ChipFind - документация

Электронный компонент: MR27V802FTP

Скачать:  PDF   ZIP

Document Outline

OKI Semiconductor
FEDR27V802F-01-03
Issue Date: Dec. 8, 2004
MR27V802F
524,288Word
x
16Bit or 1,048,576Word
x
8Bit One Time PROM
1/15
GENERAL DESCRIPTION

The MR27V802F is a 8Mbit electrically One Time Programmable Read-Only Memory that can be electrically
switched between 524,288-word
16-bit and 1,048,576-word 8-bit by the state of the BYTE# pin. The
MR27V802F supports high speed asynchronous read operation using a single 3.3V power supply.


FEATURES

524,288-word
16-bit/1,048,576-word 8-bit electrically switchable configuration
+3.3 V power supply
Access time
70 nS MAX
Operating current
18 mA MAX (5MHz)
Standby current
5 A MAX
Input/Output TTL compatible
Tri-state output
Packages:
44-pin plastic SOP (SOP44-P-600-1.27-K) (Product Name : MR27V802FMA)
48-pin plastic TSOP (TSOP(1)48-P-1220-0.50-1K) (Product Name : MR27V802FTN)
44-pin plastic TSOP (TSOP II 44-P-400-0.80-K) (Product Name : MR27V802FTP)

FEDR27V802F-01-03
OKI Semiconductor
MR27V802F / OTP
2/15
PIN CONFIGURATION (TOP VIEW)





































Pin name
Functions
D15/A1
Data output/Address input
A0 to A18
Address input
D0 to D14
Data output
CE# Chip
enable
OE# Output
enable
BYTE#/V
PP
Mode switch/Program power supply voltage
V
CC
Power supply voltage
V
SS
GND
NC Non
connection
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
A15
A14
A13
A12
A11
A10
A9
A8
NC
NC
NC
NC
NC
NC
NC
A18
A17
A7
A6
A5
A4
A3
A2
A1
A16
BYTE#/V
PP
V
SS
D15/A1
D7
D14
D6
D13
D5
D12
D4
V
CC
D11
D3
D10
D2
D9
D1
D8
D0
OE#
V
SS
CE#
A0
48-pin TSOP(I)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
NC
NC
A8
A9
A10
A11
A12
A13
A14
A15
A16
BYTE#/V
PP
V
SS
D15/A1
D7
D14
D6
D13
D5
D12
D4
V
CC
NC
A18
A17
A7
A6
A5
A4
A3
A2
A1
A0
CE#
V
SS
OE#
D0
D8
D1
D9
D2
D10
D3
D11
44-pin SOP
44-pin TSOP(II)
FEDR27V802F-01-03
OKI Semiconductor
MR27V802F / OTP
3/15
BLOCK DIAGRAM



































FUNCTION TABLE
Mode CE#
OE#
BYTE#/V
PP
V
CC
D0 to D7
D8 to D14
D15/A1
Read (16-Bit)
L
L
H
D
OUT
Read (8-Bit)
L
L
L
D
OUT
HiZ L/H
H
Output disable
L
H
L
HiZ
H
Standby H
L
3.3 V
HiZ
Program L
H
D
IN
Hi-Z L/H
Program inhibit
H
H
HiZ
Hi-Z
L/H
Program verify
H
L
8.0 V
4.0 V
D
OUT
Hi-Z L/H

: Don't Care (H or L)
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
A18
CE#
BYTE#/V
PP
OE#
CE PGM
OE
8/ 16 Switch
D0 D2 D4 D6 D8 D10 D12 D14
D1 D3 D5 D7 D9 D11 D13 D15
Memory Cell Matrix
524,288 16-Bit or 1,048,576 8-Bit
Multiplexer
Output Buffer
Row Dec
o
d
e
r
Colum
n
Deco
d
e
r
Address Buffer
In 8-bit output mode, these pins
are placed in a high-Z state and
pin D15 functions as the A-1
address pin.
A1
FEDR27V802F-01-03
OKI Semiconductor
MR27V802F / OTP
4/15
ABSOLUTE MAXIMUM RATINGS
Parameter Symbol
Condition Value Unit
Operating temperature under bias
Ta
0 to 70
C
Storage temperature
Tstg
--
55 to 125
C
Input voltage
V
I
0.5 to V
CC
+0.5 V
Output voltage
V
O
0.5 to V
CC
+0.5 V
Power supply voltage
V
CC
0.5 to 5
V
Program power supply voltage
V
PP
relative to V
SS
0.5 to 9.0
V
Power dissipation per package
P
D
Ta
=
25C
1.0
W
Output short circuit current
I
OS
--
10 mA


