TL F 9503
54F74F245
Octal
Bidirectional
Transceiver
with
TRI-STATE
Outputs
June 1995
54F 74F245
Octal Bidirectional Transceiver with TRI-STATE
Outputs
General Description
The 'F245 contains eight non-inverting bidirectional buffers
with TRI-STATE outputs and is intended for bus-oriented
applications Current sinking capability is 24 mA (20 mA Mil)
at the A ports and 64 mA (48 mA Mil) at the B ports The
Transmit Receive (T R) input determines the direction of
data flow through the bidirectional transceiver Transmit (ac-
tive HIGH) enables data from A ports to B ports Receive
(active LOW) enables data from B ports to A ports The
Output Enable input when HIGH disables both A and B
ports by placing them in a High Z condition
Features
Y
Non-inverting buffers
Y
Bidirectional data path
Y
A outputs sink 24 mA (20 mA Mil)
Y
B outputs sink 64 mA (48 mA Mil)
Y
Guaranteed 4000V minimum ESD protection
Commercial
Military
Package
Package Description
Number
74F245PC
N20A
20-Lead (0 300 Wide) Molded Dual-In-Line
54F245DM (Note 2)
J20A
20-Lead Ceramic Dual-In-Line
74F245SC (Note 1)
M20B
20-Lead (0 300 Wide) Molded Small Outline JEDEC
74F245SJ (Note 1)
M20D
20-Lead (0 300 Wide) Molded Small Outline EIAJ
74F245MSA (Note 1)
MSA20
20-Lead Molded Shrink Small Outline EIAJ Type II
54F245FM (Note 2)
W20A
20-Lead Cerpack
54F245LM (Note 2)
E20A
20-Lead Ceramic Leadless Chip Carrier Type C
Note 1
Devices also available in 13
reel Use suffix
e
SCX SJX and MSAX
Note 2
Military grade device with environmental and burn-in processing Use suffix
e
DMQB FMQB and LMQB
Logic Symbols
TL F 9503 3
IEEE IEC
TL F 9503 4
TRI-STATE
is a registered trademark of National Semiconductor Corporation
C1995 National Semiconductor Corporation
RRD-B30M75 Printed in U S A
Connection Diagrams
Pin Assignment for
DIP SOIC SSOP and Flatpak
TL F 9503 1
Pin Assignment
for LCC
TL F 9503 2
Unit Loading Fan Out
54F 74F
Pin Names
Description
U L
Input I
IH
I
IL
HIGH LOW
Output I
OH
I
OL
OE
Output Enable Input (Active LOW)
1 0 2 0
20 mA
b
1 2 mA
T R
Transmit Receive Input
1 0 2 0
20 mA
b
1 2 mA
A
0
A
7
Side A Inputs or
3 5 1 083
70 mA
b
0 65 mA
TRI-STATE Outputs
150 40(38 3)
b
3 mA 24 mA (20 mA)
B
0
B
7
Side B Inputs or
3 5 1 083
70 mA
b
0 65 mA
TRI-STATE Outputs
600 106 6(80)
b
12 mA 64 mA (48 mA)
Truth Table
Inputs
Output
OE
T R
L
L
Bus B Data to Bus A
L
H
Bus A Data to Bus B
H
X
High Z State
H
e
HIGH Voltage Level
L
e
LOW Voltage Level
X
e
Immaterial
2
Absolute Maximum Ratings
(Note 1)
If Military Aerospace specified devices are required
please contact the National Semiconductor Sales
Office Distributors for availability and specifications
Storage Temperature
b
65 C to
a
150 C
Ambient Temperature under Bias
b
55 C to
a
125 C
Junction Temperature under Bias
b
55 C to
a
175 C
Plastic
b
55 C to
a
150 C
V
CC
Pin Potential to
Ground Pin
b
0 5V to
a
7 0V
Input Voltage (Note 2)
b
0 5V to
a
7 0V
Input Current (Note 2)
b
30 mA to
a
5 0 mA
Voltage Applied to Output
in HIGH State (with V
CC
e
0V)
Standard Output
b
0 5V to V
CC
TRI-STATE Output
b
0 5V to
a
5 5V
Current Applied to Output
in LOW State (Max)
twice the rated I
OL
(mA)
ESD Last Passing Voltage (Min)
4000V
Note 1
Absolute maximum ratings are values beyond which the device may
be damaged or have its useful life impaired Functional operation under
these conditions is not implied
Note 2
Either voltage limit or current limit is sufficient to protect inputs
Recommended Operating
Conditions
Free Air Ambient Temperature
Military
b
55 C to
a
125 C
Commercial
0 C to
a
70 C
Supply Voltage
Military
a
4 5V to
a
5 5V
Commercial
a
4 5V to
a
5 5V
DC Electrical Characteristics
Symbol
Parameter
54F 74F
Units
V
CC
Conditions
Min
Typ
Max
V
IH
Input HIGH Voltage
2 0
V
Recognized as a HIGH Signal
V
IL
Input LOW Voltage
0 8
V
Recognized as a LOW Signal
V
CD
Input Clamp Diode Voltage
b
1 2
V
Min
I
IN
e b
18 mA
V
OH
Output HIGH
54F 10% V
CC
2 4
I
OH
e b
3 mA (A
n
)
Voltage
54F 10% V
CC
2 0
I
OH
e b
12 mA (B
n
)
74F 10% V
CC
2 4
V
Min
I
OH
e b
3 mA (A
n
)
74F 10% V
CC
2 0
I
OH
e b
