FEATURES
NEC's 1.5W
L, S-BAND SPDT SWITCH
DESCRIPTION
UPG2179TB
NEC's UPG2179TB is a GaAs MMIC L, S-band SPDT (Single
Pole Double Throw) switch for mobile phone and
L, S-band applications from 0.5 to 3.0 GHz.
This device can operate with 2.5 to 5.3 V from 50 MHz to
3 GHz with low insertion loss and high isolation.
The UPG2179TB is housed in a Pb-Free 6-pin super minimold
package suitable for high-density surface mounting.
APPLICATIONS
L, S-band digital cellular and cordless telephones
PCS, W-LAN, WLL and Bluetooth
TM
Short Range Wireless
California Eastern Laboratories
ORDERING INFORMATION
Remark To order evaluation samples, contact your nearby sales of ce.
Part number for sample order: UPG2179TB-A
Caution
Observe precautions when handling because these devices are sensitive to electrostatic discharge.
SWITCH CONTROL VOLTAGE:
V
cont (H)
= 2.5 to 5.3 V (3.0 V TYP.)
V
cont (L)
= -0.2 to +0.2 V (0 V TYP.)
LOW INSERTION LOSS:
0.25 dB TYP. @ 0.5 to 1.0 GHz, V
cont
= 3.0 V/0 V
0.30 dB TYP. @ 1.0 to 2.0 GHz, V
cont
= 3.0 V/0 V
0.35 dB TYP. @ 2.0 to 2.5 GHz, V
cont
= 3.0 V/0 V
0.40 dB TYP. @ 2.0 to 3.0 GHz, V
cont
= 3.0 V/0 V
HIGH ISOLATION:
27 dB TYP. @ 0.5 to 2.0 GHz
,
V
cont
= 3.0 V/0 V
24 dB TYP. @ 2.0 to 2.5 GHz
,
V
cont
= 3.0 V/0 V
HIGH POWER:
P
in (0.1 dB)
= +29.0 dBm TYP. @ 0.5 to 3.0 GHz, V
cont
= 3.0 V/0 V
P
in (1 dB)
= +32.0 dBm TYP. @ 0.5 to 3.0 GHz, V
cont
= 3.0 V/0 V
HIGH-DENSITY SURFACE MOUNT PACKAGE:
6-pin super minimold package (2.0 1.25 0.9 mm)
PB-FREE
PART NUMBER
PACKAGE
MARKING
SUPPLYING FORM
UPG2179TB-E4-A
6-pin super minimold
G4C
Embossed tape 8 mm wide
Pin 4, 5, 6 face the perforation side of the tape
Qty 3 kpcs/reel
UPG2179TB
TRUTH TABLE
RECOMMENDED OPERATING RANGE
(T
A
= 25C, unless otherwise speci ed)
PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM
Pin No.
Pin Name
1
OUTPUT1
2
GND
3
OUTPUT2
4
V
cont2
5
INPUT
6
V
cont1
(Top View)
1
2
3
6
5
4
G4C
(Bottom View)
6
5
4
1
2
3
(Top View)
1
2
3
6
5
4
ABSOLUTE MAXIMUM RATINGS
(T
A
= 25C, unless otherwise speci ed)
V
CONT1
V
CONT2
INPUT-OUTPUT1
INPU-OUTPUT2
Low
High
ON
OFF
High
Low
OFF
ON
PARAMETER
SYMBOL
RATINGS
UNIT
Switch Control Voltage
V
cont
6.0
V
Input Power
P
in
+33
dBm
Operating Ambient Temperature
T
A
-45 to +85
C
Storage Temperature
T
stg
-55 to +150
C
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
UNIT
Switch Control Voltage (H)
V
cont (H)
2.5
3.0
5.3
V
Switch Control Voltage (L)
V
cont (L)
-0.2
0
0.2
V
Note |V
cont1
V
cont2
| 6.0 V
ELECTRICAL CHARACTERISTICS
(T
A
= +25C, V
cont
= 3.0 V/0V, DC blocking capacitors = 100 pF, unless otherwise speci ed)
UPG2179TB
Caution It is necessary to use DC blocking capacitors with this device.
