GaAs INTEGRATED CIRCUIT
P
P
P
P
PG152TA
L-BAND SPDT SWITCH
1996
Document No. P12398EJ2V1DS00 (2nd edition)
Date Published January 1998 N CP(K)
Printed in Japan
DATA SHEET
DESCRIPTION
The
P
PG152TA is an L-band SPDT (Single Pole Double Throw) GaAs FET switch which was developed for digital
cellular or cordless telephone application. The device can operate from 100 MHz to 2.5 GHz, having the low
insertion loss.
It housed in as original 6 pin mini-mold that is smaller than usual 8 pin SSOP and easy to install and contributes to
miniaturizing the system. It can be used in wide-band switching applications.
FEATURES
Low insertion loss
: L
INS
= 0.6 dB typ. @ f = 2 GHz
High power switching : P
in
(1 dB)
= +30 dBm typ. @ V
CONT
= +3.0 V/0 V, f = 2 GHz
Small 6 pin mini-mold
APPLICATION
Digital cordless telephone
: PHS, DECT, PCS etc.
Digital hand-held cellular phone: PDC Antenna diversity etc.
ORDERING INFORMATION
PART NUMBER
PACKAGE
PACKING FORM
P
PG152TA-E3
6 pins Mini-mold
Carrier tape width 8 mm, 1 pin faces toward the open end of the tape,
3000 pcs/Reel
Remark
For evaluation sample order, please contact your local NEC sales office.
(Part number for sample order:
P
PG152TA)
ABSOLUTE MAXIMUM RATINGS (T
A
= 25 C)
PARAMETERS
SYMBOL
RATING
UNIT
Control Voltage 1, 2
V
CONT1, 2
6.0 to +6.0
Note
V
Input Power
P
in
+31
dBm
Total Power Dissipation
P
tot
0.4
W
Operating Temperature
T
A
50 to +80
C
Storage Temperature
T
stg
65 to +150
C
Note
Condition 2.7
d
| V
CONT1
- V
CONT 2
|
d
6.0 V
Caution
The IC must be handled with care to prevent static discharge because its circuit is composed of
GaAs MES FET.
2
P
P
P
P
PG152TA
PIN CONNECTION DIAGRAM
PIN No.
CONNECTION
PIN No.
CONNECTION
1
OUT1
4
V
CONT 2
2
GND
5
IN
3
OUT2
6
V
CONT 1
RECOMMENDED OPERATING CONDITIONS (T
A
= 25 C)
PARAMETERS
SYMBOL
MIN.
TYP.
MAX.
UNIT
Control Voltage (OFF)
V
CONT
+2.7
+3.0
+5.3
V
Control Voltage (ON)
V
CONT
0.2
0
+0.2
V
Input Power (V
CONT
= 3 V/0 V)
P
in
+27
+29
dBm
ELECTRICAL CHARACTERISTICS (Unless otherwise specified, T
A
= 25 C, V
CONT1
= 3 V,
V
CONT2
= 0 V or V
CONT1
= 0 V, V
CONT2
= 3 V, Off chip DC blocking capacitors value; 51 pF)
CHARACTERISTICS
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
UNIT
Insertion Loss
L
INS
f = 100 M to 2 GHz
0.6
1.0
dB
f = 2.5 GHz
0.8
Note 1
Isolation
ISL
f = 100 M to 2 GHz
20
22
dB
f = 2.5 GHz
20
Note 1
Input Return Loss
RI
in
f = 100 M to 2 GHz
11
dB
Output Return Loss
RI
out
f = 100 M to 2 GHz
11
dB
Input Power at 1 dB
Compression Point
Note 2
P
in(1 dB)
f = 1 GHz to 2 GHz
27
30
dBm
Switching Speed
t
sw
30
ns
Control Current
I
CONT
V
CONT
= 3 V/0 V RF None
5
P
A
Notes 1 Characteristic for reference at 2.0 to 2.5 GHz
2 Pin(1 dB) is measured the input power level when the insertion loss increase more 1 dB than that of
linear range. All other characteristics are measured in linear range.