15 mA (B
n
)
74F 5% V
CC
2 7
I
OH
e b
3 mA (A
n
)
V
OL
Output LOW
54F 10% V
CC
0 5
I
OL
e
20 mA (A
n
)
Voltage
54F 10% V
CC
0 55
V
Min
I
OL
e
48 mA (B
n
)
74F 10% V
CC
0 5
I
OL
e
24 mA (A
n
)
74F 10% V
CC
0 55
I
OL
e
64 mA (B
n
)
I
IH
Input HIGH
54F
20 0
m
A
Max
V
IN
e
2 7V
Current
74F
5 0
I
BVI
Input HIGH Current 54F
100
m
A
Max
V
IN
e
7 0V (OE T R)
Breakdown Test
74F
7 0
I
BVIT
Input HIGH Current 54F
1 0
mA
Max
V
IN
e
5 5 V (A
n
B
n
)
Breakdown (I O)
74F
0 5
I
CEX
Output HIGH
54F
250
m
A
Max
V
OUT
e
V
CC
(A
n
B
n
)
Leakage Current
74F
50
V
ID
Input Leakage
74F
4 75
V
0 0
I
ID
e
1 9 mA
Test
All Other Pins Grounded
I
OD
Output Leakage
74F
3 75
m
A
0 0
V
IOD
e
150 mV
Circuit Current
All Other Pins Grounded
I
IL
Input LOW Current
b
1 2
mA
Max
V
IN
e
0 5V (T R OE)
I
IH
a
I
OZH
Output Leakage Current
70
m
A
Max
V
OUT
e
2 7V (A
n
B
n
)
I
IL
a
I
OZL
Output Leakage Current
b
650
m
A
Max
V
OUT
e
0 5V (A
n
B
n
)
3
DC Electrical Characteristics
(Continued)
Symbol
Parameter
54F 74F
Units
V
CC
Conditions
Min
Typ
Max
I
OS
Output Short-Circuit Current
b
60
b
150
mA
Max
V
OUT
e
0V (A
n
)
b
100
b
225
V
OUT
e
0V (B
n
)
I
ZZ
Bus Drainage Test
500
m
A
0 0V
V
OUT
e
5 25V(A
n
B
n
)
I
CCH
Power Supply Current
70
90
mA
Max
V
O
e
HIGH
I
CCL
Power Supply Current
95
120
mA
Max
V
O
e
LOW
I
CCZ
Power Supply Current
85
110
mA
Max
V
O
e
HIGH Z
AC Electrical Characteristics
74F
54F
74F
T
A
e a
25 C
T
A
V
CC
e
Mil
T
A
V
CC
e
Com
Symbol
Parameter
V
CC
e a
5 0V
C
L
e
50 pF
C
L
e
50 pF
Units
C
L
e
50 pF
Min
Typ
Max
Min
Max
Min
Max
t
PLH
Propagation Delay
2 5
4 2
6 0
2 0
7 5
2 0
7 0
ns
t
PHL
A
n
to B
n
or B
n
to A
n
2 5
4 2
6 0
2 0
7 5
2 0
7 0
t
PZH
Output Enable Time
3 0
5 3
7 0
2 5
9 0
2 5
8 0
t
PZL
3 5
6 0
8 0
3 0
10 0
3 0
9 0
ns
t
PHZ
Output Disable Time
2 0
5 0
6 5
2 0
9 0
2 0
7 5
t
PLZ
2 0
5 0
6 5
2 0
10 0
2 0
7 5
Ordering Information
The device number is used to form part of a simplified purchasing code where the package type and temperature range are
defined as follows
74F
245
S
C
X
Temperature Range Family
Special Variations
74F
e
Commercial
QB
e
Military grade device with
54F
e
Military
environmental and burn-in
processing
Device Type
X
e
Devices shipped in 13 reel
Package Code
Temperature Range
P
e
Plastic DIP
C
e
Commercial (0 C to
a
70 C)
D
e
Ceramic DIP
M
e
Military (
b
55 C to
a
125 C)
F
e
Flatpak
L
e
Leadless Chip Carrier (LCC)
NOTE NOT REQUIRED
S
e
Small Outline SOIC JEDEC
FOR MSA PACKAGE CODE
MSA
e
Shrink Small Outline Package (EIAJ SSOP)
SJ
e
Small Outline Package SOIC EIAJ
4
Physical Dimensions
inches (millimeters)
20-Lead Ceramic Leadless Chip Carrier (L)
NS Package Number E20A
20-Lead Ceramic Dual-In-Line Package (D)
NS Package Number J20A
5
Physical Dimensions
inches (millimeters) (Continued)
20-Lead (0 300 Wide) Molded Small Outline Package JEDEC (S)
NS Package Number M20B
20-Lead (0 300 Wide) Molded Small Outline Package EIAJ (SJ)
NS Package Number M20D
6
Physical Dimensions
inches (millimeters) (Continued)
20-Lead Molded Shrink Small Outline Package EIAJ Type II (MSA)
NS Package Number MSA20
20-Lead Molded (0 300 Wide) Dual-In-Line Package (P)
NS Package Number N20A
7
54F74F245
Octal
Bidirectional
Transceiver
with
TRI-STATE
Outputs
Physical Dimensions
inches (millimeters) (Continued)
20-Lead Ceramic Flatpak (F)
NS Package Number W20A
LIFE SUPPORT POLICY
NATIONAL'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL
SEMICONDUCTOR CORPORATION As used herein
1 Life support devices or systems are devices or
2 A critical component is any component of a life
systems which (a) are intended for surgical implant
support device or system whose failure to perform can
into the body or (b) support or sustain life and whose
be reasonably expected to cause the failure of the life
failure to perform when properly used in accordance
support device or system or to affect its safety or
with instructions for use provided in the labeling can
effectiveness
be reasonably expected to result in a significant injury
to the user
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