Document Outline

• COVER
• Ordering Information
• 1. PIN FUNCTIONS
  • 1.1 Port Functions
  • 1.2 Functions Other than Ports (During Normal Operation)
  • 1.3 Functions Other Than Ports (During PROM Write, Verify, read)
  • 1.4 Recommended Conditions for Unused Pin
• 2. MEMORY CONFIGURATION
• 3. MEMORY EXTENSION
  • 3.1 MODE Pins
  • 3.2 MEMORY MAPPING Register (MM)
• 4. PROM PROGRAMMING
  • 4.1 PROM Programming Operation Mode
  • 4.2 PROM Write Procedure
  • 4.3 PROM Read Procedure
• 5. EPROM ERASE (ONLY PACKAGE PRODUCTS WITH CERAMIC WINDOW)
• 6. WINDOW SEAL (ONLY FOR PACKAGE PRODUCTS WITH CERAMIC WINDOW)
• 7. ONE-TIME PROM PRODUCT SCREENING
• 8. ELECTRICAL SPECIFICATIONS
• 9. CHARACTERISTIC CURVES (REFERENCE VALUE)
• 10. PACKAGE INFORMATION
• 11. RECOMMENDED CONDITIONS FOR SOLDERING
• 12. DIFFERENCES BETWEEN uPD78CP14 AND MASK ROM PRODUCTS
• APPENDIX A. DEVELOPMENT TOOLS
• APPENDIX B. PACKAGE INFORMATION OF CONVERSION SOCKETS AND RECOMMENDED PATTERNS FOR BOARD FIXING