00H
0FF5EH
Prescaler mode register 1
PRM1
-
-
11H
0FF5FH
Timer control register 1
TMC1
-
00H
0FF60H
D/A conversion value setting register 0
DACS0
-
-
0FF61H
D/A conversion value setting register 1
DACS1
-
-
0FF62H
D/A converter mode register
DAM
-
03H
0FF68H
A/D converter mode register
ADM
-
00H
0FF6AH
A/D conversion result register
ADCR
R
-
-
Undefined
0FF70H
PWM control register
PWMC
R/W
-
05H
0FF71H
PWM prescaler register
PWPR
-
-
00H
0FF72H
PWM modulo register 0
PWM0
-
-
Undefined
0FF74H
PWM modulo register 1
PWM1
-
-
0FF7DH
One-shot pulse output control register
OSPC
-
00H
0FF80H
I
2
C bus control register
IICC
-
0FF81H
Prescaler mode register for serial clock
SPRM
-
-
04H
0FF82H
Synchronous serial interface mode register
CSIM
-
00H
PD784035, 784036, 784037, 784038
30
Address
Note 1
Special function register (SFR) name
Abbreviation
R/W
Manipulatable bits
When reset
1 bit
8 bits 16 bits
0FF84H
Synchronous serial interface mode register 1
CSIM1
R/W
-
00H
0FF85H
Synchronous serial interface mode register 2
CSIM2
-
0FF86H
Serial shift register
SIO
-
-
0FF88H
Asynchronous serial interface mode register
ASIM
-
0FF89H
Asynchronous serial interface mode register 2
ASIM2
-
0FF8AH
Asynchronous serial interface status register
ASIS
R
-
0FF8BH
Asynchronous serial interface status register 2
ASIS2
-
0FF8CH
Serial receive buffer: UART0
RXB
-
-
Undefined
Serial transmission shift register: UART0
TXS
W
-
-
Serial shift register: IOE1
SIO1
R/W
-
-
0FF8DH
Serial receive buffer: UART2
RXB2
R
-
-
Serial transmission shift register: UART2
TXS2
W
-
-
Serial shift register: IOE2
SIO2
R/W
-
-
0FF90H
Baud rate generator control register
BRGC
-
-
00H
0FF91H
Baud rate generator control register 2
BRGC2
-
-
0FFA0H
External interrupt mode register 0
INTM0
-
0FFA1H
External interrupt mode register 1
INTM1
-
0FFA4H
Sampling clock selection register
SCS0
-
-
0FFA8H
In-service priority register
ISPR
R
-
0FFAAH
Interrupt mode control register
IMC
R/W
-
80H
0FFACH
Interrupt mask register 0L
MK0L MK0
FFFFH
0FFADH
Interrupt mask register 0H
MK0H
0FFAEH
Interrupt mask register 1L
MK1L
-
FFH
0FFC0H
Standby control register
STBC
-
Note 2
-
30H
0FFC2H
Watchdog timer mode register
WDM
-
Note 2
-
00H
0FFC4H
Memory expansion mode register
MM
-
20H
0FFC5H
Hold mode register
HLDM
-
00H
0FFC6H
Clock output mode register
CLOM
-
0FFC7H
Programmable wait control register 1
PWC1
-
-
AAH
0FFC8H
Programmable wait control register 2
PWC2
-
-
AAAAH
Table 7-1. Special Function Registers (SFRs) (3/4)
Notes 1. Applicable when the LOCATION 0 instruction is executed. When the LOCATION 0FH instruction is
executed, F0000H is added to each address.
2. A write operation can be performed only with special instructions MOV STBC,#byte and MOV
WDM,#byte. Other instructions cannot perform a write operation.
31
PD784035, 784036, 784037, 784038
Table 7-1. Special Function Registers (SFRs) (4/4)
Note
Applicable when the LOCATION 0 instruction is executed. When the LOCATION 0FH instruction is
executed, F0000H is added to each address.
Address
Note
Special function register (SFR) name
Abbreviation
R/W
Manipulatable bits
When reset
1 bit
8 bits 16 bits
0FFCCH
Refresh mode register
RFM
R/W
-
00H
0FFCDH
Refresh area specification register
RFA
-
0FFCFH
Oscillation settling time specification register
OSTS
-
-
0FFD0H-
External SFR area
-
-
-
0FFDFH
0FFE0H
Interrupt control register (INTP0)
PIC0
-
43H
0FFE1H
Interrupt control register (INTP1)
PIC1
-
0FFE2H
Interrupt control register (INTP2)
PIC2
-
0FFE3H
Interrupt control register (INTP3)
PIC3
-
0FFE4H
Interrupt control register (INTC00)
CIC00
-
0FFE5H
Interrupt control register (INTC01)
CIC01
-
0FFE6H
Interrupt control register (INTC10)
CIC10
-
0FFE7H
Interrupt control register (INTC11)
CIC11
-
0FFE8H
Interrupt control register (INTC20)
CIC20
-
0FFE9H
Interrupt control register (INTC21)
CIC21
-
0FFEAH
Interrupt control register (INTC30)
CIC30
-
0FFEBH
Interrupt control register (INTP4)
PIC4
-
0FFECH
Interrupt control register (INTP5)
PIC5
-
0FFEDH
Interrupt control register (INTAD)
ADIC
-
0FFEEH
Interrupt control register (INTSER)
SERIC
-
0FFEFH
Interrupt control register (INTSR)
SRIC
-
Interrupt control register (INTCSI1)
CSIIC1
-
0FFF0H
Interrupt control register (INTST)
STIC
-
0FFF1H
Interrupt control register (INTCSI)
CSIIC
-
0FFF2H
Interrupt control register (INTSER2)
SERIC2
-
0FFF3H
Interrupt control register (INTSR2)
SRIC2
-
Interrupt control register (INTCSI2)
CSIIC2
-
0FFF4H
Interrupt control register (INTST2)
STIC2
-
PD784035, 784036, 784037, 784038
32
8. PERIPHERAL HARDWARE FUNCTIONS
8.1 Ports
The ports shown in Figure 8-1 are provided to enable the application of wide-ranging control. Table 8-1 lists the
functions of the ports. For the inputs to port 0 to port 6, a built-in pull-up resistor can be specified by software.
Figure 8-1. Port Configuration
Port 0
P00
P07
8
Port 4
P40
P47
Port 1
P10
P17
Port 2
P20-P27
Port 3
P30
P37
Port 5
P50
P57
Port 6
P60
P67
Port 7
P70
P77
33
PD784035, 784036, 784037, 784038
Table 8-1. Port Functions
8.2 Clock Generator
A circuit for generating the clock signal required for operation is provided. The clock generator includes a frequency
divider; low current consumption can be achieved by operating at a lower internal frequency when high-speed
operation is not necessary.
Figure 8-2. Block Diagram of Clock Generator
Remark f
XX
: Oscillator frequency or external clock input frequency
f
CLK
: Internal operating frequency
Port name
Pin
Function
Pull-up specification by software
Port 0
P00-P07
Bit-by-bit input/output setting supported
Specified as a batch for all pins placed in
Operable as 4-bit real-time outputs
input mode.
(P00-P03, P04-P07)
Capable of driving transistors
Port 1
P10-P17
Bit-by-bit input/output setting supported
Specified as a batch for all pins placed in
Capable of driving LEDs
input mode.
Port 2
P20-P27
Input port
Specified for the 6 bits (P22-P27) as a batch.
Port 3
P30-P37
Bit-by-bit input/output setting supported
Specified as a batch for all pins placed in
input mode.
Port 4
P40-P47
Bit-by-bit input/output setting supported
Specified as a batch for all pins placed in
Capable of driving LEDs
input mode.
Port 5
P50-P57
Bit-by-bit input/output setting supported
Specified as a batch for all pins placed in
Capable of driving LEDs
input mode.
Port 6
P60-P67
Bit-by-bit input/output setting supported
Specified as a batch for all pins placed in
input mode.
Port 7
P70-P77
Bit-by-bit input/output setting supported
-
X1
X2
f
XX
/2
f
XX
f
CLK
CPU
Peripheral circuits
Oscillator
UART/IOE
INTP0 noise eliminator
Oscillation settling timer
Selector
1/2
1/2
1/2
1/2
PD784035, 784036, 784037, 784038
34
Figure 8-3. Examples of Using Oscillator
(1) Crystal/ceramic oscillation
(2) External clock
When EXTC bit of OSTS = 1
When EXTC bit of OSTS = 0
Caution When using the system clock generator, run wires in the portion surrounded by broken lines
according to the following rules to avoid effects such as stray capacitance:
Minimize the wiring.
Never cause the wires to cross other signal lines.
Never cause the wires to run near a line carrying a large varying current.
Cause the grounding point of the capacitor of the oscillator circuit to have the same potential
as V
SS1
. Never connect the capacitor to a ground pattern carrying a large current.
Never extract a signal from the oscillator.
V
SS1
X1
X2
PD784038
PD784038
X1
X2
PD74HC04, etc.
X1
X2
Open
PD784038
35
PD784035, 784036, 784037, 784038
8.3 Real-Time Output Port
The real-time output port outputs data stored in the buffer, synchronized with a timer/counter 1 match interrupt
or external interrupt. Thus, pulse output that is free of jitter can be obtained.
Therefore, the real-time output port is best suited to applications (such as open-loop control over stepping motors)
where an arbitrary pattern is output at arbitrary intervals.
As shown in Figure 8-4, the real-time output port is built around port 0 and the port 0 buffer register (P0H, P0L).
Figure 8-4. Block Diagram of Real-Time Output Port
4
4
4
P0L
P0H
Buffer register
8
4
8
P00
P07
Output latch (P0)
Real-time output port
control register
(RTPC)
Output trigger
control circuit
INTP0 (externally)
INTC10 (from timer/counter 1)
INTC11 (from timer/counter 1)
Internal bus
PD784035, 784036, 784037, 784038
36
8.4 Timers/Counters
Three timer/counter units and one timer unit are incorporated.
Moreover, seven interrupt requests are supported, allowing these units to function as seven timer/counter units.
Table 8-2. Timer/Counter Operation
Note
The one-shot pulse output function makes the level of a pulse output active by software, and makes the
level of a pulse output inactive by hardware (interrupt request signal).
Note that this function differs from the one-shot timer function of timer/counter 2.
Name
Timer/counter 0
Timer/counter 1
Timer/counter 2
Timer 3
Item
Count pulse width
8 bits
-
16 bits
Operating mode
Interval timer
2ch
2ch
2ch
1ch
External event counter
-
One-shot timer
-
-
-
Function
Timer output
2ch
-
2ch
-
Toggle output
-
-
PWM/PPG output
-
-
One-shot pulse output
Note
-
-
-
Real-time output
-
-
-
Pulse width measurement
1 input
1 input
2 inputs
-
Number of interrupt requests
2
2
2
1
37
PD784035, 784036, 784037, 784038
Figure 8-5. Timer/Counter Block Diagram
Timer/counter 0
Timer/counter 1
Timer/counter 2
Timer 3
Remark OVF: Overflow flag
TO1
f
xx
/8
OVF
TO0
INTP3
INTP3
INTC00
INTC01
Clear information
Prescaler
Selector
Timer register 0
(TM0)
Software trigger
Compare register
(CR00)
Match
Match
Pulse output control
Compare register
(CR01)
Edge
detection
Capture register
(CR02)
f
xx
/8
Timer register 3
(TM3/TM3W)
Compare register
(CR30/CR30W)
Prescaler
CSI
Clear
Match
INTC30
f
xx
/8
OVF
INTP0
INTP0
INTC10
INTC11
Clear information
Prescaler
Selector
Timer register 1
(TM1/TM1W)
Event input
Compare register
(CR10/CR10W)
Match
Match
Edge
detection
Capture/compare register
(CR11/CR11W)
To real-time
output port
Capture register
(CR12/CR12W)
TO3
f
xx
/8
OVF
TO2
INTP1
INTP1
INTC20
INTC21
INTP2/C1
INTP2
Clear information
Prescaler
Selector
Timer register 2
(TM2/TM2W)
Edge
detection
Edge
detection
Compare register
(CR20/CR20W)
Match
Match
Capture/compare register
(CR21/CR21W)
Pulse output control
Capture register
(CR22/CR22W)
PD784035, 784036, 784037, 784038
38
8.5 PWM Output (PWM0, PWM1)
Two channels of PWM (pulse width modulation) output circuitry with a resolution of 12 bits and a repetition
frequency of 62.5 kHz (f
CLK
= 16 MHz) are incorporated. Low or high active level can be selected for the PWM output
channels, independently of each other. This output is best suited to DC motor speed control.
