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Электронный компонент: UPG2304TK

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Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.
The information in this document is subject to change without notice. Before using this document, please confirm that
this is the latest version.
Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices
representative for availability and additional information.
L-BAND VCO LOCAL BUFFER AMPLIFIER
GaAs HBT INTEGRATED CIRCUIT



PG2304TK
Document No. PG10162EJ01V0DS (1st edition)
Date Published May 2002 CP(K)
Printed in Japan
NEC Compound Semiconductor Devices 2002
DATA SHEET
DESCRIPTION
The
PG2304TK is GaAs HBT MMIC for VCO local buffer amplifier which were developed for mobile phone and
another L-band application.
This device realizes excellent performance by using InGaP HBT. This device is housed in a 6-pin lead-less
minimold package (1511). And this package is able to high-density surface mounting.
FEATURES
Operation frequency
: f
opt1
= 679 to 768 MHz (720 MHz TYP.)
: f
opt2
= 1 270 to 1 371 MHz (1 320 MHz TYP.)
Supply voltage
: V
CC
= 2.7 to 2.9 V (2.8 V TYP.)
Low current consumption
: I
CC
= 3.5 mA TYP.@ V
CC
= 2.8 V
Excellent isolation
: ISL
1
= 40 dB TYP. @ f
opt1
= 720 MHz, P
in
=
-
4 dBm, V
CC
= 2.8 V
: ISL
2
= 35 dB TYP. @ f
opt2
= 1 320 MHz, P
in
=
-
4 dBm, V
CC
= 2.8 V
High-density surface mounting : 6-pin lead-less minimold package (1.5
1.1
0.55 mm)
APPLICATION
VCO Buffer Amplifier etc.
ORDERING INFORMATION
Part Number
Package
Marking
Supplying Form
PG2304TK-E2
6-pin lead-less minimold
(1511)
G3F
Embossed tape 8 mm wide
Pin 1, 6 face the perforation side of the tape
Qty 5 kpcs/reel
Remark To order evaluation samples, contact your nearby sales office.
Part number for sample order:
PG2304TK
Data Sheet PG10162EJ01V0DS
2



PG2304TK
PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM
Pin No.
Pin Name
1
OUTPUT2 (1.5 GHz) / V
CC
2
GND
3
OUTPUT1 (800 MHz) / V
CC
4
INPUT1 (800 MHz)
5
N.C.
6
INPUT2 (1.5 GHz) / V
SW
TRUTH TABLE
V
SW
= 0 V
V
SW
= 2.8 V
INPUT1 - OUTPUT1
High
Low
INPUT2 - OUTPUT2
Low
High
ABSOLUTE MAXIMUM RATINGS (T
A
= +25



C, unless otherwise specified)
Parameter
Symbol
Ratings
Unit
Supply Voltage
V
CC
4.0
V
Switch Voltage
V
SW
4.0
V
Input Power
P
in
+10
dBm
Power Dissipation
P
D
125
Note
mW
Operating Ambient Temperature
T
A
-
30 to +85
C
Storage Temperature
T
stg
-
65 to +150
C
Circuit Current
I
CC
15
mA
Control Current
I
SW
0.3
mA
Note Mounted on double-sided copper-clad 50
50
1.6 mm epoxy glass PWB, T
A
= +85
C
RECOMMENDED OPERATING RENGE (T
A
= +25



C)
Parameter
Symbol
MIN.
TYP.
MAX.
Unit
Operating Frequency 1
f
opt1
679
720
768
MHz
Operating Frequency 2
f
opt2
1 270
1 320
1 371
MHz
Supply Voltage
V
CC
2.7
2.8
2.9
V
Switch Voltage 1
V
SW1
2.7
2.8
2.9
V
Switch Voltage 2
V
SW2
0
-
0.5
V
Top View
Top View
1
2
3
4
5
6
G3F
1
2
3
4
5
6
SW Circuit
Data Sheet PG10162EJ01V0DS
3