RECOMMENDED OPERATING CONDITIONS
(Ta = 0 to 70C)
Parameter Symbol
Condition Min.
Typ.
Max.
Unit
V
CC
power supply voltage
V
CC
3.0
--
3.6
V
V
PP
power supply voltage
V
PP
0.5
--
V
CC
+0.5 V
Input "H" level
V
IH
2.2
--
V
CC
+0.5
V
Input "L" level
V
IL
V
CC
= 3.0 to 3.6 V
0.5
-- 0.6 V

Voltage is relative to V
SS
.
: Vcc+1.5V(Max.) when pulse width of overshoot is less than 10ns.
: -1.5V(Min.) when pulse width of undershoot is less than 10ns.

FEDR27V802F-01-03
OKI Semiconductor
MR27V802F / OTP
5/15
ELECTRICAL CHARACTERISTICS

DC Characteristics
(V
CC
= 3.3 V 0.3 V, Ta = 0 to 70C)
parameter Symbol Condition Min.
Typ.
Max.
Unit
Input leakage current
I
LI
V
I
= 0 to V
CC
--
-- 5
A
Output leakage current
I
LO
V
O
= 0 to V
CC
-- -- 5
A
I
CCSC
CE# = V
CC
--
--
5
A
V
CC
power supply current
(Standby)
I
CCST
CE# = V
IH
--
--
1
m
V
CC
power supply current
(Read)
I
CCA
CE# = V
IL
, OE# = V
IH
f=5MHz
-- -- 18
mA
V
PP
power supply current
I
PP
V
PP
= V
CC
--
--
10
A
Input "H" level
V
IH
-- 2.2
--
V
CC
+0.5
V
Input "L" level
V
IL
--
0.5
-- 0.6 V
Output "H" level
V
OH
I
OH
= 1 mA
2.4
--
--
V
Output "L" level
V
OL
I
OL
= 2 mA
--
--
0.4
V

Voltage is relative to V
SS
.
: Vcc+1.5V(Max.) when pulse width of overshoot is less than 10ns.
: -1.5V(Min.) when pulse width of undershoot is less than 10ns.


AC Characteristics
(V
CC
= 3.3 V 0.3 V, Ta = 0 to 70C)
Parameter Symbol
Condition Min. Max.
Unit
Address cycle time
t
C
-- 70 --
ns
Address access time
t
ACC
CE# = OE# = V
IL
-- 70
ns
CE# access time
t
CE
OE# = V
IL
-- 70 ns
OE# access time
t
OE
CE# = V
IL
-- 25 ns
t
CHZ
OE# = V
IL
0 20
ns
Output disable time
t
OHZ
CE# = V
IL
0 20
ns
Output hold time
t
OH
CE# = OE# = V
IL
0 --
ns
Measurement conditions
Input
signal
level ----------------------------------------- 0 V/3 V
Input timing reference level---------------------------- 1/2Vcc
Output load ------------------------------------------------ 50 pF
Output timing reference level ------------------------- 1/2Vcc








Output
50 pF
(Including scope and jig)
FEDR27V802F-01-03
OKI Semiconductor
MR27V802F / OTP
6/15
TIMING CHART (READ CYCLE)




16-Bit Read Mode (BYTE# = V
IH
)

























8-Bit Read Mode (BYTE# = V
IL
)

















Address
CE#
OE#
D0 to D15
t
C
t
CE
t
OE
t
OH
t
CHZ
t
OHZ
Valid Data
Hi-Z
Hi-Z
t
OH
t
ACC
Valid Data
t
ACC
t
C
Address
CE#
OE#
D0 to D7
t
C
t
CE
t
OE
t
OH
t
CHZ
t
OHZ
Valid Data
Hi-Z
Hi-Z
t
OH
t
ACC
Valid Data
t
ACC
t
C
FEDR27V802F-01-03
OKI Semiconductor
MR27V802F / OTP
7/15
ELECTRICAL CHARACTERISTICS (PROGRAMMING OPERATION)