Figure 8-6. Block Diagram of PWM Output Unit
Remark n = 0, 1
Internal bus
PWM modulo register
PWM control register
(PWMC)
Reload
control
Prescaler
8-bit
down-counter
Pulse control
circuit
4-bit counter
Output
control
PWMn (output pin)
1/256
f
CLK
8
4
16
8
PWMn 15
0
8 7
4 3
39
PD784035, 784036, 784037, 784038
8.6 A/D Converter
An analog/digital (A/D) converter having 8 multiplexed analog inputs (ANI0-ANI7) is incorporated.
The successive approximation system is used for conversion. The result of conversion is held in the 8-bit A/D
conversion result register (ADCR). Thus, speedy high-precision conversion can be achieved. (The conversion time
is about 7.5
s at f
CLK
= 16 MHz.)
A/D conversion can be started in any of the following modes:
Hardware start : Conversion is started by means of trigger input (INTP5).
Software start : Conversion is started by means of bit setting the A/D converter mode register (ADM).
After conversion has started, one of the following modes can be selected:
Scan mode : Multiple analog inputs are selected sequentially to obtain conversion data from all pins.
Select mode: A single analog input is selected at all times to enable conversion data to be obtained
continuously.
ADM is used to specify the above modes, as well as the termination of conversion.
When the result of conversion is transferred to ADCR, an interrupt request (INTAD) is generated. Using this feature,
the results of conversion can be continuously transferred to memory by the macro service.
Figure 8-7. Block Diagram of A/D Converter
ANI0
ANI7
INTP5
AV
REF1
AV
SS
R/2
R
R/2
8
8
8
Input selector
Tap selector
Sample-and-hold circuit
Voltage comparator
Successive conver-
sion register (SAR)
Series resistor string
Control
circuit
A/ D converter mode
register (ADM)
A/ D conversion
result register (ADCR)
Internal bus
Edge
detector
Conversion
trigger
Trigger enable
INTAD
ANI1
ANI2
ANI3
ANI4
ANI5
ANI6
PD784035, 784036, 784037, 784038
40
8.7 D/A Converter
Two digital/analog (D/A) converter channels of voltage output type, having a resolution of 8 bits, are incorporated.
An R-2R resistor ladder system is used for conversion. By writing the value to be subject to D/A conversion in
the 8-bit D/A conversion value setting register (DACSn: n = 0, 1), the resulting analog value is output on ANOn
(n = 0, 1). The range of the output voltages is determined by the voltages applied to the AV
REF2
and AV
REF3
pins.
Because of its high output impedance, no current can be obtained from an output pin. When the load impedance
is low, insert a buffer amplifier between the load and the converter.
The impedance of the ANOn pin goes high while the RESET signal is low. DACSn is set to 0 after a reset
is released.
Figure 8-8. Block Diagram of D/A Converter
Remark n = 0, 1
Selector
Internal bus
DACSn
DACEn
2R
2R
2R
2R
AV
REF3
AV
REF2
R
R
R
ANOn
41
PD784035, 784036, 784037, 784038
8.8 Serial Interface
Three independent serial interface channels are incorporated.
Asynchronous serial interface (UART)/three-wire serial I/O (IOE)
2
Synchronous serial interface (CSI)
1
Three-wire serial I/O (IOE)
Two-wire serial I/O (IOE)
So, communication with points external to the system and local communication within the system can be performed
at the same time. (See Figure 8-9.)
Figure 8-9. Example Serial Interfaces
Note Handshake line
INT
SCK0
SB0
V
DD
SI
SO
SCK
Port
INT
Port
[Two-wire serial I/O]
UART + Three-wire serial I/O + Two-wire serial I/O
[Three-wire serial I/O]
RS-232-C
driver/receiver
Port
RxD
TxD
SO1
SI1
SCK1
INTPm
Port
SDA
SCL
INTPn
Port
Note
Note
PD75108 (slave)
PD784038 (master)
PD4711A
PD78014 (slave)
V
DD
(UART)
PD784035, 784036, 784037, 784038
42
8.8.1 Asynchronous serial interface/three-wire serial I/O (UART/IOE)
Two serial interface channels are available; for each channel, asynchronous serial interface mode or three-wire
serial I/O mode can be selected.
(1) Asynchronous serial interface mode
In this mode, 1-byte data is transferred after a start bit.
A baud rate generator is incorporated to enable communication at a wide range of baud rates.
Moreover, the frequency of a clock signal applied to the ASCK pin can be divided to define a baud rate.
With the baud rate generator, the baud rate conforming to the MIDI standard (31.25 kbps) can be obtained.
Figure 8-10. Block Diagram of Asynchronous Serial Interface Mode
Remark f
XX
: Oscillator frequency or external clock input frequency
n = 0 to 11
m = 16 to 30
RXB, RXB2
TXS, TXS2
INTST, INTST2
INTSR,
INTSR2
INTSER,
INTSER2
1/2m
f
XX
/2
ASCK, ASCK2
TxD, TxD2
RxD, RxD2
1/2
n+1
1/2m
Baud rate generator
Receive
shift register
Receive buffer
Selector
Transmission
control parity
bit addition
Transmission
shift register
Internal bus
Reception
control parity
check
43
PD784035, 784036, 784037, 784038
(2) Three-wire serial I/O mode
In this mode, the master device makes the serial clock active to start transmission, then transfers 1-byte data
in phase with the clock.
This mode is designed for communication with a device incorporating a conventional synchronous serial interface.
Basically, three lines are used for communication: the serial clock line (SCK) and the two serial data lines
(SI and SO).
In general, a handshake line is required to check the communication state.
Figure 8-11. Block Diagram of Three-Wire Serial I/O Mode
Remark f
XX
: Oscillator frequency or external clock input frequency
n = 0 to 11
m = 1, 16 to 30
Serial clock counter
SIO1, SIO2
SI1, SI2
SO1, SO2
SCK1, SCK2
f
XX
/2
INTCSI1,
INTCSI2
Shift register
Output latch
Direction control
circuit
Internal bus
Serial clock
control circuit
Selector
1/m
1/2
n+1
Interrupt signal
generator
PD784035, 784036, 784037, 784038
44
8.8.2 Synchronous serial interface (CSI)
With this interface, the master device makes the serial clock active to start transmission, then transfers 1-byte data
in phase with the clock.
Figure 8-12. Block Diagram of Synchronous Serial Interface
Remark f
XX
: Oscillator frequency or external clock input frequency
Internal bus
Direction
control circuit
Selector
Shift register
Set
Reset
Output latch
N-ch open-drain
output enabled
(when two-wire
mode is used)
Serial clock
counter
Interrupt signal
generator
N-ch open-drain
output enabled
(when two-wire
mode is used)
Serial clock
control circuit
Selector
Timer 3 output
Selector
Prescaler
f
XX
/16
f
XX
/2
INTCSI
CLS0
CLS1
SCK0/SCL
SI0
SO0/SDA
45
PD784035, 784036, 784037, 784038
(1) Three-wire serial I/O mode
This mode is designed for communication with a device incorporating a conventional synchronous serial interface.
Basically, three lines are used for communication: the serial clock line (SCK0) and serial data lines (SI0 and SO0).
In general, a handshake line is required to check the communication state.
(2) Two-wire serial I/O mode
In this mode, 8-bit data is transferred using two lines: the serial clock line (SCL) and serial data bus (SDA).
In general, a handshake line is required to check the communication state.
8.9 Clock Output Function
The frequency of the CPU clock signal can be divided for output to a point external to the system. Moreover, the
port can be used as a 1-bit port.
The ASTB pin is also used for the CLKOUT pin, so that when this function is used, the local bus interface cannot
be used.
Figure 8-13. Block Diagram of Clock Output Function
CLKOUT
f
CLK
f
CLK
/2
f
CLK
/4
f
CLK
/8
f
CLK
/16
Selector
Output control
Enable output
Output level
PD784035, 784036, 784037, 784038
46
8.10 Edge Detection Function
The interrupt input pins (NMI, INTP0-INTP5) are used to apply not only interrupt requests but also trigger signals
for the built-in circuits. As these pins are triggered by an edge (rising or falling) of an input signal, a function for edge
detection is incorporated. Moreover, a noise suppression function is provided to prevent erroneous edge detection
caused by noise.
Note
INTP0 is used for sampling clock selection.
8.11 Watchdog Timer
A watchdog timer is incorporated for CPU runaway detection. The watchdog timer, if not cleared by software within
a specified interval, generates a nonmaskable interrupt. Furthermore, once watchdog timer operation is enabled,
it cannot be disabled by software. The user can specify whether priority is placed on an interrupt based on the
watchdog timer or on an interrupt based on the NMI pin.
Figure 8-14. Block Diagram of Watchdog Timer
Pin
Detectable edge
Noise suppression method
NMI
Rising edge or falling edge
Analog delay
INTP0-INTP3
Rising edge or falling edge, or both edges
Clock sampling
Note
INTP4, INTP5
Analog delay
f
CLK
/2
21
f
CLK
INTWDT
f
CLK
/2
20
f
CLK
/2
19
f
CLK
/2
17
Timer
Clear signal
Selector
47
PD784035, 784036, 784037, 784038
9. INTERRUPT FUNCTION
Table 9-1 lists the interrupt request handling modes. These modes are selected by software.
Table 9-1. Interrupt Request Handling Modes
9.1 Interrupt Source
An interrupt can be issued from any one of the interrupt sources listed in Table 9-2: execution of a BRK instruction
and BRKCS instruction, an operand error, or any of the 23 other interrupt sources.
Four levels of interrupt handling priority can be set. Priority levels can be set to nest control during interrupt handling
or to concurrently generate interrupt requests. Nested macro services, however, are performed without suspension.
When interrupt requests having the same priority level are generated, they are handled according to the default
priority (fixed). (See Table 9-2.)
Handling mode
Handled by
Handling
PC and PSW contents
Vectored interrupt
Software
Branches to a handling routine for execution
The PC and PSW contents are pushed
(arbitrary handling).
to and popped from the stack.
Context switching
Automatically selects a register bank, and
The PC and PSW contents are saved to
branches to a handling routine for execution
and read from a fixed area in the
(arbitrary handling).
register bank.
Macro service
Firmware
Performs operations such as memory-to-I/O-
Maintained
device data transfer (fixed handling).
PD784035, 784036, 784037, 784038
48
Table 9-2. Interrupt Sources
Type
Default
Source
Internal/
Macro
priority
Name
Trigger
external
service
Software
-
BRK instruction
Instruction execution
-
-
BRKCS instruction
Operand error
When the MOV STBC,#byte, MOV WDM,#byte, or LOCATION
instruction is executed, exclusive OR of the byte operand and byte
does not produce FFH.