PG2304TK
ELECTRICAL CHARACTERISTICS
(T
A
= +25



C, V
CC
= 2.8 V, P
in
=
-
-
-
-
4 dBm, External input and output matching, unless otherwise
specified)
Parameter
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
Circuit Current 1
I
CC1
V
SW
= 0 V
-
3.5
4.0
mA
Circuit Current 2
I
CC2
V
SW
= 2.8 V
-
3.5
4.0
mA
Power Gain 1
G
P1
V
SW
= 0 V, f = 720 MHz
-
2
0
+2
dB
Power Gain 2
G
P2
V
SW
= 2.8 V, f = 1 320 MHz
-
2
0
+2
dB
Input Return Loss 1
RL
in1
V
SW
= 0 V, f = 720 MHz
-
10
-
dB
Input Return Loss 2
RL
in2
V
SW
= 2.8 V, f = 1 320 MHz
-
10
-
dB
Output Return Loss 1
RL
out1
V
SW
= 0 V, f = 720 MHz
-
5
-
dB
Output Return Loss 2
RL
out2
V
SW
= 2.8 V, f = 1 320 MHz
-
5
-
dB
Isolation 1
ISL
1
V
SW
= 0 V, f = 720 MHz
30
40
-
dB
Isolation 2
ISL
2
V
SW
= 2.8 V, f = 1 320 MHz
30
35
-
dB
Noise Figure 1
NF
1
V
SW
= 0 V, f = 720 MHz
-
8.5
9.5
dB
Noise Figure 2
NF
2
V
SW
= 2.8 V, f = 1 320 MHz
-
7.0
8.0
dB
Data Sheet PG10162EJ01V0DS
4



PG2304TK
EVALUATION CIRCUIT (V
CC
= 2.8 V, P
in
=
-
-
-
-
4 dBm)
100 pF
OUTPUT2
56
1.5 pF
OUTPUT1
68
INPUT1
1.0 pF
1 000 pF
V
CC
270
INPUT2
V
CC
270
V
SW
1 000 pF
68 k
1
2
3
4
5
6
SW Circuit
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
Data Sheet PG10162EJ01V0DS
5



PG2304TK
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
C4
C4
R3
C3
C1
R4
R1
C2
R2
R3
Vsw
Vcc
Dual HBT LNA
6pin L2MM
800 M OUT
1.5 G OUT
Vcc
800 M IN
1.5 G IN
USING THE NEC EVALUATION BOARD
Symbol
Values
Part Number
Maker
R1
56
RR0816P-560-D
Susumu
R2
68
RR0816P-680-D
Susumu
R3
270
RR0816P-271-D
Susumu
R4
68 k
RR0816P-683-D
Susumu
C1
1 pF
GRM39CH010C50PB
muRata
C2
1.5 pF
GRM39CH1R5C50PB
muRata
C3
100 pF
GRM39CH101J50PB
muRata
C4
1 000 pF
GRM39CH102J25PB
muRata
Data Sheet PG10162EJ01V0DS
6



PG2304TK
TYPICAL CHARACTERLISTICS (T
A
= +25



C, unless otherwise specified)
INPUT1 - OUTPUT1
Input Power P
in
(dBm)
Circuit Current I
CC
(mA)
0
3
2
1
4
5
Operating Ambient Temperature T
A
(C)
Circuit Current I
CC
(mA)
0
1
2
3
4
5
Input Power P
in
(dBm)
Output P
o
w
er P
out
(dBm)
15
10
5
0
+5
20
20
+5
Operating Ambient Temperature T
A
(C)
P
o
w
er Gain G
P
(dB)
20
0
+20
+40
+100
+60
40
3
+1
0
1
2
+2
+3
15
10
5
0
15
10
5
0
+5
20
+80
20
0
+20
+40
+100
+60
40
+80
f = 720 MHz,
V
CC
= 2.8 V,
V
SW
= 0 V
f = 720 MHz,
V
CC
= 2.8 V,
V
SW
= 0 V
f = 720 MHz,
P
in
= 4 dBm
V
CC
= 2.8 V,
V
SW
= 0 V
f = 720 MHz,
P
in
= 4 dBm
V
CC
= 2.8 V,
V
SW
= 0 V
CIRCUIT CURRENT vs. INPUT POWER
CIRCUIT CURRENT vs.
OPERATING AMBIENT TEMPERATURE
OUTPUT POWER vs. INPUT POWER
POWER GAIN vs.
OPERATING AMBIENT TEMPERATURE
Remark The graphs indicate nominal characteristics.
Data Sheet PG10162EJ01V0DS
7