DC Characteristics
(Ta = 25C 5C)
Parameter Symbol
Condition Min.
Typ.
Max.
Unit
Input leakage current
I
LI
V
I
= V
CC
+0.5 V
--
--
10
A
V
PP
power supply current (Program)
I
PP2
CE# = V
IL
-- -- 50
mA
V
CC
power supply current
I
CC
-- --
--
50
mA
Input "H" level
V
IH
-- 3.0
--
V
CC
+0.5 V
Input "L" level
V
IL
--
0.5
--
0.8
V
Output "H" level
V
OH
I
OH
= 400
A 2.4 -- -- V
Output "L" level
V
OL
I
OL
= 2.1 mA
--
--
0.45
V
Program voltage
V
PP
--
7.75 8.0 8.25 V
V
CC
power supply voltage
V
CC
-- 3.9
4.0
4.1
V

Voltage is relative to V
SS
.


AC Characteristics
(V
CC
= 4.0 V 0.1 V, BYTE#/V
PP
= 8.0 V 0.25 V, Ta = 25C 5C)
Parameter Symbol
Condition
Min.
Typ.
Max.
Unit
Address set-up time
t
AS
-- 100 -- -- ns
OE# set-up time
t
OES
-- 2 -- --
s
Data set-up time
t
DS
-- 100 -- -- ns
Address hold time
t
AH
-- 2 -- --
s
Data hold time
t
DH
-- 100 -- -- ns
Output float delay time from OE#
t
OHZ
-- 0 -- 100 ns
V
PP
voltage set-up time
t
VS
-- 2 -- --
s
Program pulse width
t
PW
-- 9 10 11
s
Data valid from OE#
t
OE
-- -- -- 100
ns
Address hold from OE# high
t
AOH
-- 0 -- -- ns


Pin Check Function

Pin Check Function is to check contact between each device-pin and each socket-lead with EPROM programmer.
Setting up address as following condition call the preprogrammed codes on device outputs.
(V
CC
= 3.3 V 0.1 V, CE# = V
IL
, OE# = V
IL
, BYTE#/V
PP
= V
IH
, Ta = 25C 5C)
A0 A1 A2 A3 A4
A5 A6 A7 A8
A9 A10 A11 A12 A13 A14 A15
A16 A17 A18 DATA
0 1 0 1 0
1 0 1 0
VH
0
1
0
1
0
1
0
0
1
00FF
1 0 1 0 1
0 1 0 1
VH
1
0
1
0
1
0
1
1
0
FF00
Other conditions
FFFF

: VH = 7.0V 0.25 V
FEDR27V802F-01-03
OKI Semiconductor
MR27V802F / OTP
8/15
Consecutive Programming Waveforms



























Consecutive Program Verify Waveforms

























t
AS
A0 to A18
CE#
OE#
D0 to D15
t
AH
t
PW
Din
High
BYTE#/Vpp
t
DH
t
DS
t
VS
Din
t
OHZ
t
AHO
t
ACC
A0 to A18
CE#
OE#
D0 to D15
High
BYTE#/Vpp
Dout
t
OE
Dout
8.0 V
FEDR27V802F-01-03
OKI Semiconductor
MR27V802F / OTP
9/15
Program And Program Verify Cycle Waveforms




























Pin Capacitance
(V
CC
= 3.3 V, Ta = 25C, f = 1 MHz)
Parameter Symbol Condition Min.
Typ.
Max.
Unit
Input C
IN1
--
--
8
BYTE#/V
PP
C
IN2
V
I
= 0 V
-- -- 100
Output C
OUT
V
O
= 0 V
--
--
10
pF


t
OHZ
t
DS
t
OE
t
AS
A0 to A18
CE#
OE#
D0 to D15
t
AHO
t
PW
Dout
BYTE#/Vpp
t
DH
Din
t
OES
t
OHZ
8.0 V
FEDR27V802F-01-03
OKI Semiconductor
MR27V802F / OTP
10/15
Programming/Verify Flow Chart



















































NG
YES
NO
NO
V
CC
= 3.0 V/V
PP
= 3.0 V
Device
P
assed
Start
Last Address?
X = 0
Verify(One Word)
Last Address?
NG
X = 2?
X = X+1
Increment Address
Program 10
s
Programming
Pin Check
NG
PASS
Verify
Verify
Start
Verify
Pin Check
Bad Insertion
Device Passed
YES
YES
PASS
PASS
NG
PASS
NG
PASS
NG
PASS
NO
V
CC
= 3.6 V/V
PP
= 3.6 V
Device Failed
Bad Insertion
Address = First Location
V
CC
= 4.0 V
V
PP
= 8.0 V
Program 10
s
Verify
Device Failed
V
CC
= 3.0 V/V
PP
= 3.0 V
Address = First Location
Increment Address
Address = First Location
FEDR27V802F-01-03
OKI Semiconductor
MR27V802F / OTP
11/15
PACKAGE DIMENSIONS