Nonmaskable
-
NMI
Detection of edge input on the pin
External
-
WDT
Watchdog timer overflow
Internal
Maskable
0 (highest)
INTP0
Detection of edge input on the pin
External
Enabled
(TM1/TM1W capture trigger, TM1/TM1W event counter input)
1
INTP1
Detection of edge input on the pin
(TM2/TM2W capture trigger, TM2/TM2W event counter input)
2
INTP2
Detection of edge input on the pin
(TM2/TM2W capture trigger, TM2/TM2W event counter input)
3
INTP3
Detection of edge input on the pin
(TM0 capture trigger, TM0 event counter input)
4
INTC00
TM0-CR00 match signal issued
Internal
Enabled
5
INTC01
TM0-CR01 match signal issued
6
INTC10
TM1-CR10 match signal issued (in 8-bit operation mode)
TM1W-CR10W match signal issued (in 16-bit operation mode)
7
INTC11
TM1-CR11 match signal issued (in 8-bit operation mode)
TM1W-CR11W match signal issued (in 16-bit operation mode)
8
INTC20
TM2-CR20 match signal issued (in 8-bit operation mode)
TM2W-CR20W match signal issued (in 16-bit operation mode)
9
INTC21
TM2-CR21 match signal issued (in 8-bit operation mode)
TM2W-CR21W match signal issued (in 16-bit operation mode)
10
INTC30
TM3-CR30 match signal issued (in 8-bit operation mode)
TM3W-CR30W match signal issued (in 16-bit operation mode)
11
INTP4
Detection of edge input on the pin
External
Enabled
12
INTP5
Detection of edge input on the pin
13
INTAD
A/D converter processing completed (ADCR transfer)
Internal
Enabled
14
INTSER
ASI0 reception error
-
15
INTSR
ASI0 reception completed or CSI1 transfer completed
Enabled
INTCSI1
16
INTST
ASI0 transmission completed
17
INTCSI
CSI0 transfer completed
18
INTSER2
ASI2 reception error
-
19
INTSR2
ASI2 reception completed or CSI2 transfer completed
Enabled
INTCSI2
20 (lowest)
INTST2
ASI2 transmission completed
Remark ASI: Asynchronous serial interface
CSI: Synchronous serial interface
49
PD784035, 784036, 784037, 784038
9.2 Vectored Interrupt
When a branch to an interrupt handling routine occurs, the vector table address corresponding to the interrupt
source is used as the branch address.
Interrupt handling by the CPU consists of the following operations :
When a branch occurs
: Push the CPU status (PC and PSW contents) to the stack.
When control is returned : Pop the CPU status (PC and PSW contents) from the stack.
To return control from the handling routine to the main routine, use the RETI instruction. The branch destination
addresses must be within the range of 0 to FFFFH.
Table 9-3. Vector Table Address
Interrupt source
Vector table address
BRK instruction
003EH
Operand error
003CH
NMI
0002H
WDT
0004H
INTP0
0006H
INTP1
0008H
INTP2
000AH
INTP3
000CH
INTC00
000EH
INTC01
0010H
INTC10
0012H
INTC11
0014H
INTC20
0016H
INTC21
0018H
INTC30
001AH
INTP4
001CH
INTP5
001EH
INTAD
0020H
INTSER
0022H
INTSR
0024H
INTCSI1
INTST
0026H
INTCSI
0028H
INTSER2
002AH
INTSR2
002CH
INTCSI2
INTST2
002EH
PD784035, 784036, 784037, 784038
50
9.3 Context Switching
When an interrupt request is generated, or when the BRKCS instruction is executed, an appropriate register bank
is selected by the hardware. Then, a branch to a vector address stored in that register bank occurs. At the same
time, the contents of the current program counter (PC) and program status word (PSW) are stacked in the register
bank.
The branch address must be within the range of 0 to FFFFH.
Figure 9-1. Context Switching Caused by an Interrupt Request
9.4 Macro Service
The macro service function enables data transfer between memory and special function registers (SFRs) without
requiring the intervention of the CPU. The macro service controller accesses both memory and SFRs within the same
transfer cycle to directly transfer data without having to perform data fetch.
Since the CPU status is neither saved nor restored, nor is data fetch performed, high-speed data transfer is
possible.
Figure 9-2. Macro Service
PSW
PC19-16
0000B
PC15-0
Exchange
Save
Save
2
3
4
5
Save
1
6
7
Transfer
(Bits 8 to 11 of
temporary register)
Register bank n (n = 0-7)
Temporary register
A
X
B
C
R5
R4
R7
VP
UP
R6
D
E
H
T
U
V
W
L
Switching between register banks
(RBS0-RBS2
n)
RSS
0
IE
0
Register bank (0-7)
CPU
SFR
Memory
Read
Write
Read
Write
Macro service
controller
Internal bus
51
PD784035, 784036, 784037, 784038
9.5 Examples of Macro Service Applications
(1) Serial interface transmission
Each time macro service request (INTST) is generated, the next transmission data is transferred from memory
to TXS. When data n (last byte) has been transferred to TXS (that is, once the transmission data storage buffer
becomes empty), vectored interrupt request (INTST) is generated.
(2) Serial interface reception
Each time macro service request (INTSR) is generated, reception data is transferred from RXB to memory. When
data n (last byte) has been transferred to memory (that is, once the reception data storage buffer becomes full),
vectored interrupt request (INTSR) is generated.
Transmission data storage buffer (memory)
INTST
TXS (SFR)
TxD
Data n
Data n-1
Data 2
Data 1
Internal bus
Transmission
shift register
Transmission control
Reception data storage buffer (memory)
INTSR
RXB (SFR)
RxD
Data n
Data n-1
Data 2
Data 1
Internal bus
Reception buffer
Reception
shift register
Reception control
PD784035, 784036, 784037, 784038
52
(3) Real-time output port
INTC10 and INTC11 function as the output triggers for the real-time output ports. For these triggers, the macro
service can simultaneously set the next output pattern and interval. Therefore, INTC10 and INTC11 can be used
to independently control two stepping motors. They can also be applied to PWM and DC motor control.
Each time macro service request (INTC10) is generated, a pattern and timing data are transferred to the buffer
register (P0L) and compare register (CR10), respectively. When the contents of timer register 1 (TM1) and CR10
match, another INTC10 is generated, and the P0L contents are transferred to the output latch. When T
n
(last
byte) is transferred to CR10, vectored interrupt request (INTC10) is generated.
For INTC11, the same operation as that performed for INTC10 is performed.
Match
(SFR)
INTC10
P00-P03
(SFR)
Output pattern profile (memory)
Output timing profile (memory)
P
n
P
n1
P
2
P
1
Internal bus
P0L
Output latch
CR10
TM1
Internal bus
T
n
T
n1
T
2
T
1
53
PD784035, 784036, 784037, 784038
10. LOCAL BUS INTERFACE
The local bus interface enables the connection of external memory and I/O devices (memory-mapped I/O). It
supports a 1M-byte memory space. (See Figure 10-1.)
Figure 10-1. Example of Local Bus Interface
10.1 Memory Expansion
By adding external memory, program memory or data memory can be expanded, 256 bytes at a time, to
approximately 1M byte (seven steps).
Data bus
Latch
Gate array for I/O
expansion including
Centronics interface
circuit, etc.
RD
WR
REFRQ
AD0-AD7
ASTB
Pseudo SRAM
PROM
PD27C1001A
PD784038
A16-A19
Address bus
Data bus
A8-A15
Decoder
Kanji character
generator
PD24C1000
PD784035, 784036, 784037, 784038
54
10.2 Memory Space
The 1M-byte memory space is divided into eight spaces, each having a logical address. Each of these spaces
can be controlled using the programmable wait and pseudo-static RAM refresh functions.
Figure 10-2. Memory Space
FFFFFH
80000H
7FFFFH
40000H
3FFFFH
20000H
1FFFFH
10000H
0FFFFH
0C000H
0BFFFH
08000H
07FFFH
04000H
03FFFH
00000H
512K bytes
256K bytes
128K bytes
64K bytes
16K bytes
16K bytes
16K bytes
16K bytes
55
PD784035, 784036, 784037, 784038
10.3 Programmable Wait
When the memory space is divided into eight spaces, a wait state can be separately inserted for each memory
space while the RD or WR signal is active. This prevents the overall system efficiency from being degraded even
when memory devices having different access times are connected.
In addition, an address wait function that extends the ASTB signal active period is provided to produce a longer
address decode time. (This function is set for the entire space.)
10.4 Pseudo-Static RAM Refresh Function
Refresh is performed as follows:
Pulse refresh
: A bus cycle is inserted where a refresh pulse is output on the REFRQ pin at regular
intervals. When the memory space is divided into eight, and a specified area
is being accessed, refresh pulses can also be output on the REFRQ pin as the
memory is being accessed. This can prevent the refresh cycle from suspending
normal memory access.
Power-down self-refresh : In standby mode, a low-level signal is output on the REFRQ pin to maintain the
contents of pseudo-static RAM.
10.5 Bus Hold Function
A bus hold function is provided to facilitate connection to devices such as a DMA controller. Suppose that a bus
hold request signal (HLDRQ) is received from an external bus master. In this case, upon the completion of the bus
cycle being performed, the address bus, address/data bus, ASTB, RD, and WR pins are placed in the high-impedance
state, and the bus hold acknowledge signal (HLDAK) is made active to release the bus for the external bus master.
While the bus hold function is being used, the external wait and pseudo-static RAM refresh functions are disabled.
PD784035, 784036, 784037, 784038
56
11. STANDBY FUNCTION
The standby function allows the power consumption of the chip to be reduced. The following standby modes are
supported:
HALT mode : The CPU operation clock is stopped. By occasionally inserting the HALT mode during normal
operation, the overall average power consumption can be reduced.
IDLE mode : The entire system is stopped, with the exception of the oscillator circuit. This mode consumes
only very little more power than STOP mode, but normal program operation can be restored in
almost as little time as that required to restore normal program operation from HALT mode.
STOP mode : The oscillator is stopped. All operations in the chip stop, such that only leakage current flows.
These modes can be selected by software.
A macro service can be initiated in HALT mode.
Figure 11-1. Standby Mode Status Transition
Notes 1. INTP4 and INTP5 are applied when not masked.
2. Only when the interrupt request is not masked
Remark NMI is enabled only by external input. The watchdog timer cannot be used to release one of the standby
modes (STOP or IDLE mode).
STOP
(standby)
IDLE
(standby)
Request for masked interrupt
HALT
(standby)
NMI, INTP4, INTP5 input
Note 1
Set STOP
RESET input
Set IDLE
RESET input
NMI, INTP4, INTP5 input
Note 1
Oscillation settling
time elapses
Wait for
oscillation
settling
Program
operation
Macro service request
End of one operation
End of macro service
Macro
service
Set HALT
RESET input
Interrupt request
Note 2
Macro service request
End of one operation
57
PD784035, 784036, 784037, 784038
12. RESET FUNCTION
Applying a low-level signal to the RESET pin initializes the internal hardware (reset status).
When the RESET input makes a low-to-high transition, the following data is loaded into the program counter (PC):
Eight low-order bits of the PC
: Contents of location at address 0000H
Intermediate eight bits of the PC : Contents of location at address 0001H
Four high-order bits of the PC
: 0
The PC contents are used as a branch destination address. Program execution starts from that address. Therefore,
a reset start can be performed from an arbitrary address.
The contents of each register can be set by software, as required.
The RESET input circuit contains a noise eliminator to prevent malfunctions caused by noise. This noise eliminator
is an analog delay sampling circuit.
Figure 12-1. Accepting a Reset
For power-on reset, the RESET signal must be held active until the oscillation settling time (approximately 40 ms)
has elapsed.
Figure 12-2. Power-On Reset
Oscillation settling time
Delay
Initialize PC
Execute instruction at
reset start address
RESET
(input)
Internal reset signal
End reset
V
DD
RESET
(input)
Delay
Delay
Delay
Initialize PC
Execute instruction
at reset start address
Internal reset signal
Start reset
End reset
PD784035, 784036, 784037, 784038
58
13. INSTRUCTION SET
(1) 8-bit instructions (The instructions enclosed in parentheses are implemented by a combination of
operands, where A is described as r.)