3 When the
P
PG152TA is used it is necessary to use DC blocking capacitors for No.1 (OUT1), No.3
(OUT2) and No.5 (IN). The value of DC blocking capacitors should be chosen to accommodate the
frequency of operation, band width, switching speed and the condition with actual board of your system.
The range of recommended DC blocking capacitor value is less than 100 pF.
4 The distance between IC's GND pin and ground pattern of substrate should be as shorter as possible to
avoid parasitic parameters.
3
2
1
4
5
6
(Top View)
4
5
6
3
2
1
(Bottom View)
3
P
P
P
P
PG152TA
TYPICAL CHARACTERISTICS (T
A
= 25 C)
Note
This data is including loss of the test fixture
+2.0
+1.0
0
1.0
2.0
3.0
100 M
200 M
500 M
1 G
2 G 3 G
V
CONT1
= 0 V
V
CONT2
= +3 V
P
in
= 0 dBm
IN-OUT1 INSERTION LOSS vs. FREQUENCY
L
INS
- Insertion Loss - dB
f - Frequency - Hz
IN
L
INS
OUT2
50
OUT1
0
10
20
30
40
50
ISL - Isolation - dB
IN-OUT1 ISOLATION vs. FREQUENCY
V
CONT1
= +3 V
V
CONT2
= 0 V
P
in
= 0 dBm
100 M
200 M
500 M
1 G
2 G 3 G
f - Frequency - Hz
IN
ISL
OUT2
50
OUT1
+10
0
10
20
30
40
RL
in
- Input Return Loss - dB
IN-OUT1 INPUT RETURN LOSS vs. FREQUENCY
V
CONT1
= 0 V
V
CONT2
= +3 V
P
in
= 0 dBm
100 M
200 M
500 M
1 G
2 G 3 G
f - Frequency - Hz
IN
RL
in
OUT2
50
OUT1
+10
0
10
20
30
40
RL
out
- Output Return Loss - dB
IN-OUT1 OUTPUT RETURN LOSS vs. FREQUENCY
V
CONT1
= 0 V
V
CONT2
= +3 V
P
in
= 0 dBm
100 M
200 M
500 M
1 G
2 G 3 G
f - Frequency - Hz
IN
RL
out
OUT2
50
OUT1
4
P
P
P
P
PG152TA
+2.0
+1.0
0
1.0
2.0
3.0
100 M
200 M
500 M
1 G
2 G 3 G
V
CONT1
= +3 V
V
CONT2
= 0 V
P
in
= 0 dBm
IN-OUT2 INSERTION LOSS vs. FREQUENCY
L
INS
- Insertion Loss - dB
f - Frequency - Hz
IN
L
INS
OUT2
50
OUT1
0
10
20
30
40
50
ISL - Isolation - dB
IN-OUT2 ISOLATION vs. FREQUENCY
V
CONT1
= 0 V
V
CONT2
= +3 V
P
in
= 0 dBm
100 M
200 M
500 M
1 G
2 G 3 G
f - Frequency - Hz
+10
0
10
20
30
40
RL
in
- Input Return Loss - dB
IN-OUT2 INPUT RETURN LOSS vs. FREQUENCY
V
CONT1
= +3 V
V
CONT2
= 0 V
P
in
= 0 dBm
100 M
200 M
500 M
1 G
2 G 3 G
f - Frequency - Hz
RL
in
+10
0
10
20
30
40
RL
out
- Output Return Loss - dB
IN-OUT2 OUTPUT RETURN LOSS vs. FREQUENCY
V
CONT1
= +3 V
V
CONT2
= 0 V
P
in
= 0 dBm
100 M
200 M
500 M
1 G
2 G 3 G
f - Frequency - Hz
IN
RL
out
OUT2
50
OUT1
IN
ISL
OUT2
50
OUT1
IN
OUT2
50
OUT1
5
P
P
P
P
PG152TA
Temperature characteristics
P
out
(dBm)
34
32
30
28
26
24
22
20
18
Temperature Characteristics of Input/Output
V
CONT1
= +3.0 V
V
CONT2
= 0 V
f = 2 GHz
Non-modulated
Signal input (cw)
T
A
= 50
C
T
A
= 10
C
T
A
= 30
C
T
A
= 50
C
T
A
= 90
C
18
20
22
24
26
28
30
32
34
36
P
in
(dBm)
6
P
P
P
P
PG152TA
TEST CIRCUIT
T
A
= 25 C, V
CONT1
= +3 V, V
CONT2
= 0 V or V
CONT1
= 0 V, V
CONT2
= +3 V, f = 2 GHz
Off chip DC blocking capacitors value; 51 pF, Using NEC standard evaluation board
Z
O
= 50
1000 pF
51 pF
V
CONT1
OUT1
1
4