The value of DC blocking capacitors should be chosen to accommodate the frequency of operation, bandwidth,
switching speed and the condition with the actual board of your system. The range of recommended
DC blocking capacitor value is less than 100 pF for frequencies above 0.5 GHz, and 1,000 pF for frequencies
below 0.5 GHz.
PARAMETER
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
UNIT
Insertion Loss 1
L
INS1
f = 0.5 to 1.0 GHz
Note1
-
0.25
0.45
dB
Insertion Loss 2
L
INS2
f = 1.0 to 2.0 GHz
-
0.30
0.50
dB
Insertion Loss 3
L
INS3
f = 2.0 to 2.5 GHz
-
0.35
0.55
dB
Insertion Loss 4
L
INS4
f = 2.5 to 3.0 GHz
-
0.40
0.60
dB
Isolation 1
ISL
1
f = 0.5 to 2.0 GHz
Note1
23
27
-
dB
Isolation 2
ISL
2
f = 2.0 to 3.0 GHz
20
24
-
dB
Input Return Loss
RL
in
f = 0.5 to 3.0 GHz
Note1
15
20
-
dB
Output Return Loss
RL
out
f = 0.5 to 3.0 GHz
Note1
15
20
-
dB
0.1 dB Loss Compression
Input Power
Note2
P
in (0.1 dB)
f = 2.0 GHz
+25.5
+29.0
-
dBm
f = 2.5 GHz
+25.5
+29.0
-
dBm
f = 0.5 to 3.0 GHz
-
+29.0
-
dBm
Switch Control Current
I
cont
No signal
-
4
20
A
Switch Control Speed
t
SW
50%CTL to 90/10%RF
-
50
500
ns
Note 1. DC blocking capacitor = 1 000pF at f = 0.05 to 0.5 GHz.
2. P
in(0.1 dB)
is the measured input power level when the insertion loss increases 0.1 dB more than that of linear range.
STANDARD CHARACTERISTICS FOR REFERENCE
(T
A
= +25C, V
cont
= 3.0 V/0 V, DC blocking capacitors = 100 pF, unless otherwise speci ed)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
UNIT
1 dB Loss Compression
Input Power
Note
P
in (1 dB)
f = 0.5 to 3.0 GHz
-
+32.0
-
dBm
3rd Order Intermodulation Intercept
Point
IIP
3
f = 0.5 to 3.0 GHz, 2 tone,
5 MHz spacing
-
+60.0
-
dBm
Note P
in (1 dB)
is the measured input power level when the insertion loss increases 1 dB more than that of linear range.
UPG2179TB
EVALUATION CIRCUIT
(
V
cont1
= 3.0 V, V
cont2
= 0 V or V
cont2
= 0 V, V
cont1
= 3.0 V, off chip DC blocking capacitors value C1 = 51 pF, C2 = 1 000 pF
(Bypass), using NEC standard evaluation board)
OUTPUT2
OUTPUT1
56 pF
56 pF
6
5
4
1
2
3
V
cont2
V
cont1
INPUT
56 pF
1 000 pF
1 000 pF
This application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
UPG2179TB
ILLUSTRATION OF TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
C3
C5
C1
C
2
C
4
G4C
6pin SMM SPDT SW
Vc2
Vc1
IN
OUT 2
OUT 1
C1
C1
C1
C2
C2
V
cont2
OUTPUT2
INPUT
OUTPUT1
V
cont1
USING THE NEC EVALUATION BOARD
SYMBOL
VALUES
C1, C2, C3
100 pF
C4, C5
1 000 pF
UPG2179TB
TYPICAL CHARACTERISTICS
(T
A
= +25C, V
cont
= 3.0 V/0 V, DC blocking capacitors = 100 pF, unless otherwise speci ed)
Remark The graphs indicate nominal characteristics.