MOV, XCH, ADD, ADDC, SUB, SUBC, AND, OR, XOR, CMP, MULU, DIVUW, INC, DEC, ROR, ROL, RORC,
ROLC, SHR, SHL, ROR4, ROL4, DBNZ, PUSH, POP, MOVM, XCHM, CMPME, CMPMNE, CMPMNC, CMPMC,
MOVBK, XCHBK, CMPBKE, CMPBKNE, CMPBKNC, CMPBKC, CHKL, CHKLA
Table 13-1. Instructions Implemented by 8-Bit Addressing
2nd operand
#byte
A
r
saddr
sfr
!addr16
mem
r3
[WHL+]
n
None
Note 2
r'
saddr'
!!addr24
[saddrp]
PSWL
[WHL]
1st operand
[%saddrg]
PSWH
A
(MOV)
(MOV)
MOV
(MOV)
Note 6
MOV
(MOV)
MOV
MOV
(MOV)
ADD
Note 1
(XCH)
XCH
(XCH)
Note 6
(XCH)
(XCH)
XCH
(XCH)
(ADD)
Note 1
(ADD)
Note 1
(ADD)
Notes 1, 6
(ADD)
Note 1
ADD
Note 1
ADD
Note 1
(ADD)
Note 1
r
MOV
(MOV)
MOV
MOV
MOV
MOV
ROR
Note 3
MULU
ADD
Note 1
(XCH)
XCH
XCH
XCH
XCH
DIVUW
(ADD)
Note 1
ADD
Note 1
ADD
Note 1
ADD
Note 1
INC
DEC
saddr
MOV
(MOV)
Note 6
MOV
MOV
INC
ADD
Note 1
(ADD)
Note 1
ADD
Note 1
XCH
DEC
ADD
Note 1
DBNZ
sfr
MOV
MOV
MOV
PUSH
ADD
Note 1
(ADD)
Note 1
ADD
Note 1
POP
CHKL
CHKLA
!addr16
MOV
(MOV)
MOV
!!addr24
ADD
Note 1
mem
MOV
[saddrp]
ADD
Note 1
[%saddrg]
mem3
ROR4
ROL4
r3
MOV
MOV
PSWL
PSWH
B, C
DBNZ
STBC, WDM
MOV
[TDE+]
(MOV)
MOVBK
Note 5
[TDE]
(ADD)
Note 1
MOVM
Note 4
Notes 1. ADDC, SUB, SUBC, AND, OR, XOR, and CMP are the same as ADD.
2. There is no second operand, or the second operand is not an operand address.
3. ROL, RORC, ROLC, SHR, and SHL are the same as ROR.
4. XCHM, CMPME, CMPMNE, CMPMNC, and CMPMC are the same as MOVM.
5. XCHBK, CMPBKE, CMPBKNE, CMPBKNC, and CMPBKC are the same as MOVBK.
6. When saddr is saddr2 with this combination, an instruction with a short code exists.
59
PD784035, 784036, 784037, 784038
(2) 16-bit instructions (The instructions enclosed in parentheses are implemented by a combination of
operands, where AX is described as rp.)
MOVW, XCHW, ADDW, SUBW, CMPW, MULUW, MULW, DIVUX, INCW, DECW, SHRW, SHLW, PUSH, POP,
ADDWG, SUBWG, PUSHU, POPU, MOVTBLW, MACW, MACSW, SACW
Table 13-2. Instructions Implemented by 16-Bit Addressing
2nd operand
#word
AX
rp
saddrp
sfrp
!addr16
mem
[WHL+]
byte
n
None
Note 2
rp'
saddrp'
!!addr24
[saddrp]
1st operand
[%saddrg]
AX
(MOVW)
(MOVW)
(MOVW)
(MOVW)
Note 3
MOVW
(MOVW)
MOVW
(MOVW)
ADDW
Note 1
(XCHW)
(XCHW)
(XCHW)
Note 3
(XCHW)
XCHW
XCHW
(XCHW)
(ADD)
Note 1
(ADDW)
Note 1
(ADDW)
Notes 1,3
(ADDW)
Note 1
rp
MOVW
(MOVW)
MOVW
MOVW
MOVW
MOVW
SHRW
MULW
Note 4
ADDW
Note 1
(XCHW)
XCHW
XCHW
XCHW
SHLW
INCW
(ADDW)
Note 1
ADDW
Note 1
ADDW
Note 1
ADDW
Note 1
DECW
saddrp
MOVW
(MOVW)
Note 3
MOVW
MOVW
INCW
ADDW
Note 1
(ADDW)
Note 1
ADDW
Note 1
XCHW
DECW
ADDW
Note 1
sfrp
MOVW
MOVW
MOVW
PUSH
ADDW
Note 1
(ADDW)
Note 1
ADDW
Note 1
POP
!addr16
MOVW
(MOVW)
MOVW
MOVTBLW
!!addr24
mem
MOVW
[saddrp]
[%saddrg]
PSW
PUSH
POP
SP
ADDWG
SUBWG
post
PUSH
POP
PUSHU
POPU
[TDE+]
(MOVW)
SACW
byte
MACW
MACSW
Notes 1. SUBW and CMPW are the same as ADDW.
2. There is no second operand, or the second operand is not an operand address.
3. When saddrp is saddrp2 with this combination, an instruction with a short code exists.
4. MULUW and DIVUX are the same as MULW.
PD784035, 784036, 784037, 784038
60
(3) 24-bit instructions (The instructions enclosed in parentheses are implemented by a combination of
operands, where WHL is described as rg.)
MOVG, ADDG, SUBG, INCG, DECG, PUSH, POP
Table 13-3. Instructions Implemented by 24-Bit Addressing
2nd operand
#imm24
WHL
rg
saddrg
!!addr24
mem1
[%saddrg]
SP
None
Note
1st operand
rg'
WHL
(MOVG)
(MOVG)
(MOVG)
(MOVG)
(MOVG)
MOVG
MOVG
MOVG
(ADDG)
(ADDG)
(ADDG)
ADDG
(SUBG)
(SUBG)
(SUBG)
SUBG
rg
MOVG
(MOVG)
MOVG
MOVG
MOVG
INCG
ADDG
(ADDG)
ADDG
DECG
SUBG
(SUBG)
SUBG
PUSH
POP
saddrg
(MOVG)
MOVG
!!addr24
(MOVG)
MOVG
mem1
MOVG
[%saddrg]
MOVG
SP
MOVG
MOVG
INCG
DECG
Note
There is no second operand, or the second operand is not an operand address.
61
PD784035, 784036, 784037, 784038
(4) Bit manipulation instructions
MOV1, AND1, OR1, XOR1, SET1, CLR1, NOT1, BT, BF, BTCLR, BFSET
Table 13-4. Bit Manipulation Instructions Implemented by Addressing
2nd operand
CY
saddr.bit sfr.bit
/saddr.bit /sfr.bit
None
Note
A.bit X.bit
/A.bit /X.bit
PSWL.bit PSWH.bit
/PSWL.bit /PSWH.bit
mem2.bit
/mem2.bit
1st operand
!addr16.bit !!addr24.bit
/!addr16.bit /!!addr24.bit
CY
MOV1
AND1
NOT1
AND1
OR1
SET1
OR1
CLR1
XOR1
saddr.bit
MOV1
NOT1
sfr.bit
SET1
A.bit
CLR1
X.bit
BF
PSWL.bit
BT
PSWH.bit
BTCLR
mem2.bit
BFSET
!addr16.bit
!!addr24.bit
Note
There is no second operand, or the second operand is not an operand address.
PD784035, 784036, 784037, 784038
62
(5) Call/return instructions and branch instructions
CALL, CALLF, CALLT, BRK, RET, RETI, RETB, RETCS, RETCSB, BRKCS, BR, BNZ, BNE, BZ, BE, BNC, BNL,
BC, BL, BNV, BPO, BV, BPE, BP, BN, BLT, BGE, BLE, BGT, BNH, BH, BF, BT, BTCLR, BFSET, DBNZ
Table 13-5. Call/Return and Branch Instructions Implemented by Addressing
Instruction
$addr20 $!addr20
!addr16
!!addr20
rp
rg
[rp]
[rg]
!addr11
[addr5]
RBn
None
address
operand
Basic
BC
Note
CALL
CALL
CALL
CALL
CALL
CALL
CALL
CALLF
CALLF
BRKCS
BRK
instruction
BR
BR
BR
BR
BR
BR
BR
BR
RET
RETCS
RETI
RETCSB
RETB
Composite
BF
instruction
BT
BTCLR
BFSET
DBNZ
Note
BNZ, BNE, BZ, BE, BNC, BNL, BL, BNV, BPO, BV, BPE, BP, BN, BLT, BGE, BLE, BGT, BNH, and BH
are the same as BC.
(6) Other instructions
ADJBA, ADJBS, CVTBW, LOCATION, SEL, NOT, EI, DI, SWRS
63
PD784035, 784036, 784037, 784038
14. ELECTRICAL CHARACTERISTICS
ABSOLUTE MAXIMUM RATINGS (T
A
= 25
C)
Parameter
Symbol
Conditions
Rating
Unit
Supply voltage
V
DD
-0.5 to +7.0
V
AV
DD
AV
SS
to V
DD
+ 0.5
V
AV
SS
-0.5 to +0.5
V
Input voltage
V
I
-0.5 to V
DD
+ 0.5
V
Output voltage
V
O
-0.5 to V
DD
+ 0.5
V
Output low current
I
OL
At one pin
15
mA
Total of all output pins
100
mA
Output high current
I
OH
At one pin
-10
mA
Total of all output pins
-100
mA
A/D converter reference input
AV
REF1
-0.5 to V
DD
+ 0.3
V
voltage
AV
REF2
-0.5 to V
DD
+ 0.3
V
AV
REF3
-0.5 to V
DD
+ 0.3
V
Operating ambient temperature
T
A
-40 to +85
C
Storage temperature
T
stg
-65 to +150
C
D/A converter reference input
voltage
Caution Absolute maximum ratings are rated values beyond which physical damage will be caused to the
product; if the rated value of any of the parameters in the above table is exceeded, even
momentarily, the quality of the product may deteriorate. Always use the product within its rated
values.
PD784035, 784036, 784037, 784038
64
OPERATING CONDITIONS
Operating ambient temperature (T
A
)
: -40 to +85
C
Rise time and fall time (t
r
, t
f
) (at pins which are not specified) : 0 to 200
s
Power supply voltage and clock cycle time
: See Figure 14-1.
Figure 14-1. Power Supply Voltage and Clock Cycle Time
CAPACITANCE (T
A
= 25
C, V
DD
= V
SS
= 0 V)
Parameter
Input capacitance
Output capacitance
I/O capacitance
Symbol
C
I
C
O
C
IO
Conditions
f = 1 MHz
0 V on pins other than measured pins
MIN.
TYP.
MAX.
10
10
10
Unit
pF
pF
pF
10,000
4,000
1,000
125
100
62.5
10
0
1
2
3
4
5
6
7
Guaranteed
operating
range
Power supply voltage [V]
Clock cycle time t
CYK
[ns]
65
PD784035, 784036, 784037, 784038
OSCILLATOR CHARACTERISTICS (T
A
= -40 to +85
C, V
DD
= +4.5 to 5.5 V, V
SS
= 0 V)
Caution When using the system clock generator, run wires in the portion surrounded by broken lines
according to the following rules to avoid effects such as stray capacitance:
Minimize the wiring.
Never cause the wires to cross other signal lines.
Never cause the wires to run near a line carrying a large varying current.
Cause the grounding point of the capacitor of the oscillator circuit to have the same potential
as V
SS1
. Never connect the capacitor to a ground pattern carrying a large current.
Never extract a signal from the oscillator.