SOP44-P-600-1.27-K
Mirror finish
Package material
Epoxy resin
Lead frame material
42 alloy
Pin treatment
Solder plating (
5m)
Package weight (g)
2.10 TYP.
5
Rev. No./Last Revised
4/Dec. 5, 1996

Notes for Mounting the Surface Mount Type Package

The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in
storage.
Therefore, before you perform reflow mounting, contact Oki's responsible sales person for the product name,
package name, pin number, package code and desired mounting conditions (reflow method, temperature and
times).
(Unit: mm)
FEDR27V802F-01-03
OKI Semiconductor
MR27V802F / OTP
12/15
TSOP(1)48-P-1220-0.50-1K
Mirror finish
Package material
Epoxy resin
Lead frame material
42 alloy
Pin treatment
Solder plating (
5m)
Package weight (g)
0.55 TYP.
5
Rev. No./Last Revised
1/Dec. 2, 1999

Notes for Mounting the Surface Mount Type Package

The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in
storage.
Therefore, before you perform reflow mounting, contact Oki's responsible sales person for the product name,
package name, pin number, package code and desired mounting conditions (reflow method, temperature and
times).
(Unit: mm)
FEDR27V802F-01-03
OKI Semiconductor
MR27V802F / OTP
13/15
TSOP(2)44-P-400-0.80-K
Mirror finish
Package material
Epoxy resin
Lead frame material
42 alloy
Pin treatment
Solder plating (
5m)
Package weight (g)
0.54 TYP.
5
Rev. No./Last Revised
3/Dec. 10, 1996
Notes for Mounting the Surface Mount Type Package

The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in
storage.
Therefore, before you perform reflow mounting, contact Oki's responsible sales person for the product name,
package name, pin number, package code and desired mounting conditions (reflow method, temperature and
times).
(Unit: mm)
FEDR27V802F-01-03
OKI Semiconductor
MR27V802F / OTP
14/15
REVISION HISTORY
Page
Document
No.
Date
Previous
Edition
Current
Edition
Description
FEDR27V802F-01-01
Jan. 15, 2004
Final edition 1
FEDR27V802F-01-02
Jul. 9, 2004
1, 2
4
1, 2, 11
4
Add MR27V802FMA
Add P
D
condition and I
OS
= 10mA
FEDR27V802F-01-03
Dec. 8, 2004
1, 2
1, 2, 13
Add MR27V802FTP
FEDR27V802F-01-03
OKI Semiconductor
MR27V802F / OTP
15/15

NOTICE

1. The information contained herein can change without notice owing to product and/or technical improvements.
Before using the product, please make sure that the information being referred to is up-to-date.

2. The outline of action and examples for application circuits described herein have been chosen as an explanation
for the standard action and performance of the product. When planning to use the product, please ensure that the
external conditions are reflected in the actual circuit, assembly, and program designs.

3. When designing your product, please use our product below the specified maximum ratings and within the
specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating
temperature.

4. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation
resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or
unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified
maximum ratings or operation outside the specified operating range.

5. Neither indemnity against nor license of a third party's industrial and intellectual property right, etc. is granted
by us in connection with the use of the product and/or the information and drawings contained herein. No
responsibility is assumed by us for any infringement of a third party's right which may result from the use
thereof.

6. The products listed in this document are intended for use in general electronics equipment for commercial
applications (e.g., office automation, communication equipment, measurement equipment, consumer
electronics, etc.). These products are not, unless specifically authorized by Oki, authorized for use in any
system or application that requires special or enhanced quality and reliability characteristics nor in any system
or application where the failure of such system or application may result in the loss or damage of property, or
death or injury to humans.
Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace
equipment, nuclear power control, medical equipment, and life-support systems.

7. Certain products in this document may need government approval before they can be exported to particular
countries. The purchaser assumes the responsibility of determining the legality of export of these products and
will take appropriate and necessary steps at their own expense for these.

8. No part of the contents contained herein may be reprinted or reproduced without our prior permission.
Copyright 2004 Oki Electric Industry Co., Ltd.