0.5
0.4
0.2
0.3
0.1
0
-0.1
-0.2
-0.3
-0.4
-0.5
0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5
Insertion Loss L
INS
(dB)
Frequency f (GHz)
INSERTION LOSS vs. FREQUENCY
INPUT-OUTPUT1
50
40
30
-10
20
10
0
-30
-20
-40
-50
0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5
Isolation ISL
(dB)
Frequency f (GHz)
ISOLATION vs. FREQUENCY
INPUT-OUTPUT1
50
10
20
30
40
-10
0
-30
-20
-40
-50
0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5
Input Return Loss RL
in
(dB)
Frequency f (GHz)
INPUT RETURN LOSS vs. FREQUENCY
INPUT-OUTPUT1
50
10
20
30
40
-10
0
-30
-20
-40
-50
0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5
Isolation ISL
(dB)
Frequency f (GHz)
ISOLATION vs. FREQUENCY
INPUT-OUTPUT2
50
10
20
30
40
-10
0
-30
-20
-40
-50
0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5
Input Return Loss RL
in
(dB)
Frequency f (GHz)
INPUT RETURN LOSS vs. FREQUENCY
INPUT-OUTPUT2
0.5
0.4
0.3
0.2
0
0.1
-0.1
-0.2
-0.3
-0.4
-0.5
0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5
Insertion Loss L
INS
(dB)
Frequency f (GHz)
INSERTION LOSS vs. FREQUENCY
INPUT-OUTPUT2
UPG2179TB
33
13
15
31
29
27
25
23
21
19
17
15 14
19
21 23
25
27
29
31
33
35
Output Power P
out
(dBm)
Input Power P
in
(dBm)
OUTPUT POWER vs. INPUT POWER
f = 2.5 GHz
23
25
27
29
31
33
13
15
17
19
21
15
17
19
21
23
25
27
29
31
33 35
Output Power P
out
(dBm)
Input Power P
in
(dBm)
OUTPUT POWER vs. INPUT POWER
f = 1.0 GHz
50
10
20
30
40
-10
0
-30
-20
-40
-50
0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5
Output Return Loss RL
out
(dB)
Frequency f (GHz)
OUTPUT RETURN LOSS vs. FREQUENCY
INPUT-OUTPUT1
50
10
20
30
40
-10
0
-30
-20
-40
-50
0.5 0.8 1.1 1.4 1.7 2.0 2.3 2.6 2.9 3.2 3.5
Output Return Loss RL
out
(dB)
Frequency f (GHz)
OUTPUT RETURN LOSS vs. FREQUENCY
INPUT-OUTPUT2
Remark The graphs indicate nominal characteristics.
PACKAGE DIMENSIONS
6-PIN SUPER MINIMOLD (UNIT: mm)
UPG2179TB
0.90.1
0.7
0 to 0.1
0.15
+0.1 -0.05
0.2
+0.1 -0.05
2.00.2
1.3
0.65
0.65
1.250.1
2.10.1
0.1 MIN.
5-148
UPG2179TB
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering
methods and conditions other than those recommended below, contact your nearby sales of ce.
Soldering Method
Soldering Conditions
Condition Symbol
Infrared Re ow
Peak temperature (package surface temperature)
: 260C or below
Time at peak temperature
: 10 seconds or less
Time at temperature of 220C or higher
: 60 seconds or less
Preheating time at 120 to 180C :
12030 seconds
Maximum number of re ow processes
: 3 times
Maximum chlorine content of rosin ux (% mass)
: 0.2%(Wt.) or below
IR260
VPS
Peak temperature (package surface temperature)
: 215C or below
Time at temperature of 200C or higher
: 25 to 40 seconds
Preheating time at 120 to 150C
: 30 to 60 seconds
Maximum number of re ow processes
: 3 times
Maximum chlorine content of rosin ux (% mass)
: 0.2%(Wt.) or below
VP215
Wave Soldering
Peak temperature (molten solder temperature)
: 260C or below
Time at peak temperature
: 10 seconds or less
Preheating temperature (package surface temperature) : 120C or below
Maximum number of ow processes
: 1 time
Maximum chlorine content of rosin ux (% mass)
: 0.2%(Wt.) or below
WS260
Partial Heating
Peak temperature (pin temperature)
: 350C or below
Soldering time (per side of device)
: 3 seconds or less
Maximum chlorine content of rosin ux (% mass)
: 0.2%(Wt.) or below
HS350
Life Support Applications
These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably
be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and
agree to fully indemnify CEL for all damages resulting from such improper use or sale.
A Business Partner of NEC Compound Semiconductor Devices, Ltd.
06/01/2004
Caution
Do not use different soldering methods together (except for partial heating).
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