Resonator
Ceramic resonator
or crystal
External clock
Recommended circuit
Parameter
Oscillator frequency (f
XX
)
X1 input frequency (f
X
)
X1 input rise and fall times
(t
XR
, t
XF
)
X1 input high-level and low-
level widths (t
WXH
, t
WXL
)
MIN.
4
4
0
10
MAX.
32
32
10
125
Unit
MHz
MHz
ns
ns
V
SS1
X1
X2
C2
C1
X1
X2
HCMOS
inverter
PD784035, 784036, 784037, 784038
66
OSCILLATOR CHARACTERISTICS (T
A
= -40 to +85
C, V
DD
= +2.7 to 5.5 V, V
SS
= 0 V)
Caution When using the system clock generator, run wires in the portion surrounded by broken lines
according to the following rules to avoid effects such as stray capacitance:
Minimize the wiring.
Never cause the wires to cross other signal lines.
Never cause the wires to run near a line carrying a large varying current.
Cause the grounding point of the capacitor of the oscillator circuit to have the same potential
as V
SS1
. Never connect the capacitor to a ground pattern carrying a large current.
Never extract a signal from the oscillator.
Resonator
Ceramic resonator
or crystal
External clock
Recommended circuit
Parameter
Oscillator frequency (f
XX
)
X1 input frequency (f
X
)
X1 input rise and fall times
(t
XR
, t
XF
)
X1 input high-level and low-
level widths (t
WXH
, t
WXL
)
MIN.
4
4
0
10
MAX.
16
16
10
125
Unit
MHz
MHz
ns
ns
V
SS1
X1
X2
C2
C1
X1
X2
HCMOS
inverter
67
PD784035, 784036, 784037, 784038
DC CHARACTERISTICS (T
A
= -40 to +85
C, V
DD
= AV
DD
= +2.7 to 5.5 V, V
SS
= AV
SS
= 0 V) (1/2)
Notes 1. X1, X2, RESET, P12/ASCK2/SCK2, P20/NMI, P21/INTP0, P22/INTP1, P23/INTP2/CI, P24/INTP3,
P25/INTP4/ASCK/SCK1, P26/INTP5, P27/SI0, P32/SCK0/SCL, P33/SO0/SDA, TEST
2. P40/AD0-P47/AD7, P50/A8-P57/A15
3. P60/A16-P63/A19, P64/RD, P65/WR, P66/WAIT/HLDRQ, P67/REFRQ/HLDAK
4. P00-P07
5. P10-P17
Parameter
Input low voltage
Input high voltage
Output low voltage
Output high voltage
X1 input low current
X1 input high current
Symbol
V
IL1
V
IL2
V
IL3
V
IH1
V
IH2
V
IH3
V
OL1
V
OL2
V
OH1
V
OH2
I
IL
I
IH
Conditions
For pins other than those described in
Notes 1, 2, 3, and 4
For pins described in Notes 1, 2, 3, and
4
V
DD
= +5.0 V
10 %
For pins described in Notes 2, 3, and 4
For pins other than those described in
Note 1
For pins described in Note 1
V
DD
= +5.0 V
10 %
For pins described in Notes 2, 3, and 4
I
OL
= 2 mA
V
DD
= +5.0 V
10 %
I
OL
= 8 mA
For pins described in Notes 2 and 5
I
OH
= -2 mA
V
DD
= +5.0 V
10 %
I
OH
= -5 mA
For pins described in Note 4
EXTC = 0
0 V
V
I
V
IL2
EXTC = 0
V
IH2
V
I
V
DD
MIN.
-0.3
-0.3
-0.3
0.7V
DD
0.8V
DD
2.2
V
DD
- 1.0
V
DD
- 1.4
TYP.
MAX.
0.3V
DD
0.2V
DD
+0.8
V
DD
+ 0.3
V
DD
+ 0.3
V
DD
+ 0.3
0.4
1.0
-30
+30
Unit
V
V
V
V
V
V
V
V
V
V
A
A
PD784035, 784036, 784037, 784038
68
DC CHARACTERISTICS (T
A
= -40 to +85
C, V
DD
= AV
DD
= +2.7 to 5.5 V, V
SS
= AV
SS
= 0 V) (2/2)
Parameter
Input leakage current
Output leakage current
V
DD
supply current
Pull-up resistor
Symbol
I
LI
I
LO
I
DD1
I
DD2
I
DD3
R
L
Conditions
0 V
V
I
V
DD
For pins other than X1 when EXTC = 0
0 V
V
O
V
DD
Operation mode
f
XX
= 32 MHz
V
DD
= +5.0 V
10 %
f
XX
= 16 MHz
V
DD
= +2.7 to 3.3 V
HALT mode
f
XX
= 32 MHz
V
DD
= +5.0 V
10 %
f
XX
= 16 MHz
V
DD
= +2.7 to 3.3 V
IDLE mode
f
XX
= 32 MHz
(EXTC = 0)
V
DD
= +5.0 V
10 %
f
XX
= 16 MHz
V
DD
= +2.7 to 3.3 V
V
I
= 0 V
MIN.
15
TYP.
25
12
13
8
MAX.
10
10
45
25
26
12
12
8
80
Unit
A
A
mA
mA
mA
mA
mA
mA
k
69
PD784035, 784036, 784037, 784038
AC CHARACTERISTICS (T
A
= -40 to +85
C, V
DD
= AV
DD
= +2.7 to 5.5 V, V
SS
= AV
SS
= 0 V)
(1) Read/write operation (1/2)
Remarks
T: T
CYK
(system clock cycle time)
a: 1 (during address wait), otherwise, 0
n: Number of wait states (n
0)
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Parameter
Address setup time
ASTB high-level width
Address hold time (to ASTB
)
Address hold time (to RD
)
Delay from address to RD
Address float time (to RD
)
Delay from address to data input
Delay from ASTB
to data input
Delay from RD
to data input
Delay from ASTB
to RD
Data hold time (to RD
)
Delay from RD
to address active
Delay from RD
to ASTB
RD low-level width
Address hold time (to WR
)
Delay from address to WR
Delay from ASTB
to data output
Delay from WR
to data output
Delay from ASTB
to WR
Symbol
t
SAST
t
WSTH
t
HSTLA
t
HRA
t
DAR
t
FRA
t
DAID
t
DSTID
t
DRID
t
DSTR
t
HRID
t
DRA
t
DRST
t
WRL
t
HWA
t
DAW
t
DSTOD
t
DWOD
t
DSTW
MIN.
(0.5 + a) T - 15
(0.5 + a) T - 31
(0.5 + a) T - 17
(0.5 + a) T - 40
0.5T - 24
0.5T - 34
0.5T - 14
(1 + a) T - 9
(1 + a) T - 15
0.5T - 9
0
0.5T - 8
0.5T - 12
1.5T - 8
1.5T - 12
0.5T - 17
(1.5 + n) T - 30
(1.5 + n) T - 40
0.5T - 14
(1 + a) T - 5
(1 + a) T - 15
0.5T - 9
MAX.
0
(2.5 + a + n) T - 37
(2.5 + a + n) T - 52
(2 + n) T - 40
(2 + n) T - 60
(1.5 + n) T - 50
(1.5 + n) T - 70
0.5T + 19
0.5T + 35
0.5T - 11
After program
is read
After data is
read
Conditions
V
DD
= +5.0 V
10 %
V
DD
= +5.0 V
10 %
V
DD
= +5.0 V
10 %
V
DD
= +5.0 V
10 %
V
DD
= +5.0 V
10 %
V
DD
= +5.0 V
10 %
V
DD
= +5.0 V
10 %
V
DD
= +5.0 V
10 %
V
DD
= +5.0 V
10 %
V
DD
= +5.0 V
10 %
V
DD
= +5.0 V
10 %
V
DD
= +5.0 V
10 %
PD784035, 784036, 784037, 784038
70
(1) Read/write operation (2/2)
Note
The hold time includes the time during which V
OH1
and V
OL1
are held under the load conditions of
C
L
= 50 pF and R
L
= 4.7 k
.
Remarks
T: T
CYK
(system clock cycle time)
n: Number of wait states (n
0)
(2) Bus hold timing
Remarks
T: T
CYK
(system clock cycle time)
a: 1 (during address wait), otherwise, 0
n: Number of wait states (n
0)
Unit
ns
ns
ns
ns
ns
ns
ns
Parameter
Data setup time (to WR
)
Data hold time (to WR
)
Note
Delay from WR
to ASTB
WR low-level width
Symbol
t
SODW
t
HWOD
t
DWST
t
WWL
MIN.
(1.5 + n) T - 30
(1.5 + n) T - 40
0.5T - 5
0.5T - 25
0.5T - 12
(1.5 + n) T - 30
(1.5 + n) T - 40
MAX.
Conditions
V
DD
= +5.0 V
10 %
V
DD
= +5.0 V
10 %
V
DD
= +5.0 V
10 %
Unit
ns
ns
ns
ns
ns
ns
ns
ns
Parameter
Delay from HLDRQ
to float
Delay from HLDRQ
to HLDAK
Delay from float to HLDAK
Delay from HLDRQ
to HLDAK
Delay from HLDAK
to active
MIN.
1T - 20
1T - 30
MAX.
(6 + a + n) T + 50
(7 + a + n) T + 30
(7 + a + n) T + 40
1T + 30
2T + 40
2T + 60
Conditions
V
DD
= +5.0 V
10 %
V
DD
= +5.0 V
10 %
V
DD
= +5.0 V
10 %
Symbol
t
FHQC
t
DHQHHAH
t
DCFHA
t
DHQLHAL
t
DHAC
71
PD784035, 784036, 784037, 784038
(3) External wait timing
Remarks
T: T
CYK
(system clock cycle time)
a: 1 (during address wait), otherwise, 0
n: Number of wait states (n
0)
(4) Refresh timing
Remark
T: T
CYK
(system clock cycle time)
Parameter
Delay from address to WAIT
input
Delay from ASTB
to WAIT
input
Hold time from ASTB
to WAIT
Delay from ASTB
to WAIT
Delay from RD
to WAIT
input
Hold time from RD
to WAIT
Delay from RD
to WAIT
Delay from WAIT
to data input
Delay from WAIT
to WR
Delay from WAIT
to RD
Delay from WR
to WAIT
input
Hold time from WR
to WAIT
Delay from WR
to WAIT
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
MIN.
(0.5 + n) T + 5
(0.5 + n) T +10
nT + 5
nT + 10
0.5T
0.5T
nT + 5
nT + 10
MAX.
(2 + a) T - 40
(2 + a) T - 60
1.5T - 40
1.5T - 60
(1.5 + n) T - 40
(1.5 + n) T - 60
T - 50
T - 70
(1 + n) T - 40
(1 + n) T - 60
0.5T - 5
0.5T - 10
T - 50
T - 75
(1 + n) T - 40
(1 + n) T - 70
Conditions
V
DD
= +5.0 V
10 %
V
DD
= +5.0 V
10 %
V
DD
= +5.0 V
10 %
V
DD
= +5.0 V
10 %
V
DD
= +5.0 V
10 %
V
DD
= +5.0 V
10 %
V
DD
= +5.0 V
10 %
V
DD
= +5.0 V
10 %
V
DD
= +5.0 V
10 %
V
DD
= +5.0 V
10 %
V
DD
= +5.0 V
10 %
Symbol
t
DAWT
t
DSTWT
t
HSTWTH
t
DSTWTH
t
DRWTL
t
HRWT
t
DRWTH
t
DWTID
t
DWTW
t
DWTR
t
DWWTL
t
HWWT
t
DWWTH
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
Parameter
Random read/write cycle time
REFRQ low-level pulse width
Delay from ASTB
to REFRQ
Delay from RD
to REFRQ
Delay from WR
to REFRQ
Delay from REFRQ
to ASTB
REFRQ high-level pulse width
MAX.
MIN.