PG2304TK
INPUT2 - OUTPUT2
0
3
2
1
4
5
0
1
2
3
4
5
15
10
5
0
+5
20
20
+5
20
0
+20
+40
+100
+60
40
3
+1
0
1
2
+2
+3
15
10
5
0
15
10
5
0
+5
20
+80
20
0
+20
+40
+100
+60
40
+80
f = 1 320 MHz,
V
CC
= 2.8 V,
V
SW
= 2.8 V
f = 1 320 MHz,
V
CC
= 2.8 V,
V
SW
= 2.8 V
f = 1 320 MHz,
P
in
= 4 dBm
V
CC
= 2.8 V,
V
SW
= 2.8 V
f = 1 320 MHz,
P
in
= 4 dBm
V
CC
= 2.8 V,
V
SW
= 2.8 V
Circuit Current I
CC
(mA)
Operating Ambient Temperature T
A
(C)
Circuit Current I
CC
(mA)
Input Power P
in
(dBm)
Output P
o
w
er P
out
(dBm)
Operating Ambient Temperature T
A
(C)
P
o
w
er Gain G
P
(dB)
CIRCUIT CURRENT vs. INPUT POWER
CIRCUIT CURRENT vs.
OPERATING AMBIENT TEMPERATURE
OUTPUT POWER vs. INPUT POWER
POWER GAIN vs.
OPERATING AMBIENT TEMPERATURE
Input Power P
in
(dBm)
Remark The graphs indicate nominal characteristics.
Data Sheet PG10162EJ01V0DS
8



PG2304TK
PACKAGE DIMENSIONS
6-PIN LEAD-LESS MINIMOLD (1511) (UNIT: mm)
(0.48)
(0.48)
(0.96)
1.50.1
1.30.1
1.10.1
0.550.05
0.11
+0.1
0.05
0.16
+0.1
0.05
Remark () : Reference value
Data Sheet PG10162EJ01V0DS
9



PG2304TK
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Soldering Conditions
Condition Symbol
Infrared Reflow
Peak temperature (package surface temperature)
: 260
C or below
Time at peak temperature
: 10 seconds or less
Time at temperature of 220
C or higher
: 60 seconds or less
Preheating time at 120 to 180
C
: 120
30 seconds
Maximum number of reflow processes
: 3 times
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
IR260
VPS
Peak temperature (package surface temperature)
: 215
C or below
Time at temperature of 200
C or higher
: 25 to 40 seconds
Preheating time at 120 to 150
C
: 30 to 60 seconds
Maximum number of reflow processes
: 3 times
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
VP215
Wave Soldering
Peak temperature (molten solder temperature)
: 260
C or below
Time at peak temperature
: 10 seconds or less
Preheating temperature (package surface temperature) : 120
C or below
Maximum number of flow processes
: 1 time
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
WS260
Partial Heating
Peak temperature (pin temperature)
: 350
C or below
Soldering time (per side of device)
: 3 seconds or less
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
HS350
Caution Do not use different soldering methods together (except for partial heating).
Data Sheet PG10162EJ01V0DS
10



PG2304TK
M8E 00. 4 - 0110
The information in this document is current as of May, 2002. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data
books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products
and/or types are available in every country. Please check with an NEC sales representative for
availability and additional information.
No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
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agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
NEC semiconductor products are classified into the following three quality grades:
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products
developed based on a customer-designated "quality assurance program" for a specific application. The
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Customers must check the quality grade of each semiconductor product before using it in a particular
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Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
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support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
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(Note)
(1) "NEC" as used in this statement means NEC Corporation, NEC Compound Semiconductor Devices, Ltd.
and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
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