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Электронный компонент: NTE3035A

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NTE3035A
Phototransistor Detector
Description:
The NTE3035A is designed for a wide variety of industrial processing and control applications requir-
ing a sensitive detector. The NTE3034A is is an identical package and is designed to be used with
the NTE3029A infrared emitter.
Features:
D
Miniature, Low Profile, Clear Plastic Package
D
Designed for Automatic Handling and Accurate Positioning
D
Side Looking, with Molded Lens
D
High Volume, Economical
Absolute Maximum Ratings: (T
A
= +25
C unless otherwise specified)
CollectorEmitter Voltage, V
CEO
60V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Total Device Dissipation (T
A
= +25
C), P
D
150mW
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Derate Above 25
C (Note 1)
2mW/
C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating Junction Temperature Range, T
J
40
to +100
C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage Temperature Range, T
stg
40
to +100
C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead Temperature (During Soldering, 1/16" from case, 5sec max., Note 2), T
L
+260
C
. . . . . . . . . .
Electrical Characteristics: (T
A
= +25
C unless otherwise specified)
Parameter
Symbol
Test Conditions
Min
Typ
Max Unit
Collector Dark Current
I
D
V
CE
= 10V, H
[
0
100
nA
CollectorEmitter Breakdown Voltage
V
(BR)CEO
I
C
= 10mA, H
[
0
60
V
Capacitance
C
ce
V
CC
= 5V, f = 1MHz
3.9
pF
Optical Characteristics: (T
A
= +25
C unless otherwise specified)
Parameter
Symbol
Test Conditions
Min
Typ
Max Unit
Collector Light Current
I
L
V
CE
= 5V, H = 500
W/cm
2
,
= 940nm
5
25
mA
TurnOn Time
t
on
H = 500
W/cm
2
, V
CC
= 5V,
125
s
TurnOff Time
t
off
R
L
= 100
150
s
Saturation Voltage
V
CE(sat)
H = 500
W/cm
2
,
= 940nm,
I
C
= 2mA, V
CC
= 5V
0.75
1.0
V
Wavelength of Maximum Sensitivity
s
0.8
m
Note 1. Measured with device soldered into a typical PC board.
Note 2. Heat sink should be applied to leads during soldering to prevent case temperature from ex-
ceeding +100
C.
.120
(3.04)
.045 (1.14) Dia
.160 (4.06)
.020 (.508)
.060 (1.52)
.100 (2.54)
.125
(3.17)
.750
(19.05)
Max
.103
(2.62)
.168
(4.27)
E
C