3T
1.5T - 25
1.5T - 30
0.5T - 9
1.5T - 9
1.5T - 9
0.5T - 15
1.5T - 25
1.5T - 30
Symbol
t
RC
t
WRFQL
t
DSTRFQ
t
DRRFQ
t
DWRFQ
t
DRFQST
t
WRFQH
Conditions
V
DD
= +5.0 V
10 %
V
DD
= +5.0 V
10 %
PD784035, 784036, 784037, 784038
72
SERIAL OPERATION (T
A
= -40 to +85
C, V
DD
= +2.7 to 5.5 V, AV
SS
= V
SS
= 0 V)
(1) CSI
Remarks 1. The values in this table are those when C
L
is 100 pF.
2. T : Serial clock cycle set by software. The minimum value is 16/f
XX
.
3. f
XX
: Oscillator frequency
Unit
ns
s
ns
s
ns
s
ns
ns
ns
ns
Parameter
Serial clock cycle time (SCK0)
Serial clock low-level width
(SCK0)
Serial clock high-level width
(SCK0)
SI0 setup time (to SCK0
)
SI0 hold time (to SCK0
)
SO0 output delay time
(to SCK0
)
MIN.
10/f
XX
+ 380
T
5/f
XX
+ 150
0.5T - 40
5/f
XX
+ 150
0.5T - 40
40
5/f
XX
+ 40
0
0
MAX.
5/f
XX
+ 150
5/f
XX
+ 400
Conditions
Input
External clock
When SCK0 and SO0 are CMOS I/O
Output
Input
External clock
When SCK0 and SO0 are CMOS I/O
Output
Input
External clock
When SCK0 and SO0 are CMOS I/O
Output
CMOS push-pull output
(3-wire serial I/O mode)
Open-drain output
(2-wire serial I/O mode), R
L
= 1 k
Symbol
t
CYSK0
t
WSKL0
t
WSKH0
t
SSSK0
t
HSSK0
t
DSBSK1
t
DSBSK2
73
PD784035, 784036, 784037, 784038
(2) IOE1, IOE2
Remarks 1. The values in this table are those when C
L
is 100 pF.
2. T: Serial clock cycle set by software. The minimum value is 16/f
XX
.
(3) UART, UART2
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
MIN.
250
500
T
85
210
0.5T - 40
85
210
0.5T - 40
40
40
0
0.5t
CYSK1
- 40
MAX.
50
Symbol
t
CYSK1
t
WSKL1
t
WSKH1
t
SSSK1
t
HSSK1
t
DSOSK
t
HSOSK
Conditions
Input
V
DD
= +5.0 V
10 %
Output
Internal, divided by 16
Input
V
DD
= +5.0 V
10 %
Output
Internal, divided by 16
Input
V
DD
= +5.0 V
10 %
Output
Internal, divided by 16
When data is transferred
Unit
ns
ns
ns
ns
ns
ns
Parameter
ASCK clock input cycle time
ASCK clock low-level width
ASCK clock high-level width
Symbol
t
CYASK
t
WASKL
t
WASKH
MIN.
125
250
52.5
85
52.5
85
MAX.
Conditions
V
DD
= +5.0 V
10 %
V
DD
= +5.0 V
10 %
V
DD
= +5.0 V
10 %
Parameter
Serial clock cycle time
(SCK1, SCK2)
Serial clock low-level width
(SCK1, SCK2)
Serial clock high-level width
(SCK1, SCK2)
Setup time for SI1 and SI2
(to SCK1, SCK2
)
Hold time for SI1 and SI2
(to SCK1, SCK2
)
Output delay time for SO1 and
SO2 (to SCK1, SCK2
)
Output hold time for SO1 and
SO2 (to SCK1, SCK2
)
PD784035, 784036, 784037, 784038
74
CLOCK OUTPUT OPERATION
Remarks n: Divided frequency ratio set by software in the CPU (n = 1, 2, 4, 8, 16)
T: T
CYK
(system clock cycle time)
OTHER OPERATIONS
Remarks t
CYSMP
: Sampling clock set by software
t
CYCPU
: CPU operation clock set by software in the CPU
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
Parameter
CLKOUT cycle time
CLKOUT low-level width
CLKOUT high-level width
CLKOUT rise time
CLKOUT fall time
MIN.
nT
0.5t
CYCL
- 10
0.5t
CYCL
- 20
0.5t
CYCL
- 10
0.5t
CYCL
- 20
MAX.
10
20
10
20
Conditions
V
DD
= +5.0 V
10 %
V
DD
= +5.0 V
10 %
V
DD
= +5.0 V
10 %
V
DD
= +5.0 V
10 %
Symbol
t
CYCL
t
CLL
t
CLH
t
CLR
t
CLF
Unit
s
s
ns
ns
ns
ns
s
s
s
s
Parameter
NMI low-level width
NMI high-level width
INTP0 low-level width
INTP0 high-level width
Low-level width for INTP1-
INTP3 and CI
High-level width for INTP1-
INTP3 and CI
Low-level width for INTP4 and
INTP5
High-level width for INTP4 and
INTP5
RESET low-level width
RESET high-level width
Symbol
t
WNIL
t
WNIH
t
WIT0L
t
WIT0H
t
WIT1L
t
WIT1H
t
WIT2L
t
WIT2H
t
WRSL
t
WRSH
MIN.
10
10
4t
CYSMP
4t
CYSMP
4t
CYCPU
4t
CYCPU
10
10
10
10
MAX.
Conditions
75
PD784035, 784036, 784037, 784038
A/D CONVERTER CHARACTERISTICS (T
A
= -40 to +85
C, V
DD
= AV
DD
= AV
REF1
= +2.7 to 5.5 V, V
SS
= AV
SS
= 0 V)
Note
Quantization error is not included. This parameter is indicated as the ratio to the full-scale value.
Remark t
CYK
: System clock cycle time
Conditions
FR = 1
FR = 0
FR = 1
FR = 0
f
XX
= 32 MHz, CS = 1
STOP mode, CS = 0
MIN.
8
120
180
24
36
-0.3
TYP.
1,000
0.5
2.0
1.0
MAX.
1.0
0.8
1/2
AV
REF1
+ 0.3
1.5
5.0
20
Unit
bit
%
%
LSB
t
CYK
t
CYK
t
CYK
t
CYK
V
M
mA
mA
A
Symbol
t
CONV
t
SAMP
V
IAN
R
AN
AI
REF1
AI
DD1
AI
DD2
Parameter
Resolution
Total error
Note
Linearity calibration
Note
Quantization error
Conversion time
Sampling time
Analog input voltage
Analog input impedance
AV
REF1
current
AV
DD
supply current
PD784035, 784036, 784037, 784038
76
D/A CONVERTER CHARACTERISTICS (T
A
= -40 to +85
C, V
DD
= AV
DD
= +2.7 to 5.5 V, V
SS
= AV
SS
= 0 V)
Parameter
Resolution
Total error
Settling time
Output resistance
Analog reference voltage
Resistance of AV
REF2
and
A
VREF3
Reference power supply
input current
Symbol
R
O
AV
REF2
AV
REF3
R
AIREF
AI
REF2
AI
REF3
Conditions
Load conditions:
V
DD
= AV
DD
= AV
REF2
4 M
, 30 pF
= +2.7 to 5.5 V
AV
REF3
= 0 V
V
DD
= AV
DD
= +2.7 to 5.5 V
AV
REF2
= 0.75V
DD
AV
REF3
= 0.25V
DD
Load conditions:
V
DD
= AV
DD
= AV
REF2
2 M
, 30 pF
= +2.7 to 5.5 V
AV
REF3
= 0 V
V
DD
= AV
DD
= +2.7 to 5.5 V
AV
REF2
= 0.75V
DD
AV
REF3
= 0.25V
DD
Load conditions: 2 M
, 30 pF
DACS0, 1 = 55 H
DACS0, 1 = 55 H
MIN.
8
0.75V
DD
0
4
0
-5
TYP.
10
8
MAX.
0.6
0.8
0.8
1.0
10
V
DD
0.25V
DD
5
0
Unit
bit
%
%
%
%
s
k
V
V
k
mA
mA
77
PD784035, 784036, 784037, 784038
DATA RETENTION CHARACTERISTICS (T
A
= -40 to +85
C)
Note
RESET, P20/NMI, P21/INTP0, P22/INTP1, P23/INTP2/CI, P24/INTP3, P25/INTP4/ASCK/SCK1,
P26/INTP5, P27/SI0, P32/SCK0/SCL, and P33/SO0/SDA pins
AC TIMING TEST POINTS
Parameter
Data retention voltage
Data retention current
V
DD
rise time
V
DD
fall time
V
DD
hold time
(to STOP mode setting)
STOP clear signal input time
Oscillation settling time
Input low voltage
Input high voltage
Conditions
STOP mode
V
DDDR
= +2.7 to 5.5 V
V
DDDR
= +2.5 V
Crystal
Ceramic resonator
Specific pins
Note
MIN.
2.5
200
200
0
0
30
5
0
0.9V
DDDR
TYP.
10
2
MAX.
5.5
50
10
0.1V
DDDR
V
DDDR
Unit
V
A
A
s
s
ms
ms
ms
ms
V
V
Symbol
V
DDDR
I
DDDR
t
RVD
t
FVD
t
HVD
t
DREL
t
WAIT
V
IL
V
IH
0.8V
DD
or 2.2 V
0.8 V
0.8V
DD
or 2.2 V
0.8 V
Test points
V
DD
-1 V
0.45 V
PD784035, 784036, 784037, 784038
78
TIMING WAVEFORM
(1) Read operation
(2) Write operation
ASTB
A8-A19
AD0-AD7
RD
t
WSTH
t
SAST
t
DSTID
t
HSTLA
t
DRST
t
FRA
t
DRID
t
DAR
t
WRL
t
DSTR
t
DAID
t
HRA
t
DRA
t
HRID
ASTB
A8-A19
AD0-AD7
WR
t
WSTH
t
SAST
t
HSTLA
t
DWST
t
DAW
t
DSTW
t
HWOD
t
DSTOD
t
DWOD
t
SODW
t
WWL
t
HWA
79
PD784035, 784036, 784037, 784038
HOLD TIMING
EXTERNAL WAIT SIGNAL INPUT TIMING
(1) Read operation
(2) Write operation
HLDRQ
HLDAK
t
DHQHHAH
t
FHQC
t
DCFHA
t
DHAC
t
DHQLHAL
ADTB, A8-A19,
AD0-AD7, RD, WR
ASTB
A8-A19
AD0-AD7
RD
WAIT
t
DSTWT
t
HSTWTH
t
DSTWTH
t
DAWT
t
DWTID
t
DWTR
t
DRWTL
t
HRWT
t
DRWTH
ASTB
A8-A19
AD0-AD7
WR
WAIT
t
DSTWT
t
HSTWTH
t
DSTWTH
t
DAWT
t
DWTW
t
DWWTL
t
HWWT
t
DWWTH
PD784035, 784036, 784037, 784038
80
REFRESH TIMING WAVEFORM
(1) Random read/write cycle
(2) When refresh memory is accessed for a read and write at the same time
(3) Refresh after a read
(4) Refresh after a write
ASTB
WR
RD
t
RC
t
RC
t
RC
t
RC
t
RC
t
WRFQL
ASTB
RD, WR
REFRQ
t
DSTRFQ
t
DRFQST
t
WRFQH
ASTB
RD
REFRQ
t
DRFQST
t
DRRFQ
t
WRFQL
ASTB
WR
REFRQ
t
DRFQST
t
DWRFQ
t
WRFQL
81
PD784035, 784036, 784037, 784038
SERIAL OPERATION
(1) CSI
(2) IOE1, IOE2
(3) UART, UART2
SCK
SI
SO
Output data
Input data
t
SSSK0
t
HSSK0
t
DSBSK1
t
WSKL0
t
WSKH0
t
CYSK0
SCK
SI
SO
Output data
Input data
t
SSSK1
t
HSSK1
t
DSOSK
t
HSOSK
t
WSKL1
t
WSKH1
t
CYSK1
ASCK,
ASCK2
t
WASKH
t
WASKL
t
CYASK
PD784035, 784036, 784037, 784038
82
CLOCK OUTPUT TIMING
INTERRUPT INPUT TIMING
RESET INPUT TIMING
C
LKOUT
t
CLH
t
CLL
t
CYCL
t
CLF
t
CLR
NMI
INTP0
CI,
INTP1-INTP3
INTP4, INTP5
t
WNIH
t
WNIL
t
WIT0H
t
WIT0L
t
WIT1H
t
WIT1L
t
WIT2H
t
WIT2L
RESET
t
WRSH
t
WRSL
83
PD784035, 784036, 784037, 784038
EXTERNAL CLOCK TIMING
DATA RETENTION CHARACTERISTICS
X1
t
WXH
t
WXH
t
CYX
t
XF
t
XR
V
DD
RESET
NMI
(Clearing by falling edge)
NMI
(Clearing by rising edge)
t
HVD
t
FVD
t
RVD
t
DREL
V
DDDR
STOP mode setting
t
WAIT
PD784035, 784036, 784037, 784038
84
80 PIN PLASTIC QFP (14x14)
ITEM
MILLIMETERS
INCHES
NOTE
Each lead centerline is located within 0.13 mm (0.005 inch) of
its true position (T.P.) at maximum material condition.
