NJL6163R
- 1 -
HIGH SPEED PIN PHOTO DIODE
s
GENERAL DESCRIPTION
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OUTLINE (typ.)
Unit : mm
The NJL6163R is the PIN photo diode, which
attain high speed (fc : 200MHz) and high
sensitivity (S : 0.65A/W).
It shrinks the outline by COBP(Chip on Board
Package), and attain under half package
volume compared with lead frame type.
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FEATURES
High speed, high sensitivity
Super miniature, super thin type
(2.5mmX4.9mmX1.16mm)
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APPLICATIONS
Laser monitor for CD-R/RW etc.
Reading the signal for optical communication
etc.
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ABSOLUTE MAXIMUM RATINGS
(Ta=25
C)
PARAMETER SYMBOL
RATINGS
UNIT
Reverse Voltage
Operating Temperature
Storage Temperature
Soldering Temperature
V
R
T
opr
T
stg
T
sol
35
-30
~ +85
-40
~ +100
260 (10sec.)
V
C
C
C
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ELECTRO-OPTICAL CHARACTERISTICS
(Ta=25
C)
PARAMETER SYMBOL
TEST
CONDITION
MIN
TYP
MAX
UNIT
Dark Current
Forward Voltage
Capacitance
Peak Wavelength
Sensitivity
Cut off Frequency
I
D
V
F
C
t
P
S
fc
(-3dB)
V
R
=10V
I
F
=1mA
V
R
=2.0V, f=1MHz
--
V
R
=2.0V,
=780nm
V
R
=0.7V,
=780nm, RL=50
V
R
=2.0V,
=780nm, RL=50
--
--
--
--
0.50
--
--
0.1
--
10
800
0.65
150
200
2.0
1.0
--
--
--
--
--
nA
V
pF
nm
A/W
MHz
MHz
4.
9
2.5
2.
5
1.16
0.5
1.0
0.3
1.
3
5
0.
7
0.
3
1.
3
5
1.0
(2x)R0.3
x
anode
y
cathode
x
y
NJL6163R
- 2 -
0%
20%
40%
60%
80%
100%
500
600
700
800
900 1000 1100
Wavelength (nm)
Relative Sensitivity (%)
1.0E-13
1.0E-12
1.0E-11
1.0E-10
1.0E-09
1.0E-08
-40 -20
0
20
40
60
80 100
Ambient Temperature Ta (C)
Dark Current I
D
(A)
VR=2.0V
90%
92%
94%
96%
98%
100%
102%
104%
106%
108%
110%
-40 -20
0
20
40
60
80 100
Ambient Temperature Ta (C)
Relative Sensitivity (%)
VR=2.0V,
=780nm
0
5
10
15
20
0
1
2
3
4
5
Reverse Voltage VR (V)
Rise Time tr (ns
)
=780nm, RL=50
0
5
10
15
20
0
1
2
3
4
5
Reverse Voltage VR (V)
Fall Time tf (ns
)
=780nm, RL=50
1.00E-08
1.00E-07
1.00E-06
1.00E-05
1.00E-04
1.00E-03
1.00E-02
0.01
0.1
1
10
100
Illuninance (mW/cm )
Light Current IL (A)
VR=2.0V,
=780nm
2
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TYPICAL CHARACTERISTICS
Relative Sensitivity vs. Illuminance (Ta=25
C) Spectral Response (Ta=25
C)
Dark Current vs. Temperature Relative Sensitivity vs. Temperature
Rise Time vs. Reverse Voltage (Ta=25
C) Fall Time vs. Reverse Voltage (Ta=25
C)
NJL6163R
- 3 -
8
9
10
11
12
13
14
15
0
1
2
3
4
5
Reverse Voltage VR (V)
Capasitance Cj (pF
)
-6
-5
-4
-3
-2
-1
0
1
10
100
1000
Frequency f (MHz)
Relative Sensitivity (dB)
VR=2.0V,
=780nm,
RL=50
Relative Sensitivity vs. Frequency (Ta=25
C) Capacitance vs. Reverse Voltage (Ta=25
C)
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MEASURING CIRCUIT FOR RESPONSE TIME
OSC
50
Laser
NJL6163R
P.G.
tr
tf
90%
10%
Input
Output
NJL6163R
- 4 -
250
200
150
100
50
0
PRECAUTION FOR HANDLING
1. Soldering to actual circuit board
Soldering condition
- Heated condition of plastic package.
Lower than 240
C of maximum surface temperature, less than 30 seconds of time kept higher than 200
C.
Soldering Method
1) Reflow Method
Recommended temperature profile of its method.
x Preparatory heating condition
: 120
~ 150
C about 60 sec.
y Recommended soldering temperature : 230
~ 240
C about 3
~ 5 sec.
z Slowly cool down right after soldering.
{ Soldering to be done within twice under this condition.
(
C) 3
~ 5 sec.
240
C max.
Preparatory heating Less than
60
~ 120 sec. 30 sec.
Time
2) Reflow Method
(In case of infrared heating)
- Temperature profile : Same to the above
- Avoid direct irradiation to the plastic package because it is mold resin, absorbs the Infrared Radiation and its surface
temperature will be higher than lead itself.
3) The other method
Avoid rapid heating up like dipping the devices directly into the melting solder or vapor phase method
(VPS).
If the device is heated to high temperature and kept in its condition for longer time, it would affect to its reliability.
It is necessary to solder in short time as soon as possible.
2. Cleaning
Avoid washing of the device after soldering by reflow method.
3. Attention in handling
1) Treat not to touch the lens surface.
2) Avoid dust and any other foreign materials (paint, bonding material, etc.) on the lens surface.
3) When mounting, special care has to be taken on the mounting position and tilting of the device because it is very
important to place the device to the optimum position to the object.
4. Storage
In order to prevent from degradation of this device in moisturing at reflow method, so that this device is contained in
dampproof packaging. So that mount the device as short as possible after opening the envelope.
NJL6163R
- 5 -
(TE1)
NJL6163R Taping Specification
1. Taping Size
1) Carrier tape is used with Styrene type Carbonated Plastic.
2) Cover tape is used with electro statistically prevention treated Polyester type tape.
3) Product taping direction is to place the index mark against the pull out direction of the tape as in the drawing.
Pull out direction of tape
2. Taping Strength
Pullup the cover tape from the carrier tape, and when the opening angle comes around 10
~ 15
, and the peeling-off
strength is to be within the power of 20
~ 70g.
3. Packaging
1) The taped products are to be rolled up on the taping reel as on the drawing.
2) Rolling up specification
x Start Rolling : Carrier tape open space more than 20 Pieces.
y End of Rolling : Carrier tape open space more than 20 Pieces, and 2 round of reel space at the cover tape only.
3) Taping quantity : 2,000 Pieces
4) Seal off after putting each reels in a dampproof bag with silica gel (3 bags).
13
60
18
0
13
Label
2.0
4.0
2.9
4.0
5.
5
12
.
0
1.
75
5.
4
0.3
1.5
Carrier tape
Cover tape
1.5
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