IN
1000 pF
6
3
51 pF
Z
O
= 50
Z
O
= 50
51 pF
V
CONT2
OUT2
6 PIN MINI-MOLD PACKAGE DIMENSIONS (UNIT: mm)
2.8
+0.2
0.3
0 to 0.1
1.5
+0.2
0.1
0.3
+0.1
0.0
1
2
3
6
5
4
0.95
0.95
1.9
2.9 0.2
0.13 0.1
0.8
1.1
+0.2
0.1
7
P
P
P
P
PG152TA
TRUTH TABLE OF SWITCHING BY CONDITION OF CONTROL VOLTAGE
V
CONT1
+3 V
0 V
+3 V
0 V
EVALUATION BOARD
OUT1
OUT2
UPG152TA
V
CONT1
V
CONT2
RF IN
0.4 mm thickness
teflon glass
IN
OUT1
OUT2
IN
OUT1
OUT2
IN
OUT1
OUT2
IN
OUT1
OUT2
V
CONT2
8
P
P
P
P
PG152TA
RECOMMENDED SOLDERING CONDITIONS
This Product should be soldered in the following recommended conditions. Other soldering methods and
conditions than the recommended conditions are to be consulted with our sales representatives.
Soldering process
Soldering conditions
Recommended condition
symbol
Infrared ray reflow
Package peak temperature: 235 C
Hour: within 30 s. (more than 210 C)
Time: 3 times, Limited days: no.
Note
IR35-00-3
VPS
Package peak temperature: 215 C
Hour: within 40 s. (more than 200 C)
Time: 3 times, Limited days: no.
Note
VP15-00-3
Wave Soldering
Soldering tub temperature: less than 260 C, Hour: within 10 s.
Time: 1 time, Limited days: no.
Note
WS60-00-1
Pin part heating
Pin area temperature: less than 300 C, Hour: within 3 s.
Limited days: no.
Note
Note
It is the storage days after opening a dry pack, the storage conditions are 25 C, less than 65 %, RH.
Caution
The combined use of soldering method is to be avoided (However, except the pin area heating
method).
For details of recommended soldering conditions for surface mounting, refer to information document
SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
9
P
P
P
P
PG152TA
[MEMO]
10
P
P
P
P
PG152TA
[MEMO]
11
P
P
P
P
PG152TA
[MEMO]
P
P
P
P
PG152TA
Caution
The Great Care must be taken in dealing with the devices in this guide.
The reason is that the material of the devices is GaAs (Gallium Arsenide), which is
designated as harmful substance according to the law concerned.
Keep the law concerned and so on, especially in case of removal.
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this
document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from use of a device described herein or any other liability arising
from use of such device. No license, either express, implied or otherwise, is granted under any patents,
copyrights or other intellectual property rights of NEC Corporation or others.
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on
a customer designated "quality assurance program" for a specific application. The recommended applications
of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each
device before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
Anti-radioactive design is not implemented in this product.
M4 96. 5
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