L
0.8
0.2
0.031+0.009
0.008
M
0.15
0.006
N
0.10
0.004
A
17.2
0.4
0.677
0.016
B
14.0
0.2
0.551+0.009
0.008
C
14.0
0.2
0.551+0.009
0.008
D
17.2
0.4
0.677
0.016
F
0.825
0.032
G
0.825
0.032
H
0.30
0.10
0.012+0.004
0.005
I
0.13
0.005
J
0.65 (T.P.)
0.026 (T.P.)
Q
0.1
0.1
0.004
0.004
R
5
5
5
5
+0.10
0.05
+0.004
0.003
M
M
L
K
J
H
Q
P
N
R
detail of lead end
I
G
K
1.6
0.2
0.063
0.008
60
61
40
80
1
21
20
41
A
B
C D
F
S
S80GC-65-3B9-5
S
3.0 MAX.
0.119 MAX.
P
2.7
0.1
0.106+0.005
0.004
15. PACKAGE DRAWINGS
Remark The shape and material of the ES version are the same as those of the corresponding mass-produced
product.
85
PD784035, 784036, 784037, 784038
80 PIN PLASTIC QFP (14
14)
ITEM
MILLIMETERS
INCHES
NOTE
Each lead centerline is located within 0.13 mm (0.005 inch) of
its true position (T.P.) at maximum material condition.
P80GC-65-8BT
F
0.825
0.032
B
14.00
0.20
0.551+0.009
0.008
S
1.70 MAX.
0.067 MAX.
M
0.17
0.007+0.001
0.003
+0.03
0.07
+0.009
0.008
C
14.00
0.20
0.551+0.009
0.008
A
17.20
0.20
0.677
0.008
G
0.825
0.032
H
0.32
0.06
0.013+0.002
0.003
I
0.13
0.005
J
0.65 (T.P.)
0.026 (T.P.)
K
1.60
0.20
0.063
0.008
L
0.80
0.20
0.031+0.009
0.008
N
0.10
0.004
P
1.40
0.10
0.055
0.004
Q
0.125
0.075
0.005
0.003
R
3
3
+7
3
+7
3
D
17.20
0.20
0.677
0.008
41
60
40
61
21
80
20
1
M
S
Q
R
K
M
L
A
B
C
D
J
H
I
F
G
P
N
detail of lead end
Remark The shape and material of the ES version are the same as those of the corresponding mass-produced
product.
PD784035, 784036, 784037, 784038
86
Remark The shape and material of the ES version are the same as those of the corresponding mass-produced
product.
80 PIN PLASTIC TQFP (FINE PITCH) ( 12)
ITEM
MILLIMETERS
INCHES
I
J
0.5 (T.P.)
0.10
0.004
0.020 (T.P.)
A
NOTE
Each lead centerline is located within 0.10 mm (0.004 inch) of
its true position (T.P.) at maximum material condition.
S
A
14.0
0.2
0.551+0.009
0.008
B
12.0
0.2
0.472+0.009
0.008
C
12.0
0.2
0.472+0.009
0.008
D
14.0
0.2
0.551+0.009
0.008
F
G
1.25
1.25
0.049
0.049
H
0.22
0.009
0.002
P80GK-50-BE9-4
S
1.27 MAX.
0.050 MAX.
K
1.0
0.2
0.039+0.009
0.008
L
0.5
0.2
0.020+0.008
0.009
M
0.145
0.006
0.002
N
0.10
0.004
P
1.05
0.041
Q
0.05
0.05
0.002
0.002
R
5
5
5
5
+0.05
0.04
+0.055
0.045
B
C
D
J
H
I
G
F
P
N
L
K
M
Q
R
detail of lead end
M
61
60
41
40
21
20
1
80
87
PD784035, 784036, 784037, 784038
16. RECOMMENDED SOLDERING CONDITIONS
The conditions listed below shall be met when soldering the
PD784035,
PD784036,
PD784037, or
PD784038.
For details of the recommended soldering conditions, refer to our document Semiconductor Device Mounting
Technology Manual (C10535E).
Please consult with our sales offices in case any other soldering process is used, or in case soldering is done under
different conditions.
Table 16-1. Soldering Conditions for Surface-Mount Devices (1/2)
(1)
PD784035GC-
-3B9: 80-pin plastic QFP (14
14
2.7 mm)
PD784036GC-
-3B9: 80-pin plastic QFP (14
14
2.7 mm)
PD784037GC-
-3B9: 80-pin plastic QFP (14
14
2.7 mm)
PD784038GC-
-3B9: 80-pin plastic QFP (14
14
2.7 mm)
Caution Do not apply two or more different soldering methods to one chip (except for partial heating
method for terminal sections).
(2)
PD784035GC-
-8BT: 80-pin plastic QFP (14
14
1.4 mm)
PD784036GC-
-8BT: 80-pin plastic QFP (14
14
1.4 mm)
PD784037GC-
-8BT: 80-pin plastic QFP (14
14
1.4 mm)
PD784038GC-
-8BT: 80-pin plastic QFP (14
14
1.4 mm)
Caution Do not apply two or more different soldering methods to one chip (except for partial heating
method for terminal sections).
Soldering process
Soldering conditions
Symbol
Infrared ray reflow
Peak package's surface temperature: 235
C
IR35-00-3
Reflow time: 30 seconds or less (210
C or more)
Maximum allowable number of reflow processes: 3
VPS
Peak package's surface temperature: 215
C
VP15-00-3
Reflow time: 40 seconds or less (200
C or more)
Maximum allowable number of reflow processes: 3
Wave soldering
Solder temperature: 260
C or less
WS60-00-1
Flow time: 10 seconds or less
Number of flow processes: 1
Preheating temperature
: 120
C max. (measured on the package surface)
Partial heating method
Terminal temperature: 300
C or less
-
Heat time: 3 seconds or less (for one side of a device)
Soldering process
Soldering conditions
Symbol
Infrared ray reflow
Peak package's surface temperature: 235
C
IR35-00-2
Reflow time: 30 seconds or less (210
C or more)
Maximum allowable number of reflow processes: 2
VPS
Peak package's surface temperature: 215
C
VP15-00-2
Reflow time: 40 seconds or less (200
C or more)
Maximum allowable number of reflow processes: 2
Wave soldering
Solder temperature: 260
C or less
WS60-00-1
Flow time: 10 seconds or less
Number of flow processes: 1
Preheating temperature
: 120
C max. (measured on the package surface)
Partial heating method
Terminal temperature: 300
C or less
-
Heat time: 3 seconds or less (for one side of a device)
PD784035, 784036, 784037, 784038
88
Table 16-1. Soldering Conditions for Surface-Mount Devices (2/2)
(3)
PD784035GK-
-BE9: 80-pin plastic TQFP (fine pitch) (12
12 mm)
PD784036GK-
-BE9: 80-pin plastic TQFP (fine pitch) (12
12 mm)
PD784037GK-
-BE9: 80-pin plastic TQFP (fine pitch) (12
12 mm)
PD784038GK-
-BE9: 80-pin plastic TQFP (fine pitch) (12
12 mm)
Note
Maximum number of days during which the product can be stored at a temperature of 25
C and a relative
humidity of 65 % or less after dry-pack package is opened.
Caution Do not apply two or more different soldering methods to one chip (except for partial heating
method for terminal sections).
Soldering process
Infrared ray reflow
VPS
Partial heating method
Symbol
IR35-107-2
VP15-107-2
-
Soldering conditions
Peak package's surface temperature: 235
C
Reflow time: 30 seconds or less (210
C or more)
Maximum allowable number of reflow processes: 2
Exposure limit: 7 days
Note
(10 hours of pre-baking is required at 125
C
afterward)
<Caution>
Non-heat-resistant trays, such as magazine and taping trays, cannot be
baked before unpacking.
Peak package's surface temperature: 215
C
Reflow time: 40 seconds or less (200
C or more)
Maximum allowable number of reflow processes: 2
Exposure limit: 7 days
Note
(10 hours of pre-baking is required at 125
C
afterward)
<Caution>
Non-heat-resistant trays, such as magazine and taping trays, cannot be
baked before unpacking.
Terminal temperature: 300
C or less
Heat time: 3 seconds or less (for one side of a device)
89
PD784035, 784036, 784037, 784038
APPENDIX A DEVELOPMENT TOOLS
The following development tools are available for system development using the
PD784038.
See also (5).
(1) Language processing software
RA78K4
Assembler package for all 78K/IV series models
CC78K4
C compiler package for all 78K/IV series models
DF784038
Device file for
PD784038 sub-series models
CC78K4-L
C compiler library source file for all 78K/IV series models
(2) PROM write tools
PG-1500
PROM programmer
PA-78P4026GC
Programmer adaptor, connects to PG-1500
PA-78P4038GK
PA-78P4026KK
PG-1500 controller
Control program for PG-1500
(3) Debugging tools
When using the in-circuit emulator IE-78K4-NS
IE-78K4-NS
In-circuit emulator for all 78K/IV series models
IE-70000-MC-PS-B
Power supply unit for IE-78K4-NS
IE-70000-98-IF-C
Interface adapter when the PC-9800 series computer (other than a notebook)
is used as the host machine
IE-70000-CD-IF
PC card and interface cable when a PC-9800 series notebook is used as the
host machine
IE-70000-PC-IF-C
Interface adapter when the IBM PC/AT
TM
or compatible is used as the host
machine
IE-784038-NS-EM1
Note
Emulation board for evaluating
PD784038 sub-series models
NP-80GC
Emulation probe for 80-pin plastic QFP (GC-3B9 type)
NP-80GK
Note
Emulation probe for 80-pin plastic TQFP (GK-BE9 type)
EV-9200GC-80
Socket for mounting on target system board made for 80-pin plastic QFP
(GC-3B9 type)
TGK-080SDW
Adapter for mounting on target system board made for 80-pin plastic TQFP
(fine pitch) (GK-BE9 type)
EV-9900
Tool used to remove the
PD78P4038KK-T from the EV-9200GC-80
ID78K4-NS
Note
Integrated debugger for IE-78K4-NS
SM78K4-NS
System simulator for all 78K/IV series models
DF784038
Device file for
PD784038 sub-series models
Note
Under development
PD784035, 784036, 784037, 784038
90
When using the in-circuit emulator IE-784000-R
IE-784000-R
In-circuit emulator for all 78K/IV series models
IE-70000-98-IF-B
Interface adapter when the PC-9800 series computer (other than a notebook)
IE-70000-98-IF-C
Note
is used as the host machine
IE-70000-98N-IF
Interface adapter and cable when a PC-9800 series notebook is used as the
host machine
IE-70000-PC-IF-B
Interface adapter when the IBM PC/AT or compatible is used as the host
IE-70000-PC-IF-C
Note
machine
IE-78000-R-SV3
Interface adapter and cable when the EWS is used as the host machine
IE-784038-NS-EM1
Note
Emulation board for evaluating
PD784038 sub-series models
IE-784038-R-EM1
IE-78400-R-EM
Emulation board for all 78K/IV series models
IE-78K4-R-EX2
Note
Conversion board for 80 pins to use the IE-784038-NS-EM1 on the
IE-784000-R. The board is not needed when the conventional product
IE-784038-R-EM1 is used.
EP-78230GC-R
Emulation probe for 80-pin plastic QFP (GC-3B9 type)
EP-78054GK-R
Emulation probe for 80-pin plastic TQFP (fine pitch) (GK-BE9 type) for all
PD784038 sub-series
EV-9200GC-80
Socket for mounting on target system board made for 80-pin plastic QFP
(GC-3B9 type)
TGK-080SDW
Adapter for mounting on target system board made for 80-pin plastic TQFP
(fine pitch) (GK-BE9 type)
EV-9900
Tool used to remove the
PD78P4038KK-T from the EV-9200GC-80
ID78K4
Integrated debugger for IE-784000-R
SM78K4
System simulator for all 78K/IV series models
DF784038
Device file for
PD784038 sub-series models
Note Under development
(4) Real-time OS
RX78K/IV
Real-time OS for 78K/IV series models
MX78K4
OS for 78K/IV series models
91
PD784035, 784036, 784037, 784038
(5) Notes when using development tools
The ID78K-NS, ID78K4, and SM78K4 can be used in combination with the DF784038.
The CC78K and RX78K/IV can be used in combination with the RA78K4 and DF784038.
The NP-80GC is a product from Naito Densei Machida Mfg. Co., Ltd. (044-822-3813). Consult the NEC sales
representative for purchasing.
The TGK-080SDW is a product from TOKYO ELETECH CORPORATION.
Refer to: Daimaru Kogyo, Ltd.
Tokyo Electronic Components Division (03-3820-7112)
Osaka Electronic Components Division (06-244-6672)
The host machines and operating systems corresponding to each software are shown below.
Host machine
PC
EWS
[OS]
PC-9800 Series [Windows
TM
]
HP9000 Series 700
TM
[HP-UX
TM
]
IBM PC/AT and compatibles [Windows] SPARCstation
TM
[SunOS
TM
]
NEWS
TM
(RISC) [NEWS-OS
TM
]
Software
RA78K4
Note
CC78K4
Note
PG-1500 controller
Note
-
ID78K4-NS
-
ID78K4
SM78K4
-
RX78K/IV
Note
MX78K4
Note
Note Software under MS-DOS
PD784035, 784036, 784037, 784038
92
APPENDIX B RELATED DOCUMENTS
Documents Related to Devices
Document name
Document No.
Japanese
English
PD784031 Data Sheet
U11507J
U11507E
PD7840335, 784036, 784037, 784038
U10847J
This manual
PD78P4038 Data Sheet
U10848J
U10848E
PD784038, 784038Y Sub-Series User's Manual, Hardware
U11316J
U11316E
PD784038 Sub-Series Special Function Registers
U11090J
-
78K/IV Series User's Manual, Instruction
U10905J
U10905E
78K/IV Series Instruction Summary Sheet
U10594J
-
78K/IV Series Instruction Set
U10595J
-
78K/IV Series Application Note, Software Basic
U10095J
-
Documents Related to Development Tools (User's Manual)
Document name
Document No.
Japanese
English
RA78K4 Assembler Package
Operation
U11334J
U11334E
Language
U11162J
U11162E
RA78K Series Structured Assembler Preprocessor
U11743J
U11743E
CC78K4 C Compiler
Operation
U11572J
U11572E
Language
U11571J
U11571E
CC78K Series Library Source File
U12322J
U12322E
PG-1500 PROM Programmer
U11940J
U11940E
PG-1500 Controller PC-9800 Series (MS-DOS
TM
) Base
EEU-704
EEU-1291
PG-1500 Controller IBM PC Series (PC DOS
TM
) Base
EEU-5008
U10540E
IE-78K4-NS
Under creation
To be created
IE-784000-R
U12903J
EEU-1534
IE-784038-NS-EM1
To be created
To be created
IE-784038-R-EM1
U11383J
U11383E
EP-78230
EEU-985
EEU-1515
EP-78054GK-R
EEU-932
EEU-1468
SM78K4 System Simulator Windows Base
Reference
U10093J
U10093E
SM78K Series System Simulator
External Parts User Open
U10092J
U10092E
Interface Specifications
ID78K4 Integrated Debugger
Reference
U12796J
U12796E
ID78K4 Integrated Debugger Windows Base
Reference
U10440J
U10440E
ID78K4 Integrated Debugger HP-UX, SunOS, NEW-OS Base
Reference
U11960J
U11960E
Caution The above documents may be revised without notice. Use the latest versions when you design
application systems.
93
PD784035, 784036, 784037, 784038
Documents Related to Software to Be Incorporated into the Product (User's Manual)
Document name
Document No.
Japanese
English
78K/IV Series Real-Time OS
Basic
U10603J
U10603E
Installation
U10604J
U10604E
Debugger
U10364J
-
OS for 78K/IV Series MX78K4
Basic
U11779J
-
Other Documents
Document name
Document No.
Japanese
English
IC PACKAGE MANUAL
C10943X
Semiconductor Device Mounting Technology Manual
C10535J
C10535E
Quality Grades on NEC Semiconductor Device
C11531J
C11531E
NEC Semiconductor Device Reliability/Quality Control System
C10983J
C10983E
Guide to Prevent Damage for Semiconductor Devices by Electrostatic Discharge (ESD)
U11892J
E11892E
Semiconductor Device Quality Control/Reliability Handbook
C12769J
-
Guide for Products Related to Microcomputer: Other Companies
C11416J
-
Caution The above documents may be revised without notice. Use the latest versions when you design
application systems.
PD784035, 784036, 784037, 784038
94
NOTES FOR CMOS DEVICES
1
PRECAUTION AGAINST ESD FOR SEMICONDUCTORS
Note: Strong electric field, when exposed to a MOS device, can cause destruction of
the gate oxide and ultimately degrade the device operation. Steps must be taken
to stop generation of static electricity as much as possible, and quickly dissipate
it once, when it has occurred. Environmental control must be adequate. When
it is dry, humidifier should be used. It is recommended to avoid using insulators
that easily build static electricity. Semiconductor devices must be stored and
transported in an anti-static container, static shielding bag or conductive
material. All test and measurement tools including work bench and floor should
be grounded. The operator should be grounded using wrist strap. Semiconduc-
tor devices must not be touched with bare hands. Similar precautions need to
be taken for PW boards with semiconductor devices on it.
2
HANDLING OF UNUSED INPUT PINS FOR CMOS
Note: No connection for CMOS device inputs can be cause of malfunction. If no
connection is provided to the input pins, it is possible that an internal input level
may be generated due to noise, etc., hence causing malfunction. CMOS device
behave differently than Bipolar or NMOS devices. Input levels of CMOS devices
must be fixed high or low by using a pull-up or pull-down circuitry. Each unused
pin should be connected to V
DD
or GND with a resistor, if it is considered to have
a possibility of being an output pin. All handling related to the unused pins must
be judged device by device and related specifications governing the devices.
3
STATUS BEFORE INITIALIZATION OF MOS DEVICES
Note: Power-on does not necessarily define initial status of MOS device. Production
process of MOS does not define the initial operation status of the device.
Immediately after the power source is turned ON, the devices with reset function
have not yet been initialized. Hence, power-on does not guarantee out-pin
levels, I/O settings or contents of registers. Device is not initialized until the
reset signal is received. Reset operation must be executed immediately after
power-on for devices having reset function.
95
PD784035, 784036, 784037, 784038
IEBus is a trademark of NEC Corporation.
MS-DOS and Windows are either registered trademarks or trademarks of Microsoft Corporation in the United
States and/or other countries.
PC/AT and PC DOS are trademarks of IBM Corporation.
HP9000 series 700 and HP-UX are trademarks of Hewlett-Packard Company.
SPARCstation is a trademark of SPARC International, Inc.
SunOS is a trademark of Sun Microsystems, Inc.
NEWS and NEWS-OS are trademarks of SONY Corporation.
PD784035, 784036, 784037, 784038
96
NEC Electronics Inc. (U.S.)
Santa Clara, California
Tel: 408-588-6000
800-366-9782
Fax: 408-588-6130
800-729-9288
NEC Electronics (Germany) GmbH
Duesseldorf, Germany
Tel: 0211-65 03 02
Fax: 0211-65 03 490
NEC Electronics (UK) Ltd.
Milton Keynes, UK
Tel: 01908-691-133
Fax: 01908-670-290
NEC Electronics Italiana s.r.1.
Milano, Italy
Tel: 02-66 75 41
Fax: 02-66 75 42 99
NEC Electronics Hong Kong Ltd.
Hong Kong
Tel: 2886-9318
Fax: 2886-9022/9044
NEC Electronics Hong Kong Ltd.
Seoul Branch
Seoul, Korea
Tel: 02-528-0303
Fax: 02-528-4411
NEC Electronics Singapore Pte. Ltd.
United Square, Singapore 1130
Tel: 253-8311
Fax: 250-3583
NEC Electronics Taiwan Ltd.
Taipei, Taiwan
Tel: 02-719-2377
Fax: 02-719-5951
NEC do Brasil S.A.
Cumbica-Guarulhos-SP, Brasil
Tel: 011-6465-6810
Fax: 011-6465-6829
NEC Electronics (Germany) GmbH
Benelux Office
Eindhoven, The Netherlands
Tel: 040-2445845
Fax: 040-2444580
NEC Electronics (France) S.A.
Velizy-Villacoublay, France
Tel: 01-30-67 58 00
Fax: 01-30-67 58 99
NEC Electronics (France) S.A.
Spain Office
Madrid, Spain
Tel: 01-504-2787
Fax: 01-504-2860
NEC Electronics (Germany) GmbH
Scandinavia Office
Taeby, Sweden
Tel: 08-63 80 820
Fax: 08-63 80 388
Regional Information
Some information contained in this document may vary from country to country. Before using any NEC
product in your application, please contact the NEC office in your country to obtain a list of authorized
representatives and distributors. They will verify:
Device availability
Ordering information
Product release schedule
Availability of related technical literature
Development environment specifications (for example, specifications for third-party tools and
components, host computers, power plugs, AC supply voltages, and so forth)
Network requirements
In addition, trademarks, registered trademarks, export restrictions, and other legal issues may also vary
from country to country.
J97. 8
97
PD784035, 784036, 784037, 784038
[MEMO]
98
PD784035, 784036, 784037, 784038
Some related documents may be preliminary versions. Note, however, that whether a related document is preliminary is not
indicated in this document.
No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this
document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from use of a device described herein or any other liability arising
from use of such device. No license, either express, implied or otherwise, is granted under any patents,
copyrights or other intellectual property rights of NEC Corporation or others.
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on
a customer designated "quality assurance program" for a specific application. The recommended applications
of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each
device before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
Anti-radioactive design is not implemented in this product.
M4 96. 5
The export of this product from Japan is regulated by the Japanese government. To export this product may be prohibited
without governmental license, the need for which must be judged by the customer. The export or re-export of this product
from a country other than Japan may also be prohibited without a license from that country. Please call an NEC sales
representative.